Entanglement is a form of correlation between quantum objects, such as particles at the atomic scale. This uniquely quantum phenomenon cannot be explained by the laws of classical physics, yet it is one of the properties that explains the macroscopic behavior of quantum systems.Because entanglement is central to the way quantum systems work, understanding it better could give scientists a deeper sense of how information is stored and processed efficiently in such systems.Qubits, or quantum bits, are the building blocks of a quantum computer. However, it is extremely difficult to make specific entangled states in many-qubit systems, let alone investigate them. There are also a variety of entangled states, and telling them apart can be challenging.Now, MIT researchers have demonstrated a technique to efficiently generate entanglement among an array of superconducting qubits that exhibit a specific type of behavior.Over the past years, the researchers at the Engineering Quantum Systems (<a href="https://equs.mit.edu/" target="_blank">EQuS</a>) group have developed techniques using microwave technology to precisely control a quantum processor composed of superconducting circuits. In addition to these control techniques, the methods introduced in this work enable the processor to efficiently generate highly entangled states and shift those states from one type of entanglement to another — including between types that are more likely to support quantum speed-up and those that are not.“Here, we are demonstrating that we can utilize the emerging quantum processors as a tool to further our understanding of physics. While everything we did in this experiment was on a scale which can still be simulated on a classical computer, we have a good roadmap for scaling this technology and methodology beyond the reach of classical computing,” says Amir H. Karamlou ’18, MEng ’18, PhD ’23, the lead author of the paper.The senior author is William D. Oliver, the Henry Ellis Warren professor of electrical engineering and computer science and of physics, director of the Center for Quantum Engineering, leader of the EQuS group, and associate director of the Research Laboratory of Electronics. Karamlou and Oliver are joined by Research Scientist Jeff Grover, postdoc Ilan Rosen, and others in the departments of Electrical Engineering and Computer Science and of Physics at MIT, at MIT Lincoln Laboratory, and at Wellesley College and the University of Maryland. The&nbsp;<a href="https://www.nature.com/articles/s41586-024-07325-z" target="_blank">research appears today in&nbsp;Nature</a>.<h2>Assessing entanglement</h2>In a large quantum system comprising many interconnected qubits, one can think about entanglement as the amount of quantum information shared between a given subsystem of qubits and the rest of the larger system.The entanglement within a quantum system can be categorized as area-law or volume-law, based on how this shared information scales with the geometry of subsystems. In volume-law entanglement, the amount of entanglement between a subsystem of qubits and the rest of the system grows proportionally with the total size of the subsystem.On the other hand, area-law entanglement depends on how many shared connections exist between a subsystem of qubits and the larger system. As the subsystem expands, the amount of entanglement only grows along the boundary between the subsystem and the larger system.In theory, the formation of volume-law entanglement is related to what makes quantum computing so powerful.“While have not yet fully abstracted the role that entanglement plays in quantum algorithms, we do know that generating volume-law entanglement is a key ingredient to realizing a quantum advantage,” says Oliver.However, volume-law entanglement is also more complex than area-law entanglement and practically prohibitive at scale to simulate using a classical computer.“As you increase the complexity of your quantum system, it becomes increasingly difficult to simulate it with conventional computers. If I am trying to fully keep track of a system with 80 qubits, for instance, then I would need to store more information than what we have stored throughout the history of humanity,” Karamlou says.The researchers created a quantum processor and control protocol that enable them to efficiently generate and probe both types of entanglement.Their processor comprises superconducting circuits, which are used to engineer artificial atoms. The artificial atoms are utilized as qubits, which can be controlled and read out with high accuracy using microwave signals.The device used for this experiment contained 16 qubits, arranged in a two-dimensional grid. The researchers carefully tuned the processor so all 16 qubits have the same transition frequency. Then, they applied an additional microwave drive to all of the qubits simultaneously.If this microwave drive has the same frequency as the qubits, it generates quantum states that exhibit volume-law entanglement. However, as the microwave frequency increases or decreases, the qubits exhibit less volume-law entanglement, eventually crossing over to entangled states that increasingly follow an area-law scaling.<h2>Careful control</h2>“Our experiment is a tour de force of the capabilities of superconducting quantum processors. In one experiment, we operated the processor both as an analog simulation device, enabling us to efficiently prepare states with different entanglement structures, and as a digital computing device, needed to measure the ensuing entanglement scaling,” says Rosen.To enable that control, the team put years of work into carefully building up the infrastructure around the quantum processor.By demonstrating the crossover from volume-law to area-law entanglement, the researchers experimentally confirmed what theoretical studies had predicted. More importantly, this method can be used to determine whether the entanglement in a generic quantum processor is area-law or volume-law.“The MIT experiment underscores the distinction between area-law and volume-law entanglement in two-dimensional quantum simulations using superconducting qubits. This beautifully complements our work on entanglement Hamiltonian tomography with trapped ions in a&nbsp;<a href="https://www.nature.com/articles/s41586-023-06768-0" target="_blank">parallel publication</a> published in&nbsp;Nature in 2023,” says Peter Zoller, a professor of theoretical physics at the University of Innsbruck, who was not involved with this work.“Quantifying entanglement in large quantum systems is a challenging task for classical computers but a good example of where quantum simulation could help,” says Pedram Roushan of Google, who also was not involved in the study. “Using a 2D array of superconducting qubits, Karamlou and colleagues were able to measure entanglement entropy of various subsystems of various sizes. They measure the volume-law and area-law contributions to entropy, revealing crossover behavior as the system’s quantum state energy is tuned. It powerfully demonstrates the unique insights quantum simulators can offer.”In the future, scientists could utilize this technique to study the thermodynamic behavior of complex quantum systems, which is too complex to be studied using current analytical methods and practically prohibitive to simulate on even the world’s most powerful supercomputers.“The experiments we did in this work can be used to characterize or benchmark larger-scale quantum systems, and we may also learn something more about the nature of entanglement in these many-body systems,” says Karamlou.Additional co-authors of the study are<a target="_blank">&nbsp;</a>Sarah E. Muschinske, Cora N. Barrett, Agustin Di Paolo, Leon Ding, Patrick M. Harrington, Max Hays, Rabindra Das, David K. Kim, Bethany M. Niedzielski, Meghan Schuldt, Kyle Serniak, Mollie E. Schwartz, Jonilyn L. Yoder, Simon Gustavsson, and Yariv Yanay.

The advance offers a way to characterize a fundamental resource needed for quantum computing.

Scientists tune the entanglement structure in an array of qubits

Explore the different types of solder, their unique properties, and their critical roles in various engineering applications. Understand how to choose the right solder for your project and the considerations involved.

Types of Solder: A Comprehensive Guide for Engineering Professionals

<h1 id="isPasted">Wired for Autonomy: Confronting PCBA Complexities in Mobile Robotics</h1><section>The field of untethered robotics is booming, and across industries, autonomous robots are rapidly assuming responsibility for an increasing number of tasks. In their expansion into increasingly diverse industries, these robots place additional demands on their internal workings, specifically the PCBAs that help them function.However, developing PCBAs for autonomous robot systems presents several unique challenges that electrical engineers must overcome to succeed. We take a deep dive into these challenges by exploring design considerations beyond those associated with conventional PCBAs.<h3>Beyond the Basics: Design Considerations for Autonomous Robots</h3>While core electrical principles remain a top priority, autonomous robotics introduces additional complexity to PCBA design that electrical engineers must consider from day one. To function properly, these machines must anticipate and plan for the unexpected in harsh, changing conditions.Intuitive Machines’ Odysseus moon lander recently brought this to light, when the private spacecraft <a href="https://www.reuters.com/technology/space/moon-lander-described-alive-well-day-after-white-knuckle-lunar-touchdown-2024-02-23/" target="_blank">landed on the moon’s surface</a>. As much as the sideways landing attracted media attention, few reports focused on last-minute troubleshooting that kept the mission afloat, a testament to the quick-thinking nature of the engineers involved.Here are some of the important factors to consider when designing PCBAs for untethered robotics:<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1713979758192-1713979758192.png" alt="Autonomous robot design considerations" class="fr-fic fr-dii"><ul><li>PCBAs Must Prioritize Efficiency: Untethered robots almost entirely rely on batteries, so PCBAs must focus on efficiency. The key to this is meticulous component selection, such as using low-power microcontrollers and efficient voltage regulators, as well as excellent circuit design that minimizes standby currents. Using clock gating also maximizes battery life and reduces heat generation.</li><li>Maintain Signal Integrity Amid Noise: Robots operate in dynamic environments with <a href="https://www.macrofab.com/blog/bypass-caps-decouple-your-way-to-cleaner-power/" target="_blank">potential electrical noise</a> from motors, sensors, and external sources. EMI can wreak havoc on robotic sensors, causing glitches, calibration issues, or even complete sensor failure. Consider layout strategies in detail to cut crosstalk and ground loops and maintain clear signal transmission.</li><li>Build for Endurance: Many robots are subjected to extreme temperatures, temperature fluctuations, vibrations, and shocks. Use ruggedized PCBA boards that have components with adequate vibration and temperature ratings. To prevent overheating, soldering must be properly performed to handle thermal expansion and contraction, mechanical fatigue, and dust and moisture infiltration. Enclosures need to protect against dust and moisture egress.</li><li>Size Matters: Robots must be mobile, so PCBAs must also be compact and lightweight to minimize robot weight. Choose wisely when choosing mechanisms within your robot, like vacuum track-based models or electromagnetic ones. They may increase the mass of your robot and reduce maneuverability. High-density interconnect (HDI) techniques and minimizing wasted space become crucial.</li><li>Don’t Compromise Reliability: Autonomous robots, operating alone, demand ultra-reliable PCBAs to minimize failure. Filtering tackles this by reducing sensor noise for cleaner data, smoothing data for fewer errors, extracting key features for better navigation, and even lowering processing load for faster decision-making. Redundancy and fail-safe features further enhance reliability.</li><li>Play by the Rules: Robots must comply with <a href="https://www.macrofab.com/blog/safeguarding-pcba-design-from-electromagnetic-interference/" target="_blank">Electromagnetic Compatibility (EMC) regulations</a> to ensure proper operation and avoid interfering with other electronic devices. Shielding techniques and filtering components become necessary.</li><li>Ensure Maintainability: After assembling, it’s crucial to diagnose faults and perform maintenance. Make sure test points are conveniently accessible after the final assembly. Consider implementing Built-in Test (BIT) features on the PCBA for self-diagnostic features or options for wireless troubleshooting.</li></ul><h2> </h2><h3>The Unexpected Factors: When Biology Interferes</h3>Biological influences are often overlooked when designing PCBAs for autonomous robotics but are an important factor. Autonomous robotics may work in many different environments, encountering biological challenges that can undermine even the most robust and reliable designs.<h3>Biofouling</h3>Biofouling, or the accumulation of microorganisms on surfaces, happens most frequently in aquatic environments. However, this issue can also occur within humid industrial settings or food processing facilities. Biofouling causes issues in many ways including:<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1713979758511-1713979758511.png" alt="Biofouling" class="fr-fic fr-dii"><ul><li>Reduced Performance: Fouling on sensors, thrusters, and hulls can decrease efficiency and accuracy. As a result, sensors become less sensitive, propellers drag more, and overall power consumption increases. Special coatings applied to surfaces can deter organism attachment.</li><li>Problems with Navigation: Fouling on navigational equipment leads to positioning and localization errors, which make it difficult for the robot to map its surroundings, keep its trajectory, and reach its destination.</li><li>Maintenance Issues: Regular cleaning to remove biofouling is essential, particularly in remote locations. As a result, downtime occurs and reduces operational efficiency. Prevent biofouling with brushes or wipers, as well as scheduled cleaning protocols.</li><li>Damage and Disruption: Biofouling can cause physical damage by promoting barnacle growth and corroding structures. Choosing materials that discourage organism growth is a passive defense, and monitoring systems can detect biofouling early and trigger automatic cleaning.</li></ul>Especially within industrial and food processing industries, biofouling can create a surprising but challenging issue for logistics robotics in order fulfillment, for example, or other autonomous vehicles. Make sure to consider this possibility when designing for specific applications.<h3> </h3><h3>Biological Challenges Across Environments</h3>While biofouling dominates aquatic environments, other biological factors impact robots in other settings:<ul><li>On Land: Dust, dirt, and debris can accumulate on sensors and cameras in terrestrial robots, hindering performance. Agricultural robots may encounter challenges with mud and plant debris.</li><li>Airborne: Airborne robots face issues with dust, pollen, insects, and other airborne particles that can increase drag, reduce lift, and affect sensor accuracy.</li></ul>To address animal-related challenges, EEs can employ design strategies like:1. Physical Resilence:&nbsp;<ul><li>Challenge: Animals may chew on cables or antennas, causing malfunctions.</li><li>Solution: Employ ruggedized components, reinforced substrates, and protective enclosures to enhance PCBA durability against physical damage from animal interactions. Additionally, utilize encapsulation and conformal coatings to safeguard critical components from moisture, dust, and possible damage by animals.</li></ul>2. Sensor Integrity:<ul><li>Challenge: Animals brushing against sensors can distort sensor inputs, leading to navigation errors.</li><li>Solution: Design sensors with robust shielding, noise filtering capabilities, and redundancy features to ensure reliable operation and accurate data despite potential interference from animals. Develop strategies for preventing animals from brushing against sensors to keep distortions and navigational errors from happening. For example, anti-fouling paints or cages around the robot could prevent fouling, or sensors might be placed where animals cannot access them.</li></ul>3. Mobility Optimization:<ul><li>Challenge: Animals blocking pathways or obstructing movement can impede the robot’s forward progress.</li><li>Solution: Develop strategies to address mobility constraints caused by animals blocking pathways or obstructing movement, ensuring that robots can navigate effectively and complete their objectives. This could include low-power LEDs or subtle sounds that encourage animals to move away. Optimize power management systems to maximize operational autonomy and extend battery life in resource-constrained environments where robots may interact with animals.</li></ul><h3>Security: The Next Level in AMR PCBA Design</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1713979758575-1713979758575.png" alt="AMR PCBA security" class="fr-fic fr-dii">AMR PCBA securityPCB design traditionally focuses on protecting against electrical malfunctions and physical damage. However, for AMRs (autonomous mobile robots) connected to the internet, cybersecurity emerges as a key concern. Hacking hazards present significant security risks. A compromised robot can open the door to major security breaches. Thus, incorporating encryption and secure boot mechanisms in PCBA design is essential to block unauthorized access.Hardware Trojan Horses also pose a silent yet profound threat. These sneaky modifications, made during manufacturing, can go almost unnoticed. To counteract this, it’s critical to partner with trustworthy suppliers and employ hardware authentication methods.Consider working with a partner with a connected technology platform that keeps you in touch with your manufacturing process from start to finish. Moreover, work with a partner that employs robust security practices and can provide proof of such, such as ISO and ITAR certifications, or membership in the ERAI, an organization established to <a href="https://www.macrofab.com/blog/electronics-industry-counterfeit-parts-problem/" target="_blank">combat counterfeit electronics</a> and high-risk components in the electronics industry. MacroFab holds these standards, and it is a member of ERAI.Another challenge is the theft of PCBAs after robot deployment, especially those containing valuable intellectual property. Consider using tamper-evident seals or protective enclosures if you will be installing robotics in an unsupervised area.Want to read more about designing PCBAs for robotics? Read <a href="https://www.macrofab.com/documents/reshaping-robotics-how-pcba-advances-drive-tomorrows-autonomous-solutions/" target="_blank">Reshaping Robotics: How PCBA Advances Drive Tomorrow's Autonomous Soutions</a> now.<h2> </h2><h3>Conclusion: Embracing the Challenge</h3>The realm of PCBA design for autonomous robots transcends the traditional electrical engineer’s domain. While electrical fundamentals remain the cornerstone, navigating the complexities of this field necessitates venturing beyond the confines of the schematic. It’s a world where understanding environmental stresses, mitigating biological influences, and safeguarding against security vulnerabilities are equally critical.By embracing these unique challenges and fostering a spirit of relentless innovation, electrical engineers will become the architects of a new era in robotics. The future holds immense potential for these autonomous machines, with robust, adaptable PCBAs serving as their foundation.Need PCBAs for your robotics project?&nbsp;</section><a href="https://factory.macrofab.com/quick_quote?mbsy_source=c2dfbfd3-8c8b-4098-87b7-c7e0e06119ec&campaignid=62990&mbsy=6DBV3m" target="_blank">GET AN INSTANT QUOTE NOW</a><section><h5> </h5></section>

Autonomous robotics must anticipate and plan for the unexpected, often in harsh, changing environments. We take a deep dive into these challenges by exploring design considerations beyond those associated with conventional PCBAs.

Wired for Autonomy: Confronting PCBA Complexities in Mobile Robotics

Embedded World 2024, held at Nuremberg Messe from April 8 to 11, was a brilliant event for all engineers, designers, and researchers involved in embedded systems.&nbsp;With almost a thousand exhibitors and a huge schedule of related events, Embedded World has really lived up to its reputation of showcasing the industry's cutting-edge.&nbsp;Wevolver team members took the chance to meet engineers from all over the world. Here are some of the highlights.&nbsp;<h2>OKdo: LLMs at the edge.&nbsp;</h2>At Embedded World 2024, <a href="https://www.wevolver.com/profile/okdo" target="_blank" rel="noopener noreferrer">OKdo</a> - a key player in single-board computing and IoT solutions - &nbsp;showcased its significant advancements in industrial computing technologies. One of the highlights was the display from LiquidAI. Liquid AI is developing a new generation of AI foundation models built from first principles - going beyond generative pre-trained Transformers (GPTs). Liquid neural net technologies unlock efficiency, robustness, explainability, and state-of-the-art performance. Generative AI on the edge (for example on a Raspberry Pi 5 or Rock 5a) becomes possible.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEzOTUxMTA5ODUwLU9LIHN0YW5kLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib">The OKdo Embedded World stand. Credit: OKdo.<h2>Enabling cutting-edge PCB design</h2>Altium, a PCB design software company, &nbsp;introduced its new enterprise-grade system, Electronics Lifecycle Management (ELM), a system for enterprise-level hardware design and development, which was a featured presentation in the Exhibit Hall. The booth experience also featured live demos of solutions, including Altium Designer, Altium 365, Nexar API, and Octopart. Altium is transforming electronic development by allowing anyone in the electronics industry to connect with team members and partners and with solutions and data to work more productively.&nbsp;“Altium is uniquely positioned to reshape the future of electronics development and production. We were extremely excited to share our vision of a transformed industry ― which is fast becoming a reality ― with the world’s leaders in embedded technology at Embedded World 2024.” – VP Enterprise Marketing, Altium, Naomi Hamels&nbsp;See Altium in action below:&nbsp;<iframe width="640" height="360" src="https://www.youtube.com/embed/aZeWMmDGFKg?&amp;wmode=opaque&amp;rel=0&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true" data-gtm-yt-inspected-9="true" id="253684619" title="Altium at Embedded World 2024">&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;</iframe><h2>Exploring NXP's advancements in motor control and TSN communication&nbsp;</h2>At Embedded World 2024, NXP showcased advancements in smart edge technologies aimed at improving device automation and connectivity. They introduced new technologies and products for various markets, including automotive, industrial, and smart home sectors. Demonstrations highlighted NXP's solutions for software-defined vehicles, smart home interoperability, and industrial automation. The event also featured expert-led tours and demonstrations exploring AI, edge computing, and more.<iframe width="640" height="360" src="https://www.youtube.com/embed/fFeo0q6AdWA?&amp;feature=youtu.be&amp;wmode=opaque&amp;rel=0&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true" data-gtm-yt-inspected-9="true" id="597216751" title="Wevolver at Embedded World: NXP Semiconductors">&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;</iframe><h2>The latest in automotive local dimming control with Synaptics</h2>AT EW 2024, Synaptics launched its <a href="https://www.synaptics.com/products/embedded-processors" target="_blank" rel="noopener noreferrer">Astra platform</a> of AI-native embedded processors designed to enhance the capabilities of Internet of Things (IoT) devices. This platform focuses on providing multi-modal, AI-enabled microprocessors (MPUs) and microcontrollers (MCUs) that are optimized for power efficiency and high performance. Astra supports a unified software experience across various operating systems and includes an adaptive AI framework, which facilitates the integration of AI into devices. It also offers robust connectivity solutions, such as Wi-Fi and Bluetooth, and is designed to help developers easily incorporate AI features into their products.During our visit, we also got to see their SmartBridge technology live. This advanced automotive display processor is a local dimming IC that supports large, high-contrast, high-resolution automotive LCDs while consuming lower overall power and cost. SmartBridge can handle up to 30-inch displays and 6k resolutions. It leverages a proprietary algorithm to analyze incoming images and control the brightness of each LED in the array.&nbsp;<iframe width="640" height="360" src="https://www.youtube.com/embed/xGelGpfUJFw?&amp;wmode=opaque&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true" data-gtm-yt-inspected-9="true" id="506257900" title="Wevolver at Embedded World: Synaptics Incorporated">&nbsp;&nbsp;&nbsp;&nbsp;</iframe><h2>Code reading with MVTec Software</h2>At the Embedded World 2024, <a href="http://www.mvtec.com" target="_blank" rel="noopener noreferrer">MVTec Software</a> showcased its extensive portfolio of machine vision software, prominently featuring their products HALCON and MERLIC. These products are designed to integrate seamlessly with various hardware configurations, supporting a broad spectrum of operating systems, AI accelerators, CPUs, and embedded boards. The company emphasized the adaptability of their software to different industrial needs, making it suitable for smart cameras, sensors, and other embedded vision applications.MVTec's presentation revolved around the theme "Embedded Vision = YOUR Hardware + OUR Software," underscoring the customizable nature of their solutions to enhance hardware capabilities with sophisticated vision software. This approach not only facilitates enhanced performance and compatibility across different machine vision standards like GigE Vision, GenICam, and USB3 Vision but also promotes quicker time-to-market for products developed using their systems. The technologies highlighted include advanced features for code reading, optical character recognition (Deep OCR), and deep learning applications such as anomaly detection.<iframe width="640" height="360" src="https://www.youtube.com/embed/CHitadg5uKg?&amp;wmode=opaque&amp;rel=0&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true" data-gtm-yt-inspected-9="true" id="37302711" title="Wevolver at Embedded World: MVTec Software Demo">&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;</iframe><h2>The 2024 State of Edge AI Report</h2>At Embedded World we were thrilled to share the 2024 State of Edge AI Report with you. &nbsp;This report represents months of hard work, research, and dedication to exploring the dynamic world of Edge AI applications across industries.<h3>Report Highlights:</h3>#1: Industry-specific insights– Each industry is covered by a dedicated chapter that provides industry-specific insights, descriptions, and examples. ,#2: Real-life case studies – Get comprehensive insights from featured sections of real-world case studies.&nbsp;#3: A look into the future - The report also provides a peek into the exciting generative AI technology and its convergence with edge computing before delving into the challenges still hindering Edge AI today.We hope you download the report below!&nbsp;<iframe width="540" height="665" src="https://c8056756.sibforms.com/serve/MUIFAIvLRE9FbYyICZVAlYl6oaSYA1y_4gbHWS82SbbrrHstSB6VMs2aj57Tvg0e16L_UZVprsukgYH2yB927lpe-0uPg3ZEAhJiDPRQb2_oMEFQLYiEcG6zXHV6DwzxZPaJo25g3EzCRsYZ5z3ey0dkbIZE_M-AQ1kRN3i2_dq-vjEv7FQC29p_-Vu8tD5vbyaerZZF9IYqTQ8D" frameborder="0" scrolling="auto" allowfullscreen="" style="display: block;margin-left: auto;margin-right: auto;max-width: 100%;" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true" data-gtm-yt-inspected-9="true">&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;</iframe>

Wevolver was present at the recent Embedded World event in Nuremberg to launch the 2024 Edge AI report. 


Embedded World 2024: Trends, Tech, and Trailblazers

Silicon Carbide (SiC) wafers are specialized materials employed in semiconductor technology, crafted from silicon carbide. This article explores the advent of silicon carbide (SiC) wafers and how it has opened up new possibilities in power electronics.

Silicon Carbide (SiC) Wafers: Revolutionizing Power Electronics and Beyond

Discover the science behind EMI shielding and its crucial role in ensuring the reliability and performance of electronic devices across various industries.

EMI Shielding: Protecting Electronic Devices in a Noisy World

This article delves into the various types of printed circuit boards, their fundamental concepts, structures, manufacturing processes, and advanced PCB technologies, highlighting their advantages, limitations, and typical applications.

Types of Printed Circuit Boards: A Comprehensive Guide

In the world of electronic design and development, the importance of power analysis has surged, driven by the push for energy efficiency and sustainability in today’s technology. Tools like the <a href="https://www.okdo.com/de/p/qoitech-otii-arc-pro-dc-power-analyzer-5a-max-5v-max/" target="_blank" rel="noopener noreferrer">Qoitech Otii Arc Pro DC Power Analyzer&nbsp;</a>emerge as pivotal solutions, catering to engineers' and designers’ needs to optimize power consumption and enhance device battery life.Advancements in Electronic Design Automation (EDA) and the growing complexity of power delivery networks (PDNs) shape the landscape of power analysis. These developments underscore the need for sophisticated analysis tools that can navigate the challenges of modern electronic design, from managing multiple power domains to optimizing for low power consumption.The Qoitech Otii Arc Pro stands at the forefront of this field, offering precise, in-depth insights into devices’ power usage, facilitating the identification of inefficiencies, and driving the optimization of power management strategies. Its role is crucial in enabling the development of energy-efficient, high-performance devices that meet the demands of an increasingly connected and environmentally conscious world.In this article, we dive into the critical role of power analysis in electronic design and development, highlighting the growing need for efficient power management in the face of advancing technology.<h2 dir="ltr">Overview of the Qoitech Otii Arc Pro</h2>The <a href="https://www.qoitech.com/otii-arc-pro/" target="_blank" rel="noopener noreferrer">Qoitech Otii Arc Pro</a> is a compact, versatile instrument designed for developers and engineers focusing on power analysis and battery optimization for low-power devices. It is a powerful tool, providing real-time analysis and measurements for current, voltage, and power, thereby making it an essential device for optimising energy consumption and extending the battery life of IoT devices and applications.<h3 dir="ltr">Compact and Portable Design</h3>The Otii Arc Pro is characterised by its compact and lightweight design, making it highly portable for field measurements, lab work, and office use. It measures 10.9 x 14.4 x 4.4cm and weighs 450 grams, ensuring ease of transport and use in various environments without a traditional lab setup.<h3 dir="ltr">Powerful Features for Versatile Use</h3>Capable of handling a maximum current of up to 5A and a voltage range of 0.5V to 5V, the Otii Arc Pro can be powered by USB or an external DC adapter, offering flexibility depending on the testing environment and device requirements. Its precise measurement capabilities are complemented by the Otii software, which runs on Windows, Ubuntu, and macOS. It provides an intuitive interface for real-time analysis, statistics generation, and energy consumption monitoring.The device includes various technical specifications, such as a current measurement accuracy of ±(0.1% + 50 nA), voltage accuracy of ±(0.1% + 1.5 mV), and a sample rate of up to 4ksps, making it an accurate and reliable tool for detailed power analysis. The Otii Arc Pro also offers additional functionalities through its software, supporting a wide range of analyses and optimisations for energy consumption.Its ability to conduct detailed power analysis and battery optimisation on the go empowers users to tackle energy efficiency challenges directly in the field, enhancing the development of power-efficient hardware and software solutions.<h3 dir="ltr">Software and Support</h3>The Otii Arc Pro is supported by Otii Basic perpetual software. As part of a recent update, it now includes a perpetual license for Otii Pro software at no additional cost, offering advanced features and capabilities for users who require in-depth analysis and optimization tools. This change provides significant value, allowing access to enhanced functionalities such as scripting and profiling for batteries and energy harvesting solutions without needing a separate subscription. Additional software modules can still be purchased for extended functionalities.<h3>Key Features and Benefits</h3>The Qoitech Otii Arc Pro stands out for its precision, versatility, and user-friendly interface. It is an indispensable tool for developers and engineers focused on power optimization and battery life extension.<h3 dir="ltr">Precise Power Measurement</h3>The Otii Arc Pro distinguishes itself with exceptional accuracy and resolution in power measurements. It offers a current measurement accuracy of ±(0.1% + 50 nA) and a voltage accuracy of ±(0.1% + 1.5 mV), with a sample rate of up to 4k samples per second.&nbsp;This high level of precision is crucial for accurately assessing device power consumption, enabling developers to pinpoint energy inefficiencies and optimise device performance. The precise power measurement capability ensures that even the smallest power draw is accounted for, providing a detailed understanding of a device's energy needs.<h3 dir="ltr">Versatile Application Support</h3>The Otii Arc Pro is designed to support various devices and applications, making it an ideal tool for various sectors, including IoT devices, wearable technology, and any battery-powered device. Its ability to measure current from nA to 5A across a voltage range of 0.5V to 5V makes it versatile enough to handle everything from low-power sensors to more demanding electronic devices.&nbsp;This versatility is further enhanced by its software, which supports real-time energy profiling and optimisation across different stages of development, from initial design to final product testing.<h3 dir="ltr">User-Friendly Software Interface</h3>The Otii software enhances the overall usability of the Otii Arc Pro through an intuitive and customizable interface. It offers users a comprehensive set of analysis tools and project settings, making conducting detailed power and energy measurements easier.&nbsp;The software provides real-time analysis capabilities, allowing for the immediate visualization of power consumption patterns and the identification of power-hungry processes. Users can easily scroll, zoom, and select parts of the current consumption data for in-depth analysis.&nbsp;Additionally, the software supports unlimited undo/redo actions and maintains a fully responsive UI even under heavy data measurement loads, ensuring a smooth user experience.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEyOTIzODM0NDE0LVNjcmVlbnNob3QgMjAyNC0wNC0xMiAxNDEwMTcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib">Otii software comes as powerful yet easy-to-use desktop application for Ubuntu, Windows &amp; macOS. Image: Qoitech.<h3 dir="ltr">Extended Battery Analysis</h3>The Otii Arc Pro's extended battery analysis features offer the capability to simulate various battery profiles and analyze battery life extensively. This functionality is especially crucial for developing portable and remote devices, where battery life is key.&nbsp;The Otii Arc Pro comprehensively assesses a device's performance under various power scenarios by enabling developers to emulate different battery types and conditions. It helps identify potential inefficiencies and optimize battery usage, thereby extending the operational lifespan of the device.<h3 dir="ltr">Integration with Development Workflows</h3>Integration with existing development and testing workflows is another standout feature of the Otii Arc Pro. It supports scripting and automation, allowing developers to automate tests and directly integrate power and energy measurements into their development pipelines.&nbsp;This seamless integration facilitates continuous monitoring and optimization of power consumption throughout the development process, from initial prototyping to final product testing. By enabling automated testing and analysis, the Otii Arc Pro enhances productivity and ensures that power optimization is a consistent focus throughout product development.<h2>Use Cases</h2>The Qoitech Otii Arc Pro has found numerous applications in the real world, showcasing its versatility and effectiveness in optimizing power consumption across a wide range of industries. From ensuring consumer electronics' longevity to enhancing IoT devices' operational efficiency in agriculture, the Otii Arc Pro plays a crucial role in various settings.<h3>Optimizing Power Consumption in IoT Devices</h3>Maintaining optimal power consumption is a critical challenge in the rapidly expanding domain of the Internet of Things (IoT). The Otii Arc Pro is instrumental in addressing this challenge by allowing developers to accurately measure and analyze the power usage of their devices in real-time. This capability is particularly valuable when devices must operate on limited power sources for extended periods, such as in smart home applications, wearable technology, and remote monitoring systems. By identifying and minimizing energy wastage, the Otii Arc Pro helps significantly extend the battery life of these devices, thereby enhancing their reliability and user experience.<h3 dir="ltr">Prolonging Battery Life in Consumer Electronics</h3>Consumer electronics, including smartphones, laptops, and wearable devices, are integral to daily life. The Otii Arc Pro aids manufacturers in these sectors by providing detailed insights into the power consumption patterns of their products. Through meticulous analysis, developers can optimize the energy efficiency of these devices, ensuring they offer longer battery life. This not only meets the consumer's expectations for durability and performance but also contributes to the sustainability of the products by reducing the frequency of charging and lowering the environmental impact.<h3 dir="ltr">Quality Control in Manufacturing</h3>In industrial settings, such as factories, the Otii Arc Pro can be used for quality control to ensure that equipment operates within specified power consumption parameters. This application is crucial for maintaining the efficiency and reliability of manufacturing processes, where any deviation in power usage can indicate potential equipment setup or function issues. By integrating the Otii Arc Pro into their quality control routines, manufacturers can preemptively address these issues, ensuring their machinery operates optimally and reducing downtime.These practical applications underscore the Otii Arc Pro's versatility and effectiveness in enhancing energy efficiency and optimising power consumption across various industries.<h3 dir="ltr">Comparison with Other Power Analyzers</h3>The Qoitech Otii Arc Pro distinguishes itself from other power analyzers in several key aspects, offering unique features and benefits for users focusing on precision, user interface, and efficiency in power analysis and battery optimization.Precision and Measurement Capabilities: The Otii Arc Pro delivers high precision in both current and voltage measurements, essential for accurately gauging the power consumption of devices. It features an impressive current measurement accuracy of ±(0.1% + 50 nA) and voltage measurement total accuracy of ±(0.1% + 1.5 mV), which stands out when compared to many competitors. This level of precision is critical for developers working on low-power devices, where even small inaccuracies can significantly affect the outcome of power consumption analyses.User Interface and Software Features:&nbsp;The Otii software, which comes with the Otii Arc Pro, enhances the user experience by providing a clear and intuitive interface for conducting measurements and analyzing data. It offers a comprehensive suite of features, including the ability to synchronize expansion port and power measurements, thereby making it easier for developers to correlate power consumption with application states. This seamless integration of hardware with software simplifies the process of identifying and addressing power inefficiencies.Unique Features for Battery Optimization:&nbsp;One of the standout features of the Otii Arc Pro is its battery toolbox, which supports battery emulation and profiling. This allows developers to accurately model and test their devices under various battery conditions without the need for physical battery changes, ultimately leading to more energy-efficient designs. By utilizing this feature, companies have been able to switch to smaller, more cost-effective batteries that still meet their operational requirements, such as achieving a battery life of 6 months, thereby enhancing the overall efficiency and reducing the cost of their products.Comparison with Competitors:&nbsp;When compared to other power analyzers, the Otii Arc Pro's combination of precision, ease of use, and specialized features for battery optimization set it apart. For example, its ability to both source and sink current, alongside a comprehensive software suite that facilitates battery emulation and profiling, is not commonly found in other power analysis tools. This versatility makes it an invaluable tool for a wide range of applications, from IoT devices to other battery-powered technologies.<h2>Final Thoughts</h2>The Qoitech Otii Arc Pro has emerged as a pivotal tool in the field of electronics development, particularly for those focused on enhancing energy efficiency and fostering sustainable technology innovations. This compact, yet remarkably powerful device, serves a multifaceted role—acting as a power profiler, DC energy analyzer, power supply, digital multimeter, and SMU, all designed to streamline the development process of electronic devices.One of the Otii Arc Pro's standout features is its ability to precisely source voltage or current while simultaneously measuring these parameters. This capability is critical for engineers and developers aiming to pinpoint and mitigate energy drains within their devices, thereby optimizing battery life and overall energy consumption.Moreover, the Otii Arc Pro's design incorporates a synchronization expansion port and power measurements, enabling seamless correlation of power consumption with the application state, thereby offering a comprehensive view of a device's energy profile.The versatility, precision, and comprehensive feature set of the Otii Arc Pro underscore its value in creating energy-efficient and environmentally friendly electronic solutions. As we look towards a future where sustainability is increasingly paramount, tools like the Otii Arc Pro play a crucial role in enabling developers to meet these challenges head-on, fostering innovations that are not only technologically advanced but also kind to our planet.In conclusion, the integration of the Qoitech Otii Arc Pro into the electronics development workflow offers a pathway to significantly improve product performance and environmental sustainability. By leveraging this tool, developers can gain deeper insights into their devices' energy consumption, unlocking new opportunities for optimization and efficiency that benefit both the end-users and the environment.<h2>References</h2><ol><li dir="ltr"><a href="https://www.electromaker.io/blog/article/unveiling-quitechs-oti-range-of-power-monitors-a-game-changer-for-iot-devices" target="_blank">https://www.electromaker.io/blog/article/unveiling-quitechs-oti-range-of-power-monitors-a-game-changer-for-iot-devices</a></li><li dir="ltr"><a href="https://www.qoitech.com/otii-arc-pro/" target="_blank">https://www.qoitech.com/otii-arc-pro/</a></li><li dir="ltr"><a href="https://www.cnx-software.com/2020/03/20/a-first-look-at-otii-arc-power-supply-power-meter-and-daq-unit/" target="_blank">https://www.cnx-software.com/2020/03/20/a-first-look-at-otii-arc-power-supply-power-meter-and-daq-unit/</a></li><li dir="ltr"><a href="https://www.wevolver.com/specs/otii-arc-pro" target="_blank">https://www.wevolver.com/specs/otii-arc-pro</a></li><li dir="ltr"><a href="https://no.rs-online.com/web/p/power-quality-analysers/2564687" target="_blank">https://no.rs-online.com/web/p/power-quality-analysers/2564687</a></li></ol>

Discover the Qoitech Otii Arc Pro, the ultimate power analysis tool for enhancing device energy efficiency. Learn how its precision, user-friendly interface, and unique battery optimization features can transform your electronic design and development projects for the better.

Qoitech for power analysis and battery optimisation

<h2 id="isPasted">Introduction&nbsp;</h2>Your design choices play a major role in ensuring the quality and reliability of your end product. The key to making good choices is building adaptability and expertise to first understand how your choices will affect the design and how it can be manufactured.This expertise as a PCBA designer will make you stand out in the competitive electronics industry.This e-Book will provide you with the design skills to develop exceptional PCBAs that not only meet but surpass their intended objectives while adhering to tight deadlines and budget constraints. Besides covering the essentials of PCBA design, this invaluable resource will also give you an insight into more advanced approaches and best practices to help even the most experienced designers achieve success. &nbsp; We will cover• Designing for Manufacturability: Discover techniques for optimizing your designs tosimplify manufacturing processes and reduce cost•&nbsp;Designing for Reliability: Understand how to create robust PCBAs that withstandchallenging environments and perform consistently over time• Designing for Testability: Learn to incorporate built-in testing methods to streamlineproduction and improve fault detection.• Designing for Compliance: Explore strategies to ensure your designs adhere to industryregulations and standards.• Designing for EMC Compliance: Uncover the principles behind electromagneticcompatibility and learn how to minimize interference in your PCBA designs.• Designing for PCBA Lifespan: Gain insights on maximizing the longevity and performance of your PCBAs through strategic design choices.Embrace the challenge and embark on this technological journey. You're only one step away from unlocking your full potential in the dynamic world of electrical engineering. Start reading today.<h2>Section One: &nbsp;Designing for Manufacturability: Design Techniques and Best Practices</h2>Design complexity is a daily reality for most PCBA designers, making their jobs increasingly difficult and challenging. This complexity extends beyond design, leading to intricate manufacturing hurdles.Selecting a contract manufacturer that aligns with your design needs is crucial, as every product is unique and quality hinges on a compatible factory. A mismatch can result in manufacturing issues that can persist long after product shipment, causing unfulfilled warranty expectations, financial strain, or even loss of market share.Design is a crucial element in the manufacturing and assembly process, and implementing effective strategies can make all the difference. While "design for manufacturability" (DFM) is a known concept, it is sometimes underappreciated or underutilized by electrical engineers.&nbsp;Design for Manufacturability (DFM) is a proactive approach to designing products that can be consistently manufactured by the designated supply chain with minimal defects. A DFM approach combines best practices with a keen awareness of supply chain limitations, and it can improve the efficiency and quality of manufacturing.By embracing DFM in the design process, electrical engineers can sidestep common problems like high production costs, low yields, extended lead times, and component shortages that tend to surface when DFM is neglected.The purpose of this section is to provide electrical engineers with a deeper understanding of PCBA design guidelines and DFM best practices.&nbsp;<h2 dir="ltr">Best Practices for PCBA Design</h2>To create high-quality, cost-effective, and easily manufactured PCBAs, it's essential to adhere to certain design guidelines that are critical for manufacturability. These include<h3 dir="ltr">Component Placement and Selection</h3>Choosing the right components for your PCBA is crucial for long-term reliability and performance. When selecting components, be sure to:<ul><li dir="ltr">Opt for standard components: Avoid unique or rare components, which may lead to higher costs, limited supplier competition, and increased supply chain disruptions. Standard components are more cost-effective, have a proven track record, and have shorter lead times for better on-time product delivery.</li><li dir="ltr">Conduct a Bill of Materials (BOM) analysis:&nbsp;A streamlined BOM can help reduce manufacturing costs. Fewer parts result in less purchasing activity, lower inventory needs, simplified inspections, and easier testing protocols. Careful creation and review of the BOM are essential to achieve this.</li><li dir="ltr">Use multi-functional parts: Choose components that serve multiple purposes, such as a cover or base plate that also functions as a heat sink.&nbsp;</li><li dir="ltr">Account for Moisture Sensitivity Level (MSL):&nbsp;Identify the MSL for all components and ensure the exposure time on the production floor is controlled. This helps prevent moisture-induced damage to sensitive components.</li></ul><h3 dir="ltr">Improve PCBA Design with Lean Processes</h3>As you tackle your PCBA design, remember to prioritize efficiency. Remove any unnecessary steps or elements that don't contribute to your product's overall quality or function. By simplifying the supply, fabrication, and assembly processes, you'll not only increase accuracy and speed but also make your PCBA easier to manufacture.&nbsp;<ul><li dir="ltr">Use consistent traces: Use consistent trace widths and avoid overly complex routing patterns to facilitate a smooth and easy manufacturing and inspection process</li><li dir="ltr">Optimize component placement:&nbsp; Choose careful component placement to minimize trace lengths and reduce the chance of signal interference</li><li dir="ltr">Collaborate with manufacturers:&nbsp; Engage in early and ongoing communication with your CM to ensure design compatibility and address potential issues to improve and enhance manufacturability.&nbsp;</li></ul><h3 dir="ltr">Optimize Trace Routing and Layout</h3>Some key aspects to consider while optimizing trace routing and layout are:<ul><li dir="ltr">Trace Widths and Spaces:&nbsp;Choose trace widths and spaces according to the guidelines provided by IPC-2221 to ensure the efficient distribution of electrical signals and reduce signal interference.</li><li dir="ltr">Layer Stackup:&nbsp;Design a balanced layer stack-up that promotes efficient signal routing and thermal management, considering factors such as signal integrity and power distribution.</li><li dir="ltr">Routing Techniques:&nbsp;Implement appropriate routing techniques, such as using differential pairs, controlled impedance traces, and avoiding 90-degree angles, to maintain signal integrity and reduce the possibility of electromagnetic interference (EMI).</li><li dir="ltr">Ground and Power Planes: Design solid ground and power planes to provide adequate electrical and thermal performance while minimizing noise and crosstalk.</li><li dir="ltr">Design for Signal Integrity: Consider factors such as trace impedance, trace length matching, and proper termination to ensure the signals maintain integrity throughout the circuit.</li></ul><h3 dir="ltr">Implement Design for Manufacturing (DFM) &amp; Design for Test (DFT)</h3>The DFM process focuses on designing products to be easily and cost-effectively manufactured. By considering factors such as materials, component placement, and fabrication techniques, DFM aims to minimize production costs, reduce the risk of manufacturing defects, and increase the overall efficiency of the manufacturing process. &nbsp;DFT on the other hand, ensures the PCBA can be tested and diagnosed efficiently. This process involves designing the board to be easily accessible for testing equipment, incorporating test points, and providing the necessary documentation for test engineers. &nbsp;Consider:&nbsp;<ul><li dir="ltr">Utilize Design Rules Check (DRC): Employ DRC to verify design compliance with industry standards, evaluating parameters like trace widths, spacing, hole sizes, and component placement to ensure successful fabrication.</li><li dir="ltr">Detect and Address Design Issues Early: Using DRC and DFT tools helps identify potential design violations or testability problems early, allowing designers to resolve them before manufacturing</li></ul>Implementing these tools can help detect potential design violations or testability issues early in the process, enabling designers to address them before the manufacturing stage, ultimately saving time and reducing costs.MacroFab's DFM Check:After an order is placed, MacroFab runs an extensive DFM check to ensure the highest quality PCBAs. This analysis includes evaluating the design's manufacturability and identifying potential issues impacting the production process. &nbsp;By utilizing MacroFab's proactive approach, customers can avoid costly rework and achieve faster time to market.&nbsp;<h2 dir="ltr">Challenges in PCBA Manufacturability</h2>The field of circuit board assembly has evolved significantly since its inception, leading to the development of advanced technologies and assembly methods that enable the creation of innovative electronic devices. However, these advancements have also brought about certain challenges when it comes to manufacturing PCBAs.So, what kind of challenges are we talking about? Let's explore some of the common issues that arise with popular PCBA design choices.Join thousands of engineers who have unlocked their full potential! Download the complete MacroFab's Engineering Essentials guide (over 70 pages) and gain the insights trusted by leading professionals in the industry.<a href="https://www.macrofab.com/documents/pcba-design-handbook-2023/" target="_blank" rel="noopener noreferrer">Download now</a>

To excel in the fast-paced electronics industry, you need not just adaptability, but a cultivated expertise to discern the far-reaching impact of your design decisions. This eBook is your key to building such expertise.

Engineering Design Essentials: The PCBA Design Handbook

Are you an EE looking for a new podcast?  Here's a list of MacroFab Circuit Break episodes to get you started. 

The Perfect Binge! Top 8 Circuit Break Episodes for New Listeners

Is there anything better than a good cup of coffee? It's devine when it's hot, and deliciously refreshing when it's iced.&nbsp;…But room-temperature coffee? Not so great.&nbsp;For most adults around the world, brewing a hot cup of coffee is an established part of our morning routine. But when you have a busy day, it’s easy to get preoccupied and neglect your coffee until it cools to an unpleasant temperature.Duru Uluk, a Voltera test engineering intern, set out to find a solution to this problem. Her goal was to create an induction mug heater using in-mold electronics (also known as in-mold structural electronics).In-mold electronics (IME) processes involve printing conductive inks on moldable plastic films, which are then formed into a desired 3D shape. In the full IME process, after thermoforming, the part is passed along to injection molding, where it is molded in plastic and the electronics become part of the entire structure.&nbsp;In IME, the electronics are printed using a standard process of screen-printing traces onto thermoformable plastics, but new innovative materials — like specially formulated functional inks optimized for high single-stretch operation — allow the traces to stretch into the new thermoformed shape and maintain conductivity.&nbsp;This technology is particularly exciting for automotive and aerospace applications, where thousands of feet of copper wire could be replaced with conductive traces integrated directly into the vehicle’s panels to reduce the vehicle’s weight and improve efficiency. Incorporating IME into vehicle construction also presents opportunities for new design concepts, features, and functionality — like the ability to incorporate strain sensors directly into panels to monitor for damage, interactive surfaces in the interior vehicle panels, or to heat and de-ice the wing of an airplane during flight.&nbsp;In the image below, all the red components identify the wire in a vehicle:<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712283732859-63b49367152a021e60088642_3ZoHWv-Zic4V11X_3xOkWv831wmyc-hbLHIuslxurYTiXj6bsTy7zNxC97dVW-rYkGLgtJeYYhR5KCm91dpma-EpW2wOgcFG4d_InqrlcJFlFDp3zdS57GulmRe_iM-7DsUkP7ZUhs4RA1FXQ5HbMhmn9_Hgoqkd0BlsUhtZOuHgArS5v-Nn0GG6gaZX3.png" style="width: 100%px;" class="fr-fic fr-dib"><ul id="isPasted"><li>One vehicle has 5000 feet of wires = 50 lbs of copper.</li><li>Transporting 50 lbs burns 12 L of gas per year.</li><li>70,000,000 new cars produced per year.</li><li>840,000,000 L of gas is burned to transport copper cables per year.</li></ul>‍In addition to this example of copper wire, IME offers plenty of other opportunities to reduce the mass of many vehicle components, like the headlight assembly, dashboard, center console, and more.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712283763549-63b49367f5596f24c741daec_4ZpHDUtkWx5wmeYtb6X6YjGlsuiVxdPXJ3H64MFHHtiDpTG1Bil6Mat9evncEvLP-DsCX7T2TC63nZtB5DzKQI8Vs98V-vE0R6e3Xbh6oy2iLiPHV6t7InCwE-C3-Mv_9XaLvGjKOrAfnppvIszjmAkMSYyGpSKIKpmn1A621NCHPe04dRGFy75i-Om81.png" style="width: 100%px;" class="fr-fic fr-dib"><a href="https://www.idtechex.com/en/research-article/what-does-2023-hold-for-printed-flexible-electronics/28172" target="_blank" id="isPasted">IDTechEx</a> anticipates the mainstream adoption of in-mold electronics in automotive interiors to begin in 2023, and is forecasting that electronics will be printed onto 3D surfaces, like door panels, in 2026.&nbsp;<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712283778550-63b49367684ec45971bc70ac_9Gf654z1WMdopCZ5ZMfeK0mO-ZCYnQ1bpkpRVMCY4A4crd2KzqLzh6pao8OoT3ACsO7xnDTdqSfhdTUkRLs-flCOWGlTTjWUHQElpJ__YKFBoiHltw43eQPxsSzSt6DFJUnZ7ONaolf9Fv32CugpbDAMtWnRMf7bRfl-XDBMCBhXX--1QKBBwFR8jUAWd.png" style="width: 100%px;" class="fr-fic fr-dib">Roadmap for selected emerging printed/flexible electronics technologies. Source: IDTechExBut let’s get back to Duru’s coffee conundrum.&nbsp;Using&nbsp;<a href="http://voltera.io/nova" target="_blank">NOVA</a>, a&nbsp;<a href="https://mayku.me/formbox" target="_blank">Mayku Formbox</a>, and a&nbsp;<a href="https://formlabs.com/3d-printers/form-2/" target="_blank">Formlabs 3D printer</a>, Duru designed and built a mug heater with in-mold electronics technology.&nbsp;“During my co-op term at Voltera, Matt (Ewertowski, Product Manager) was my supervisor and also just a super cool person to talk to. We had conversations about different applications of NOVA and how flexible substrates open doors to a lot of different project ideas,” Duru recalled. “He suggested the idea of using the Mayku Formbox alongside NOVA for an in-mold electronics project. I did some research about making molds, molded electronic applications, and coil heaters — and from there it seemed feasible enough to continue with a demo.”&nbsp;So, Duru got to work. First, she used the Formlabs Form 2 3D printer to create a resin mold, and then used NOVA to print traces onto the Mayku Formbox substrates. Finding the optimal baking temperature for the Mayku substrates was a bit of a challenge, since they aren’t intended for IME, but with some experimentation and a bit of help from Mayku, she eventually found the right temperature and baking time to avoid substrate deformation. Once the curing temperature was refined, Duru encountered trace breakage during the forming process. Through some trial and error, Duru refined the design of the mold and the traces until she was successful in creating a design that could be thermoformed and maintain conductivity.&nbsp;<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712283802120-63b49367bedfeccaa9cf2122_18Qk-iwOjIp00g_snsqEE-x33qu6yTIyGZgI7LuwCgRcaZM_MqpFYbKCYiJuFZBouwEXx12yQES8yTL8EyCsHTZdx9tJe3hHoxa_25BT4I0v1AKIbJnATzxzcMlx7Sax3lK_uGQrK_F9idp-Fxa-5rsh0MAJA5HS_IV8y-YJOUrY7bGJacjQY-0kMgNi_.png" style="width: 100%px;" class="fr-fic fr-dib">“It took several iterations to achieve a design that ensured a fully conductive trace with no breaks. When the baked print goes into the Mayku Formbox, the substrate is being heated and deformed,” she explained. “There are so many factors to consider. Will the conductive ink be damaged? Will the substrate be damaged? That required a lot of correspondence with people to get information about melting points and what not, including <a href="https://insulectro.com/" target="_blank" id="isPasted">Insulectro</a>, who supplied us with the ink — they really helped out. But the biggest issue was of course the sharp angle of the mold, causing the trace to be deformed to a point where it is no longer conductive. And that’s why I had to gradually reduce that angle and on the trace edges.”&nbsp;<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712283815611-63b493679710e828f9389688_waXyaVYzojKJhCnZk3L-4449I7fgizrTBOeX5J_OFFrewsSraWdgajH_SZWHidk2TmHiCQQyixG-GXwRC5MjWiTqBm1HuSU0SPIVCTu_nf4hCdQgQfHpeLhQ5nWupJ7h9OA6rmDnQfC3-dykkJzPrYl_hx-uljy8UhHay90NQDdw1DOL--90k-rxEUl0.jpeg" style="width: 100%px;" class="fr-fic fr-dib">Despite the challenges of the project, Duru loved working with <a href="https://www.youtube.com/watch?v=T62cUY8uj8M" target="_blank" id="isPasted">NOVA</a>. “Everyday I was excited to use the NOVA just because of how cool it is. The user interface is super easy to use, the modular design and the way everything magnetically clicked into place, the sounds, the lights, etc.” she noted. “I also love NOVA’s ability to work with various substrates. I worked a lot with flexible substrates during my time at Voltera, so the vacuum feature was being used frequently.”<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712283834936-63b4936799db03ad4a1aacaf_ZS6BCi4fHe5wPMhX5X845YVFQK8foJ0C90XCCX2Q0EIZFQ_TL2AX2fVH2gvyMzbL3mfu1mFjlED5rciLDX-kYKeIIYwMn4lQYjsoLvpLbzf2P3dVsHL8YTW0Qjss0gFxsrC5DuwivgbeDPpdGys4vfyDzQ2fmShgr4FPqtWeknJUgW3gxonzz5EeLXoV.jpeg" style="width: 100%px;" class="fr-fic fr-dib">In Duru’s eyes, there are so many exciting applications for the technology. “In biomedical applications, for example, you could use in-mold electronics to build medical tools or prosthetics that are ergonomic and accessible, with electronic components integrated through in-mold processes — to easily incorporate electronics into things that have awkward shapes, or have been challenging to design using traditional methods. And in cases like these, being able to use NOVA to build electronics that fit a specific, custom shape may be a great advantage.”&nbsp;The experience of working with NOVA was inspiring for Duru, and piqued her interest in electronics innovation. “During my time working with NOVA I gained a big interest in additive electronics and learned a foundation of knowledge (about conductive inks, substrates, rheology) that I still bring up at every chance I get,” she said. “I also got inspired to tinker more. Having access to benchtop tools like the NOVA would enable people to tinker freely and try new things — which is beneficial to the engineering iteration process.”&nbsp;Working at Voltera also impacted Duru’s career aspirations. “Many of my co-op placements have been R&amp;D specific. During my future career I think I’d like to work in spaces where I have access to tools like NOVA while doing R&amp;D work and product development. My perspective has shifted to appreciate the potential of additive electronics in&nbsp;<a href="https://www.researchgate.net/publication/361717600_Inkjet_and_Extrusion_Printed_Silver_Biomedical_Tattoo_Electrodes" target="_blank">biomedical applications</a> — for example the&nbsp;<a href="https://uploads-ssl.webflow.com/6334888a34bfac03b46aa715/633c55566e5bffe8db61ba27_NOVA-0082%20-%20Insole%20Case%20Study_v2.pdf" target="_blank" data-lf-fd-inspected-kn9eq4roawkarlvp="true">in-sole pressure sensor</a> project I did, or things like wearable biomarker sensors.”And now, thanks to her in-mold mug heater, Duru can iterate for hours and never have to worry about her coffee getting cold.&nbsp;

Duru Uluk, a Voltera test engineering intern, created an induction mug heater using in-mold electronics (also known as in-mold structural electronics).

Warming Your Coffee with In-Mold Structural Electronics

Gold and platinum group metals such as palladium, platinum and iridium are in high demand for use in electronics. However, sourcing these metals from mining and current electronics recycling techniques is not sustainable and comes with a high carbon footprint. Gold used in electronics accounts for 8% of the metal’s overall demand, and 90% of the gold used in electronics ends up in U.S. landfills yearly, the study reports.&nbsp;The study, led by <a href="https://chbe.illinois.edu/" target="_blank">chemical and biomolecular engineering</a> professor <a href="https://chbe.illinois.edu/people/profile/x2su" target="_blank">Xiao Su</a>, describes the first precious metal extraction and separation process fully powered by the inherent energy of electrochemical liquid-liquid extraction, or e-LLE. The method uses a reduction-oxidation reaction to selectively extract gold and platinum group metal ions from a liquid containing dissolved electronic waste.&nbsp;In the lab, the team dissolved catalytic converters, electronic waste such as old circuit boards, and simulated mining ores containing gold and platinum group metals using an organic solvent. The system then streams the dissolved electronics or ores over specialized electrodes in three consecutive extraction columns: one for oxidation, one for leaching and one for reduction.&nbsp;“The metals are then converted to solids using electroplating, and the leftover liquid can be treated to capture the remaining metals and recycle the organic solvent,” Su said. “The stream containing the organic extractant is then pumped back to the first extraction column, closing the loop, which greatly minimizes waste.”<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712185056672-224788.jpg" style="width: 768px;" class="fr-fic fr-dib">This schematic diagram details the electrochemical extraction device used in Su’s laboratory. Graphic courtesy Xiao SuAn economic analysis of the new approach showed that the new method runs at a cost of two orders of magnitude lower than current industrial processes. “The social value of this work is really its ability to produce green gold quickly in a single step, greatly improving transparency and trust in conflict free recycled precious metals,” said postdoctoral researcher Stephen Cotty, the first author of the study.&nbsp;Su said one of the many advantages of this new method is that it can run continuously in a green fashion and is highly selective in terms of how it extracts precious metals. “We can pull gold and platinum group metals out of the stream, but we can also separate them from other metals like silver, nickel, copper and other less valuable metals to increase purity greatly – something other methods struggle with.”The team said that they are working to perfect this method by improving the engineering design and the solvent selection.Research scientist Johannes Elbert and graduate student Aderiyike Faniyan contributed to this study. Su also is affiliated with the <a href="https://beckman.illinois.edu/" target="_blank">Beckman Institute for Advanced Science and Technology</a> and a professor of <a href="https://cee.illinois.edu/" target="_blank">civil and environmental engineering</a> at Illinois. &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp; &nbsp;&nbsp;The U.S. Department of Energy supported this study. The University of Illinois Urbana-Champaign has filed a provisional patent on the technology presented in this work. The authors declare no competing financial interest.&nbsp;

A new study from the University of Illinois Urbana-Champaign shows how electrochemistry can be used to extract precious metals from discarded electronics in an efficient and environmentally friendly manner. Photo by Fred Zwicky

A new method safely extracts valuable metals locked up in discarded electronics and low-grade ore using dramatically less energy and fewer chemical materials than current methods, report University of Illinois Urbana-Champaign researchers in the journal Nature Chemical Engineering. 

Electrochemistry helps clean up electronic waste recycling, precious metal mining

<h1 id="isPasted">Cybersecurity &amp; the Supply Chain: Safeguarding PCBA Builds</h1><section><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712161626033-1712161626033.png" alt="Cybersecurity supply chain first" class="fr-fic fr-dii">In today's hyper-connected world, the intersection of cybersecurity and the global supply chain has become increasingly crucial, particularly for electronics organizations. The growing reliance on digital technology and the Internet of Things (IoT) has given rise to new challenges, exposing vulnerabilities in cybersecurity measures and creating opportunities for cybercriminals.In this blog post, we'll explore the current state of cyberattacks, the staggering financial and reputational costs of cybercrime, and the steps organizations can take to protect their Printed Circuit Board Assembly (PCBA) builds while fulfilling their ethical obligations to end users and the wider community.<h2></h2><h3>The State of Cyberattacks</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712161626427-1712161626426.png" alt="State of cyberattacks" class="fr-fic fr-dii">As we delve into the murky world of cyber threats, it's essential to understand the various attacks prevalent today. The cost of cybercrime is on the rise. With businesses becoming increasingly digital, the opportunities for cybercriminals are growing. In 2022, the estimated global cost of cybercrime was a staggering $600 billion, expected to rise in the coming years.The digital world has observed a striking surge in ransomware assaults in recent years. These pernicious attacks not only freeze critical business functions, potentially leading to significant operational losses, but they can also inflict substantial financial penalties and tarnish an organization's reputation. Prominent cases such as the Colonial Pipeline incident in 2021 serve as stark reminders of the potential scale and real-world implications of these attacks.The rapidly expanding ecosystem of the Internet of Things (IoT) is increasingly falling under the crosshairs of cybercriminals. This interconnected network of devices, particularly integral and of interest to the electronics industry, often lacks stringent security protocols, making them prime targets for exploitation. Notably, the Mirai botnet attack of 2016, which commandeered IoT devices to launch distributed denial of service (DDoS) attacks, illustrates the inherent vulnerabilities of these systems.Persistent threats from nation-state actors continue to menace government institutions and organizations, drawn by the cache of sensitive information they harbor. The U.S., with its vast digital infrastructure and wealth of data, remains a high-profile target, enduring an incessant barrage of cyberattacks. Examples of this include the SolarWinds hack of 2020, widely attributed to a nation-state actor, which infiltrated numerous U.S. government agencies.<h2></h2><h3>How Cybercrime and PCBA Design Interconnect</h3>PCBA design plays a significant role in determining the security and integrity of electronic devices, as it influences the effectiveness of security measures, exploitable vulnerabilities, and how resilient electronic devices are to cyber threats.In this context, a well-executed PCBA design, integrating robust security practices, can help safeguard against cybercrime. Conversely, a poorly designed PCBA can create vulnerabilities that cybercriminals can exploit, leading to data breaches, unauthorized access, and other malicious activities.Here are some specific ways PCBA design can enhance or undermine cybersecurity:<ul><li>Device Vulnerabilities: PCBA design plays a crucial role in determining the security of electronic devices. If a PCBA is poorly designed, it may have vulnerabilities that can be exploited by cybercriminals. For example, inadequate security measures, weak authentication mechanisms, or insufficient protection against tampering could make the device more susceptible to cyberattacks. Several <a href="https://nvd.nist.gov/vuln/detail/CVE-2021-42114" target="_blank">modern DRAM devices</a> were affected by a novel Rowhammer attack in 2021.</li><li>Malware and Backdoors: Cybercriminals may target PCBA design to introduce malware or backdoors into electronic devices. By compromising the PCBA design process or the supply chain, attackers can inject malicious code into the firmware or hardware of the device, allowing them to gain unauthorized access, control the device remotely, or steal sensitive information.</li><li>Data Breaches: PCBA design flaws can also contribute to data breaches. If a PCBA lacks proper encryption mechanisms or fails to implement secure communication protocols, cybercriminals may intercept or manipulate data transmitted by the device, leading to the compromise of sensitive information.</li><li>Countermeasures: Conversely, PCBA designers need to incorporate cybersecurity measures into their designs to mitigate the risks of cybercrime. This includes implementing secure communication protocols, strong encryption algorithms, secure authentication mechanisms, and physical protection against tampering. By considering cybersecurity during the PCBA design process, designers aim to minimize vulnerabilities and enhance the overall security of the device.</li><li>Forensics and Investigation: In the aftermath of a cybercrime incident, PCBA design can play a role in forensic analysis and investigation. Experts may examine the PCBA design, firmware, or components to identify potential vulnerabilities, backdoors, or traces of tampering. This analysis can help in understanding the nature of the cyberattack, attributing it to specific actors, and taking appropriate measures to prevent future incidents. After the SolarWinds supply chain attack in 2020, cybersecurity experts investigated both the affected software and the hardware it interacted with.</li></ul>The impact of PCBA design on cybersecurity cannot be overstated. A poorly designed or delivered product with design flaws or vulnerabilities not only risks user data and privacy but also puts individuals and organizations at risk of financial loss and reputational damage.As such, it is imperative for companies to invest in robust PCBA design processes, incorporate best practices for security, and conduct thorough testing and evaluation to identify and address potential vulnerabilities.To avoid the financial repercussions of delivering a product leading to a cyber breach, companies should ensure they maintain continuous high standards for PCBA design and protection during manufacturing by working with a trusted manufacturing partner who takes security seriously. By prioritizing cybersecurity, companies can contribute to a safer digital landscape, bolster user trust, and mitigate the risks associated with cybercrime.<h2></h2><h3>The Cost of Cybercrime</h3>Cybercrime carries far-reaching financial implications. For example, in the U.S., the average cost of a data breach in 2022 was estimated to be $8.64 million. Moreover, the time it takes to identify and remediate a breach is also a significant factor in the overall cost. On average, it takes organizations 280 days to identify and contain a breach, during which the cybercriminals can cause substantial damage.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712161626668-1712161626668.png" alt="Cost of cybercrime graph1" class="fr-fic fr-dii">Source: <a href="https://cybersecurityventures.com/cybercrime-damage-costs-10-trillion-by-2025/" target="_blank">Cybercrime Magazine</a> Projections suggest that by 2025, the annual cost of cybercrime will skyrocket to $10.5 trillion, almost tripling the cost recorded in 2015.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712161626744-1712161626744.png" alt="Cost of cybercrime graph2" class="fr-fic fr-dii">Source: <a href="https://www.statista.com/statistics/273575/us-average-cost-incurred-by-a-data-breach/" target="_blank">Statista</a>Furthermore, reputational damage, loss of customer trust, and potential legal repercussions can have far-reaching effects hard to quantify but are just as damaging.<h2></h2><h3>Protective Measures for Electronics Organizations Against Cyber Threats</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712161626943-1712161626943.png" alt="Protective measures" class="fr-fic fr-dii">The cost of cybercrime is expected to soar in the coming years. Global expenditure in the cybersecurity market is projected to rise by $5.7 trillion between 2023 and 2028, reaching a staggering $13.82 trillion by 2028. Electronics organizations are particularly vulnerable, as cyberattacks can lead to intellectual property theft, product counterfeiting, and fraud.To address these challenges, manufacturers must adopt a comprehensive approach to cybersecurity. This section outlines several data-driven steps manufacturers can take to protect themselves against cyber threats.<h3></h3><h3>Uphold IP Confidentiality Throughout Manufacturing</h3>For electronics organizations, ensuring the protection of intellectual property (IP) during the manufacturing process is of paramount importance. This is due to the potential of cyberattacks and theft. Here are some actionable steps to guarantee IP confidentiality throughout manufacturing:<ul><li>Secure File Sharing: Adopt secure practices for sharing design files with contract manufacturers (CMs). Measures could include file encryption, password protection, and the use of secure file transfer protocols. Access to design files should be strictly limited to necessary personnel.</li><li>Trusted Partners: Maintain a strong relationship with CMs known for protecting sensitive information. Perform regular security audits to verify compliance and ensure they have robust cybersecurity defenses.</li><li>Non-disclosure Agreements (NDAs): Establish NDAs with CMs and other partners who handle sensitive design files. These agreements should stipulate each party's responsibilities concerning IP protection and penalties for breaches.</li><li>Design Obfuscation: Consider employing techniques that make unauthorized understanding or reverse-engineering of design files challenging. These could include splitting designs across multiple files or using proprietary file formats.</li><li>Monitoring and Tracking: Consistently oversee and track the handling of design files throughout the manufacturing process. Implement a system that records access to sensitive files</li><li>Manufacture in IP-strong locations: Manufacturing in countries with robust IP laws, like the USA and Mexico, further protects designs against cyber attacks.</li><li>Employee training: Train employees on the importance of IP protection and the potential consequences of IP theft. Encourage a culture of cybersecurity awareness and vigilance within the organization. Ensure all manufacturing partners do the same.</li></ul>By taking these proactive measures, electronics organizations can significantly reduce the risk of IP theft during manufacturing, helping maintain their competitive edge and protect their investments in research and development.<h3></h3><h3>Mitigate Counterfeit Component Risks through Strategic Sourcing</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712161627129-1712161627129.png" alt="Mitigate conterfeit component risks" class="fr-fic fr-dii">A 2020 study by the Alliance for Gray Market and Counterfeit Abatement (AGMA) found that counterfeit components in the technology industry lead to an estimated loss of $28 billion in revenue annually. Ensuring components are sourced from reliable and verified suppliers can help mitigate this risk.Not only can counterfeit components lead to system instability, failures, or unusual behaviors that can aid a cyberattack, but they can also allow embedded malware and hardware trojans to be activated once the PCBA they're attached to has been used. By doing so, hackers can gain unauthorized access to sensitive data or disrupt the device's operations.To mitigate these risks, companies should maintain the integrity of their supply chain by vetting suppliers carefully and by using secure hardware and software design practices to protect against threats.<h2></h2><h3>Conclusion</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1712161627252-1712161627252.png" alt="Cybersecurity supply chain conclusion" class="fr-fic fr-dii">In conclusion, the rapidly evolving landscape of cyber threats and the significant financial and reputational damages that cyberattacks can inflict necessitate proactive measures to safeguard businesses, particularly in the electronics industry. As cybercrime costs continue to rise, organizations must prioritize implementing robust cybersecurity strategies to protect their valuable assets and intellectual property.By adopting various data-driven protective measures, such as detection and prevention tools, employee training, response planning, IP protection, and secure strategic sourcing, organizations can effectively mitigate cyber risks and create a more resilient and secure environment for their operations. Proactive investment in cybersecurity is essential for the survival of individual businesses and plays a crucial role in maintaining the integrity and security of the global supply chain.</section><h4>Discover How MacroFab Can Keep Your IP Safe&nbsp;</h4><a href="https://www.macrofab.com/prototyping/intellectual-property/" target="_blank">PROTECT YOUR BUILDS WITH MACROFAB</a>

Hackers can access sensitive data and disrupt device operations by activating embedded malware or hardware trojans in counterfeit components.  How can you avoid these issues? 

Cybersecurity and the Supply Chain: Safeguarding PCBA Builds

This comprehensive series delves into the fundamentals of PCB design, including design workflow, signal integrity, manufacturing, testing and debugging, advanced design techniques, and the latest software and tools available for PCB design.

PCB Design: A Comprehensive Guide to Printed Circuit Board Design - Part 2

PCB Design: A Comprehensive Guide to Printed Circuit Board Design - Part 1

Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.

What is a Semiconductor? A Comprehensive Guide to Engineering Principles and Applications

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semiconductors

This article provides a detailed understanding of microprocessor vs integrated circuit, their basics, key differences, future trends, challenges, and how they synergize to form the backbone of our digital systems.

Microprocessor vs Integrated Circuit: Unveiling the Core of Modern Technology

semiconductors

What is a Semiconductor? A Comprehensive Guide to Engineering Principles and Applications

Profiles