This is the definitive technical comparison between Junction Field-Effect Transistors and metal-oxide Semiconductor Field-Effect Transistors. This in-depth analysis covers operational physics, performance metrics, and practical implementation guidelines for electronic design engineers.

JFET vs MOSFET: A Comprehensive Engineering Analysis and Selection Guide

<h2 dir="ltr" id="isPasted">Introduction</h2>In modern automotive engineering, Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) are fundamental components that enhance the performance, efficiency, and safety of vehicle electronics. Serving as key components in power management systems, motor controls, safety mechanisms, and various other vehicle subsystems, the reliability and performance of MOSFETs significantly impact the efficiency, safety, and overall driving experience of both electric vehicles (EVs) and internal combustion engine (ICE) vehicles. Consequently, the quality of MOSFETs is a non-negotiable aspect.This article provides a detailed look at high-performance MOSFETs tailored for automotive applications, focusing on their essential functions, performance metrics, and rigorous quality standards. Additionally, it examines Nexperia's contributions to the evolution of the technology, highlighting real-world applications and discussing the trends currently shaping the industry.<h2 dir="ltr">Understanding Automotive MOSFETs</h2>MOSFETs are pivotal components in the architecture of modern automotive electronics. Their ability to efficiently switch and amplify power makes them a critical component across various systems within vehicles.<h3 dir="ltr">Function and Importance of MOSFETs in Automotive Systems</h3>MOSFETs are integral to the functionality of numerous automotive systems, serving as critical components in power management and signal processing across various applications. Their ability to handle high currents and voltages efficiently while switching and amplifying signals makes them a vital electronic component in modern vehicles. Here’s a closer look at some specific applications:<ul><li dir="ltr" style="font-weight: bold;">Powertrain and Vehicle Dynamics:<ul style="font-weight: initial;"><li dir="ltr">Advanced Driver Assistance Systems (ADAS) radar sensor module:&nbsp;MOSFETs regulate the power distribution to the radar components of ADAS, ensuring optimal performance by managing the precise control of high currents needed for the radar's operation.</li><li dir="ltr">Electronic Power Steering (EPS): MOSFETs modulate the power supplied to the electric motor that drives the steering mechanism, allowing for precise control and responsiveness, enhancing both the efficiency of steering operations and the overall safety and comfort for the driver.</li><li dir="ltr">Anti-locking braking systems/Electronic Stability Control (ABS/ESC): Critical in providing the rapid switching needed for effective electronic stability control and braking systems.</li></ul></li><li dir="ltr" style="font-weight: bold;">Vehicle Comfort and Convenience:<ul style="font-weight: initial;"><li dir="ltr">Adaptive Front LED lights and Interior LED lighting:&nbsp;MOSFETs drive the lighting systems, offering precision control that adapts to varying conditions and user settings.</li><li dir="ltr">Automatic Heating Ventilation and Air Conditioning (HVAC):&nbsp;Ensures efficient motor control for heating, ventilation, and air conditioning, enhancing passenger comfort.</li><li dir="ltr">Active Suspension System: MOSFETs facilitate the rapid adjustment of suspension settings to adapt to road conditions to improve ride quality and vehicle handling. This technology contributes to a smoother driving experience by dynamically managing the suspension's response to changes in terrain.</li></ul></li><li dir="ltr" style="font-weight: bold;">Safety Systems:<ul style="font-weight: initial;"><li dir="ltr">Airbag controller with Safing MOSFET:&nbsp;Controls the deployment of airbags in a crash situation, ensuring timely and reliable activation.</li><li dir="ltr">Seat Belt Pretensioners and Force Limiters: MOSFETs control the mechanisms that tighten seat belts instantly during a collision, reducing slack to protect occupants. They also regulate the force limiters to ensure that the belt tightens adequately without causing injury, enhancing passenger safety during severe impacts.</li></ul></li></ul><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729694339156-image1.jpg" style="width: 100%px;" class="fr-fic fr-dib" alt="mosfet-applications-vehicle"><ul id="isPasted"><li dir="ltr" style="font-weight: bold;">Power Management in EVs/Hybrids:<ul style="font-weight: initial;"><li dir="ltr">High power, high-efficiency DC/DC converter and On-Board Charger (OBC): Essential for converting and managing power within the vehicle’s electrical system, crucial for electric and hybrid vehicles.</li><li dir="ltr">Zonal Control Units: MOSFETs facilitate intelligent power distribution controlled by software, optimizing the delivery of power to different zones of the vehicle. This not only enhances the efficiency of electrical systems but also supports advanced features such as customized lighting and climate control across different cabin areas.</li><li dir="ltr">Battery Management System (BMS):&nbsp;MOSFETs play a crucial role in managing systems that monitor and control battery packs, crucial for EV performance and safety. They also help in the balanced charging of battery cells, a process that is critical for maintaining the health and extending the lifetime of the battery. By ensuring each cell within the battery pack is charged correctly, MOSFETs prevent overcharging and help maintain the overall battery balance, thus safeguarding and maximizing battery life.</li></ul></li><li dir="ltr" style="font-weight: bold;">Applications in ICE vehicles:<ul style="font-weight: initial;"><li dir="ltr">Cooling Fan and Fluid Pump Controls:&nbsp;Manage the operation of cooling systems and fluid circulation, which are vital for maintaining the operational integrity of engine and battery systems.</li><li dir="ltr">Electronic Fuel Injection:&nbsp;Improves the efficiency and control of fuel delivery to the engine, optimizing performance and reducing emissions.</li></ul></li></ul>MOSFETs’ versatility enables them to support these (and many more) critical functions across various systems within the vehicle, highlighting their importance in the automotive industry.<h3 dir="ltr">Key Performance Metrics for MOSFETs</h3>The high performance, efficiency, and reliability of MOSFETs in automotive applications are essential for ensuring the smooth operation of vehicle electronics. These metrics include:<ul><li dir="ltr" style="font-weight: bold;">Electrical Efficiency:<ul style="font-weight: initial;"><li dir="ltr">Switching Efficiency:&nbsp;Effective switching speeds for automotive power MOSFETs typically range from tens to hundreds of nanoseconds, essential for fast response times in power-intensive applications. Small signal MOSFETs, which are also qualified for automotive use, can switch in just a few nanoseconds, providing even faster response for applications requiring high-speed signal processing.</li><li dir="ltr">On-state Resistance:&nbsp;Lower on-state resistance increases efficiency by reducing power losses. Typical values range from 10 mΩ to sub &lt;1mΩ, ideal for minimizing heat generation and energy wastage.</li><li dir="ltr">Power Limits:&nbsp;These are determined by the maximum voltage and current the MOSFET can handle—commonly between 5V to 100V and 10A to 2000A—suitable for a variety of automotive functions.</li></ul></li><li dir="ltr" style="font-weight: bold;">Thermal Performance:<ul style="font-weight: initial;"><li dir="ltr">Operating Temperature Range:&nbsp;Automotive MOSFETs must operate effectively within a range of -55°C to +150°C, with short-term tolerance of up to 175°C for high-heat environments such as engine compartments.</li><li dir="ltr">Thermal Resistance of Junction-Base Mounting: &nbsp;This parameter, ranging from 0.5K/W to 2K/W, indicates the capability of heat dissipation. Lower values are preferable, as they denote superior thermal management.</li></ul></li><li dir="ltr" style="font-weight: bold;">Durability and Longevity:<ul style="font-weight: initial;"><li dir="ltr">Thermal Cycling Resistance:&nbsp;MOSFETs are designed to withstand numerous thermal cycles without performance degradation, ensuring long-term reliability. Additionally, they must pass rigorous electrical bias stress tests, including high temperature gate bias, high temperature reverse bias, and humidity bias stress. These tests are critical for assessing the durability of MOSFETs under severe environmental conditions and electrical stresses, further ensuring their robustness and suitability for demanding automotive applications.</li></ul></li></ul>Suggested reading:&nbsp;<a href="https://www.wevolver.com/article/next-generation-mosfet-technology-meets-demand-for-strong-thermal-performance-in-automotive-applications" target="_blank">Next-generation MOSFET technology Meets Demand for Strong Thermal&nbsp;Performance in Automotive Applications.</a><h2 dir="ltr">Quality Standards and Certifications</h2>MOSFETs used in automotive applications are subject to specific industry standards that dictate their design, testing, and performance criteria. One of the most critical standards is the AEC-Q101, a stringent specification from the Automotive Electronics Council that covers stress tests for semiconductors in automotive applications. This standard ensures that MOSFETs can withstand extreme conditions such as high temperatures, vibrations, and varying electrical loads.Compliance with AEC-Q101 involves multiple tests, including thermal shock, moisture resistance, electrostatic discharge susceptibility, and life-cycle testing. These tests are designed to simulate the actual operating conditions that MOSFETs will face in a vehicle, ensuring that only the most robust components make it into automotive systems.&nbsp;Suggested reading: <a href="https://www.wevolver.com/article/semiconductor-resilience-with-innovations-in-testing-techniques-and-packaging" target="_blank">Semiconductor Resilience with Innovations in Testing Techniques and Packaging</a><h2 dir="ltr">Trends and Innovations</h2>The automotive industry is on the brink of a big technological transformation, with MOSFETs playing a crucial role in shaping the future of mobility. As the demand for EVs and autonomous driving systems increases, MOSFETs are evolving to meet the new challenges and performance requirements.New materials such as Silicon Carbide (SiC) and Gallium Nitride (GaN) are making their way into MOSFET design. These materials offer superior efficiency, higher breakdown voltage, higher temperature tolerance, and faster switching capabilities than traditional silicon MOSFETs, making them ideal for the high-power demands of EV powertrains and charging systems.Additionally, the integration of intelligent control features within vehicle subsystems is becoming more common. Smart power converters can provide real-time diagnostics and protection features, enhancing the overall safety, reliability and repairability of automotive electronics.Moreover, as vehicles become more connected and autonomous, the number of electronic components and systems is set to increase continuously, necessitating MOSFETs that can perform reliably in a more crowded and interconnected environment. The ongoing development in MOSFET technology also aims to reduce interference and improve communication between components, ensuring seamless operation.<h2 dir="ltr">Nexperia's High-Performance MOSFETs: Driving Excellence and Innovation in Automotive Electronics</h2>Nexperia distinguishes itself in the automotive electronics market with a strong focus on quality, performance, and innovation. As a semiconductor manufacturer, Nexperia is committed to developing MOSFET technology that meets the stringent requirements of modern automotive systems.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729694884790-image3.png" style="width: 100%px;" class="fr-fic fr-dib" alt="lfpak-family">MOSFETs optimized for Automotive applications by Nexperia in an LFPAK package. Source: Nexperia<h3 dir="ltr">Innovative Product Range</h3>Nexperia’s automotive MOSFET product portfolio contains over 400 types of power MOSFETs, with specifications ranging from -18 &nbsp;to 500 A for drain currents and drain-source voltage ratings ranging from -60to 100 V. These are housed in robust copper-clip packages featuring cutting-edge technologies, such as flexible leads and wettable flanks for ease of Automatic Optical Inspection (AOI) and improved reliability. This diversity ensures solutions for every automotive electronic need, from simple lamp circuits to complex power requirements of vehicle electrification and hybrid battery systems.Suggested reading:&nbsp;<a href="https://www.wevolver.com/article/a-story-of-innovation-how-lfpak-revolutionized-an-industry" target="_blank">A story of innovation: How LFPAK revolutionized an industry.</a><h3 dir="ltr">Focused on Future Needs and Sustainability</h3>Nexperia is further advancing MOSFET technology with initiatives like the introduction of the <a href="https://www.nexperia.com/products/sic-mosfets" target="_blank">1200 V Silicon Carbide MOSFETs</a>, which enhance efficiency and reduce energy waste—crucial for extending the driving range of EVs. The company's efforts in scaling down MOSFET sizes allow for more compact system designs without compromising performance or reliability. These innovations support the automotive industry’s goals of reducing carbon footprints and advancing sustainable mobility solutions.<iframe width="640" height="360" src="https://www.youtube.com/embed/pD7b3YkhG6s?&amp;pp=ygUPbmV4cGVyaWEgbW9zZmV0&amp;wmode=opaque&amp;rel=0" frameborder="0" allowfullscreen="" class="fr-draggable">&nbsp;</iframe><h3 dir="ltr">Specialization for Reliability</h3>Tailoring MOSFET offerings to specific automotive needs ensures that each component delivers optimal performance and efficiency. Nexperia’s MOSFETs are essential in systems ranging from adaptive lighting and climate control to critical applications like electric power steering and braking systems. Innovations in packaging and silicon technologies enhance thermal performance and durability, vital attributes where reliability and space economy are most important.Nexperia upholds a zero-defect culture, which has been recognized through multiple supplier awards, reflecting their commitment to excellence. Impressively, the company has maintained a complaint rate of less than 0.05 complaints per million since 2019, emphasizing their relentless focus on quality.&nbsp;In addition to these innovations, Nexperia provides next-generation support tools for automotive engineers. Their interactive datasheets allow real-time adjustment of parameters like voltage, current, and temperature, instantly visualizing MOSFET behavior. This streamlines design workflows by eliminating manual calculations and circuit simulations. Advanced electrothermal MOSFET models also enable early-stage validation of circuit designs, helping identify EMI and EMC issues upfront.Nexperia's ongoing innovations and focus on quality support automotive manufacturers in developing more efficient, reliable, and cost-effective electronic systems. These advancements contribute to vehicles that offer improved safety, comfort, and environmental performance.Visit <a href="https://nexperia.com/mosfets" target="_blank">Nexperia's official website</a> to explore a range of advanced MOSFET solutions built for automotive electronics.<h2 dir="ltr">Conclusion</h2>Nexperia's ongoing commitment to innovation in MOSFET technology highlights the critical role these components play in improving vehicle performance, efficiency, and safety. By leveraging advanced materials and innovative designs, Nexperia ensures that automotive electronics meet stringent contemporary standards and are equipped for the evolving demands of tomorrow. As the shift towards more electric and autonomous vehicles continues, the need for reliable, efficient, and high-performance MOSFETs becomes increasingly apparent.<h2 dir="ltr">References</h2>[1] Nexperia. Driving solenoids in automotive applications Rev. 1.1 [Internet]. 3 Nov 2023. Available from:<a href="https://assets.nexperia.com/documents/application-note/AN50003.pdf" target="_blank">&nbsp;https://assets.nexperia.com/documents/application-note/AN50003.pdf</a>[2] Nexperia. MOSFET and GaN FET Application Handbook [Internet]. 19 Nov 2020. Available from:<a href="https://efficiencywins.nexperia.com/efficient-products/mosfet-and-gan-fet-application-handbook" target="_blank">&nbsp;https://efficiencywins.nexperia.com/efficient-products/mosfet-and-gan-fet-application-handbook</a>[3] Nexperia. Selection Guide: Discrete, MOSFET and GaN FET components, analog &amp; logic ICs [Internet], Available from: <a href="https://assets.nexperia.com/documents/selection-guide/Nexperia_Selection_guide_2023.pdf" target="_blank">https://assets.nexperia.com/documents/selection-guide/Nexperia_Selection_guide_2023.pdf</a>

Nexperia's automotive MOSFETs enhance innovation across both traditional and electric vehicles, expertly managing a wide array of applications from simple lighting to advanced electrification systems, ensuring high performance, reliability and superior efficiency in every aspect.

High-Performance MOSFETs Driving Excellence and Innovations in Automotive Electronics

Magnetic cores are essential in modern electronics, influencing the functionality and efficiency of devices, from power supplies to renewable energy systems. Traditional designs, especially those with a single large air gap, struggle to meet the high-frequency and efficiency demands of present-day applications.&nbsp;This challenge has catalyzed the development of distributed air gap cores, which are primarily used to increase power handling capabilities, enable higher currents, and enhance the efficiency and thermal performance of magnetics. Historically, the technology behind distributed air gap cores has been around for nearly 30 years but has always been an expensive, highly customized solution –that is, until now.&nbsp;Today, <a href="https://www.tdk-electronics.tdk.com/en/2796388/products/product-catalog/ferrites-and-accessories/cores-with-distributed-air-gaps" target="_blank" rel="noopener noreferrer">TDK Corporation</a>, a global leader in electronic components, is innovating the standardization of Distributed air gap cores in a way that is revolutionizing how the market will specify, purchase, and adopt these crucial components. This article explores how distributed air gap cores are revolutionizing magnetic core design, offering a glimpse into their principles, advantages, and standardization efforts led by TDK.<h2 dir="ltr" id="isPasted">Challenges of Traditional Single Large Air Gap Cores</h2>Traditional magnetic cores with single large air gaps exhibit a number of drawbacks due to their high magnetic reluctance. This reluctance acts as resistance to magnetization, leading to considerable energy losses as magnetic fields stray from their intended paths. The large fringing flux emitted from these air gaps spreads into the winding area, causing copper losses that further lead to a rise in temperature and proximity losses in high-frequency magnetics.These compounded inefficiencies escalate into several challenges, notably excessive heat that degrades component performance and shortens device lifespan—critical issues in high-power and high-frequency applications. Additionally, the need to mitigate these effects results in larger, heavier cores, posing significant limitations in applications requiring compactness and device miniaturization.<h2 dir="ltr">Development of Distributed Air Gap Cores</h2>Distributed air gap cores are a type of magnetic core, which feature a magnetic material interspersed with non-magnetic gaps. These gaps are distributed uniformly throughout the material, rather than being concentrated in one area. By integrating multiple smaller air gaps throughout the core, distributed air gap technology optimizes the magnetic flux path, significantly reducing areas prone to flux leakage and fringing effects. This strategic distribution of air gaps minimizes non-functional magnetic fields and enhances the core's overall efficiency and performance.Additionally, this configuration allows for a more compact core design without sacrificing power handling capabilities, thus supporting the trend towards miniaturization in technology. The benefit extends to improved thermal management, as the reduced energy losses lead to less heat generation, allowing devices to operate at higher frequencies without compromising their longevity or performance.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIzNTQ4MzA2NDk5LWltYWdlMy5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib" alt="thermal-image-temperature-comparision-single-air-ga-core-vs-distributed-air-gap-core">&nbsp;A thermal image comparison shows that after 60 minutes of operation at 3.4 A and 50 kHz, the temperature increase in a single large air gap core (left) is significantly higher than in a distributed air gap core (right).Here is a summary of the key benefits of using distributed air gap cores to address issues posed by their traditional counterparts:<ul><li dir="ltr">Improved Fringing Flux: Anywhere a gap is present, fringing flux is emitted. When there is a larger gap, there is also a larger fringing flux path. By incorporating a distributed air gap, the fringing flux losses decrease as the number of smaller air gaps increases. This can reduce the fringing flux losses by up to 70%.&nbsp;</li><li dir="ltr">Increased Power Density and Optimized Efficiency: Distributed air gaps increase the power handling capability of the design. In many cases the winding area is reduced to avoid fringing flux losses. By using distributed gapped cores to minimize the fringing flux, the full winding area can be used. This can allow for either a smaller component or higher power through the originally selected component.</li><li dir="ltr">Enhanced Performance: In high-frequency applications, the skin effect and proximity effect can lead to significant losses in electrical conductors. The skin effect refers to the tendency of alternating current (AC) to distribute itself within a conductor such that the current density is highest near the surface, effectively reducing the cross-sectional area available for current flow. The proximity effect, on the other hand, occurs when alternating magnetic fields from neighboring conductors cause the current to concentrate in certain regions of a conductor, increasing resistance and associated losses.&nbsp; Litz wire is a specialized type of wire designed to mitigate these effects. It consists of multiple thin, insulated strands woven together in a specific pattern, which helps reduce the losses caused by the skin and proximity effects. However, when using distributed air gap cores, which reduce the effects of fringing flux, it is possible to use solid wire instead of Litz wire. This substitution could lead to higher copper utilization within the winding area, thereby increasing efficiency and reducing costs.</li><li dir="ltr">Utilization of New Semiconductor Material: Distributed air gap cores are well-suited for applications using higher frequency switching technologies like Silicon Carbide and Gallium Nitrides. Their design reduces energy losses and enhances thermal management, making them ideal for handling the increased power densities and rapid switching speeds these technologies require.</li></ul><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1723548324218-image2.gif" style="width: 100%px;" class="fr-fic fr-dib" alt="hot-spot-comparision-single-gap-vs-distributed-gap-core">Hot spot comparison for single large air gap vs. distributed air gap cores: distributed air gaps reduce fringing flux and hotspots, improving thermal performance and efficiencyDistributed air gap cores have seen significant innovation in recent years. However, these solutions have been tailored and delivered specifically for the design of each end application.&nbsp;An unfortunate side effect of this is that each time a core is created for a custom application, it likely will not be used again for another design, increasing the overall cost of the technology and preventing new innovations from being passed on to others.<h2 dir="ltr">Introducing TDK’s Standardized Solutions</h2>TDK has responded to the need for taking a highly customized technology like the distributed air gap core and <a href="https://www.tdk-electronics.tdk.com/en/2796388/products/product-catalog/ferrites-and-accessories/cores-with-distributed-air-gaps" target="_blank" rel="noopener noreferrer">providing a more standardized solution for it</a>. A standardized distributed air gap core portfolio offer reduces the dependence on custom-built offerings and will revolutionize the Distributed air gap core industry. Such standardized solutions will speed up time to market, improve the return on investment, and stimulate innovation while still allowing for application-specific customization.<iframe width="640" height="360" src="https://www.youtube.com/embed/5KzHH0Mh3bY?&amp;ab_channel=TDK&amp;wmode=opaque&amp;rel=0&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true">&nbsp;</iframe>TDK solutions also offer one of the best total costs of ownership and cost/performance ratios due to reliability and reduced proximity losses. This becomes apparent when a single large air gap core is compared to various configurations of distributed air gaps.&nbsp;In fact, the best cost/performance ratio is achieved with three identical air gaps. Thermal image test comparisons between a single large air gap, when contrasted against three identical distributed air gap core sets, clearly show significantly lower outputs at varied frequencies.&nbsp;<h2 dir="ltr">The TDK Standardization Revolution</h2>As a pioneer in magnetics, TDK is the first to offer standard distributed air gap core solutions. TDK continues to invest in the future of magnetics and to support this introduction. The company has invested heavily in new automated manufacturing processes and equipment that improve the quality of air-gapped core products.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIzNTQ4MzQwMzcwLWltYWdlNC5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib" alt="distribute-air-gap-ferrite-core-by-TDK-corporation">A standard ferrite core with distributed air gaps by TDK. Image Source: TDK Corporation[1]TDK is revolutionizing how the market will specify, purchase, and adopt distributed air gapped cores with new standardized products. TDK offers the market easy access to a once highly customized solution. Manufacturing innovation is allowing the industry to take advantage of the technology in new ways. Additional innovation will follow, just as it does whenever a custom solution is standardized.Visit the <a href="https://www.tdk-electronics.tdk.com/en/2796388/products/product-catalog/ferrites-and-accessories/cores-with-distributed-air-gaps" target="_blank" rel="noopener noreferrer">TDK Corporation’s official website</a> to learn more about their innovative distributed air gap cores and how they can enhance the efficiency and performance of your high-power high-frequency applications.<h2 dir="ltr">Conclusion</h2>The development and standardization of distributed air gap cores mark a major advancement in magnetic materials used in electrical/electronics applications. By addressing the challenges with traditional designs, distributed air gap cores enhance efficiency, thermal management, and power handling.&nbsp;TDK’s leadership in standardizing these cores has reduced costs and accelerated innovation across various industries. As applications in industries, renewable energy, automotive, and high-frequency electronics grow, the importance of distributed air gap cores will continue to rise.<h2 dir="ltr">References</h2>[1] TDK Electronics. Distributed air gaps in ferrite cores. Available from: <a href="https://www.tdk-electronics.tdk.com/en/180386/tech-library/publications/ferrites/ferrites-air-gaps-standard/2905788" target="_blank">https://www.tdk-electronics.tdk.com/en/180386/tech-library/publications/ferrites/ferrites-air-gaps-standard/2905788</a>

Distributed air gap cores, traditionally expensive, enhance efficiency and thermal management in high-power, high-frequency applications by reducing reluctance and fringing flux. Standardization efforts by brands like TDK are making these advanced solutions more accessible and cost-effective.

Distributed Air Gap Cores: Standardizing High-Performance Magnetic Solutions

<h1 dir="ltr" id="isPasted">Introduction</h1>In the ever-evolving world of electronic circuits, managing heat within printed circuit board (PCB) designs has become a pivotal challenge, especially as devices shrink and demands on performance increase. Traditional current sensing methods, particularly those involving shunt resistors, often lead to significant heat generation, which can impair system reliability and performance.&nbsp;Magnetic current sensors present an innovative solution to these challenges. By offering a way to measure currents with minimal heat production, these sensors help preserve the integrity of electronic systems. This article explores how magnetic current sensors can transform thermal management in PCB design, which marks a step forward in electronics manufacturing.In our <a href="https://www.wevolver.com/article/next-generation-current-measurement-addressing-pcb-design-challenges-with-magnetic-current-sensors/draft" target="_blank">Next-Generation Current Measurement series</a>, we previously explored various challenges associated with traditional current sensing methods. This article focuses specifically on addressing the thermal challenges within PCB design to highlight the advantages of magnetic current sensors in modern electronics.<h1 dir="ltr">Heat Challenges in Traditional Current Sensing Methods</h1>Traditional methods of current measurement often rely on shunt resistors, components known for generating significant amounts of heat during operation. This heat production is primarily due to the resistance inherent in shunt resistors, where power dissipation is calculated as:P=I2RAt high currents, even a low-resistance shunt resistor can dissipate considerable power, thereby raising the temperature of both the resistor and its surrounding components on the PCB.Excessive heat can lead to several adverse effects on electronic systems, such as:Component Degradation: Continuous high temperatures can accelerate the aging process of electronic components, which reduces their operational lifespan.System Reliability:&nbsp;Heat can cause electronic components to fail or operate unpredictably to lead to system instability and potential data loss.Thermal Runaway:&nbsp;In power-intensive applications, heat generation can lead to thermal runaway, where the system becomes unable to regulate its temperature, and causes further increases in heat and potential damage.These challenges necessitate complex heat mitigation strategies that often involve using additional components such as heat sinks and thermal pads or choosing shunt resistors with extremely low values, all of which increase the overall cost and complexity of the PCB design. Additionally, the physical space required for effective heat dissipation further limits the miniaturization of electronic devices, a critical factor in many modern applications.<h1 dir="ltr">Limitations of Conventional Heat Mitigation Strategies</h1>While conventional methods for thermal management can be effective, they come with notable drawbacks that can hinder the design and functionality of compact electronic devices:Increased System Cost and Complexity: Implementing heat sinks and thermal pads adds to the material costs and complicates the assembly process. This not only increases the overall production expenses but also extends the time required for manufacturing and assembly.Larger Board Requirements: To accommodate heat sinks and ensure adequate spacing for air circulation, PCBs often need to be designed with larger dimensions. This requirement runs counter to the trend towards miniaturization in the electronics industry, where reducing the size of devices is frequently a primary objective.Aesthetic and Practical Design Limitations: Larger heat sinks and expanded PCB areas can impinge on the design aesthetics and the practicality of electronic devices, especially in devices in which form factor is crucial.These traditional heat management approaches, while necessary for thermal control, impose significant limitations on the design and innovation potential of new electronic products.<h1 dir="ltr">Inadequacies of Low Resistance Shunt Resistors</h1>To minimize heat generation, some designs opt for exceptionally low resistance shunt resistors. However, this solution introduces its own set of challenges that can adversely affect the overall efficiency and performance of electronic systems:High-gain Amplifiers: Low resistance values typically require the use of high-gain amplifiers to produce a measurable output signal. This amplification can significantly increase the noise in the measurements, which compromises signal integrity and accuracy. High noise levels can be particularly problematic in precision applications, where the quality of data is important.Increased Component Size and Cost:&nbsp;Achieving extremely low resistance often necessitates using larger or more specialized shunt resistors, which can be more expensive. This not only impacts the cost-efficiency of the design but also counteracts efforts to reduce PCB space usage.Complexity in Design: Incorporating very low resistance shunt resistors and their associated high-gain amplifiers requires intricate design considerations. These include careful routing and shielding to prevent interference, as well as additional calibration steps during manufacturing to ensure accuracy. This complexity adds to the development time and costs, which increases the overall project timeline and budget.As engineers seek more streamlined and cost-effective solutions, the focus has shifted towards innovative technologies that inherently avoid these complications. Magnetic current sensors represent one such advancement and offer significant benefits in terms of heat management, design simplicity and cost-effectiveness.<h1 dir="ltr">Minimizing PCB Heating with Magnetic Current Sensing</h1>The adoption of magnetic current sensors presents a significant advancement in addressing the heat-related challenges of current sensing. These sensors utilize a Hall-effect-based methodology that inherently exhibits low resistance and minimal heat generation compared to traditional shunt resistors.<h2 dir="ltr">Comparison with Traditional Shunt Resistors</h2>Lower Resistance: Magnetic current sensors do not rely on resistance and Ohm’s law for measurement. However, magnetic current sensors have metal leadframes for their current carrying path which possess minimal resistance when compared to most shunt resistors used in current measurement circuits. Consequently, magnetic current sensors enable significantly lower system heating—essential for designing smaller or more efficient electronic devices.Simplified Signal Processing: The output of magnetic current sensors is directly proportional to the magnetic field and does not require the high levels of amplification needed for low-resistance shunt measurements. This reduces complexity and potential noise interference in signal processing.These features make magnetic current sensors an attractive alternative for modern electronics, where efficiency and miniaturization are key. By integrating functions traditionally handled by multiple components into a single, compact package, these sensors not only mitigate heat generation but also improve the overall performance and reliability of electronic systems with less potential points of failure. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIzNTM5OTA3NTIyLTI0MDcyMV9KZXNzLTA1LmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib" alt="power-dissipation-shunt-resistor-vs-magnetic-current-sensors">Power dissipation in shunt resistors vs. Allegro’s 4x4mm QFN “EZ” package. Image source: Allegro MicroSystems<h1 dir="ltr">Key Benefits of Magnetic Current Sensors</h1>Magnetic current sensors like those from <a href="https://www.allegromicro.com/en/products/emerging-technologies/replace-the-shunt?utm_source=wevolver&utm_medium=article&utm_campaign=punt-the-shunt&utm_term=article-2&utm_content=landing-page" target="_blank">Allegro MicroSystems</a> significantly enhance PCB designs by providing essential advantages over traditional sensing methods. These benefits are tailored to meet the evolving demands of advanced electronic systems.<h2 dir="ltr">Improved Thermal and Operational Performance</h2>Minimal Thermal Impact: Magnetic current sensors operate with significantly lower heat output, which eliminates the need for complex thermal management systems and results in a cleaner and more efficient design.Reliable Accuracy:&nbsp;These sensors maintain high measurement accuracy without the complications of thermal drift, which can negatively affect components subjected to high temperatures, to ensure dependable operation across various applications.<h2 dir="ltr">Enhanced Efficiency and Design Simplification</h2>Integrated Functionality:&nbsp;These sensors combine multiple sensing functions into a single device, thereby reducing the need for additional components and simplifying the overall design.Streamlined Manufacturing: The compact and integrated nature of magnetic sensors allows for a more straightforward assembly process to reduce both time and cost associated with manufacturing.<h2 dir="ltr">Cost and Space Optimization</h2>Reduced PCB Size:&nbsp;By eliminating the need for ancillary components like high-gain amplifiers and heat dissipation units, these sensors allow for more compact PCB layouts.Cost-Effective Material Use: Lower numbers of components and simplified circuit design translate into reduced material use and cost, thus making the overall product more economically viable.<h2 dir="ltr">Flexibility in Application</h2>Versatile Integration: The small footprint and robust performance of magnetic current sensors facilitate their integration into a diverse range of products, particularly suitable for medium to high current applications ranging from tens of amperes in industrial systems to larger scales.Enhanced Durability: With fewer parts and reduced susceptibility to heat degradation, these sensors offer greater durability, which is crucial for devices in harsh environments.<h1 dir="ltr">Case Study: European Motor Module Manufacturer</h1>An example of the practical benefits offered by magnetic current sensors can be seen in the experience of a leading European motor module manufacturer. This company faced significant challenges in designing compact motor modules that required minimal power dissipation to maintain low system temperatures. Traditional shunt resistors were inadequate due to their high-power dissipation and led to excessive heat generation, which impacted both performance and reliability.<h2 dir="ltr">Challenge Faced</h2>The manufacturer needed a current sensing solution that fit within the stringent size and thermal constraints of their compact motor designs. Traditional shunt resistors and their auxiliary components were too bulky and generated too much heat, which necessitates additional cooling mechanisms that increased both cost and complexity.<h2 dir="ltr">Solution Implemented</h2>The manufacturer explored alternative technologies and ultimately chose to integrate <a href="https://www.allegromicro.com/en/products/emerging-technologies/replace-the-shunt?utm_source=wevolver&utm_medium=article&utm_campaign=punt-the-shunt&utm_term=article-2&utm_content=landing-page" target="_blank">Allegro</a>’s ACS37220 magnetic current sensor into their designs. This sensor stood out due to its low power dissipation and compact size.<h2 dir="ltr">The Outcome</h2>Incorporating the ACS37220 resulted in several significant improvements:<ul><li dir="ltr">Reduced Heat Generation: The lower resistance of the magnetic sensor minimized the amount of heat produced, which allowed the motor modules to operate within safe thermal limits without the need for extensive cooling strategies.</li><li dir="ltr">Compact Design: The small size of the ACS37220 enabled the manufacturer to meet the compact design specifications of their motor modules.</li><li dir="ltr">Cost and Complexity Reduction: By eliminating the need for additional thermal management components, the overall cost and design complexity were significantly reduced.</li></ul>This successful implementation of the ACS37220 met the manufacturer's specific needs and demonstrated the magnetic current sensor's potential to transform product design by overcoming traditional challenges associated with current sensing and thermal management.<h1 dir="ltr">Overcoming Heating Challenges in PCB Design with Magnetic Current Sensors by Allegro MicroSystems</h1>The <a href="https://www.allegromicro.com/en/products/sense/current-sensor-ics/fifty-to-two-hundred-amp-integrated-conductor-sensor-ics/acs37220?utm_source=wevolver&utm_medium=article&utm_campaign=punt-the-shunt&utm_term=article-1&utm_content=landing-page" target="_blank">Allegro ACS37220</a> magnetic current sensor offers essential features to effectively mitigate heating issues in electronic systems. Capable of handling high currents up to 200A, it is particularly suitable for power-intensive applications, yet it operates with significantly reduced heat generation.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIzNTUxMjU3MjkxLTI0MDcyMV9KZXNzLTA2LmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 832px;" class="fr-fic fr-dib" alt="allegro-acs-37220">ACS37220 Magnetic Current Sensor by Allegro Microsystems in a 7-pin 4 x 4 mm QFN packageIts compact 4x4 mm QFN package maximizes PCB space efficiency, which eliminates the need for additional cooling components such as heat sinks or fans. This benefit simplifies design and reduces overall manufacturing costs. These characteristics make the ACS37220 an optimal choice for ensuring thermal efficiency and enhancing the reliability of modern electronic systems where maintaining lower temperatures is crucial.<h1 dir="ltr">Conclusion</h1>This discussion highlights the significant role of magnetic current sensors in mitigating thermal challenges within PCB design. By drastically reducing heat generation compared to traditional shunt resistors, these sensors enhance system reliability and longevity. Their continued integration is vital for advancing thermal management in electronics to ensure that as devices become smaller, they remain efficient.Visit <a href="https://www.allegromicro.com/en/products/emerging-technologies/replace-the-shunt?utm_source=wevolver&utm_medium=article&utm_campaign=punt-the-shunt&utm_term=article-2&utm_content=landing-page" target="_blank">Allegro Microsystems' official website</a> today to find the perfect solution for your current measurement needs.<hr>This article is a part of&nbsp;<a href="https://www.wevolver.com/article/next-generation-current-measurement-addressing-pcb-design-challenges-with-magnetic-current-sensors/draft" target="_blank" rel="noopener noreferrer">Next-Generation Current Sensing</a>, a series that delves into innovative developments in current measurement.&nbsp;Articles featured in the series:<ul><li dir="ltr"><a href="https://www.wevolver.com/article/next-generation-current-measurement-addressing-pcb-design-challenges-with-magnetic-current-sensors" target="_blank" rel="noopener noreferrer">Next-Generation Current Measurement: Addressing PCB Design Challenges with Magnetic Current Sensors</a></li><li dir="ltr"><a href="https://www.wevolver.com/article/overcoming-size-challenges-in-pcb-design-with-magnetic-current-sensors" target="_blank">Overcoming Size Challenges in PCB Design with Magnetic Current Sensors</a></li><li dir="ltr"><a href="https://www.wevolver.com/article/overcoming-heating-challenges-in-pcb-design-with-magnetic-current-sensors" target="_blank">Overcoming Heating Challenges in PCB Design with Magnetic Current Sensors</a></li><li dir="ltr"><a href="https://www.wevolver.com/article/overcoming-complexity-challenges-in-pcb-design-with-magnetic-current-sensors" target="_blank">Overcoming Complexity Challenges in PCB Design with Magnetic Current Sensors</a></li></ul>

Article 2 of Next-Generation Current Measurement Series: Magnetic current sensors offer a streamlined and thermally-efficient solution to traditional current measurement methods, which significantly lowers heat production and reduces component size on PCBs, essential for compact electronic designs.

Overcoming Heating Challenges in PCB Design with Magnetic Current Sensors

Introducing the Next-Generation Current Measurement Series: Advanced magnetic current sensors accurately detect magnetic fields generated by current flow, offering precise current level measurements.

Next-Generation Current Measurement: Addressing PCB Design Challenges with Magnetic Current Sensors

As the world continues to embrace the Internet of Things (IoT), the demand for efficient power management solutions for IoT devices is on the rise. 

What Are the Best Applications for IoT in the New World of IC Power Management?

The <a href="https://www.wevolver.com/article/connect-for-good-low-power-wireless-sustainability-challenge" target="_blank" rel="noopener noreferrer">Connect for Good Challenge</a>, a joint initiative by Nordic Semiconductor, Mouser Electronics, Soracom, and Crowd Supply, united a global network of engineers, entrepreneurs, and developers.&nbsp;Their mission was clear: to devise low-power wireless solutions that contribute towards achieving the United Nations Sustainable Development Goals while also utilizing the nRF9160 DK.This challenge attracted an impressive 116 entries, each entry a testament to the&nbsp;<iframe id="63dd10be17a2d300080113f2" width="250" class="specs-iframe" height="440" src="https://wevolver.com/iframe/specs/nrf9160-development-kit?iframe=true" frameborder="0" scrolling="false" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe> unwavering commitment towards sustainable development from innovators across the globe.From the extensive pool of innovative concepts, ten projects stood out as finalists. These projects presented a diverse range of solutions, from seismic sensor networks designed for earthquake-prone regions to cutting-edge bioreactors capable of carbon capture. The top ten entries met the challenge's high standards and exemplified the immense potential and impact of low-power wireless technology in tackling critical sustainability issues worldwide.With the stage set by these trailblazing finalists, we now turn our attention to presenting the Connect for Good Challenge winners.<h2 dir="ltr">Grand Winner - Ivan Araquistain from Tecnalia Project: Monitoring and Anomaly detection on sustainable logistics infrastructure</h2>Ivan Araquistain’s winning project presents an innovative solution for the green transport of perishable goods, eliminating the need for energy-intensive refrigerated cargo trailers. This achievement is significant for the logistics industry, offering a more sustainable method of transport while ensuring the cold chain's integrity.<img data-fr-image-pasted="true" src="https://lh7-us.googleusercontent.com/NshYbRl37Cb-aLTarym3rpMt35cPUxJs9lm3y6Mhqqufr2E7rQFo8bPFbbECXZTtVFdVtzvlbvXDv_3W5gF2TKCStdk8-7eNSmgiKxWUuxgKTPg0ZEIzzevOLQ_Hb7DKTuTeFquVBZLVjntP8I7ZyLw" width="602" height="401" id="isPasted" class="fr-fic fr-dii">Image credit: Ivan AraquistainThe project's core is an IoT device equipped with a suite of sensors and GPS, enabling efficient tracking and monitoring of goods. Key component of this project is the integration of the NRF9160-DK, chosen specifically for its low energy consumption and reliable cellular connectivity. By leveraging low-energy technology and incorporating mini solar panels, the device can operate autonomously, making it a model for sustainable transport in the logistics sector.<img data-fr-image-pasted="true" src="https://lh7-us.googleusercontent.com/B2V5gCBDYosXNk3swpt2I3jeqcKF0bl19narcvtPj5rqi8vIeBbP_Qz4c8SpnvaZ8wnGtJkosOl0CuLxLzkoLxxyIIE-buMk7k8sRrNOk7V_AL2Mr3ijuQIWVMMw3JSY5FqJEtcymFL83vlektHnm5Y" width="698" height="432" class="fr-fic fr-dii">Image credit: Ivan AraquistainThe practical implications of this project are immense, directly impacting Sustainable Development Goals 7, 11, and 13. It exemplifies a significant stride toward reducing energy consumption in logistics, offering an eco-friendly alternative that can reshape how goods are transported globally. This project's success could pave the way for a more sustainable logistics industry, significantly reducing carbon emissions and operational costs.<h2 dir="ltr">Second Place - Patrick Whetman’s Initiative: Ai Honey Bee Swarm Detector / Predictor System</h2>In second place, Patrick Whetman's project focuses on the conservation of the native bee species. This endeavor is crucial for ecological balance and biodiversity, as bees play a vital role in pollination. Whetman’s project utilizes LoRa radio technology for communication, specifically designed for rural and remote areas. The system's low power requirement, complemented by compact solar panels, ensures its sustainability and efficiency.<img data-fr-image-pasted="true" src="https://lh7-us.googleusercontent.com/BVm91tDSOoMs6upkJMV4AINayDJ8Zk-TXSVdtA8rMGZvRNIcdSDiYqZmcsMIx_76lVzdd02rxiv4qNifl_XG-iEj2bM19_4RxaB51VxtCuU4plfeFCkincgrLa_TFGR3xA_QX-RxxvqwPJ1VUK8SK8o" width="602" height="501" class="fr-fic fr-dii">Image credit: Patrick WhetmanAddressing Sustainable Development Goal 15, this project is pivotal in conserving life on land. It not only protects a vital species but also educates and raises awareness about the importance of biodiversity. The potential for adaptation in various regions, especially those with similar ecological concerns, is vast, making it a scalable solution for global bee conservation efforts.<h2 dir="ltr">Third Place - Aris Maaniq’s Carbonbox Bioreactor</h2>Securing the third position, Aris Maaniq’s project, the Carbonbox Bioreactor, targets a crucial environmental concern – industrial CO2 emissions. This biological reactor utilizes microorganisms for carbon capture, converting CO2 from industrial flue gas into oxygen. The project integrates the Nordic nRF9160 for monitoring and controlling the bioreactor environment, ensuring optimal conditions for the microorganisms.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk5OTY5NzcyMzEzLUlNR18yMDIzMTExNF8wNzEwMDBfNTI0LmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 300px;" class="fr-fic fr-dib">Image credit: Aris MaaniqThis bioreactor directly contributes to Sustainable Development Goal 13 (Climate Action), offering a novel approach to fighting climate change. It represents a significant step towards sustainable industrial practices, potentially transforming how industries manage their carbon footprint.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk5OTcwMDU3ODAyLUlNR18yMDIzMDMzMF8wMDUzNDMuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 246px;" class="fr-fic fr-dib">Image credit: Aris Maaniq<h2 dir="ltr">A Step Towards a Sustainable Future</h2>The Connect for Good Challenge has successfully showcased the significant role that engineering and technology play in solving environmental issues. The winners, Ivan Araquistain, Patrick Whetman, and Aris Maaniq, have each offered unique and effective solutions that promise a more sustainable future by addressing complex sustainability challenges.&nbsp; These projects, along with the other finalists, serve as inspiring examples of how focused innovation and hard work in the field of engineering, paid with low power wireless IoT solutions, can lead to meaningful environmental progress. Thank you all for participating in this amazing challenge and we are looking forward to seeing you around to next endeavours!

Spotlighting Innovation: Celebrating the Connect for Good Challenge Winners


Connect for Good Challenge Winners: Logistics Infrastructure Monitoring, Smart Bees and Bioreactors

Early this year, Nordic Semiconductor, in partnership with Mouser Electronics, Soracom, and Crowd Supply, introduced the "Connect for Good: Low Power Sustainability Challenge." This initiative invited engineers, inventors, entrepreneurs, and developers from all corners of the world to design solutions that address the United Nations Sustainable Development Goals, specifically focusing on goals related to cities and sustainability.The challenge garnered a whopping 116 entries, a testament to the global community's unwavering commitment to sustainable solutions. From this impressive pool, ten projects have emerged as finalists, exemplifying a blend of technological ingenuity and a dedication to a greener future. Here's a deep dive into these pioneering projects:<h3 dir="ltr">Seismic Sensor Nodes Network by Aleksei Bokov</h3>Aiming to mitigate the devastating consequences of unexpected earthquakes, Aleksei Bokov proposes a network of seismic sensor nodes. These nodes are strategically placed in earthquake-prone areas, ensuring rapid alerts and potentially saving countless lives. Designed to protect public services and the general population, this project stands as a testament to technology's potential in disaster risk reduction.<h3 dir="ltr">Carbonbox Bioreactor by Aris Maaniq</h3>At the intersection of biology and technology lies the Carbonbox bioreactor. This system captures carbon dioxide from industrial exhaust while producing oxygen, thanks to the photosynthetic abilities of microorganisms like cyanobacteria. The real-time monitoring and cloud connectivity make it a robust solution for industries aiming for net-zero emissions.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk4MTQwODIyMDI4LUFyaXMgTWFhbmlxLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 300px;" class="fr-fic fr-dib">The Carbonbox bioreactor. Image credit: Aris Maaniq<h3 dir="ltr" id="isPasted">Sustainable Logistics Infrastructure by Ivan Araquistain</h3>Redefining the logistics of perishable goods transport, Ivan Araquistain introduces a sustainable transport mechanism. By eliminating the need for refrigerated cargo trailers and integrating AI-driven anomaly detection, this solution not only preserves the cold chain but also curtails operational costs significantly.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk4MTQwODUzMzE4LUl2YW4gQXJhcXVpc3RhaW4uanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib">Sustainable refrigerated transport. Image credit: Ivan Araquistan<h3 dir="ltr" id="isPasted">SouldNat: The Forest Ears by Marcelo Vieira</h3>Brazil's forests are under constant threat from illegal deforestation and mining activities. Marcelo Vieira's SouldNat leverages AI-powered sound detection to identify potential threats, such as chainsaw noises and unauthorized conversations, enabling timely intervention and preservation of these critical ecosystems.<h3 dir="ltr">Mountain Road Monitoring System by Mayukh Shubhra Saha</h3>Avalanches and landslides in mountainous terrains often lead to prolonged road blockages, stranding travelers. Mayukh Shubhra Saha’s solution employs motion sensors overlooking major mountain roads, allowing real-time detection of landslides and facilitating quick response by authorities.<h3 dir="ltr">ForestGuard by Muhammed Ali Ornek</h3>Forest fires pose a dual threat – both to the environment and to the communities that live close by. ForestGuard, developed by Muhammed Ali Ornek, is a mesh network of IoT devices that monitor atmospheric conditions in forests, providing early detection and risk assessment capabilities for forest fires.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk4MTQwOTA1OTgzLU11aGFtbWVkIEFsaSBPcm5lay5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 300px;" class="fr-fic fr-dib">ForestGuard. Image credit: Muhammed Ali Ornek<h3 dir="ltr" id="isPasted">Landslide Alert System by Omkar Khair</h3>With a rise in landslides in regions like Maharashtra, India, Omkar Khair’s Landslide Alert System stands out as a beacon of hope. The system is designed to provide early warnings against extreme weather conditions in landslide-prone zones, potentially saving lives and infrastructure.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk4MTQwOTM2NjYzLU9ta2FyIEtoYWlyLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 300px;" class="fr-fic fr-dib">A prototype of the Landslide Alert System. Image credit: Omkar Khair<h3 dir="ltr" id="isPasted">Ai Honey Bee Swarm Detector by Patrick Whetman</h3>Bee conservation is crucial for our ecosystems, and Patrick Whetman's project aims to conserve the native bee species, Apis Mellifera Mellifera. His solution ensures minimal energy consumption while optimizing communication, ensuring the safety of these essential pollinators.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698141608336-Patrick+Whetman.JPG" style="width: 300px;" class="fr-fic fr-dib">Ai Honey Bee Swarm Detector. Image credit: Patrick Whetman<h3 dir="ltr" id="isPasted">Mikoko by Ryan Kiprotich Cheruiyot</h3>Ryan's AI-driven solution, Mikoko, stands at the forefront of mangrove conservation. Recognizing the vital role of mangroves in coastal protection and carbon sequestration, this project employs sensors to monitor the mangrove ecosystem's environmental parameters, ensuring their protection and sustainable management.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698141646525-Ryan+Kiprotich.jpg" style="width: 300px;" class="fr-fic fr-dib">Render of Mikoko. Image credit: Kiprotich Cheruiyot<h3 dir="ltr" id="isPasted">Range Based Deforestation Monitoring by Vybhav Nag</h3>In a unique approach to forest conservation, Vybhav Nag’'s project uses sound and vibration data to detect potential deforestation activities. This real-time monitoring solution offers an efficient alternative to traditional methods, proving instrumental in the conservation of forests and their inhabitants.<hr>These ten finalists represent the zenith of engineering innovation, driven by a shared commitment to sustainable change. Their projects are more than just technological marvels—they are beacons of hope in our collective journey towards a sustainable future. We commend all participants for their outstanding contributions and look forward with great anticipation to the announcement of the winners on November 8th, 2023. To the finalists, best of luck, and to our vast community of engineers and innovators, let's continue to connect for good!Follow the <a href="https://www.wevolver.com/profile/nordic.semiconductor" target="_blank" rel="noopener noreferrer">Nordic Semiconductor</a> profile to get alerts when new content about the challenge is published.&nbsp;

From seismic sensors to bioreactors, the top ten finalists of the Connect for Good Challenge showcase the power of low-power wireless technology in addressing global sustainability challenges.


Connect for Good: Top 10 Finalists of the Low Power Wireless Sustainability Challenge

If you&rsquo;re developing an IoT device, odds are that you want it to do some valuable computations to solve an important problem. Maybe you want to <a href="https://www.mistywest.com/posts/5-reasons-to-use-an-iot-framework/" target="_blank">deploy sensors in remote locations</a>, develop a device that can perform data analytics to monitor a renewable energy source, or build a medical device that can use computer vision to detect early signs of an illness.Whatever you&rsquo;re building, at some point you may start to wonder: should your device perform these important computations in the cloud or at the edge? Choosing between computing on the cloud or on the edge is a decision that can impact things like your device&rsquo;s cost or efficiency &ndash; and no one wants to make the wrong decision initially and spend time and money later down the line to pivot to the correct one.&nbsp;We asked some of our experienced engineers what they think someone needs to consider when choosing between computing in the cloud or on the edge.&nbsp;<h2>What is cloud computing?</h2>The &ldquo;cloud&rdquo; refers to the collection of servers that can be accessed over the internet &ndash; popular <a href="https://www.mistywest.com/posts/azure-vs-aws-which-iot-framework-is-right-for-you/" target="_blank">cloud providers include Amazon Web Services, Microsoft Azure</a>, and Google Cloud.&nbsp;These servers can provide on-demand computing resources to store and process data. You can think of the cloud as a centralized location for your files and programs, and you can connect any device to the cloud to access them. Services like Dropbox or Google Drive are some of the many cloud-based services out there.&nbsp;<img data-fr-image-pasted="true" src="https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-03.png" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-03.png 1360w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-03-300x155.png 300w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-03-1024x528.png 1024w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-03-768x396.png 768w" sizes="(max-width: 1360px) 100vw, 1360px" class="fr-fic fr-dii">&nbsp;Cloud computing describes the idea of performing computations in the cloud. These computations can include data analysis and visualization, computer vision and machine learning. An example of cloud computing in action is when your average smart home speaker sends your audio input to the cloud where it is interpreted by algorithms and sends back a response. &nbsp;&nbsp;&nbsp;<h2>What is edge computing?</h2><a href="https://blogs.nvidia.com/blog/2022/01/05/difference-between-cloud-and-edge-computing/#:~:text=The%20main%20difference%20between%20cloud,deploy%20them%20at%20the%20edge" target="_blank">The edge describes the &ldquo;edge&rdquo; of the network.&nbsp;</a>It includes devices that are an entry/exit point to the cloud, but are not part of the cloud itself. For example, a server in a data centre is part of the cloud; your smartphone and router that connects to that server is part of the edge.&nbsp;&nbsp;<img data-fr-image-pasted="true" src="https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-02.png" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-02.png 1360w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-02-300x155.png 300w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-02-1024x528.png 1024w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-02-768x396.png 768w" sizes="(max-width: 1360px) 100vw, 1360px" class="fr-fic fr-dii">&nbsp;Edge computing describes the idea of performing computations on the edge. This way, the processing is done closer to or at the location where the data is collected or acted upon.An example of an edge computing process is object detection on an autonomous vehicle. The vehicle processes data from its sensors and uses the results to avoid obstacles. Unlike your smart home speaker, the data it collects is processed locally, rather than sending it to the cloud.&nbsp;&nbsp;<h1>Key Considerations</h1>There are a couple of key questions to consider when choosing between the edge and cloud computing.&nbsp;<h2>What is the quality of your device&rsquo;s network?</h2>Performing computations on the cloud can work well when you have high-bandwidth, low-latency, and stable connection to the internet, as you will be needing to send your data back and forth between cloud servers and your device. If your device is intended to be used, for instance, in a home or office with a good internet connection, this back and forth can be done relatively seamlessly.&nbsp;In most cases, if the computation is done on the edge, it won&rsquo;t be affected by poor or lost internet connection in a remote location; the processing can continue since it is not computed in the cloud. You wouldn&rsquo;t want your vehicle&rsquo;s object detection to stop working while on a long road trip; that&rsquo;s one of the reasons why autonomous vehicles frequently perform computations like object detection on the edge.&nbsp;&nbsp;<h2>How quick and how often does your data need to be processed?</h2>Edge computing can be ideal in cases where your customer needs response times from your device to be faster than what can be achieved with a decent network connection, such as monitoring vital components of a system. The latency from travel-time between the device and the cloud can be reduced or eliminated completely. As a result, the data can be processed right away. If the data processing itself is quick, you could achieve real-time responses from your device.&nbsp;Cloud computing is beneficial when device use is intermittent. Smart homes devices are a good example of this again, where running computations in the cloud lets you share the same computing resources between multiple customers. This reduces costs by avoiding the need to provision your device with upgraded hardware to run the data processing.&nbsp;&nbsp;<img data-fr-image-pasted="true" src="https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-05.png" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-05.png 1360w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-05-300x155.png 300w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-05-1024x528.png 1024w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-05-768x396.png 768w" sizes="(max-width: 1360px) 100vw, 1360px" class="fr-fic fr-dii">&nbsp;<h2>What part of your data is important to you?</h2>Computing on the edge is useful if you only care about the result of your data after it has been processed. You can send only what is important to store in the long-term in the cloud, and doing so will allow you to reduce the cost of storing and processing data in the cloud. For example, if you are creating a traffic surveillance device that needs to report levels of congestion on a road, you could preprocess the videos on the edge&ndash;Instead of running hours of raw video in the cloud&ndash;and only send images or clips of the traffic when traffic is present.It&rsquo;s possible you need to keep the data to <a href="https://www.mistywest.com/posts/improving-dataset-creation-for-machine-learning/" target="_blank">build out your machine learning dataset</a>, or you plan on analyzing the raw data in other ways in the future. If you are already sending your raw data to the cloud, it may be ideal to perform calculations in the cloud as well.&nbsp;<h2>What are your device&rsquo;s power and size limitations?</h2>If you expect your device will be restricted in power and size, given that it has a good network connection, sending the computing work to be done on the cloud will allow your device to remain small and low-power. Google Home and Amazon Alexa, for example, will capture the audio and send it to the cloud for processing, allowing complex computations to be run on the audio that would not be possible to run on the small computers inside the devices themselves.&nbsp;<img data-fr-image-pasted="true" src="https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-04.png" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-04.png 1360w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-04-300x155.png 300w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-04-1024x528.png 1024w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest_Edge_Vs_Cloud-04-768x396.png 768w" sizes="(max-width: 1360px) 100vw, 1360px" class="fr-fic fr-dii">&nbsp;<h2>Is your data processing model your Intellectual Property?</h2>If you are making a consumer device and the method you are using to process data is part of your Intellectual Property (IP), you may need to consider how you plan to protect it. Putting your IP on your device without a robust security plan can leave it vulnerable to hacks. If you don&rsquo;t have the knowledge or resources to secure your IP on the edge, it may be best to leave it on the cloud, which already has security measures in place.&nbsp;<a data-rel="lightbox-image-0" data-rl_caption="" data-rl_title="" href="https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest-Cloud-Vs-Edge-FlowChart-01.jpg" target="_blank" title=""><img data-fr-image-pasted="true" src="https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest-Cloud-Vs-Edge-FlowChart-01.jpg" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest-Cloud-Vs-Edge-FlowChart-01.jpg 1801w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest-Cloud-Vs-Edge-FlowChart-01-275x300.jpg 275w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest-Cloud-Vs-Edge-FlowChart-01-938x1024.jpg 938w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest-Cloud-Vs-Edge-FlowChart-01-768x839.jpg 768w, https://www.mistywest.com/wp-content/uploads/2022/05/MistyWest-Cloud-Vs-Edge-FlowChart-01-1406x1536.jpg 1406w" sizes="(max-width: 1801px) 100vw, 1801px" class="fr-fic fr-dii"></a>&nbsp;<h2>Some final considerations for choosing between edge and cloud computing</h2>There are quite a few things to consider when choosing between computing on the edge or in the cloud. In complex problems, you may benefit from using a combination of both, by leaving some parts of your processing on the edge and the rest on the cloud.We created the above flow chart to help guide you through which path you should take, but there may always be more to consider for your device, depending on how complex your use case is.&nbsp; This article was originally written by Amanda Luu, former Product Design Engineer Coop at MistyWest,&nbsp;<a href="https://www.mistywest.com/posts/edge-vs-cloud-computing-which-solution-is-better-for-your-connected-device/" rel="noopener noreferrer" target="_blank">for the MistyWest blog</a>.

Choosing between computing on the cloud or on the edge is a decision that can impact things like your device’s cost or efficiency. Here’s how you can ensure you make the right decision early on in your product development roadmap.

Edge Vs. Cloud Computing: Which Solution Is Better For Your Connected Device?

Electric machinery parts manufacturing in industry 

This guide delves into DFM's principles, implementation process, impacts, and challenges, aiming to provide readers with a comprehensive understanding of this integral concept.

Enhancing Industrial Processes through Design for Manufacturing: A Comprehensive Guide

<h2 id="isPasted">Introduction</h2>The 21st century has seen a rapid advancement in semiconductor technology, leading to the development of highly complex electronic devices and systems. Engineers today face the challenge of delivering high levels of performance and functionality within increasingly restrictive size and power constraints. Moreover, with a rising global focus on minimizing energy costs and gas emissions, the cost and power requirements of electronic devices will only become more demanding. Therefore, engineers and designers must have an in-depth understanding of the devices and components they are utilizing to build complex systems.&nbsp;Currently, a number of manufacturers around the globe offer discrete semiconductor device technologies with features suitable for wide-ranging applications. However, there is a gap between the technical specifications of these devices, their behaviours and operating principles and the knowledge and understanding of the engineers who use them. This know-how is imperative for engineers today to achieve the high-efficiency standards set by consumers.&nbsp;Nexperia, a global producer of essential semiconductor devices, recognizes these design challenges, and aims to address them by providing engineers and designers with a greater understanding of their products and solutions. They are doing this by developing a comprehensive library of advanced support tools comprising of improved simulation models, interactive application notes, video resources and handbooks[1]. Nexperia&rsquo;s aim is to facilitate engineers while using its products in their designs to achieve a higher level of efficiently, reduced costs and faster time to market.<h2>Precision Electrothermal Models</h2>Compared to integrated circuit (IC) components, board level discrete power devices are typically manufactured with very limited modelling data. These models are simulated using a few device parameters covering only typical temperatures and do not provide an in-depth analysis of the device&rsquo;s behaviour at extended temperature ranges. When designing more complex systems, engineers are therefore, forced to resort to their experience or estimation to analyse device performance in wider case scenarios.&nbsp;Data regarding characteristics like electromagnetic compatibility (EMC) is often completely overlooked. This means that critical weaknesses and flaws in electromagnetic interference and compatibility are sometimes only revealed after complete product design and testing. As a result, companies have to do costly and time consuming debugging and redesigning late in the product design cycle.To solve this issue, Nexperia has released highly comprehensive Electrothermal models for its power MOSFETs[2,3]. These models were developed in close collaboration with Original Equipment Manufacturers (OEMs) with focus on their application specific requirements regarding modelling data. The models provide engineers with the thermal and electrical interdependency data of all device parameters simulated across a large operating temperature range of -55 &deg;C to 175 &deg;C.&nbsp;The electrothermal models also include reverse diode recovery time and better estimations of electromagnetic compatibility (EMC) performance. The EMC modelling of devices is especially important, as EMC performance cannot be tested until a device is fully manufactured. Without simulation data, engineers would have to completely redesign a product if it does not meet the specified EMC criteria. Accurate models representing EMC and reverse diode recovery time allow engineers to build more complex systems, save valuable design time, and lower the risk of re-design costs.&nbsp;Nexperia&rsquo;s advanced electrothermal models allow devices to be simulated under all possible thermal and electrical conditions that will be encountered in their applied use. Consequently, engineers can design products and systems with complete confidence of their end operation.<iframe width="640" height="360" src="https://www.youtube.com/embed/GS-mlkSKcRc??list=TLGGURexvjFQ50QyMTA0MjAyMw&wmode=opaque&rel=0&enablejsapi=1&origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe><h2>Quick Learning Videos</h2>Another unique support tool offered by Nexperia is a compilation of &ldquo;Quick Learning Videos&rdquo;[4]. As the name suggests, the videos are created to provide users with quick and easy understanding of the principles behind Nexperia products. The videos are designed in the traditional chalkboard style to make learning more convenient and informal and can be used by professional engineers and amateur designers alike to get a head start in creating new products.The videos encompass a range of topics from basics like the correct method of interpreting a device datasheet, selecting the right power MOSFET for a specific application as well as more advanced topics such as the design considerations for sub-milliohm MOSFETs, evaluation of switching performances and connecting various devices to the power MOSFETs. The videos feature Nexperia&rsquo;s own community of engineers and designers who guide the audience on insights regarding its products and best practices of designing and testing.Although the videos focus on Nexperia&rsquo;s products, however, they are a valuable resource for anyone hoping to learn about power MOSFET design. They also prove to be an effective tool in introducing Nexperia&rsquo;s products and solutions to customers worldwide and help them understand which applications they are best suited for.<iframe width="640" height="360" src="https://www.youtube.com/embed/GFVde4Nayqw?&wmode=opaque&rel=0&enablejsapi=1&origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe><h2>Interactive Application Notes</h2>Analysing extensive datasheets to work out the operating parameters of a device is familiar for electronics engineers. Nexperia has transformed this previously often tedious activity by introducing interactive application notes. This novel approach allows engineers to use embedded Cloud-based simulations and see the behavior of the company&rsquo;s Power MOSFETs[5].&nbsp;Users can open an application note and view a component&rsquo;s simulation simply by clicking on it. From there, users can open the schematics of the design and play around with different device parameters. The notes are designed to aid in modelling any physical system comprising electrical, mechanical, electromechanical, thermal or pneumatic components. They also provide guidelines on how to employ various power designs and topologies leading to design optimization, faster prototyping and a greater degree of design validation before moving on to the manufacturing stage.&nbsp;<h2>Engineer&rsquo;s Handbook</h2>Perhaps the largest and most comprehensive resource provided by Nexperia is its Engineer&rsquo;s handbook [6]. It is designed to provide up-to-date information to professional engineers using a collection of technical data and application notes. The handbook is a &ldquo;go to&rdquo; resource for engineers tasked with integrating MOSFETs and GaN FETs into real-world systems, already appearing on the workstations of tens of thousands of engineers, and rated 4.8 out of 5 stars by readers.Through the handbook, Nexperia shares the expertise and knowledge gathered by its engineers through decades of assisting customers in building their applications through the initial stages of prototyping all the way to end production. The handbook investigates issues and challenges an engineer typically faces when dealing with complex designs using MOSFETs and Power GaN FETs. Coming from the perspective of veteran engineers who have had hands-on experience with these devices, the book serves as a guide that is more helpful than any publication written from a purely theoretical or academic point of view.The MOSFET and GaN FET <a href="https://efficiencywins.nexperia.com/efficient-products/nexperia-design-engineers-guides.html" rel="noopener noreferrer" target="_blank">Engineers&rsquo; Handbook</a> features in a library of Design Engineers&rsquo; Guides from Nexperia, with additional editions for ESD Protection, Diodes, and Logic products.<h2>Design Acceleration with Nexperia</h2>Nexperia&rsquo;s advanced support tools tackle a crucial problem in modern electronic design i.e. the increasing compromise between design complexity, efficiency, cost and time. Engineers are expected to produce highly complex systems with dozens of interdependent parameters and deliver the complete design within ever-tightening time, size, cost, and power constraints. In order to achieve this, they must be equipped with the most relevant and practical information and knowledge regarding their tools and materials.&nbsp;Nexperia&rsquo;s advanced support tools aim to achieve this on several distinct levels. The electrothermal models and application notes are designed to give engineers the complete arsenal required to design a system for unpredictable or extreme electrical and thermal conditions. On the other hand, the quick learning videos and handbooks are to help and aid the engineer in a visual manner regarding design pitfalls and best practices.&nbsp;The tools can allow engineers and amateur designers to spend more time optimizing their project rather than waste valuable time and resources on the initial steps of device selection and behavioural simulation. In turn, companies can develop prototypes faster with more certainty of their performance.<h2>About the sponsor: Nexperia</h2>Nexperia is a dedicated global leader in Discretes, Logic and MOSFETs. We became independent at the beginning of 2017. Focused on efficiency, Nexperia produces consistently reliable semiconductor components at high volume: more than 90 billion annually. &nbsp;Our extensive portfolio meets the stringent standards set by the automotive industry. And industry-leading small packages, produced in our own manufacturing facilities, combine power and thermal efficiency with best-in-class quality levels. Built on over half a century of expertise, Nexperia has over 11,000 employees across Asia, Europe and the U.S. supporting customers globally.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjgyMDY0MzYzOTUyLW5leHBlcmlhIGxvZ28ucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib"><h3>References</h3>&nbsp;1.&nbsp;Nexperia. Advanced Support Tools [Internet]. Nexperia. [cited 2023 Apr 2]. Available from: https://www.nexperia.com/applications/advanced-support-tools/2.&nbsp;Nexperia. Advanced Support Tools - Electrothermal MOSFET models [Internet]. Nexperia. [cited 2023 Apr 3]. Available from: https://www.nexperia.com/applications/advanced-support-tools/3.&nbsp;Berry A. Discrete MOSFETs Finally Get the Models they Deserve [Internet]. Nexperia. [cited 2023 Apr 3]. Available from: https://efficiencywins.nexperia.com/efficient-products/Discrete-MOSFETs-Finally-Get-the-Models-they-Deserve.html4.&nbsp;Nexperia. Advanced Support Tools - Quick Learning Videos [Internet]. Nexperia. [cited 2023 Apr 3]. Available from: https://www.nexperia.com/applications/advanced-support-tools/5.&nbsp;Nexperia. Advanced Support Tools - Interactive Application Notes [Internet]. Nexperia. [cited 2023 Apr 3]. Available from: https://www.nexperia.com/applications/advanced-support-tools/6.&nbsp;Nexperia. MOSFET and GaN FET application handbook | Efficiency Wins [Internet]. 2nd ed. 2020 [cited 2023 Apr 3]. 600 p. Available from: https://efficiencywins.nexperia.com/efficient-products/mosfet-and-gan-fet-application-handbook.html

Semiconductor manufacturers are providing more support to engineers to  support in the design of highly complex electronic systems. The tools include highly detailed models of semiconductor devices, interactive application notes, quick learning videos and a handbook designed specifically for power electronics engineers.

Advances in-design tools for engineers accelerate complex system design

It&rsquo;s easy to feel overwhelmed when you&rsquo;re building low power electronics. There are so many different components and technologies to learn that it can be hard to know where to begin.Recently, one of our clients wanted to redesign their field-deployed IoT environmental monitor to a smaller, lighter, and more power-efficient package with longer battery life and could be placed more easily into remote locations. In order to achieve this, they faced a choice of going with a Linux-based single-board-computer with a microprocessor, or a microcontroller-based compute platform.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ4MjY5NDYzLTE2Nzk5NDgyNjk0NjMucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-environmental-monitoring-2.jpg 1000w, https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-environmental-monitoring-2-300x200.jpg 300w, https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-environmental-monitoring-2-768x512.jpg 768w" sizes="(max-width: 1000px) 100vw, 1000px" class="fr-fic fr-dii">Environmental sensors may require either a microcontroller or microprocessor to compute&nbsp;In this post, we look at the differences between single board computers and microcontroller kits when it comes to <a href="https://www.mistywest.com/posts/5-reasons-to-use-an-iot-framework/" target="_blank">designing a successful remote sensor</a>, so that you have the information you need to choose the right solution for future applications.&nbsp;<h2>A summary of differences between microcontroller kits and single-board computers (SBCs)</h2>A microcontroller is a small all-in-one computing platform with features like onboard memory, built-in timers, IO handling, and other key features for interacting with electrical hardware.&nbsp;Microcontrollers&rsquo; common uses are devices like remote controls, toys, industrial equipment, cars, and implantable medical devices. You can find them in microcontroller kits like <a href="https://www.arduino.cc/" target="_blank">Arduino</a>.&nbsp;<a data-rel="lightbox-image-0" data-rl_caption="An Arduino Uno, one of the microcontroller boards in the Arduino family" data-rl_title="" href="https://www.mistywest.com/wp-content/uploads/2022/06/Arduino_Uno_-_R3.jpg" target="_blank" title=""><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ4MjY5MjAzLTE2Nzk5NDgyNjkyMDMucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/06/Arduino_Uno_-_R3.jpg 600w, https://www.mistywest.com/wp-content/uploads/2022/06/Arduino_Uno_-_R3-300x300.jpg 300w, https://www.mistywest.com/wp-content/uploads/2022/06/Arduino_Uno_-_R3-150x150.jpg 150w" sizes="(max-width: 600px) 100vw, 600px" class="fr-fic fr-dii">An Arduino Uno, one of the microcontroller boards in the Arduino family</a>&nbsp;A microprocessor is similar to a conventional computer CPU, which is only the processor, and needs to be connected to external memory, timers, storage, and IO peripherals in order to function. Microprocessors are generally more powerful, and allow for a more granular hardware design by selecting the exact memory, timers and other features that one needs. You&rsquo;ll find microprocessors in consumer computing equipment, and the increase of small and cheap single-board computers (SBCs) like <a href="https://www.raspberrypi.org/" target="_blank">Raspberry Pi</a> has enabled them to be used in new applications like smart devices.&nbsp;<a href="https://opensource.com/resources/raspberry-pi" target="_blank"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ4MjY5NDk4LTE2Nzk5NDgyNjk0OTcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-raspberry-pi.jpg 675w, https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-raspberry-pi-300x205.jpg 300w" sizes="(max-width: 675px) 100vw, 675px" class="fr-fic fr-dii">Raspberry Pi single-board computer</a>&nbsp;<h2>Strengths and Weaknesses</h2>When it comes to computing power, how resource-intensive is your problem? Will it be simple sensor reading (low intensity), image processing (high intensity), or machine vision/AI (very intense)? For development, can you use an off-the-shelf operating system or reuse other people&rsquo;s code? And how much power consumption or battery life will you require?To help you evaluate the strengths and weaknesses between your options, we&rsquo;ve added them to Table 1 below, followed by a detailed breakdown of each feature.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ4MjY5MDgyLTE2Nzk5NDgyNjkwODIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-microcontroller-microprocessor-compare-v3-01.jpg 717w, https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-microcontroller-microprocessor-compare-v3-01-300x193.jpg 300w" sizes="(max-width: 717px) 100vw, 717px" class="fr-fic fr-dii">Table 1: strengths and weaknesses between the computing devices&nbsp;<h3>Computing power</h3>Some microcontrollers are designed with low power consumption in mind and are specified to be run at reduced clock frequencies, meaning the chip computes more slowly but with less power consumption. This makes microcontrollers good for less compute-intensive applications like sensor reading, serial communication, or mechanical control systems, but they don&rsquo;t tend to have the processing power for computationally intensive tasks, like image processing.In comparison, there&rsquo;s often much more computing power available on commercial microprocessor boards like Raspberry Pi, which can support more complicated tasks like streaming video or running a local website. There are also microprocessors with additional modules, such as the <a href="https://www.nvidia.com/en-us/autonomous-machines/embedded-systems/jetson-nano/" target="_blank">Nvidia Jetson Nano</a>, which has a graphics processing unit for tasks like machine vision and AI.&nbsp;<a href="https://www.nvidia.com/en-us/autonomous-machines/embedded-systems/jetson-nano/education-projects/" target="_blank"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ4MjY5MDA3LTE2Nzk5NDgyNjkwMDcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-jetson-nano-nvdia.jpg 800w, https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-jetson-nano-nvdia-300x169.jpg 300w, https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-jetson-nano-nvdia-768x432.jpg 768w" sizes="(max-width: 800px) 100vw, 800px" class="fr-fic fr-dii">Nvidia Jetson Nano</a>&nbsp;<h3>Available packages, development resources, and support</h3>If you pick an established platform like Arduino or Raspberry Pi, there are many existing open-source libraries and a community that can help debug issues. However, If you pick a more specialized and less common platform, you may be on your own when sorting through documentation and trying to fix the issue. It is important for you to decide if you need the specialized features of a particular platform and trade that against the supportWith embedded Linux solutions, most of the basic drivers for common connections like ethernet, audio, and video are already available, tested and stable. In contrast, you may need to write the drivers for your particular microcontroller to connect with peripherals, which can be time-consuming and challenging.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ4MjY4NzkwLTE2Nzk5NDgyNjg3OTAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-power-consumption-graphic-01.png 612w, https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-power-consumption-graphic-01-300x74.png 300w" sizes="(max-width: 612px) 100vw, 612px" class="fr-fic fr-dii">&nbsp;<h3>Power consumption</h3>Microcontroller-based boards usually use less energy than microprocessor-based SBCs. One of the reasons is that microcontrollers generally run at lower clock frequencies than microprocessors which in turn also means reduced computing power.&nbsp;<h3>Coding language support</h3>If you&rsquo;re running your code on a microcontroller, you&rsquo;re likely going to need to build your software with a lower level language like C or C++. On a microprocessor with a Linux distribution, you will have the choice between many more languages. This can help to create POCs (Proof Of Concepts) at a much faster pace.&nbsp;There are many libraries for peripherals like cameras, sensors, etc. written in higher-level languages like Python, for instance. By picking a platform that can run those languages you will be able to leverage those open source libraries. However, If your solution requires a lot of low-level hardware manipulation, this may not be helpful.&nbsp;<h3>Code portability</h3>How tightly integrated is the code with the hardware? If you write a bare-metal application for a microcontroller, it will be challenging to switch over to another platform &ndash; but projects that are running FreeRTOS, for example, make switching easier. If you&rsquo;re using a Linux-based SBC and peripherals over protocol like USB, it will be even easier to change the compute platform because there&rsquo;s often libraries and drivers available. In summary, depending on the tools you are planning to use some platforms might be more flexible to be interchangeable than others.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ4MjY4ODY2LTE2Nzk5NDgyNjg4NjYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-boot-time-graphic-01.png 892w, https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-boot-time-graphic-01-300x100.png 300w, https://www.mistywest.com/wp-content/uploads/2022/06/mistywest-boot-time-graphic-01-768x257.png 768w" sizes="(max-width: 892px) 100vw, 892px" class="fr-fic fr-dii">&nbsp;<h3>Boot time</h3>The boot time of a SBC with embedded Linux on it is significantly greater than that of a microcontroller, be it bare-metal or running an RTOS. When utilizing an SBC, an application must not depend on fixed time slots during start up and a few seconds for it to come up must be acceptable.&nbsp;<h3>Cost</h3>In general, microcontrollers cost less than microprocessors. As an example, the <a href="https://www.pjrc.com/teensy/" target="_blank">top of the line Teensy</a> costs $26 and the flagship <a href="https://store-usa.arduino.cc/collections/boards/products/arduino-uno-rev3" target="_blank">Arduino board (Uno)</a> costs $25, whereas the flagship <a href="https://www.raspberrypi.com/products/raspberry-pi-4-model-b/" target="_blank">Raspberry Pi board (Pi 4)</a> starts at $35 and more expensive boards like the <a href="https://store.nvidia.com/en-us/jetson/store/?page=1&limit=9&locale=en-us&product=117&product_filter=117~3,118~3,119~4,120~3,173~1" target="_blank">Jetson Nano</a> may range up to $130. There is a wide range of costs in both domains and plenty of choices available on the market.&nbsp;<h2>Conclusion</h2>Ultimately, SBCs and microcontroller kits are both solutions for embedded applications that require computing; it&rsquo;s the use case that will inform which selection is the right one to make.SBCs with an embedded Linux OS, even though more costly, offer greater computing power, and allow a quick start to your project, with a wide range of options for your application&rsquo;s programming language, very active online communities and advantageous portability. Microcontrollers, on the other hand, are much more energy efficient and allow full control and fine tuning of their internal configuration &ndash; but additional time for development of features might need to be considered.In the case for our client, there were tradeoffs for both; a microcontroller-based platform/MCU could achieve lower power consumption, but would require more custom firmware development to integrate. The SBC accelerated development by providing a lot of open-source software packages and drivers that could be rapidly configured, but at the expense of higher power consumption.When it comes to making the right selection, if a quick prototype for a proof of concept is needed or if the device is going to be used for inference, object localization or other demanding computing tasks, an SBC is likely the better solution. The portability of the code and the flexibility of the system will simplify development and maintenance significantly. This article was originally written by Malcolm Dimeglio, Software Developer at MistyWest, <a href="https://www.mistywest.com/posts/choosing-the-right-computing-device-for-a-low-power-sensor-application/" rel="noopener noreferrer" target="_blank">for the MistyWest blog</a>.

Here's what you should consider when designing a successful remote sensor.

Choosing The Right Computing Device For A Low Power Sensor Application

When entering the connected device market, businesses are looking for IoT solutions that can keep costs manageable, scale effectively with business demands, and keep data secure.In particular, scaling effectively requires proper consideration for provisioning, configuration, monitoring, and analysis of the connected devices because making the wrong decisions early on can get costly later. Getting scalability right is even more critical for sensors deployed in remote and inaccessible locations.One of our clients initially planned on building their own custom IoT solution for their remote monitored devices that are being deployed in 10 locations. While being a more affordable cost up-front, a custom, in-house solution would require our client to be responsible for all maintenance throughout a device&rsquo;s lifecycle. This ongoing maintenance would mean increased resources &ndash; and increased costs, <a href="https://www.outsystems.com/glossary/what-is-technical-debt/" target="_blank">known as &ldquo;tech debt&rdquo;</a>.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ3OTgzMjY0LTE2Nzk5NDc5ODMyNjQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-01.png 909w, https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-01-300x194.png 300w, https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-01-768x496.png 768w" sizes="(max-width: 909px) 100vw, 909px" class="fr-fic fr-dii">Our client ultimately decided on using a standard IoT framework&ndash;<a href="https://www.mistywest.com/posts/azure-vs-aws-which-iot-framework-is-right-for-you/" target="_blank">such as Azure, AWS</a>, or Google Cloud Platform&ndash;where they&rsquo;d pay more for the development up front, but have lower operating costs in the long term. This solution also does not require specialized resources to know the technical systems.In this post, we look at the 5 major selling features of an IoT framework for a device deployment.&nbsp;<h2>1. Cradle to grave tracking of devices</h2>Our client selected Azure for their IoT framework, using it to provision devices on the assembly line and make a first-time connection. After this, the devices can arrive up-to-date and automatically update to the latest firmware, and any calibration, configuration, or firmware changes are tracked during manufacturing as well as out in the field in an automatic, consistent, cloud-hosted way.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ3OTg0MTM3LTE2Nzk5NDc5ODQxMzcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-02.png 906w, https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-02-300x158.png 300w, https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-02-768x405.png 768w" sizes="(max-width: 906px) 100vw, 906px" class="fr-fic fr-dii"><h2>2. Ability to determine at-a-glance whether a device is problematic</h2>Devices dial out to the cloud to establish connectivity, and that connectivity is tracked by Azure&rsquo;s IoT system. Proactive alerts can be set if a device has not appeared online for a while or data has not been uploaded. All of this automation helps minimize downtime and data loss.&nbsp;<h2>3. Continuous uploading and organization of data</h2>The devices will upload data continuously, whenever there is a connection. The data goes into a standard cloud-hosted storage solution (blob storage) which keeps the data centralized and accessible to those who need it, while also being monitored to ensure the devices are functioning correctly. The data upload can trigger further data processing and automated pipelines that give real time insights into activity.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ3OTgyNzk4LTE2Nzk5NDc5ODI3OTgucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-03.png 906w, https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-03-300x190.png 300w, https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-03-768x487.png 768w" sizes="(max-width: 906px) 100vw, 906px" class="fr-fic fr-dii"><h2>4. Offline (queued) updates to parameters and firmware</h2>Devices on a standard framework don&rsquo;t have to be online to queue up changes to parameters and schedule new firmware updates &ndash; they can be in storage, in transit, or in use. Businesses can adopt a &ldquo;set it and forget it&rdquo; mindset knowing updates will be automatically applied. This reduces additional coordination work.&nbsp;<h2>5. Mass updates to the smart device&rsquo;s parameters</h2>Updates to parameters can be easily made fleet-wide, or to any subset of devices. As the product evolves, these changes can be made to optimize operation, and subsets of devices can be used as a test bed before rolling out changes to a larger number. The built-in optimization for updates helps decrease device management overhead.&nbsp;<h2>Conclusion</h2>When looking at scaling of deployments, the economics favor the standard IoT framework. By using a standard solution you&rsquo;re leveraging thousands of engineering hours, other companies&rsquo; testing, and have the benefit of continued development of new features useful to (and not driven by) your business.Think about what scale your business is going to be reaching when considering your own connectivity solution &ndash; if you plan on continuing to grow, adopting a standard solution will be the more affordable and manageable solution in the long run. This article was originally written by Kevin Baillie, Mechatronics Designer, <a href="https://www.mistywest.com/posts/5-reasons-to-use-an-iot-framework/" rel="noopener noreferrer" target="_blank">for the MistyWest blog</a>.

Considering a quick IoT solution that will get your product deployed faster? Here’s why you should reconsider.

5 Reasons To Use An IoT Framework For Your Connected Devices

Smart connected devices are being deployed in all industries, but the one that could have the greatest impact for individuals is within healthcare. In this article we will take a deep dive into the <a href="https://www.renesas.com/eu/en/application/iot-applications/smart-health/smart-connected-pulse-oximeter" rel="noopener noreferrer" target="_blank">smart connected pulse oximeter</a>, which is a super-low power system that can accurately measure blood oxygen levels in patients. We will take a look at the system&rsquo;s components, the unique features of the design, and why this solution is just the beginning in a bright future for smart medical devices.<h2>What is a pulse oximeter?</h2>A pulse oximeter measures the oxygen saturation of the blood in order to determine how well the heart is pumping oxygenated blood to the furthest extremities, such as the arms and legs [1]. Common devices clip a probe onto the patient&rsquo;s ear or fingertip to measure blood oxygen levels. Traditionally, these devices were attached to a monitor directly, or are often seen as part of a blood pressure machine in doctor&rsquo;s offices and hospitals.&nbsp;Healthcare professionals use oximeters quite frequently. They can be used to monitor a patient&rsquo;s current condition if they are suspected of having or diagnosed with a heart attack, heart failure, anemia, lung cancer, asthma, or pneumonia. In addition, patients that have undergone surgery that required sedation or are being subjected to a stress test to assess their cardiovascular abilities will also be monitored using a pulse oximeter&nbsp;[1]. The data captured by the oximeter provides crucial feedback to doctors, nurses, and technicians, which can help treat and monitor patients every day.During the COVID-19 pandemic, doctors began using at-home pulse oximeters to monitor blood oxygen levels of high-risk patients with the virus, such as those with diabetes, those who were pregnant, those with chronic illnesses, and those who were elderly. By taking readings on the portable sensor twice a day, patients were asked to let their doctor know if the reading dropped below 95%. If at any point a patient&rsquo;s blood oxygen level dropped to 90% or lower, they were told to seek immediate attention and to get to the emergency department. Early detection of lower blood saturation limits led to better outcomes in patients who used a pulse oximeter. A study in South Africa determined that a 50% reduction in patient mortality was possible if pulse oximeters were used to get patients the care they required as soon as blood oxygen levels dropped [2]. &nbsp;&nbsp;<h2 dir="ltr">Case Study: Renesas Smart Oximeter design</h2>To bring smart wireless technology to a commonly used medical tool, <a href="https://www.renesas.com/eu/en/application/iot-applications/smart-health/smart-connected-pulse-oximeter" rel="noopener noreferrer" target="_blank">Renesas developed the Smart Connected Pulse Oximeter.&nbsp;</a>Improving on traditional wired probes, the Smart Connected Pulse Oximeter uses a super-low power Bluetooth&reg; Low Energy (LE) System-on-Chip to relay the data to a smartphone app. The company has developed both iOS and Android applications that patients can download for free, and the software itself is open source for the reference design, allowing for future app improvements and collaborations within the industry.&nbsp;For example, healthcare practitioners could work together with app developers to create an interface that would serve their patient population and their own record-keeping needs. Doctors would have the best idea of how tech-savvy their patient population is and how simple the user interface would need to be. Bluetooth&reg; connection, for instance, may need to be automatic, or there may need to be tutorials in place for patients. In addition, doctors would be able to help direct the ideal frequency of checks per day and work with developers to add in notifications for the patient, so they don&rsquo;t forget to check their blood oxygen saturation. Because the device records the levels in the app, it could be further developed to connect to servers that the doctor has access to in order to help monitor the patient.&nbsp;The Smart Oximeter by Renesas is powered by two AAA batteries on the back of the board. Patients connect their smartphone to the oximeter using the Bluetooth&reg; module and can then rest their fingertip on an OB1203 biosensor. The biosensor on the chip is the smallest available at 4.2mm x 2 mm x 1.2 mm. A red light can be seen under the fingertip while measurements are taken, including heart rate, blood oxygen concentration, profusion index, and battery level, which show up in the smartphone application. Measurements take approximately six seconds, and through the use of a medical-grad algorithm have been shown to be accurate on even the most difficult-to-measure patients.Previously, pulse oximeters were not wireless devices that could connect to smartphones. They were small devices that patients used to measure their blood oxygen levels at home. But with advances in&nbsp;Bluetooth&reg; technology, including the size of the chip and the minimal energy it consumes, the pulse oximeter can now be brought online. Currently, this allows for a small device to be used at home, and it allows for greater accuracy in readings helping more patients get to the hospital if their blood oxygen levels get too low. Adding the&nbsp;Bluetooth&reg; capability also opens the door to remote monitoring both by healthcare practitioners and loved ones who are keeping track of their friends&rsquo; and family&rsquo;s health. The data can now be transmitted to the caretaker&rsquo;s phone.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjgyNTA0Mzg1MDU2LXB1bHNlIDEucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib">Layout of the system. Image credit; Renesas<h2 dir="ltr">Benefits of the Smart Oximeter for the healthcare industry and end consumers</h2>The Smart Oximeter with the available mobile applications is a complete solution available to different healthcare providers. While hospital departments and doctor&rsquo;s offices may have traditional wired oximeters in place, they can be bulky and cumbersome to move from room to room. The Smart Oximeter offers a compact and portable solution for healthcare professionals, and those who are providing their services in patient&rsquo;s homes. They can easily transport the Smart Oximeter on their person and can rest assured it will be using the very little battery energy throughout the day.Because of the lightweight design and mobile monitoring characteristics, the Smart Oximeter could also be used on gym or physiotherapy equipment, like treadmills, ellipticals, and stationary bikes. Patients would be able to monitor their blood oxygen levels, and healthcare providers could receive the data from their patients even between appointments.&nbsp;As a wearable device, patients can rest assured that they can check if their blood oxygen saturation is sufficient or not. This will also ensure patients get to their doctor or local emergency department when blood oxygen levels are too low. The simplicity of the Smart Oximeter by Renesas means it can be used in multiple settings to assist the maximum number of people afflicted with conditions or undergoing treatments and surgeries that may lower their blood oxygen saturation.<h2 dir="ltr">Expanding IoT and smart healthcare solutions to save lives</h2>While engineers have been expanding the Internet of Things (IoT) into all technical realms, the most common examples that seem to be at the forefront are those in manufacturing or smart home systems or even industrial energy applications. But by taking health monitors, sensors, and the latest wireless technology into the IoT domain, many people will benefit from the advances, and not just select high-tech industries.&nbsp;A simple, but powerful, device like the oximeter could be made readily available to patients and their healthcare professionals to more effectively monitor them. For example, if a patient sees their specialist once every two weeks to have their blood oxygen saturation measured, there is a large time lapse within which the patient may decline. Putting the Smart Oximeter into the hands of healthcare frontline professionals and patients could truly save many lives. And with the adoption of smart mobile monitoring, the industry and patients will grow more comfortable of the technology and the elevated level of monitoring and care they will have access to, resulting in many more smart applications in the years to come.&nbsp;<h2 dir="ltr" id="isPasted">Summary</h2>The Renesas Smart Oximeter is a complete solution to monitoring a patient&rsquo;s blood oxygen saturation wirelessly. Powered by two AAA batteries on the back of the chip, the Renesas Smart Oximeter uses a super-low power Bluetooth&reg; System-on-Chip to connect to a smartphone app where the heart rate, blood oxygen concentration, profusion index, and battery levels are displayed. The biosensor on the chip is the smallest available at just 4.2 mm x 2 mm x 1.2 mm, where a patient rests their fingertip.&nbsp;By bringing a smart mobile solution to the healthcare industry, Renesas has made the oximeter more portable, more energy efficient, and more accurate than traditional oximeters. If deployed to healthcare practitioners and their patients more widely, monitoring accuracy and frequency would increase to ensure adequate patient blood oxygen levels, meaning the Renesas Smart Oximeter could literally save lives. &nbsp;&nbsp;<h2 dir="ltr">References:</h2>[1] Johns Hopkins Medicine. Pulse Oximetry [Internet]. Maryland: The Johns Hopkins University; 2022 [cited 2022 May 12]. Available from: <a href="https://www.hopkinsmedicine.org/health/treatment-tests-and-therapies/pulse-oximetry" rel="noopener noreferrer" target="_blank">https://www.hopkinsmedicine.org/health/treatment-tests-and-therapies/pulse-oximetry</a>[2] Parker-Pope, Tara. Do I Still Need a Pulse Oximeter? A new study shows just how lifesaving home monitoring of oxygen levels can be. [Internet]. New York: The New York Times; 2021 [cited 2022 May 15]. Available from: <a href="https://www.nytimes.com/2021/10/05/well/live/covid-pulse-oximeter.html" rel="noopener noreferrer" target="_blank">https://www.nytimes.com/2021/10/05/well/live/covid-pulse-oximeter.html</a>

A life-saving application of a super-low power system. 


Simply saving lives: A deep look at the simple but brilliant pulse oximeter

This article is part of the series on Getting Started with LwM2M. If you&rsquo;re new to LwM2M, make sure to start by reading the previous article: <a href="https://www.wevolver.com/article/whats-this-lwm2m-standard-and-why-should-you-care" target="_blank">What&#39;s this LwM2M standard, and why should you care?</a>&nbsp;In today&rsquo;s market, IoT devices come in different forms and shapes. Each device has a unique communication stack which comes with a particular data packet structure and a thoughtfully designed device management layer.Now imagine the struggles of an energy distributor who deployed various brands of smart meters over the years to measure the use of electricity in thousands of buildings. Each meter comes with a different data structure which needs to be formatted. Specific processes need to be implemented to remotely manage the different devices, and particular mechanisms need to be put in place to update the devices&rsquo; firmware.When devices use the LwM2M standard, IoT integrators can be assured that each device reports its data in a similar fashion. The configurations and firmware can be updated using similar server commands independent of the hardware, firmware version or sensors used. In this article, we will explore the three fundamental components of LwM2M that ensure interoperability: the standardized data format, LwM2M architecture and LwM2M operations.<h2 dir="ltr" id="isPasted">LwM2M Data Format - Objects &amp; Resources</h2>LwM2M is an application-layer communication protocol developed by the <a href="https://omaspecworks.org/" target="_blank">OMA SpecWorks</a> to simplify messaging and device management of IoT devices. The protocol defines communication semantics, device management mechanisms, over-the-air updates (FOTA), telemetry data collection and is well suited for resource-constrained devices.To realize data interoperability, the LwM2M standard uses so-called IPSO Smart Objects to represent configurations, functionalities and sensors. When structuring the IPSO Smart Objects in a specific way, a language is created which both the LwM2M Client and the LwM2M Server can comprehend. This language contains Objects, Object Instances and Resources.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3NzU0OTgzNTM5LVNtYXJ0IE9iamVjdHMyLmpwZWciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 766px;" class="fr-fic fr-dib"><h3>Objects</h3>Objects represent a physical component (a sensor, LED or actuator) or a logical entity (such as the preferred radio technology, Firmware Update configuration or security implementation). All objects are defined by an object ID.The LwM2M standard defines three&nbsp;mandatory objects&nbsp;which are considered as essential for the device to connect and communicate with a LwM2M server. The mandatory objects are:<ul><li dir="ltr">Object ID 0: LwM2M Security - contains confidential information about connections to the LwM2M Servers configured on the Client.</li><li dir="ltr">Object ID 1: LwM2M Server - contains non-confidential information about connections to the LwM2M Servers configured on the Client.</li><li dir="ltr">Object ID 3: Device - contains basic information about the device, such as e.g. serial number and firmware version.</li></ul>Next to the mandatory objects, additional objects can be implemented. Examples of non-mandatory objects are:<ul><li dir="ltr">Object ID 4: Connectivity Monitoring - provides information about the device&#39;s connectivity status, such as the signal strength and network type.</li><li dir="ltr">Object ID 5: Firmware Update - allows for remote firmware updates to be performed.</li><li dir="ltr">Object ID 6: Location - provides information about the device&#39;s geographic location, such as its latitude and longitude.</li><li dir="ltr">Object ID 11: LwM2M APN Connection Profile - enables a device to connect to an APN.</li><li dir="ltr">Object ID 3303: Temperature - reports temperature measurements.</li><li dir="ltr">Object ID 3313: Accelerometer&nbsp;- represents a 1-3 axis accelerometer.</li></ul><h3 dir="ltr">Object Instances</h3>Some objects may have multiple&nbsp;object instances. Examples of such objects include the object that manages connections to LwM2M Servers as multiple LwM2M Servers can be configured, or devices which contain multiple SIMs with different APN profiles. When devices contain multiple identical sensors, object instances are used to distinguish the different sensors.<h3 dir="ltr">Resources</h3>Resources represent specific properties of an object which can be read, written or executed. Each Resource is identified by a unique resource ID.For example, a temperature object has the resources current temperature, unit of measurement, and a timestamp. Similarly, the device object has resources like manufacturer name, serial number and firmware version. The location object has the resources latitude, longitude and altitude. All details of the objects and resources are defined in the <a href="https://technical.openmobilealliance.org/OMNA/LwM2M/LwM2MRegistry.html" target="_blank">OMA Registry</a>. There is also a possibility to define your own custom object if a specific feature or sensor is not listed in the OMA Registry.Each resource contains an identifier, a type (float, string, int, opaque) and allowed Server Operations (such as READ, WRITE or EXECUTE).&nbsp;Examples The Device object is represented with the identifier&nbsp;3, the resources include:<div align="left" dir="ltr"><table><tbody><tr><td>Resource ID</td><td>Resource name</td><td>Server Operation</td><td>Type</td></tr><tr><td>0</td><td>Manufacturer</td><td>Read</td><td>String</td></tr><tr><td>1</td><td>Model Number</td><td>Read</td><td>String</td></tr><tr><td>3</td><td>Firmware Version</td><td>Read</td><td>String</td></tr><tr><td>4</td><td>Reboot</td><td>Executable</td><td>-</td></tr><tr><td>13</td><td>Current Time</td><td>Writeable</td><td>Time</td></tr></tbody></table></div>The Temperature object is represented with the identifier 3303, the resources include:<div align="left" dir="ltr"><table><tbody><tr><td>Resource ID</td><td>Resource name</td><td>Server Operation</td><td>Type</td></tr><tr><td>5700</td><td>Sensor Value</td><td>Read</td><td>Float</td></tr><tr><td>5701</td><td>Sensor Units</td><td>Read</td><td>String</td></tr><tr><td>5518</td><td>Timestamp</td><td>Read</td><td>Time</td></tr></tbody></table></div>When sending data, each message is formatted as:<pre dir="ltr">&lt;object id&gt;/&lt;object instance id&gt;/&lt;resource id&gt; = &lt;data&gt;</pre>To send the latest temperature data, it could look something like:&nbsp;<pre dir="ltr">3303/0/5700 = 23.5</pre>To optimize bandwidth, the data is usually encoded to a space-efficient binary payload. Although the data can be sent with plain JSON, more common is to use CBOR or SenML to reduce the payload size.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3NzUzMTI0NDk4LUxvY2F0aW9uX29iamVjdC5qcGVnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 766px;" class="fr-fic fr-dib">Sending Latitude and Longitude using the LwM2M data formatResource InstancesIn some cases, resources have multiple resource instances. For example, the Device object 3 includes the&nbsp;resource 6: Available Power Sources. The different instances describe the different power sources: 0: DC power 1: Internal Battery 2: External Battery 3: Fuel Cell 4: Power over Ethernet 5: USB 6: AC (Mains) power 7: SolarTo describe the availability of solar power, the message format becomes:&nbsp;<pre dir="ltr">3/0/6/7</pre><h2 dir="ltr" id="isPasted">LwM2M Architecture - Client &amp; Server</h2>The LwM2M architecture comprises the LwM2M Client and the LwM2M Server. The communication works independent of the (wireless) technology used and can run on top of both IP and non-IP networks. Popular IP technologies include WiFi and cellular. Non-IP includes Bluetooth, LoRaWAN or Wirepas. Non-IP networks can be addressed using IEEE 802.15.4 (6LoWPAN) networks. For example by running Thread over Bluetooth.&nbsp;The LwM2M standard uses the CoAP protocol to let devices easily communicate with the cloud. Think of CoAP as the HTTP protocol, but designed for resource-constrained devices. CoAP is often compared to MQTT as both protocols are commonly used in IoT applications. A key difference is that CoAP uses UDP by default while MQTT relies on TCP. The small overhead of UDP is often seen as an advantage when compared to TCP. Although CoAP can be used with TCP, UDP is often the preferred choice when efficient use of network resources is a priority.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3NzUzMjc1ODExLUx3TTJNX0FyY2hpdGVjdHVyZS5qcGVnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 768px;" class="fr-fic fr-dib">Popular LwM2M Clients include Anjay (maintained by AVSystem) and Zephyr LwM2M Client (maintained by the Zephyr Project). The LwM2M Server provided by AVSystem is called Coiote and can be used to process device data, configurations and firmware updates.The LwM2M Client runs on the end device and communicates with the LwM2M server using a secure connection. The Client informs the Server about the supported objects and resources during its first connection as well as during periodic status updates. Throughout the lifetime of the device, the client sends notification to the server with telemetry data formatted as defined by the LwM2M standard. All data is captured and stored by the LwM2M Server where it can be further processed or forwarded to specific databases of platforms such as Azure IoT Hub, or AWS IoT Core.<h2 dir="ltr" id="isPasted">LwM2M Operations</h2>The third core feature of the LwM2M protocol are operations that can be initiated from both the Client and the Server. Client Operations are used to inform the Server about telemetry data or the state of devices. Server Operations are used to read or write data, or to remotely update device configurations or firmware over time.Two interfaces can be distinguished: The Information Reporting Interface, and the Device Management Interface.<h3 dir="ltr" id="isPasted">Information Reporting Interface</h3><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3NzUzMzc0NDk1LUluZm9ybWF0aW9uIFJlcG9ydGluZyBJbnRlcmZhY2UuanBlZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 766px;" class="fr-fic fr-dib">The LwM2M Client can inform the Server about telemetry data or state changes in real-time, initiated by the Client. The Server can also define the device&rsquo;s behavior by requesting the device to send data at periodic intervals, or when values exceed a certain threshold (e.g. when temperature rises above 30 degrees). This can be accomplished using the operations: OBSERVE, SEND and NOTIFY.Server operation<ul><li dir="ltr">OBSERVE: When the Observe operation is invoked, the Client will start sending NOTIFY messages to the Server about its data or state at configurable intervals. The OBSERVE operation can also be canceled when sending CANCEL OBSERVE.</li></ul>Client Operations<ul><li dir="ltr">SEND: The SEND message is used by the Client to send data to the server without explicit request. Depending on the application firmware it can be used to report new measurements, or inform the server about a change in telemetry data or state.</li><li dir="ltr">NOTIFY: In response to the OBSERVE operation initiated from the server, the client sends NOTIFY operations with data. Usually, the server provides a bandwidth in which the client needs to send its data. E.g. At least every 1 hour, but no more than once every 15 minutes.</li></ul><h3 dir="ltr" id="isPasted">Device Management Interface</h3><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3NzUzNDEwMTYyLURldmljZSBNYW5hZ2VtZW50IEludGVyZmFjZS5qcGVnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 766px;" class="fr-fic fr-dib">The Device Management Interface allows the server to remotely connect with the LwM2M Client and manage its configuration, software, security etc. The interface comes with a set of standardized operations, all of which are initiated by the Server.<ul><li dir="ltr">DISCOVER: Retrieving the list of objects and resources supported by the Client.</li><li dir="ltr">READ: Retrieving the current value of a specific resource or an object as a whole.</li><li dir="ltr">WRITE: Modifying the value of a specific resource, or an object as a whole.</li><li dir="ltr">EXECUTE: Invoking an action or operation on a resource. For example instructing a device to reset, reboot or upgrade its firmware.</li><li dir="ltr">CREATE: Creating a new object instance.</li><li dir="ltr">DELETE: Deleting an object instance.</li></ul><h2 dir="ltr">Conclusions</h2>The IoT landscape is fragmented and it&#39;s easy to get lost when digging through the wireless technologies, messaging protocols and data formats. LwM2M promises to simplify the connected world through standardization and interoperability.This is accomplished as a result of the IPSO Smart Objects with predefined identifiers, allowing for the creation of a digital representation of the device. The standardized data format allows any LwM2M Server to easily interpret the data. The client-server architecture specifies how data flows between the end devices and the web. Lastly, the pre-defined operations enable devices to send data and be reconfigured over time.To get started with LwM2M, follow AVSystem&rsquo;s <a href="https://iotdevzone.avsystem.com/docs/quickstart/" target="_blank">Quick Start</a> guide, and build your first end to end LwM2M application within 20 minutes.<h3 dir="ltr" id="isPasted"><a href="https://iotdevzone.avsystem.com/docs/quickstart/" target="_blank">Start Building &rarr;</a></h3>

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