The Ezurio Sona IF573 Modules, powered by Infineon's AIROC CYW55573 chipset, are designed for industrial IoT connectivity. These modules offer robust support for Wi-Fi 6E (802.11ax) and Bluetooth v5.4, utilizing the 6GHz spectrum for enhanced wireless performance. The IF573 modules feature integrated Power Amplifiers (PA) and Low Noise Amplifiers (LNA), with 2x2 MU-MIMO antennas to ensure reliable connectivity, even in challenging RF environments. Available in pluggable card and SMT M.2 formats, the modules support PCIe and SDIO interfaces, making them adaptable to various industrial applications. These modules are built to withstand industrial temperature ranges and are compatible with many Linux kernels, including v6.1.x, through the Linux Backports package. 

Sona IF573 Modules Features  

Ezurio Sona IF573 Modules offer a comprehensive feature set designed to meet the demanding requirements of industrial IoT applications. These modules provide reliable connectivity, enhanced performance, and security to ensure seamless integration and operation in challenging environments. Let’s explore some of its notable features:

Connectivity and Performance

The Ezurio Sona IF573 Modules are equipped with the Infineon AIROC CYW55573 chipset, enabling reliable and high-performance wireless connectivity. These modules support both Wi-Fi and Bluetooth technologies, operating seamlessly within industrial temperature ranges. With access to PCIE and SDIO interfaces, the IF573 modules offer versatile integration options for various industrial IoT applications. 

Feature Set and Standards

The IF573 modules boast a rich feature set, including 802.11ax Wi-Fi 6E and Dual-Mode BT v5.4 support for the 6GHz spectrum. This ensures compatibility with the latest wireless standards and provides enhanced data rates and efficiency. Additionally, the modules support WPA3 security standards, safeguarding sensitive data and protecting against unauthorized access.

Physical Specifications

The Ezurio Sona IF573 Modules are available in two form factors: M.2 1318 SMT and M.2 2230 Key E pluggable. This flexibility allows for easy integration into different hardware configurations. The modules operate within a wide temperature range of -40°C to +85°C, making them suitable for demanding industrial environments.

Wireless Specifications

The IF573 modules offer 2x2 Wi-Fi 6E and 1x1 Bluetooth 5.4 wireless specifications, providing robust connectivity and high data rates. They support 2.4GHz, 5GHz, and 6GHz frequencies (up to 7.125GHz), ensuring compatibility with various wireless networks. The modules are equipped with an Infineon AIROC CYW55573 chipset and have obtained certifications from FCC, IC, CE, MIC, RCM, and Bluetooth SIG.

Interfaces and Data Rates

The IF573 modules feature PCIE v3.0 Gen 2 (Wi-Fi) and HCI using HS-UART (BT) interfaces, allowing for seamless communication with host devices. Additionally, they support SDIO 3.0 (Wi-Fi) and HCI using HS-UART (BT) for flexible connectivity options. The modules offer maximum data rates of up to 574Mbps at 2.4GHz and up to 1.2Gbps at 5/6GHz, ensuring efficient data transfer.

Applications

The Sona IF573 Modules are ideal for a wide range of industrial IoT applications requiring reliable and high-performance wireless connectivity. These modules are well-suited for factory automation, smart grids, building automation, transportation, and logistics. Their robust design, wide temperature range, and comprehensive feature set make them suitable for demanding industrial environments. The IF573 modules can be used to connect various sensors, actuators, and devices to create intelligent and efficient industrial systems.