Explore key methods like Direct Ink Writing, screen printing, and jet dispensing, and learn how Voltera’s V-One and NOVA are transforming the solder paste application process for improved accuracy and efficiency.

Cutting-Edge Methods of Solder Paste Application for Electronics Manufacturing

<p id="isPasted">Imagine being able to build an entire dialysis machine using nothing more than a 3D printer.</p><p>This could not only reduce costs and eliminate manufacturing waste, but since this machine could be produced outside a factory, people with limited resources or those who live in remote areas may be able to access this medical device more easily.</p><p>While multiple hurdles must be overcome to develop electronic devices that are entirely 3D printed, a team at MIT has taken an important step in this direction by demonstrating fully 3D-printed, three-dimensional solenoids.</p><p>Solenoids, electromagnets formed by a coil of wire wrapped around a magnetic core, are a fundamental building block of many electronics, from dialysis machines and respirators to washing machines and dishwashers.</p><p>The researchers modified a multimaterial 3D printer so it could print compact, magnetic-cored solenoids in one step. This eliminates defects that might be introduced during post-assembly processes.</p><p>This customized printer, which could utilize higher-performing materials than typical commercial printers, enabled the researchers to produce solenoids that could withstand twice as much electric current and generate a magnetic field that was three times larger than other 3D-printed devices.</p><p>In addition to making electronics cheaper on Earth, this printing hardware could be particularly useful in space exploration. For example, instead of shipping replacement electronic parts to a base on Mars, which could take years and cost millions of dollars, one could send a signal containing files for the 3D printer, says Luis Fernando Velásquez-García, a principal research scientist in MIT’s Microsystems Technology Laboratories (MTL).</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 768px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1708991607041-MIT-Printed-Solenoids-02-press.jpg" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">The researchers modified a multimaterial 3D printer so it could print compact, magnetic-cored solenoids in one step. This eliminates defects that might be introduced during post-assembly processes. Image: Courtesy of the researchers</span></span></span></p><p>“There is no reason to make capable hardware in only a few centers of manufacturing when the need is global. Instead of trying to ship hardware all over the world, can we empower people in distant places to make it themselves? Additive manufacturing can play a tremendous role in terms of democratizing these technologies,” adds Velásquez-García, the senior author of a new <a href="https://www.tandfonline.com/doi/full/10.1080/17452759.2024.2310046" target="_blank">paper on the 3D printed solenoids that appears in the journal <em>Virtual and Physical Prototyping</em></a><em>.</em></p><p>He is joined on the paper by lead author Jorge Cañada, an electrical engineering and computer science graduate student; and Hyeonseok Kim, a mechanical engineering graduate student.</p><h2><strong>Additive advantages</strong></h2><p>A solenoid generates a magnetic field when an electrical current is passed through it. When someone rings a doorbell, for instance, electric current flows through a solenoid, which generates a magnetic field that moves an iron rod so it strikes a chime.</p><p>Integrating solenoids onto electrical circuits manufactured in a clean room poses significant challenges, as they have very different form factors and are made using incompatible processes that require post assembly. Consequently, researchers have investigated making solenoids utilizing many of the same processes that make semiconductor chips. But these techniques limit the size and shape of solenoids, which hampers performance.</p><p>With additive manufacturing, one can produce devices that are practically any size and shape. However, this presents its own challenges, since making a solenoid involves coiling thin layers made from multiple materials that may not all be compatible with one machine.</p><p>To overcome these challenges, the researchers needed to modify a commercial extrusion 3D printer.</p><p>Extrusion printing fabricates objects one layer at a time by squirting material through a nozzle. Typically, a printer uses one type of material feedstock, often spools of filament.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 768px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1708991654926-MIT-Printed-Solenoids-03-press.jpg" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Solenoids are produced by precisely layering three different materials — a dielectric material that serves as an insulator, a conductive material that forms the electric coil, and a soft magnetic material that makes up the core. The soft magnetic material the researchers used, which is in the form of pellets, achieves higher performance than filament-based materials. Image: Courtesy of the researchers</span></span></span></p><p>“Some people in the field look down on them because they are simple and don’t have a lot of bells and whistles, but extrusion is one of very few methods that allows you to do multimaterial, monolithic printing,” says Velásquez-García.</p><p>This is key, since the solenoids are produced by precisely layering three different materials — a dielectric material that serves as an insulator, a conductive material that forms the electric coil, and a soft magnetic material that makes up the core.</p><p>The team selected a printer with four nozzles — one dedicated to each material to prevent cross-contamination. They needed four extruders because they tried two soft magnetic materials, one based on a biodegradable thermoplastic and the other based on nylon.</p><h2><strong>Printing with pellets</strong></h2><p>They retrofitted the printer so one nozzle could extrude pellets, rather than filament. The soft magnetic nylon, which is made from a pliable polymer studded with metallic microparticles, is virtually impossible to produce as a filament. Yet this nylon material offers far better performance than filament-based alternatives.</p><p>Using the conductive material also posed challenges, since it would start melting and jam the nozzle. The researchers found that adding ventilation to cool the material prevented this. They also built a new spool holder for the conductive filament that was closer to the nozzle, reducing friction that could damage the thin strands.</p><p>Even with the team’s modifications, the customized hardware cost about $4,000, so this technique could be employed by others at a lower cost than other approaches, adds Velásquez-García.</p><p>The modified hardware prints a U.S. quarter-sized solenoid as a spiral by layering material around the soft magnetic core, with thicker conductive layers separated by thin insulating layers.</p><p>Precisely controlling the process is of paramount importance because each material prints at a different temperature. Depositing one on top of another at the wrong time might cause the materials to smear.</p><p>Because their machine could print with a more effective soft magnetic material, the solenoids achieved higher performance than other 3D-printed devices.</p><p>The printing method enabled them to build a three-dimensional device comprising eight layers, with coils of conductive and insulating material stacked around the core like a spiral staircase. Multiple layers increase the number of coils in the solenoid, which improves the amplification of the magnetic field.</p><p>Due to the added precision of the modified printer, they could make solenoids that were about 33 percent smaller than other 3D-printed versions. More coils in a smaller area also boosts amplification.</p><p>In the end, their solenoids could produce a magnetic field that was about three times larger than what other 3D-printed devices can achieve.</p><p>“We were not the first people to be able to make inductors that are 3D-printed, but we were the first ones to make them three-dimensional, and that greatly amplifies the kinds of values you can generate. And that translates into being able to satisfy a wider range of applications,” he says.</p><p>For instance, while these solenoids can’t generate as much magnetic field as those made with traditional fabrication techniques, they could be used as power convertors in small sensors or actuators in soft robots.</p><p>Moving forward, the researchers are looking to continue enhancing their performance.</p><p>For one, they could try using alternate materials that might have better properties. They are also exploring additional modifications that could more precisely control the temperature at which each material is deposited, reducing defects.</p>

MIT researchers modified a multi-material 3D printer so it could produce three-dimensional solenoids in one step by layering ultrathin coils of three different materials. It prints a U.S. quarter-sized solenoid as a spiral by layering material around the soft magnetic core, with thicker conductive layers separated by thin insulating layers. Image: Courtesy of the researchers

The printed solenoids could enable electronics that cost less and are easier to manufacture — on Earth or in space.

Engineers 3D print the electromagnets at the heart of many electronics

<p id="isPasted">Surface energy is a fundamental topic with implications in nearly every field of engineering, and frankly, it can be a bit mind-boggling. In the world of printed electronics, surface energy often comes up around the interactions of materials, specifically when we’re printing conductive inks onto various surfaces (substrates). While there are several factors that determine if an ink and a substrate will work together, surface energy plays its own very specific role. Let’s dig a bit deeper into how surface energy works, and more importantly, how it can impact&nbsp;<em>your&nbsp;</em>work.&nbsp;</p><p>If you use&nbsp;<a href="https://www.voltera.io/blog/introduction-inkjet-technology" target="_blank">inkjet</a> technology, then the surface energy rating of your materials is a key determinant in whether or not an ink will be compatible with a substrate. Due to their low viscosity, inkjet inks are significantly impacted by surface energy. But, when you read the surface tension rating on your ink, how does it translate into the compatibility of your materials?&nbsp;</p><p><strong>If you’re using low-viscosity inkjet inks</strong>, then read on, because surface energy has a big impact on your materials' compatibility.&nbsp;</p><p><strong>If you’re using high-viscosity screen-printable inks</strong>, surface energy isn’t really a concern for you, but there are several other factors to consider when you’re trying to figure out whether an ink and substrate are compatible. Stay tuned for a future blog post covering this!</p><h3><strong><em>Sci-Snack</em></strong></h3><p><a href="https://www.voltera.io/blog/what-is-viscosity" target="_blank"><strong><em>Viscosity</em></strong></a><em>&nbsp;is the measure of a fluid’s resistance to flow, due to the internal friction of the fluid. Low-viscosity inks, like inkjet inks, have very little friction between the molecules of the ink, so the match or mismatch of surface energy has a significant impact on how your ink and substrate interact.&nbsp;</em></p><p><em>High-viscosity screen-printable inks have a lot of friction between the molecules in the ink. Molecular friction helps these inks hold their shape and stay where you put them, regardless of the surface energy of the substrate to which they are applied.&nbsp;</em></p><h2><strong>What is surface energy and how does it work?</strong></h2><p><strong>Surface area&nbsp;</strong>is the measure of the total area that the surface of the object or liquid occupies<strong>.</strong></p><p><strong>Surface energy&nbsp;</strong>is the amount of energy required to increase the surface area of a material. It applies to liquids and solids.</p><p>In other words, it’s the energy required to increase the space between the molecules. The surface energy of your ink and the surface energy of your substrate — and how those two energies interact — will dictate if your ink spreads out on the substrate, forms nice contained traces, or beads up like water on a non-stick pan.&nbsp;</p><p>Surface energy manifests itself in&nbsp;<strong>surface tension&nbsp;</strong>— when a liquid minimizes its surface area due to the cohesive forces between the molecules. Surface tension occurs in liquids only, never gasses or solids. Surface tension is calculated by measuring the surface energy over a surface area.&nbsp;</p><p>This concept might seem complex, but if you look around, you’ll see examples of it everywhere in your day-to-day life. Right now, there’s a viral trend all over TikTok that demonstrates the cohesive forces between water molecules. You’d recognize it as “<a href="https://twitter.com/overtime/status/1509659771993042949?ref_src=twsrc%5Etfw%7Ctwcamp%5Etweetembed%7Ctwterm%5E1509659771993042949%7Ctwgr%5E9eaf2411d9aaf80dbe5a8f8d579d14cedd5f5df6%7Ctwcon%5Es1_c10&ref_url=https%3A%2F%2Fkotaku.com%2Fembed%2Finset%2Fiframe%3Fid%3Dtwitter-1509659771993042949autosize%3D1" target="_blank">The Water Cup Challenge</a>”.&nbsp;</p><p>In the water cup challenge, players take turns adding drops of water to a full cup. The objective is to gradually add water to the cup, and reach the threshold of surface tension without the water overflowing. The literal tension of the players builds as the surface tension of the water reaches its threshold, mushrooming above the rim of the cup, yet miraculously holding itself together. Eventually the water overflows, and the loser who poured that critical last drop gets thrown into a swimming pool. Fun times.</p><h3><strong><em>Sci-Snack</em></strong></h3><ul><li><strong><em>Surface area&nbsp;</em></strong><em>is the measurement of the total area that the surface of the object or liquid occupies</em><strong><em>.</em></strong></li><li><strong><em>Surface energy&nbsp;</em></strong><em>is the amount of energy required to increase the surface area of a material. It applies to liquids and solids.</em><strong><em>‍</em></strong></li><li><strong><em>Surface tension&nbsp;</em></strong><em>is when a liquid minimizes its surface area due to the cohesive forces between the molecules. Surface tension occurs in liquids only, never gasses or solids.</em></li></ul><p>To demonstrate the concept of surface tension at the molecular level, we’re going to take a look at penguins. When it’s really cold out, penguins form a huddle to share body heat. Think of any material as a penguin huddle and the penguins are molecules. The penguins on the outer edge of the huddle — the ones at the surface — are very tightly packed together, trying to preserve heat. You can imagine that these surface penguins would be pretty difficult to remove or push around. The desire of the penguins to stay close together is like the surface tension or surface energy between molecules or atoms.&nbsp;</p><p>If it’s a warm day, the penguins spread out, increasing the surface area they occupy.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA3MjEwMzUzODU5LTYzNzNiZDI2YWYwZjkxZjQ2MjUwMDMzY19zN3d6T3ktcDltZHJTTlptTEcxa0l2OFFhRU9FOWVPVnc4ZWprOVpUejZYR21Ia0VEQk5DQnN1LUduNGFPMm81WEZIUUFWellHb2sxTS00QjV2M0IybzZSSmxKSDZCMVZGSWtPWS1ZRVNTaDRQRnpLNERMc2s2c01UcHYtTGpNQ3FzY1Q4NXJ0ejBGeE5TV1RlRjVDX1hpX0xCeVFfRmZMdUxENzMyTE5YTENGSlZDekVQbVRpbXA2Y05TZi5qcGVnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib"></p><p>If it’s cold outside, the penguins huddle together tightly to share body heat, reducing the surface area they occupy.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA3MjEwMzcxNjQ2LTYzNzNiZDNmNjM5YTUyMjI3ZTc5MjYxOV9mUFVDZTdWLUdObE9MeHY1X3gzV1FkVi1aQlBuaGhzeDJFSDFiRHhyNjFtdXlvUHlfNVRqUXNYUDd6VkNyZldkWTg0d0R2R1lqWFVsblRqYVgydHFLa0hueWZZSlNsTXJ2WFdtLU9EcFlmNllUZGV3Q0JxMjlKdjh0VDNlTl9QLTIzME14NHdyNXZ5RE9qNGYtbTB6REJFTDVmQS14bmY1cmtRNlhZQWlqdmc3aFJaanNodm9McmlDbDhnQS5qcGVnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib"></p><h3 id="isPasted"><strong><em>Sci-Snack</em></strong></h3><p><em>If a material has&nbsp;</em><strong><em>high surface energy</em></strong><em>, that means it’s going to take a lot of energy to change the surface area of the material, so it’s going to be resistant to change. Materials with high surface energy include glass, ceramic, and most metals (and cold penguins).</em></p><p><em>If a material has&nbsp;</em><strong><em>low surface energy</em></strong><em>, that means it will change its surface area relatively easily. Materials with low surface energy include soft low-density plastics like vinyl, polystyrene, and polyethylene.&nbsp;</em></p><p>Liquid mercury, as another example, has incredibly high surface tension. When poured onto a surface, the liquid mercury pulls itself together into a perfect sphere. A sphere is the easiest way for a substance to minimize its surface area.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA3MjEwMzg2ODY2LTYzNzNiZDU3YTQyMTdmMmEwMTNjZTNiMV8tUTFkNUw3NFhCdlBCdWlYWmZmZlZMYTNLNzJWUXFLTmJGS1RLTDNhdW1aaXFCY29QaUxoRXowd2x5amxySDE4U0RSWjY5UTdNbEdsYXNuS1pHSXhZMEVjcC1PYXEzWWs1eGJRMGU1SkpWb2hlWDZCX0t4RDQyQ0pRYTRRdUpuMTgzc3B1RUNaSEkyRDdBME9iZ1VZRU9HZDdVc0QyQm9HNFZ0cVV4UHpobGZXT2lCa2kxQnhkR3RmNzV3aHYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib"></p><p>In the iconic film Terminator 2, the terminator is smashed to pieces, and then liquifies into molten metal and pulls back together into the shape of a man. This is a great science-fiction demonstration of surface tension.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1707210457655-ezgif-3-db889fabbf.gif" style="width: 300px;" class="fr-fic fr-dib"></p><p id="isPasted">Each material has its own surface energy rating based on the chemical makeup of the material. This applies to liquids (inks) as well as solids (substrates).</p><p>When you deposit ink onto a substrate, the interaction between the ink and the substrate’s respective surface energies can result in changes to the shape of your traces. This is where you’ll see your ink do one of three things — become very runny and flat, contain itself properly, or bead up.</p><p>You can determine the difference in surface energies between an ink and a substrate by measuring the contact angle — the angle of the ink droplet relative to the substrate. This angle determines if a liquid is spreading, wetting well, or not wetting at all.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA3MjEwNTAxMDAwLTYzNzNiZDdhNDM1MzkxNWUwY2JkNjI2Nl81a1h4TFExRkZsUEhkQjU2UndUVUNkUWh1cXFIWUFKZ0JjTGZiQ2pnZTIyaGV1UFJoblNlYzZsZ0hlSkNOVUUyMmEweW5UdW1talFYbzcwM0ZVUTBjSzVLcHpacGNlQ0lpZGs2NEF1T29UTVhRQW9UVzJ1LVdPcDNaeDF3TFZEa1QwLUs2Um1leXdvbEJ1ZzRSR3hMSUN4WEh4SldTbkMwQVVOTFJBVDRFRXBDcWVDNVF3aFdQOWRXc1RVMi5qcGVnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib"></p><h2 id="isPasted"><strong>Matching the surface energies of your ink and substrate</strong></h2><p>The shape-quality of your traces depends on how well you’ve matched the surface energy of your ink and substrate. If the surface energies of these materials are relatively similar, then the ink and substrate will interact compatibly. You’ll get nice traces that contain themselves and stay where you put them.&nbsp;</p><p>If the surface energies of your ink and substrate are quite different, they are incompatibly matched. Surface energy forces are going to change the shape of the ink and you’ll end up with traces that either bead up, or spread out too much.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA3MjEwNTM2NTIxLTYzNzNiZGE2YzZlOGEzZDBjMjBhNDY5N19FNi0wRVJXd09Eb01yUzh6UXhRNGRhZmVTendxSnl3bWNyNXBBcG9leGJxdXczTVFpRzVqZzhTSXVyMl9oSzJETy1RVHlZbUZ5bEs4WVYzaU1sRG10ZWFlM1I4Vl81ZlVYM294elhNNGVhSHlxZzd4OHExZzVPQlhJclBvNFRjVHpPRU8wc2hpM1ZVYzRHWWVKdXBabTFoc01mWjlFd2NLZDlxLXhCYlotcnoySk55WjhDQjExbXhQRmZ3Y0oucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib"></p><p id="isPasted">Inks have different surface tension ratings, and substrates have different surface energy ratings, which influence how these materials interact. The objective is to find a match between the surface energy of the substrate and the surface tension of the ink, resulting in traces that make a nice domed shape and hold together properly: &nbsp;</p><p>Take a look at how inks with surface tension ratings of 30 and 60 interact with different substrates.&nbsp;</p><p>First, let’s take a look at different inks on polyimide. The ink on the left has a low surface tension rating of 30, and it wets and spreads out a bit too much. The ink on the right has a high surface tension rating of 60, and it beads. Based on how the inks perform, we can deduce that the surface energy of the polyimide substrate is somewhere in between 30 and 60.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1707210551204-6373c500a4217f28973d6f3a_Polyimide+Viscosity_optimized.gif" style="width: 300px;" class="fr-fic fr-dib"></p><p>In this example, the same inks are applied to a sheet of PET with silica flakes to promote adhesion. The ink with a surface tension of 30 wets out significantly, flooding the substrate. The ink with a surface tension of 60 still beads a bit, but it’s closer to the kind of match you’d want for traces.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1707210574950-6373c54100a60421a99cdfa6_PET+Viscosity_optimized.gif" style="width: 300px;" class="fr-fic fr-dib"></p><p>Now look at how these inks perform on the same PET, but without the adhesion promoter. The ink with a surface tension of 30 wets out a bit. The ink with a surface tension of 60 beads significantly.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1707210597173-6373c58100a60485769ce6c4_PET+Adhesion+Promoter+Viscosity_optimized.gif" style="width: 300px;" class="fr-fic fr-dib"></p><p>Next, we tried an ink with a surface tension rating of 44, in between our bookends of 30 and 60. Check out how this one interacts with the three different substrates:</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1707210784581-ezgif-3-e49a46355c.gif" style="width: 300px;" class="fr-fic fr-dib"></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1707210832807-ezgif-3-68b99b268c.gif" style="width: 300px;" class="fr-fic fr-dib"></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1707210877485-ezgif-3-c854dd3a7b.gif" style="width: 300px;" class="fr-fic fr-dib"></p><p id="isPasted">Based on the way the 44 dyne pen behaves, what does this tell you about the surface energy of each of the substrates? &nbsp;</p><h2><strong>So what does this mean for choosing an inkjet ink?</strong></h2><p>If your surface energies don’t match, it can be very challenging to get a good quality print. Unfortunately, every substrate is different, so prepare yourself for a lot of trial and error. There are some options to modify the surface energy of your substrate, if you’re willing to roll up your sleeves and do some lab work. We consulted with a friend, <a href="https://uwaterloo.ca/sensors-integrated-microsystems-lab/people-profiles/krishna-iyer" target="_blank">Krishna Iyer</a>, Optical Systems Engineer at University of Waterloo's <a href="https://uwaterloo.ca/sensors-integrated-microsystems-lab/" target="_blank">Sensors and Integrated Microsystems Laboratory</a>, to learn more about surface energy modification:</p><ul><li><strong>Surface treatments&nbsp;</strong><strong>—</strong> substrates can be treated to help match the surface energy of the ink. Surface treatments include surfactants (anionic, cationic, zwitterionic, or amphoteric), as well as plasma, corona, or acid/alkaline surface treatments.&nbsp;</li><li><strong>Temperature —&nbsp;</strong>temperature doesn’t directly affect surface energy, but it <em>does</em> affect viscosity. By controlling the processing temperature, you can have a significant impact on the coverage of your ink or coating material.&nbsp;</li><li><strong>Surface coatings —&nbsp;</strong>you can add coatings to affect the surface energy of your substrate while still preserving the mechanical properties. For example, coating PET with an adhesion promoter, or coating a surface with Teflon.&nbsp;</li><li><strong>Surface preparation —&nbsp;</strong>there are inexpensive, accessible, non-chemical approaches to making a surface more favorable for wetting. For example, a surface with higher roughness increases the surface area and improves wetting without affecting the surface energy, but this can have the opposite effect if roughness is too high (see <a href="https://www.youtube.com/watch?v=54lDqR6LU8E" target="_blank">Wenzel effects</a>).&nbsp;</li></ul><p>With higher viscosity screen printing inks, like those used with <a href="http://voltera.io/nova" target="_blank">NOVA</a>, the internal friction of the ink makes it less impacted by surface energy effects. This enables you to print on a much wider variety of materials without changing your formulation, so you may want to consider switching technologies to avoid the headache.&nbsp;</p>

In the world of printed electronics, surface energy often comes up around the interactions of materials, specifically when we’re printing conductive inks onto various surfaces (substrates).

What is Surface Energy?

<p id="isPasted">Multifunctional computer chips have evolved to do more with integrated sensors, processors, memory and other specialized components. However, as chips have expanded, the time required to move information between functional components has also grown.&nbsp;</p><p>“Think of it like building a house,” said Sang-Hoon Bae, assistant professor of mechanical engineering &amp; materials science in the McKelvey School of Engineering at Washington University in St. Louis. “You build out laterally and up vertically to get more function, more room to do more specialized activities, but then you have to spend more time moving or communicating between rooms.&nbsp;</p><p>To address this challenge, Bae and a team of international collaborators, including researchers from MIT, Yonsei University, Inha University, Georgia Tech and University of Notre Dame, demonstrated monolithic 3D integration of layered 2D material into novel processing hardware for artificial intelligence computing. They envision that their new approach will not only provide a material-level solution for fully integrating many functions into a single, small electronic chip, but also pave the way for advanced AI computing. Their work was published Nov. 27 in&nbsp;<em>Nature Materials</em> where it was selected as a front cover article.</p><p>The team’s monolithic 3D-integrated chip offers advantages over existing laterally integrated computer chips. The device contains six atomically thin 2D layers, each with its own function, and achieves significantly reduced processing time, power consumption, latency and footprint. This is accomplished through tightly packing the processing layers to ensure dense interlayer connectivity. As a result, the hardware offers unprecedented efficiency and performance in AI computing tasks.</p><p>This discovery offers a novel solution to integrate electronics and also opens the door to a new era of multifunctional computing hardware. With ultimate parallelism at its core, this technology could dramatically expand the capabilities of AI systems, enabling them to handle complex tasks with lightning speed and exceptional accuracy, Bae said.</p><p>“Monolithic 3D integration has the potential to reshape the entire electronics and computing industry by enabling the development of more compact, powerful and energy-efficient devices,” Bae said. “Atomically thin 2D materials are ideal for this, and my collaborators and I will continue improving this material until we can ultimately integrate all functional layers on a single chip.”</p><p>Bae said these devices also are more flexible and functional, making them suitable for more applications.</p><p>“From autonomous vehicles to medical diagnostics and data centers, the applications of this monolithic 3D integration technology are potentially boundless,” he said. “For example, in-sensor computing combines sensor and computer functions in one device, instead of a sensor obtaining information then transferring the data to a computer. That lets us obtain a signal and directly compute data resulting in faster processing, less energy consumption, and enhanced security because data isn’t being transferred.”</p><hr><p>Kang J-H, Shin H, Kim KS, Song M-K, Lee D, Meng Y, Choi C, Suh JM, Kim BJ, Kim H, Hoang AT, Park B-I, Zhou G, Sundaram S, Vuong P, Shin J, Choe J, Xu Z, Younas R, Kim JS, Han S, Lee S, Kim SO, Kang B, Seo S, Ahn H, Seo S, Reidy K, Park E, Mun S, Park M-C, Lee S, Kim H-J, Kum HS, Lin P, Hinkle C, Ougazzaden A, Ahn J-H, Kim J, and Bae S-H. Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions.&nbsp;<em>Nature Materials</em>. Nov. 27, 2023. DOI:&nbsp;<a href="https://doi.org/10.1038/s41563-023-01704-z" target="_blank">https://doi.org/10.1038/s41563-023-01704-z</a></p>

Researchers demonstrated monolithic 3D integration of layered 2D material into novel processing hardware for artificial intelligence computing. The new approach provides a material-level solution for fully integrating many functions into a single, small electronic chip – and paves the way for advanced AI computing. (Image courtesy of Sang-Hoon Bae)

Sang-Hoon Bae and collaborators have demonstrated integrated processing hardware they say could revolutionize AI computing

2D material reshapes 3D electronics for AI hardware

<p id="isPasted">Elephantech is developing mass production of multi-layer flexible and rigid PCBs [FPCBs and RPCBs] using inkjet printing. This is an important industry development which enables more sustainable electronic production. This article appeared <a href="https://www.techblick.com/post/additive-electronics-mass-production-of-mult-layer-fpcbs-and-rpcbs-with-inkjet-printing" rel="noopener noreferrer" target="_blank">here&nbsp;</a>on <a href="//TechBlick.com" rel="noopener noreferrer" target="_blank">TechBlick.com</a> first.&nbsp;</p><p>Slide [1] compares the convention process vs the inkjet printed process, showing how the number of production steps and the amount of material consumed can be reduced since ink-printing enables additive (vs subtractive) manufacture.&nbsp;</p><p>Note in slide [1] how Elephantech is also developing technology to enable double-sided FPCBs with drilled vias[more on this later]</p><p><br></p><article><div data-rce-version="9.11.0"><div data-id="rich-content-viewer" dir="ltr"><div data-hook="rcv-block6" type="empty-line"><br></div><div data-hook="galleryViewer"><div data-key="pro-gallery-inner-container" tabindex="-1"><div data-hook="item-link-wrapper" data-id="79eabf8c-0ccf-4430-b391-13195662fa55_0" data-idx="0" tabindex="-1"><div data-hash="79eabf8c-0ccf-4430-b391-13195662fa55_0" data-hook="item-container" data-id="79eabf8c-0ccf-4430-b391-13195662fa55_0" data-idx="0" tabindex="0"><div data-hook="item-wrapper"><div data-hook="image-item"><img alt="" data-idx="0" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3MTg3OTcwMjM1LTE2ODcxODc5NzAyMzIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" class="fr-fic fr-dii"></div><div data-hook="item-hover-0"><br></div></div></div></div></div></div><div data-hook="rcv-block7" type="gallery"><br></div><div data-hook="rcv-block9" type="empty-line"><span class="fr-img-caption   fr-fic fr-dib fr-draggable" contenteditable="false" draggable="false" style="width: 768px;"><span class="fr-img-wrap"><a href="https://www.techblick.com/post/digital-electrochemical-multimaterial-printing-bulk-like-wide-material-choice-no-curing" rel="noopener noreferrer" target="_blank"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3MTg4MTIwODQyLUxpbmtlZEluLVBlcnNvbmFsLUFjY291bnQtMTU4NHgzOTYtKHN1bXBsZXMpLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 768px;" class="fr-fic fr-dib"><span class="fr-inner" contenteditable="true" data-dl-input-translation="true"></span></a><div data-hook="rcv-block8" id="isPasted" type="empty-line"><a href="https://www.techblick.com/post/digital-electrochemical-multimaterial-printing-bulk-like-wide-material-choice-no-curing" rel="noopener noreferrer" target="_blank"><strong>Join TechBlick, Elephantech, and 650+ others from around the world to learn the latest in the world of Additive and Sustainable Electronics. Explore the programme&nbsp;</strong></a><strong><a href="https://www.techblick.com/post/digital-electrochemical-multimaterial-printing-bulk-like-wide-material-choice-no-curing" rel="noopener noreferrer" target="_blank">here&nbsp;</a></strong></div></span></span>&nbsp;</div><p>Slide [2] shows how Elephantech is a vertically integrated operation now, covering material development [copper nanoparticles] to ink formulation to inkjet printer development to production of FPCBs in house. The ultimate goal is to be an equipment supplier. However, they will do manufacturing to gain production experience to perfect the process and machinery in the years to come</p><div data-hook="rcv-block10" type="paragraph"><br></div><p>Slide [2] also demonstrated the sustainability of the process, showing that the additive inkjet based process reduces copper and water consumption vs. the traditional etched process by 70% and 95%, respectively whilst reducing the carbon footprint by 75%. These are very important achievements, in particular considering how all major electronics OEMs are now pushing for greener value chains [10% of the CO2 footprint of Apple comes from PCB production!]</p><div data-hook="rcv-block12" type="paragraph"><br></div><div data-hook="rcv-block13" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3MTg3OTcwNTExLTE2ODcxODc5NzA1MTEucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/634751_6e3b2ad007d04977a59542f3a5ccd297~mv2.png/v1/fill/w_960,h_540,al_c,lg_1,q_90/634751_6e3b2ad007d04977a59542f3a5ccd297~mv2.png" class="fr-fic fr-dii"></div><div data-hook="rcv-block14" type="image"><br></div><div data-hook="rcv-block15" type="empty-line"><br></div><p>Slide [3] shows an inkjet printer under development. This is not the final design and many design questions remain open such as number of print heads or the exact choice of piezo-actuated printer suppliers.&nbsp;</p><p>Slide [4] shows the current achievements. Incredibly, they can directly achieve inkjet printed linewidth-to-spacing [L/S] ratio of 100/100um without the need for any laser ablation or laser finetuning. This is an important achievement which is the result of high optimization between inkjet head, control system, and ink and substrate development.&nbsp;</p><p>In this process, first a copper nanoparticle ink [50-100 nm particles] is inkjet printed. The Cu nanoparticle solution is specially formulated with surface functionalization [my guess is the substrate PI is also somehow pre-treated] to promote strong adhesion to the surface. The inkjet printed Cu layers are then photosintered using a Xenon or similar lamp.</p><div data-hook="rcv-block21" type="empty-line"><br></div><p>The idea of the activation here is not to achieve high conductivity but to achieve a solid network of deposited copper nanoparticles with strong substrate adhesion which acts as a seed layer. In fact, conductivity is not measured. This is &nbsp;because the formulation of these Cu nanoinks must fulfill different criteria as those aimed at printed electronics.</p><div data-hook="rcv-block23" type="empty-line"><br></div><p>In the recent past, Ag seed layers were used. This important transition is motivated by cost savings.&nbsp;</p><p>The seed layer is then thickened using electroless plating. Plated copper gives bulk level conductivity and solderability, making it [unlike circuits with printed paste] a drop-in replacement performance-wise</p><div data-hook="rcv-block27" type="empty-line"><br></div><p>As shown in slide [4], a 12um thick copper plated can be achieved. This is a significant advancement vs. the previous achievement of 3um. Importantly, the adhesion remains strong even with a thick plated layer</p><div data-hook="rcv-block28" type="paragraph"><br></div><div data-hook="rcv-block29" type="empty-line"><br></div><div data-hook="galleryViewer"><div data-key="pro-gallery-inner-container" tabindex="-1"><div data-hook="item-link-wrapper" data-id="f344c238-bc4f-4e92-985a-ff70f162ca3a_0" data-idx="0" tabindex="-1"><div data-hash="f344c238-bc4f-4e92-985a-ff70f162ca3a_0" data-hook="item-container" data-id="f344c238-bc4f-4e92-985a-ff70f162ca3a_0" data-idx="0" tabindex="0"><div data-hook="item-wrapper"><div data-hook="image-item"><img alt="" data-idx="0" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3MTg3OTcxOTExLTE2ODcxODc5NzE5MTEucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" class="fr-fic fr-dii"></div><div data-hook="item-hover-0"><br></div></div></div></div><div data-hook="item-link-wrapper" data-id="6c76ac2a-c210-4b2a-b7c2-713d26209de1_1" data-idx="1" tabindex="-1"><div data-hash="6c76ac2a-c210-4b2a-b7c2-713d26209de1_1" data-hook="item-container" data-id="6c76ac2a-c210-4b2a-b7c2-713d26209de1_1" data-idx="1" tabindex="-1"><div data-hook="item-wrapper"><div data-hook="image-item"><img alt="" data-idx="1" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3MTg3OTcxNTA5LTE2ODcxODc5NzE1MDkucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" class="fr-fic fr-dii"></div><div data-hook="item-hover-1"><br></div></div></div></div></div></div><div data-hook="rcv-block30" type="gallery"><br></div><div data-hook="rcv-block31" type="empty-line"><br></div><div data-hook="rcv-block32" type="empty-line"><span class="fr-img-caption fr-fic fr-dib" style="width: 766px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3MTg4MjgzMDIwLUFnZW5kYS1FeGhpYml0aW9uIChCRVJMSU4tT2N0LTIwMjMpICgxKS1taW4uanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 766px;" class="fr-fic fr-dib"><span class="fr-inner" data-dl-input-translation="true">Join TechBlick, Elephantech, and 650+ others from around the world to learn the latest in the world of Additive and Sustainable Electronics. Explore the programme&nbsp;<a href="https://www.techblick.com/post/digital-electrochemical-multimaterial-printing-bulk-like-wide-material-choice-no-curing" id="isPasted" rel="noopener noreferrer" target="_blank">here&nbsp;</a></span></span></span></div><p>Slide [5] shows how double sided FPCBs can be achieved. Here, a via is drilled into the PI substrate and is then metallized with inkjet printing before being plated.&nbsp;</p><p>Slide [6] shows the future roadmap. Firstly, the deposited layer will be thickened to 30um to support more PCB options. This needs much better adhesion and must have more optimized interplay between functionalized Cu nanoparticles, substrate surface, and electroless plating process. Next, they will transition from flexible to rigid PCBs and add more layers to the capabilities.&nbsp;</p><p>These developments will take time and are an engineering challenge, but in the end this is a more sustainable production process yielding high performance PCBs compared to etched PCB production. As such, in the long term, it will have its role in the industry without doubt. Indeed, as shown in slide [7] it is already on the market.</p><div data-hook="rcv-block37" type="paragraph"><br></div><div data-hook="rcv-block38" type="empty-line"><br></div><div data-hook="galleryViewer"><div data-key="pro-gallery-inner-container" tabindex="-1"><div data-hook="item-link-wrapper" data-id="a80004d0-3d66-480f-90cd-c23d5c475947_0" data-idx="0" tabindex="-1"><div data-hash="a80004d0-3d66-480f-90cd-c23d5c475947_0" data-hook="item-container" data-id="a80004d0-3d66-480f-90cd-c23d5c475947_0" data-idx="0" tabindex="0"><div data-hook="item-wrapper"><div data-hook="image-item"><img alt="" data-idx="0" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3MTg3OTcyMDkwLTE2ODcxODc5NzIwOTAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" class="fr-fic fr-dii"></div><div data-hook="item-hover-0"><br></div></div></div></div><div data-hook="item-link-wrapper" data-id="9e9ff219-fb7b-4207-978d-7b397bac02d7_1" data-idx="1" tabindex="-1"><div data-hash="9e9ff219-fb7b-4207-978d-7b397bac02d7_1" data-hook="item-container" data-id="9e9ff219-fb7b-4207-978d-7b397bac02d7_1" data-idx="1" tabindex="-1"><div data-hook="item-wrapper"><div data-hook="image-item"><img alt="" data-idx="1" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3MTg3OTcxNjkyLTE2ODcxODc5NzE2OTIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" class="fr-fic fr-dii"></div><div data-hook="item-hover-1"><br></div></div></div></div><div data-hook="item-link-wrapper" data-id="b4f2c04c-7c11-42bb-8efe-4abd471f8b03_2" data-idx="2" tabindex="-1"><div data-hash="b4f2c04c-7c11-42bb-8efe-4abd471f8b03_2" data-hook="item-container" data-id="b4f2c04c-7c11-42bb-8efe-4abd471f8b03_2" data-idx="2" tabindex="-1"><div data-hook="item-wrapper"><div data-hook="image-item"><img alt="" data-idx="2" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3MTg3OTc0NzA1LTE2ODcxODc5NzQ3MDUucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" class="fr-fic fr-dii"></div><div data-hook="item-hover-2"><br></div></div></div></div></div></div><div data-hook="rcv-block39" type="gallery"><br></div></div></div></article>

Additive electronics is sustainable reduceing copper and water consumption vs. the traditional PCB production processes by 70% and 95%, respectively whilst reducing the carbon footprint by 75%. Here you will read about the latest advances by one of the leading firms in the field from Japan

Sustainable electronics: Mass manufacture mulit-layer FPCBs and RPCBs with inkjet printing

<p dir="ltr" id="isPasted">Announcing TechBlick&#39;s&nbsp;open free-to-attend&nbsp;virtual conference and exhibition day on <strong>2 DEC 2022 from 13:00 CET to 19:00 CET</strong>. The conference will offer the following two parallel tracks:</p><ul><li dir="ltr"><p dir="ltr">Track 1: &nbsp;Printed, Flexible, Hybrid, 3D Electronics: Innovation Showcase Day</p></li><li dir="ltr"><p dir="ltr">Track 2: Wearable Sensors and Therapeutics, E-Textiles, and Continuous Vital Signs Monitoring</p></li></ul><p dir="ltr"><strong>You can view the combined agenda&nbsp;and register free&nbsp;<a href="https://techblick-dot-yamm-track.appspot.com/2ISOs9hOMy2x8pbhQhl6KSSvgJLWIkOrG6xamhF4N_XNJc7g4hAHrTK3lmPs6viFvxTWpwv-ZckWPjtUPOAWzWbCua0Z6ORGl6JITifLNV7zXxNP6u2slSvhW_RP_2SY2c1JW8AOJI3cmvLbxsAYYVpfxKU3_2gHjvUnYyyQoFx3X0bYTw_lxzeKOy3sdQyPw0xfcZeUBrfUVgA" target="_blank">here.</a>&nbsp;</strong> It is a unique event with two-parallel live tracks, a live engaging exhibition floor, and 400+ attendees. &nbsp;The exhibiting companies include the likes of Voltera, Epishine, Dupont Teijin Films, DoMicro, Copprint, InnovationLab, NovaCentrix, PulseForge, Fujikura Kasei, ImageXpert, Panacol, Neotech AMT, Celanese, Applied Materials, Coatema, Sateco, IDS, Ames Goldsmith, Kimoto, Encres Dubuit, Raymor, Quad Industries, Ynvisible, Brilliant Matters, CondAlign, DTI, and many more</p><p dir="ltr"><strong>Full Agenda</strong></p><p dir="ltr">The times below is Central European Times (CET) / Berlin time.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1668430736253-speakers+lpogos.jpg" style="width: 695px;" class="fr-fic fr-dib"></p><p dir="ltr">1:00pm &nbsp;ATT Advanced Thermal Technologies | How to keep Cameras, RADAR &amp; LiDAR Sensors free of Snow &amp; Ice by means of Printed Electronics &nbsp; </p><p dir="ltr">01:00pm&nbsp;&nbsp;DTI |&nbsp;Advance printed electronics and standardization within the smart wearables industry.</p><p dir="ltr">01:15pm&nbsp;&nbsp;Singapore Institute of Manufacturing Technology (SIMTech) |&nbsp;Development of smart apparel for bio-signal measurement &nbsp;&nbsp;</p><p dir="ltr">01:15pm&nbsp;&nbsp;VTT |&nbsp;Pilot factory for converting of next generation wearables towards high quality manufacturing processes &nbsp;&nbsp;</p><p dir="ltr">01:30pm&nbsp;&nbsp;NexStem |&nbsp;Wearable Brain-Computer Interfaces (BCIs) - Measuring Signals Beyond Patches &nbsp;&nbsp;</p><p dir="ltr">01:30pm&nbsp;&nbsp;Silicon Austria |&nbsp;Advancements in hybrid flexible electronics towards ultra-fine pitch chip bonding &nbsp;&nbsp;</p><p dir="ltr">01:45pm&nbsp;&nbsp;ISRA |&nbsp;Fab-as-a-Service: prototyping &amp; manufacturing of copper based printed electronics devices &nbsp;&nbsp;</p><p dir="ltr">01:45pm CondAlign&nbsp;| (TBC)</p><p dir="ltr"><strong>02.00pm &nbsp;Exhibition &amp; Networking Break &nbsp;&nbsp;</strong></p><p dir="ltr">02:45pm &nbsp;Encres DUBUIT | Transparent and conductive films based on nanocellulose.</p><p dir="ltr">&nbsp;02:45pm &nbsp;Zimmer Peacock | Printed Wearable Sensors for Sports and Athletic Performance &nbsp;</p><p dir="ltr">03:00pm &nbsp;Binder ITZ | Printed sensors on 3D surfaces &nbsp;&nbsp;</p><p dir="ltr">03:00pm &nbsp;EastPrint | (TBC) Wearable Biosensors: Overview of Printing Techniques</p><p dir="ltr">03:15pm&nbsp;&nbsp;FLEEP Technologies |&nbsp;PrintIC: integrated circuits can be printed! &nbsp;&nbsp;</p><p dir="ltr">03:15pm&nbsp;&nbsp;X-trodes |&nbsp;Soft electrode array for skin electro-physiology: New opportunities in sleep studies and rehabilitation &nbsp;&nbsp;</p><p dir="ltr">03:30pm&nbsp;&nbsp;EERS Global Technologies/ &Eacute;cole de technologie sup&eacute;rieure |&nbsp;(TBC) In-Ear Sensors To Measure Biometric Data and Brain Signals: Present and Future &nbsp;&nbsp;</p><p dir="ltr">03:30pm&nbsp;&nbsp;Marquardt Group |&nbsp;Fully printed organic photo sensor to supervise display functionality &nbsp;&nbsp;</p><p dir="ltr">03:45pm&nbsp;&nbsp;University of Chicago |&nbsp;Skin-like wearable electronics with artificial-intelligence computing &nbsp;&nbsp;</p><p dir="ltr">03:45pm&nbsp;&nbsp;e2ip |&nbsp;(TBC) InMold Electronics: Achieving ultra complex shapes with molecular inks &nbsp;&nbsp;</p><p dir="ltr"><strong>4.00pm &nbsp;Exhibition &amp; Networking Break &nbsp;&nbsp;</strong></p><p dir="ltr">04:55pm&nbsp;&nbsp;Georgia Institute of Technology |&nbsp;Soft Wearable Bioelectronics for Human Healthcare and Human-Machine Interfaces &nbsp;&nbsp;</p><p dir="ltr">04:55pm&nbsp;&nbsp;Murata Manufacturing |&nbsp;Highly Conductive MXene for Electronics &nbsp;&nbsp;</p><p dir="ltr">05:10pm&nbsp;&nbsp;NAMICS Technologies |&nbsp;Low temperature sintering nano silver paste &nbsp;&nbsp;</p><p dir="ltr">05:10pm&nbsp;&nbsp;University of Texas |&nbsp;Graphene based electronic tattoo technologies for complex electrophysiology &nbsp;&nbsp;</p><p dir="ltr">05:25pm&nbsp;&nbsp;Tampere University |&nbsp;Arterial Pulse Wave Monitoring: Self-Powered, Highly Unobtrusive, Low-Cost and Accurate &nbsp;&nbsp;</p><p dir="ltr">05:25pm MacDermid&nbsp;| (TBC) Ultralow temperature solder and pastes for InMold Electronics and Flexible Hybrid Electronics</p><p dir="ltr">05:40pm&nbsp;&nbsp;MesoMat |&nbsp;Stretchable piezo-resitive yarns for strain sensing in high deformation systems &nbsp;&nbsp;</p><p dir="ltr">05:40pm&nbsp;&nbsp;NanoPrintek |&nbsp;Dry Multimaterial Printer: An Ink-less Technology with On-Demand Generation and Real-time Sintering of Pure Nanoparticles &nbsp;&nbsp;</p><p dir="ltr">05:55pm&nbsp;&nbsp;Cardiomo Care |&nbsp;(TBC) Continous Non-Invastive ECG Monitoring: Hardware and Software &nbsp;&nbsp;</p><p dir="ltr">05:55pm&nbsp;CPI | Flexible Electronics for HealthTech</p><p dir="ltr"><strong>06.10pm &nbsp;Exhibition &amp; Networking Break &nbsp;&nbsp;</strong></p><p dir="ltr">06:45pm&nbsp;&nbsp;Theranica Bio Electronics |&nbsp;Remote Electrical Neuromodulation: Wearable Medical Devices</p><p><strong>You can view the combined agenda and register free&nbsp;</strong><a href="https://techblick-dot-yamm-track.appspot.com/2ISOs9hOMy2x8pbhQhl6KSSvgJLWIkOrG6xamhF4N_XNJc7g4hAHrTK3lmPs6viFvxTWpwv-ZckWPjtUPOAWzWbCua0Z6ORGl6JITifLNV7zXxNP6u2slSvhW_RP_2SY2c1JW8AOJI3cmvLbxsAYYVpfxKU3_2gHjvUnYyyQoFx3X0bYTw_lxzeKOy3sdQyPw0xfcZeUBrfUVgA" target="_blank"><strong>here.</strong></a>&nbsp;</p>

Announcing TechBlick's free-to-attend virtual conference and exhibition covering innovations in Wearable Sensors | E-Textiles | Printed Electronics & Beyond. It is a unique event with two-parallel live tracks, a live engaging exhibition floor, and 400+ attendees. See details & registration link here

Innovations: Wearable Sensors, E-Textiles, Printed Flexible Electronics

<p id="isPasted">Carnegie Mellon University researchers have pioneered the CMU Array&mdash;a new type of microelectrode array for brain computer interface platforms. It holds the potential to transform how doctors are able to treat neurological disorders.</p><p>3D printed at the nanoscale, the ultra-high-density microelectrode array (MEA) is fully customizable. This means that one day, patients suffering from epilepsy or limb function loss due to stroke could have personalized medical treatment optimized for their individual needs.</p><p>The collaboration combines the expertise of Rahul Panat, associate professor of mechanical engineering, and Eric Yttri, assistant professor of biological sciences. The team applied the newest microfabrication technique, Aerosol Jet 3D printing, to produce arrays that solved the major design barriers of other brain computer interface (BCI) arrays. The findings were published in&nbsp;<a href="https://doi.org/10.1126/sciadv.abj4853" rel="noopener" target="_blank"><em>Science Advances.</em>Opens in new window</a></p><p>&ldquo;Aerosol Jet 3D printing offered three major advantages,&rdquo; Panat explained. &ldquo;Users are able to customize their MEAs to fit particular needs; the MEAs can work in three dimensions in the brain; and the density of the MEA is increased and therefore more robust.&rdquo;</p><p><span class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable" contenteditable="false" draggable="true"><iframe src="https://www.youtube.com/embed/dMM-XWxo6VQ?&wmode=opaque&rel=0&enablejsapi=1&origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" style="width: 767px; height: 429px;"></iframe></span></p><p id="isPasted"><br>MEA-based BCIs connect neurons in the brain with external electronics to monitor or stimulate brain activity. They are often used in applications like neuroprosthetic devices, artificial limbs, and visual implants to transport information from the brain to extremities that have lost functionality. BCIs also have potential applications in treating neurological diseases such as epilepsy, depression, and obsessive-compulsive disorder. However, existing devices have limitations.</p><p>There are two types of popular BCI devices. The oldest MEA is the Utah array, developed at the University of Utah and patented in 1993. This silicone-based array uses a field of tiny pins, or shanks, that can be inserted directly into the brain to detect electrical discharge from neurons at the tip of each pin..</p><p>Another type is the Michigan array, which is printed on flat, delicate silicone chips. It reads the electrons as they fire across the chips. Due to design limitations, both of these arrays are only able to record on a two-dimensional plane. That means that they cannot be customized to fit the needs of each patient or application.</p><p><span class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable" contenteditable="false" draggable="true"><iframe src="https://www.youtube.com/embed/NH1XxVadNU4?&wmode=opaque&rel=0&enablejsapi=1&origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" style="width: 767px; height: 425px;"></iframe></span></p><p id="isPasted">The most important aspect of an MEA is its three-dimensional sampling ability, which is limited by the density of microelectrodes in the array and the ability to position these arrays in the precise spot one wants to sense. Modern MEA manufacturing techniques have made tremendous advances regarding the density of these microelectrode arrays. Adding the third dimension significantly increases the sampling ability of the arrays. In addition, custom-made MEAs for each specific application allows for more accurate and higher-fidelity readings.</p><p>The researchers&rsquo; CMU Array is the densest BCI, about one order of magnitude denser than Utah Array BCIs.</p><p>Higher-quality MEAs are in demand. MEAs used for controlling virtual actions on a computer or complex limb movements are running up on limitations of the current technology. More advanced applications require MEAs that are customized to each individual and are much higher fidelity than what is currently available.</p><blockquote><p>Within a matter of days, we can now produce a precision medicine device tailored to a patient or experimenter&rsquo;s needs.</p><cite><strong>Eric Yttri</strong>,&nbsp;<em>Assistant Professor</em>, Biological Sciences</cite></blockquote><p>&ldquo;Within a matter of days, we can now produce a precision medicine device tailored to a patient or experimenter&rsquo;s needs,&rdquo; says Yttri, co-senior author of the study. In addition, while technologies like visual cortex stimulation and artificial limb control are used successfully by the public, being able to personalize the control system in the brain could pave the way for enormous advances in the field.</p><p>Panat predicts that it may take five years to see human testing, and even longer to see commercial use. The team is excited to get this successful process out to other researchers in the field to begin testing a wide variety of applications.</p><p>A patent on the CMU Array architecture and manufacturing method is pending. The next step, Panat says, is to work with the National Institutes of Health (NIH) and other business partners to get these findings into other labs as quickly as possible and apply for funding that would commercialize this technology.</p>

Carnegie Mellon University collaborators pioneer the CMU Array—a customizable, 3D nano-printed, ultra-high-density microelectrode array platform for next-generation brain-computer interfaces. This technology can transform the way doctors are able to treat neurological disorders.

Nanoprinting electrodes for customized treatments of disease

<p>To overcome this issue, <a data-attribute-index="0" data-entity-hovercard-id="urn:li:fs_miniProfile:ACoAAABAP5cBYvrXJUAWBalx5GfjF9G7A62hSh8" data-entity-type="MINI_PROFILE" href="https://www.linkedin.com/in/ACoAAABAP5cBYvrXJUAWBalx5GfjF9G7A62hSh8" id="isPasted" target="_blank">Zachary James Davis</a> et al at <a data-attribute-index="2" data-entity-hovercard-id="urn:li:fs_miniCompany:7092" data-entity-type="MINI_COMPANY" href="https://www.linkedin.com/company/teknologiskinstitut/" target="_blank">Teknologisk Institut</a> have scaled up copper nanoparticle production with particle sizes between 30-300nm. As can be seen below, they have already achieved the following:</p><p><br>1) 10+ Kg per day - here the main bottleneck is the heating and mixing of the green ingredients<br>2) 300 Euros per Kg cost of production which is comparable to cost of production of Ag nanoparticles. This level of production cost- coupled with much lower raw material cost @36.7 Euro/Kg - can translate into a much lower product cost<br>3) Inkjet printable inks with DGME based solvents able to lay down 0.5-1um thick layers in a single pass achieving 60mOhm per sqr<br>4) screen printable versions (in development) targeting 50 mOhm/sqr</p><p><br>The scale up of Cu nanoparticle production with automated workflows is an important step towards making Cu ink and paste technology a commercially viable alternative to the dominant Ag inks and pastes&nbsp;</p><p><br><a data-attribute-index="4" href="https://www.linkedin.com/feed/hashtag/?keywords=copper&highlightedUpdateUrns=urn%3Ali%3Aactivity%3A6966445428347125760" target="_blank">#copper</a> <a data-attribute-index="5" href="https://www.linkedin.com/feed/hashtag/?keywords=ci&highlightedUpdateUrns=urn%3Ali%3Aactivity%3A6966445428347125760" target="_blank">#Ci</a> <a data-attribute-index="6" href="https://www.linkedin.com/feed/hashtag/?keywords=conductivepaste&highlightedUpdateUrns=urn%3Ali%3Aactivity%3A6966445428347125760" target="_blank">#conductivepaste</a> <a data-attribute-index="7" href="https://www.linkedin.com/feed/hashtag/?keywords=printedelectronics&highlightedUpdateUrns=urn%3Ali%3Aactivity%3A6966445428347125760" target="_blank">#printedelectronics</a> <a data-attribute-index="8" href="https://www.linkedin.com/feed/hashtag/?keywords=inkjet&highlightedUpdateUrns=urn%3Ali%3Aactivity%3A6966445428347125760" target="_blank">#inkjet</a> <a data-attribute-index="9" href="https://www.linkedin.com/feed/hashtag/?keywords=screenprinting&highlightedUpdateUrns=urn%3Ali%3Aactivity%3A6966445428347125760" target="_blank">#screenprinting</a> <a data-attribute-index="10" href="https://www.linkedin.com/feed/hashtag/?keywords=nanoparticles&highlightedUpdateUrns=urn%3Ali%3Aactivity%3A6966445428347125760" target="_blank">#nanoparticles</a> <a data-attribute-index="11" href="https://www.linkedin.com/feed/hashtag/?keywords=nanoparticle&highlightedUpdateUrns=urn%3Ali%3Aactivity%3A6966445428347125760" target="_blank">#nanoparticle</a></p><p><span class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable fr-active" contenteditable="false" draggable="true"><iframe src="https://player.vimeo.com/video/741186937" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" style="width: 767px; height: 592px;"></iframe></span>&nbsp;</p>

Cost of production has been a major barrier despite the fact that Cu raw material prices are far lower than Ag. This is because this large raw material cost difference does not often get translated into equally large nanoparticle dispersion or ink costs. Can this be overcome?

Will copper nanoparticle inks finally come of age to disrupt the dominance of silver in the conductive paste business?

<p id="isPasted">Flexible electronics have enabled the design of sensors, actuators, microfluidics and electronics on flexible, conformal and/or stretchable sublayers for wearable, implantable or ingestible applications. However, these devices have very different mechanical and biological properties when compared to human tissue and thus cannot be integrated with the human body.</p><p>A team of researchers at Texas A&amp;M University has developed a new class of biomaterial inks that mimic native characteristics of highly conductive human tissue, much like skin, which are essential for the ink to be used in 3D printing.</p><p>This biomaterial ink leverages a new class of 2D nanomaterials known as molybdenum disulfide (MoS<sub>2</sub>). The thin-layered structure of MoS<sub>2&nbsp;</sub>contains defect centers to make it chemically active and, combined with modified gelatin to obtain a flexible hydrogel, comparable to the structure of Jell-O.</p><p>&ldquo;The impact of this work is far-reaching in 3D printing,&rdquo; said Dr. Akhilesh Gaharwar, associate professor in the Department of Biomedical Engineering and Presidential Impact Fellow. &ldquo;This newly designed hydrogel ink is highly biocompatible and electrically conductive, paving the way for the next generation of wearable and implantable bioelectronics.&rdquo;</p><p>This study was recently published in <a href="https://pubs.acs.org/doi/10.1021/acsnano.1c09386" target="_blank"><em>ACS Nano</em></a>.</p><p id="isPasted">The ink has shear-thinning properties that decrease in viscosity as force increases, so it is solid inside the tube but flows more like a liquid when squeezed, similar to ketchup or toothpaste. The team incorporated these electrically conductive nanomaterials within a modified gelatin to make a hydrogel ink with characteristics that are essential for designing ink conducive to 3D printing.</p><p>&ldquo;These 3D-printed devices are extremely elastomeric and can be compressed, bent or twisted without breaking,&rdquo; said Kaivalya Deo, graduate student in the biomedical engineering department and lead author of the paper. &ldquo;In addition, these devices are electronically active, enabling them to monitor dynamic human motion and paving the way for continuous motion monitoring.&rdquo;</p><p>In order to 3D print the ink, researchers in the Gaharwar Laboratory designed a cost-effective, open-source, multi-head 3D bioprinter that is fully functional and customizable, running on open-source tools and freeware. This also allows any researcher to build 3D bioprinters tailored to fit their own research needs.</p><p>The electrically conductive 3D-printed hydrogel ink can create complex 3D circuits and is not limited to planar designs, allowing researchers to make customizable bioelectronics tailored to patient-specific requirements.</p><p>In utilizing these 3D printers, Deo was able to print electrically active and stretchable electronic devices. These devices demonstrate extraordinary strain-sensing capabilities and can be used for engineering customizable monitoring systems. This also opens up new possibilities for designing stretchable sensors with integrated microelectronic components.</p><p>One of the potential applications of the new ink is in 3D printing electronic tattoos for patients with Parkinson&rsquo;s disease. Researchers envision that this printed e-tattoo can monitor a patient&rsquo;s movement, including tremors.</p><p>This project is in collaboration with Dr. Anthony Guiseppi-Elie, vice president of academic affairs and workforce development at Tri-County Technical College in South Carolina, and Dr. Limei Tian, assistant professor of biomedical engineering at Texas A&amp;M.&nbsp;</p>

Researchers at the Gaharwar Laboratory have developed a new nanoengineered bioink for 3D-printable wearable bioelectronics. These 3D-printable devices are electronically active and can monitor dynamic human motion, paving the way for continuous motion monitoring. | Image: Gaharwar Laboratory

Flexible electronics have enabled the design of sensors, actuators, microfluidics and electronics on flexible, conformal and/or stretchable sublayers for wearable, implantable or ingestible applications.

Researchers design new inks for 3D-printable wearable bioelectronics

<p><br id="isPasted"><a data-attribute-index="0" data-entity-hovercard-id="urn:li:fs_miniProfile:ACoAAAoaomAB9rqC9YgyhHEyK6vOx5VqZotSfB0" data-entity-type="MINI_PROFILE" href="https://www.linkedin.com/in/ACoAAAoaomAB9rqC9YgyhHEyK6vOx5VqZotSfB0" target="_blank">Arnold Kell</a> and&nbsp;<a data-attribute-index="2" data-entity-hovercard-id="urn:li:fs_miniProfile:ACoAAANiDYABr5VK20bIR4XHrc3HUSK6sPsojDA" data-entity-type="MINI_PROFILE" href="https://www.linkedin.com/in/ACoAAANiDYABr5VK20bIR4XHrc3HUSK6sPsojDA" target="_blank">Julie Ferrigno</a> showcased some unique properties of these inks- together with unique IME possibilities- at a TechBlick conference in May 2021. Some unique feetures are:<br><br>1- UV sintering: you can see in the slide below how the transparent clear molecular inks can be UV sintered (x5 times faster than thermal cure). At first, the clear inks absorb very little UV light. However, as Ag particles begin to percipitate out, the absorption grows. The higher absorption in turn raise the temperature, accelerating the sintering and resulting in higher UV absorption. This process continues until the ink is fully sintered and then self stops because then the particles reflect the light back like a mirror.<br><br>2- Partial sintering compatible with InMold Electronics: as part of the IME process, a thermoforming step is required. In this step, the substrate temperature is raised in a controlled fashion to soften the material, allowing it to be 3D formed. In the proposed scheme, the printed molecular inks are first only partially cured by UV light. The full sintering then takes place in-situ by the elevated temperature of the 3D thermoforming process. This is an interesting approach because it enables faster curing and also allows one to sinter molecular inks on low-T substrates like PC.<br><br>3- Extreme formability: The 3rd slide belows shows comparision of these molecular inks with other standard inks. It shows that these inks can be stretched upto 50% with comparatively little change in resistance. This can be because these printed lines are very thin, and are thus able to follow the contours of the stretched substrate far better than a thicker particle-filled ink/paste</p><p><br>4- Unique shaped: The shapes enabled by IME are often limited by the formability of the inks. These inks can liberate the designer from such limitation, allowing the design and production of complex shapes with extreme curvatures. Here, an award-winning example is showcased by Julie, showing steep curves (see the controlled knob).</p><p>To learn more about additive electronics visit <a href="//www.TechBlick.com" rel="noopener noreferrer" target="_blank">www.TechBlick.com</a> <span dir="ltr"><br><br><a data-attribute-index="9" data-entity-hovercard-id="urn:li:fs_miniCompany:40697896" data-entity-type="MINI_COMPANY" href="https://www.linkedin.com/company/e2ip-technologies/" target="_blank">E2IP TECHNOLOGIES</a><br><a data-attribute-index="11" data-entity-hovercard-id="urn:li:fs_miniCompany:8417" data-entity-type="MINI_COMPANY" href="https://www.linkedin.com/company/national-research-council/" target="_blank">National Research Council Canada / Conseil national de recherches Canada</a><br><a data-attribute-index="13" data-entity-hovercard-id="urn:li:fs_miniProfile:ACoAAAYgmPoBuPUSTluI0vsnbvU6HsWLvkd67v0" data-entity-type="MINI_PROFILE" href="https://www.linkedin.com/in/ACoAAAYgmPoBuPUSTluI0vsnbvU6HsWLvkd67v0" target="_blank">Ilira Qamirani</a><br><a data-attribute-index="15" data-entity-hovercard-id="urn:li:fs_miniProfile:ACoAAAE6ZpwBxe_XNADVQsl-EMw3Gj79B7f_dJQ" data-entity-type="MINI_PROFILE" href="https://www.linkedin.com/in/ACoAAAE6ZpwBxe_XNADVQsl-EMw3Gj79B7f_dJQ" target="_blank">Patrick R. L. Malenfant</a><br><a data-attribute-index="17" data-entity-hovercard-id="urn:li:fs_miniProfile:ACoAAADZC6ABEC7FIAkoFhbsNv7glcBBsAJIBK8" data-entity-type="MINI_PROFILE" href="https://www.linkedin.com/in/ACoAAADZC6ABEC7FIAkoFhbsNv7glcBBsAJIBK8" target="_blank">Chantal Paquet</a></span></p><p><br></p><p><br></p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYwNjQ3NTIxNzQxLTEucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 648px;" class="fr-fic fr-dib"></p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYwNjQ3NTc5MjgyLVRoZXJtb2Zvcm1pbmcgTW9sZWN1bGFyIElua3MucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 603px;" class="fr-fic fr-dib"></p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYwNjQ3NjA5NzU4LUV4dHJlbWUgZm9ybWFiaWxpdHkgb2YgbW9sZWN1bGFyIElua3MucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 573px;" class="fr-fic fr-dib"></p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYwNjQ3NjIyNjU1LVVuaXF1ZSBJbk1vbGQgRWxlY3Ryb25pY3MgU2hhcGVzLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 569px;" class="fr-fic fr-dib"></p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjYwNjQ3NjM0NDgzLWVpbmRob2l2ZW4xLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 563px;" class="fr-fic fr-dib"></p><p><br></p>

Molecular particle free inks can offer extreme formability and stretchability, allowing the design and production of 3D shaped and/or in-mold electronics parts with extreme curvatures and complex shapes.


Complex 3D Electronic Shapes with Particle-Free Inks

<p id="isPasted">As NASA prepares to send astronauts back to the Moon to live and explore, capabilities for space-based manufacturing of sensors, circuits, and other electronics will become increasingly critical. Recent microgravity flights have helped to advance cutting-edge methods for 3D printing of electronics by teams from San Jose, California-based Space Foundry and Iowa State University in Ames, supported by NASA&rsquo;s <a href="https://www.nasa.gov/directorates/spacetech/flightopportunities/index.html" target="_blank">Flight Opportunities</a> and <a href="https://sbir.nasa.gov/" target="_blank">Small Business Innovation Research</a> (SBIR) programs.</p><p>A vast range of future scenarios could benefit from electronics printed in space &ndash; from radiation sensors printed onto the walls of lunar habitats, to printing solar panels on the Moon&rsquo;s surface, to gas and biosensors for use on the International Space Station. The capability to print electroinics in space is critical to the NASA mission and testing the ability to print electorincs in microgravity on Earth first is an important step in the maturation of technology.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 768px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1660638534623-zerog_printed_pattern_web_spacefoundry.jpg" style="width: 766px;" class="fr-fic fr-dib"><span class="fr-inner">Space Foundry printed electrodes that could be used in space-based biological and chemical sensors on parabolic flights in Nov. and Dec. 2021 and June 2022. Credits: Space Foundry</span></span></span></p><p>&ldquo;In terms of electronics, there are so many critical needs for which we must enable reliable in-space manufacturing, because we simply cannot anticipate and carry with us all of the sensors and circuits that we might need for a given mission,&rdquo; said Curtis Hill, senior materials engineer at NASA&rsquo;s Marshall Space Flight Center and principal investigator for NASA&rsquo;s On-Demand Manufacturing of Electronics (ODME) project, part of the agency&rsquo;s <a href="https://www.nasa.gov/directorates/spacetech/game_changing_development/index.html" target="_blank">Game Changing Development</a> program. ODME will select electronics manufacturing technologies among systems from Space Foundry, Iowa State, and other organizations for 2024 demonstrations on the space station.</p><p>But first, the innovations are being tested on parabolic flights. These flights take place on modified airplanes that perform a series of maneuvers called parabolas, resulting in brief intervals of reduced and zero gravity. &nbsp;</p><p>&ldquo;Technology maturation is done in steps, and a very important step is parabolic flights and the microgravity testing they provide,&rdquo; said Hill. &ldquo;These flights help us take technologies to higher <a href="https://www.nasa.gov/directorates/heo/scan/engineering/technology/technology_readiness_level" target="_blank">technology readiness levels</a> and allow us to evaluate them for potential infusion in lunar and <a href="https://www.nasa.gov/gateway" target="_blank">Gateway</a> missions, among others.&rdquo;</p><p>Parabolic flights from Zero Gravity Corporation in late 2021 and June 2022 enabled Space Foundry researchers to test a <a href="https://spinoff.nasa.gov/Plasma-Improves-3D-Electronics-Printing" target="_blank">system licensed from NASA&rsquo;s Ames Research Center</a> designed for high-throughput plasma jet printing of conductive metal inks. The process addresses challenges of space-based 3D printing, including the time-consuming curing processes that most methods require. By contrast, Space Foundry&rsquo;s process leverages a single-step approach that doesn&rsquo;t require heat or ultraviolet curing. These advantages could lessen impact on astronauts&rsquo; time, lower costs, and improve the versatility of printing electronics for a wide range of applications. &nbsp;</p><p>&ldquo;A single-step process is ideal, especially when printing electronics for large structures in space,&rdquo; said Dr. Ram Prasad Gandhiraman, founder and CEO of Space Foundry and former research scientist at NASA Ames, where he led the technology&rsquo;s initial development. &ldquo;For example, if you wanted to print sensors on an aircraft wing, having a single-step process could allow for simplified printing directly on the structure, without removing it for more complicated, multi-step curing.&rdquo;</p><p>November 2021 parabolic flights proved instrumental in <a href="https://www.nasa.gov/feature/small-business-gets-an-assist-from-nasa-problem-solvers" target="_blank">helping Space Foundry work out some hardware glitches</a> and fix them between successive flights over multiple days. That troubleshooting led to successful printing of silver electrodes and a Wi-Fi antenna during December 2021 flights, and allowed the company to take their work further.</p><p>&ldquo;After resolving hardware challenges and a successful demonstration printing silver, we were keen to print copper as well,&rdquo; said Dr. Gandhiraman.</p><p><span class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable" contenteditable="false" draggable="true"><iframe src="https://www.youtube.com/embed/SoyvVvtJxx0?&wmode=opaque&rel=0&enablejsapi=1&origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" style="width: 767px; height: 436px;"></iframe></span><em>View a recent NASA webinar for insights from Iowa State&rsquo;s Dr. Hantang Qin and NASA ODME&rsquo;s Curtis Hill on testing technologies for in-space manufacturing of electronics on suborbital flights.&nbsp;</em></p><p>Dr. Gandhiraman noted that copper is beneficial for space-based electronics because it is highly conductive, and they wanted to try printing copper with a Space Foundry-developed ink designed to overcome the shelf-life concerns of other off-the-shelf inks. During two flights in June 2022, the company successfully used the proprietary ink to print a copper electrode.</p><p>Recent flights also provided testing for Iowa State&rsquo;s system for electrohydrodynamic inkjet printing, which addresses another challenge of space-based 3D printing: lack of gravity needed to drive the flow of liquid inks. The university&rsquo;s system leverages electrical force to drive ink flow, replacing the need for gravity to accomplish this task.</p><p>The team&rsquo;s first printer was flown in Dec. 2021 and successfully printed microelectronics including a humidity sensor &ndash; but the team found the system to be less stable and robust than they expected. They made key upgrades, including increased process automation and modification of the inks to withstand vibration, and flew the new hardware successfully in May 2022.</p><p>&ldquo;My impression of these flights is that they are full of challenges, especially the first flights when you don&rsquo;t know exactly what will happen,&rdquo; said Iowa State&rsquo;s Dr. Hantang Qin, principal investigator for the project. &ldquo;Flying multiple times, we resolved the challenges and improved the technology to show that it is ready to integrate with other printing platforms.&rdquo;</p><p>As ODME tracks the progress of these electronics printing methods, Hill said that parabolic flight testing is key to helping NASA understand the best electronics applications for each printing method.</p><p>&ldquo;As results come in, we start to see how the specific materials respond to microgravity, and we are able to identify which methods match up best with various uses in space. This will ultimately help us prepare for demonstration of specific capabilities on the station,&rdquo; said Hill.</p><p>Flight Opportunities, SBIR, and Game Changing Development are part of NASA&#39;s Space Technology Mission Directorate.</p>

Space Foundry CEO and co-founder Dr. Ram Prasad Gandhiraman (left) and CTO and co-founder Dr. Dennis Nordlund operate the company’s plasma jet printing of electronics experiment in microgravity on a parabolic flight in December 2021 Credits: Zero Gravity Corporation/Steve Boxall

As NASA prepares to send astronauts back to the Moon to live and explore, capabilities for space-based manufacturing of sensors, circuits, and other electronics will become increasingly critical. Recent microgravity flights have helped to advance cutting-edge methods for 3D printing of electronics

Microgravity Testing Advances Space-Based Printing of Electronics

<p id="isPasted">The traditional LDS (laser direct structuring) process is fantastic but only works on special plastic substrates containing an sub-surface activation particles. This limits the choice and functionality of materials. Firstly, it typically does not work with glass, ceramics, PET or thermosets. Furthermore, the addition of activation particles can render a transparent material opaque or eliminate bio-compatibility. Furthermore, the linewidth resolution is typically around 80-100um (but can be pushed further down) with surface roughness of 20-30um</p><div data-hook="rcv-block1" type="paragraph"><br></div><p><a data-hook="linkViewer" href="https://www.linkedin.com/company/71510477/admin/#" rel="noopener noreferrer" tabindex="0" target="_blank">Nouhad Bachnak , 3D-MID</a> from <a data-hook="linkViewer" href="https://www.linkedin.com/company/71510477/admin/#" rel="noopener noreferrer" tabindex="0" target="_blank">Sunway Communication</a> unveils a new process below, which promises to overcome these limitations. Here, the process first involves a special laser structuring process followed by a so-called chemical activation step. After this step, the structured and activated part undergoes typical plating (Cu-NiP-Au)</p><div data-hook="rcv-block2" type="paragraph"><br></div><p>The details of the chemical activation step - possibly the most important step- were not disclosed. Nonetheless, the disclosed examples and results indeed suggest that it can work on glass, ceramics, thermosets, etc.</p><div data-hook="rcv-block3" type="paragraph"><br></div><p>This is an important development and advancement of the technology, because it greatly lessens the limits on the choice of materials which can be 3D metallized with bulk-like properties and solderable surfaces</p><div data-hook="rcv-block4" type="paragraph"><br></div><p>Furthermore, it is argued that this process- presumably when optimized- will achieve 5um linewidths with a surface roughness of just 2-3um (great for antennas, for example). It can also plate within vias with 40um diameter.</p><div data-hook="rcv-block5" type="paragraph"><br></div><p>This is still not the full production level for all substrates. The most advanced development is for thermoset, which is production ready. The other substrates like glass, PET, and ceramics are still in development. Nonetheless, it is a good space to watch</p><p>For more information visit <a href="//www.TechBlick.com" rel="noopener noreferrer" target="_blank">www.TechBlick.com</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1659975590213-Picture1.png" style="width: 528px;" class="fr-fic fr-dib"></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1659975605677-2.png" style="width: 481px;" class="fr-fic fr-dib"></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1659975623721-Picture3.png" style="width: 451px;" class="fr-fic fr-dib"></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1659975636685-4.png" style="width: 435px;" class="fr-fic fr-dib"></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1659975660070-Picture5.png" style="width: 465px;" class="fr-fic fr-dib"></p><p><br></p><p>Sunway will be presenting at the TechBlick show on 12-13 OCT 2022. See agenda below</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1659975697389-1.AGENDA-%28PE-October-2022-LIVE%29-small+%282%29.jpg" style="width: 662px;" class="fr-fic fr-dib"></p>

How to overcome the traditional limits of LDS (laser direct structuring) to metallize 2D and 3D objects made from all kinds of surfaces?

High-res metalization of 2D and 3D object made from glass, ceramic, PET or thermosets?

<html><head></head><body><p id="isPasted"><strong>Ultrafine line screen printing: emerging application and competing technologies</strong></p><p>TechBlick - the home of additive electronics- &nbsp;prepared this presentation to outline the latest trends in ultrafine line screen printing as well as an overview of other ultrafine printing technologies. To be more specific, in the following video, you can see the following</p><ul><li><strong>Existing and emerging applications for ever finer Screen Printing linewidths (sub-15 micron meters):&nbsp;</strong>Photovoltaic metallization | MicroLED wrap-around edge electrodes | Fan-out structure for flexible hybrid electronics | Transparent HMIs |Transparent Touch Displays | Edge Electrodes | MLCC | LTCC</li></ul><p><br></p><ul><li><em><strong>Hybrid and direct (non-digital) printing technologies towards sub-micron linewidths:</strong>&nbsp;</em>Hybrid screen printing (print + etch/ablate) | R2R flexo printing | R2R Gravure Offset Printing &nbsp;|S2S Offset Printing | S2S Reverse Offset Printing |R2R Reverse Offset Printing | R2R Imprinting + Filling | R2R Photolithgraphy&nbsp;</li></ul><p><strong>You can download the slides and read the full transcription of the presentaiton&nbsp;</strong><a href="https://www.techblick.com/blog" target="_blank"><strong>here.</strong></a></p><p><strong><span class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable" contenteditable="false" draggable="true"><iframe width="640" height="360" src="https://player.vimeo.com/video/730919566" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true"></iframe></span></strong><br></p><p><br></p><p><br></p></body></html>

We first discuss emerging and existing applications for ultra fineline screen printing, outlining how evolution of screen printing can unlock various electronic applications. Next, it will review other printing technologies extending the linewidth resolution to sub-micron range

Ultra fineline printed electronics: review of applications and technologies

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