<h2 id="isPasted">Project overview</h2><h3>Purpose</h3><p>The purpose of this project was to demonstrate the multilayer capability of <a href="https://www.voltera.io/nova">Voltera NOVA</a>. We printed a blue light-emitting pattern — the Voltera logo — on two substrates: paper and PET separately, using electroluminescent ink.</p><p><span contenteditable="false" draggable="true" class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable"><iframe src="https://www.youtube.com/embed/Yc8nEoVnpDY?&amp;wmode=opaque&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true" style="width: 640px; height: 450px;"><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span></iframe></span></p><h3 id="isPasted">Design layout</h3><p>Electroluminescence operates by exciting a phosphor material with an electric field. An inverter is needed to convert the direct current from the power source into alternating current.</p><p>Based on this mechanism, our design positions a phosphor layer between two conductive layers, incorporating a dielectric ink layer to insulate the phosphor. The printing sequence is as follows:</p><ul><li>Layer 1: Base conductive layer&nbsp;</li><li>Layer 2: Dielectric layer&nbsp;</li><li>Layer 3: Phosphor layer</li><li>Layer 4: Top conductive layer</li></ul><h3>Layer overview</h3><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731492862692-67091c8ba38b9d9305e349bd_67091ae09acab270adbdf20e_Printing-electroluminescent-ink-paper-pet-layer-overview.webp" style="width: 100%px;" class="fr-fic fr-dib"></p><h3 id="isPasted">Desired outcome</h3><p>Once connected to an alternating current (140 V, 1.862 kHz), the phosphor layer emits blue light, illuminating the Voltera logo with an even glow across both prints.</p><h3>Functionality</h3><p>We determined the Voltera logo would be suitable for this project. It is feasible to incorporate designs into larger electronic applications, including billboards, branded merchandise, and control panels.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731492887115-67091c8ca38b9d9305e34a1b_67091b02bdc7f308274e583c_Printing-electroluminescent-ink-paper-pet-functionality.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: Final print on paper<br></span></span></span></p><h2 id="isPasted">Printing the electroluminescent Voltera logo</h2><h3>Base conductive layer</h3><p>This layer consists of a Voltera logo pattern (55.5 mm L × 19.75 mm W) and positive and negative traces that connect to power and ground terminals.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731492929241-67091c8ba38b9d9305e349c3_67091b1d9aa70f5ad577fd0b_Printing-electroluminescent-ink-base-conductive-layer-settings.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: NOVA settings, base conductive layer<br></span></span></span></p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731492948899-67091c8ba38b9d9305e349d2_67091b3ba4c7564aec9fc4c0_Printing-electroluminescent-ink-base-conductive-layer-paper-result.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: Result on paper, base conductive layer</span></span></span></p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731492971049-67091c8ca38b9d9305e34a00_67091b566f34a25480b46ae4_Printing-electroluminescent-ink-base-conductive-layer-pet-result.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: Result on PET, base conductive layer</span></span></span></p><h3 id="isPasted">Dielectric layer</h3><p>This layer features a dielectric Voltera logo pattern which measures 23 mm L × 15 mm W and two dielectric pads. These extra pads help ensure the top conductive layer is appropriately insulated.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731493165129-67091c8ba38b9d9305e349c0_67091b7716905ac65aa4e290_Printing-electroluminescent-ink-dielectric-layer-settings.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: NOVA settings, dielectric layer</span></span></span></p><h3><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731493233623-67091c8ba38b9d9305e349cf_67091b9107b512cf5a4ae562_Printing-electroluminescent-ink-dielectric-layer-paper-result.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: Result on paper, dielectric layer<br></span></span></span></h3><h3><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731493246956-67091c8ca38b9d9305e34a15_67091bafbdc7f308274eea1a_Printing-electroluminescent-ink-dielectric-layer-pet-result.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: Result on PET, dielectric layer</span></span></span></h3><h3 id="isPasted">Phosphor layer</h3><p>This layer contains a Voltera logo pattern, slightly smaller than the dielectric layer (by 0.5 mm each way), printed with blue light-emitting ink.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731493315418-67091c8ba38b9d9305e349c9_67091bcf07c69e92aba81f70_Printing-electroluminescent-ink-phosphor-layer-settings.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: NOVA settings, phosphor layer</span></span></span></p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731493337007-67091c8ba38b9d9305e349d5_67091be50886a22f6b31099d_Printing-electroluminescent-ink-phosphor-layer-paper-result.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: Result on paper, phosphor layer</span></span></span></p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731493358134-67091c8ca38b9d9305e34a1e_67091c028b83f4ea5977853c_Printing-electroluminescent-ink-phosphor-layer-pet-result.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: Result on PET, phosphor layer</span></span></span></p><h3 id="isPasted">Top conductive layer</h3><p>Lastly, this layer includes a conductive overlay with an opening at the bottom left to prevent short circuiting. It measures 29.5 mm L × 21.5 mm W and connects to the ground terminal.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731493385109-67091c8ba38b9d9305e349db_67091c23c63ef691b7477c26_Printing-electroluminescent-ink-top-conductive-layer-settings.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: NOVA settings, top conductive layer</span></span></span></p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731493412343-67091c8ca38b9d9305e34a12_67091c394819899b375fb8eb_Printing-electroluminescent-ink-top-conductive-layer-paper-result.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: Result on paper, top conductive layer</span></span></span></p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731493430542-67091c8ca38b9d9305e34a18_67091c534ec56a943f81fc4f_Printing-electroluminescent-ink-top-conductive-layer-pet-result.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: Result on PET, top conductive layer</span></span></span></p><h2 id="isPasted">Challenges and advice for printing multilayer electroluminescent displays</h2><h3>Trapped air</h3><p>Air bubbles can form in inks that have been left unused for an extended period. These bubbles caused the dielectric layer to break when we cured it in the oven.&nbsp;</p><p>Mixing the ink with a dual asymmetric centrifugal mixer before printing will eliminate air bubbles. Additionally, it is recommended to allow the dielectric layer to dry naturally at room temperature instead of curing it in an oven.&nbsp;</p><h3>Uneven glow&nbsp;</h3><p>During our experiments, some prints exhibited dark areas, leading to an uneven glow. This issue can arise from several factors:&nbsp;</p><ul><li>The top conductive layer being too thick</li><li>The phosphor layer being too thin or getting scratched off during dispensing of the ink for the top conductive layer</li><li>Irregularities in print height</li></ul><p>Adding fiducials to each layer helps improve alignment and print quality. In terms of print settings, if the layer is too thick, increasing the print speed, reducing the height (we reduced it to approximately 40 µm), and using a smaller nozzle can be helpful. If the layer is too thin, try to reduce the print speed.&nbsp;</p><p>Furthermore, in multilayer projects, changes in height can happen drastically when printing over existing traces. Setting a low probe pitch will make the height map more accurate, ensuring the height transition at the edges of features is accurate and reducing the risk of traces being printed off-course.</p><h2>Conclusion</h2><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731493470103-67091c8ca38b9d9305e34a03_67091c71bdc7f308274f8ff7_Printing-electroluminescent-ink-paper-pet-conclusion.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: Electroluminescent logo final print</span></span></span></p><p id="isPasted">The paper substrate provided consistent results throughout our experimentation, due to its absorbent nature. Each layer was smoother on paper than on PET, highlighting the potential of using paper as a substrate in EL display applications. &nbsp;</p><p>On the other hand, PET, being flexible and chemically resistant, offers the advantage of suitability for more demanding use cases. As demonstrated by this project, with careful attention and fine-tuning of the print settings, the results of EL display on PET are equally impressive.</p><p>EL displays are also intriguing when printed on glass and other non-conductive substrates. As we continue to explore the possibilities of electroluminescent inks, we invite you to view the&nbsp;<a href="https://www.voltera.io/applications">other projects</a> we’ve completed.</p>

Due to their consistent brightness, low cost and high energy efficiency, electroluminescent inks are used in a wide range of electroluminescent display applications. This project is an example of printing an electroluminescent ink on soft and flexible substrates.

Printing Electroluminescent Ink on Paper and PET

Aluminium PCBs - G4 LED bulbs in different Sizes, and Shapes

This technical guide examines aluminum PCB architecture, manufacturing processes, thermal characteristics, and implementation methodologies for optimal thermal performance in high-power electronic systems.

Aluminum PCB Design: Advanced Thermal Management Solutions for High-Power Electronics

<p dir="ltr">Bioelectronics is a multidisciplinary field that combines biology and electronics to develop devices that interface with biological systems. It plays a crucial role in the healthcare industry as it enables innovations like advanced prosthetics, electronic skins (e-skins), and exoskeletons to improve the quality of life for individuals by restoring or enhancing bodily functions. This integration of biological systems with electronic devices is transforming healthcare by allowing for more personalized, efficient, and responsive treatments.</p><h2 dir="ltr">The Evolution of Bioelectronics</h2><h3 dir="ltr">From Concept to Application</h3><p dir="ltr">Bioelectronics emerged in the late 18th century with Luigi Galvani's experiments, which discovered that electricity could stimulate muscles, introducing the concept of "animal electricity." His work laid the foundation for understanding neuroelectricity. In the 1930s, electrical stimulation research led to the development of cochlear implants. The field gained momentum in the 1940s and 1950s when Alan Hodgkin and Andrew Huxley recorded action potentials in nerve cells, earning them a Nobel Prize in 1963.&nbsp;1</p><p dir="ltr">Currently, bioelectronics in medicine is considered to be a rapidly growing market.&nbsp;1&nbsp;Bioelectronics is currently being applied in various areas of healthcare, including wearable devices, implantable sensors, neural interfaces, and drug delivery systems. For instance, wearable electronics like health monitors and smart textiles are used to track vital signs in real time. Similarly, implantable devices, such as neural interfaces, facilitate direct communication between the brain and external devices.</p><h2 dir="ltr">Key Technologies in Bioelectronics</h2><p dir="ltr">The current state of bioelectronics became possible due to several advanced key technologies. For instance, flexible electronics technologies allow devices to conform to the body's contours to enhance user comfort and enable continuous monitoring. Sensors embedded within these systems can capture and relay physiological data. Similarly, biocompatible materials, like bioceramics, are compatible with the body and minimize adverse reactions.</p><p dir="ltr">Another important technology in this regard is additive manufacturing, specifically DIW, since it allows users to print electronic structures with biocompatible inks layer by layer with high precision, which helps develop complex biomedical devices tailored to individual patients.</p><h1 dir="ltr">Understanding Biocompatible Inks and Their Role in Bioelectronics</h1><h3 dir="ltr">What Are Biocompatible Inks?</h3><p dir="ltr">Biocompatible inks are specialized materials designed for safe interaction with biological systems which makes them significant in developing bioelectronics. These inks are typically composed of polymers, hydrogels, conductive materials like gold and silver-silver chloride, or other bio-friendly substances that can mimic the properties of living tissues, such as flexibility and conductivity. The primary role of biocompatible inks in bioelectronics is to create interfaces that can integrate smoothly with biological tissues, enabling innovations like flexible sensors, and implantable devices.</p><h3 dir="ltr">Biocompatible Inks in DIW Systems</h3><p dir="ltr">DIW technology is an advanced additive manufacturing method used to print electrical circuits, features, patterns, and traces by extruding ink from a fine nozzle in a precise and controlled manner. DIW can print biocompatible inks onto biocompatible substrates for in- or on-body monitoring and recording of bioelectric signals.&nbsp;</p><p dir="ltr">Moreover, DIW offers high precision and flexibility, making it ideal for creating customized biomedical solutions as it allows the users to tune various parameters, including extrusion pressure, nozzle speed, and material calibration, to tailor the printed material's properties to the specific needs of a patient.</p><h3 dir="ltr">Compatibility with Common Substrates</h3><p dir="ltr">DIW systems are highly versatile and allow precise dispensing of various materials with differing mechanical and electrochemical properties. This adaptability makes DIW well-suited for printing onto organic polymer substrates like PEDOT:PSS, which is a combination of two distinct polymers (poly(3,4-ethylenedioxythiophene) and polystyrene sulfonate).&nbsp;</p><p dir="ltr">PEDOT:PSS offers excellent electrical conductivity, flexibility, and biocompatibility, making it an ideal substrate for biosensing applications. This compatibility of PEDOT:PSS with DIW helps create complex, multifunctional devices where the electrochemical behavior of this substrate enhances the functionality of printed sensors, leading to innovative biomedical solutions.</p><h1 dir="ltr">On-Body and In-Body Bioelectronics: Current Applications and Future Prospects</h1><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzMwOTg0OTIxMDA0LUdvbGQgZWxlY3Ryb2RlIG9uIHNraW5fMS5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib"></p><p>Over the next decade, the bioelectronic technologies market is expected to witness significant growth, projected to expand from $23.9 billion in 2024 to approximately $33.6 billion by 2029, achieving a compound annual growth rate (CAGR) of 7.0%. This growth is expected due to the rising elderly population and increasing prevalence of cardiovascular and neurological disorders. Non-invasive electroceutical devices, such as on-body bioelectronics like transcutaneous electrical nerve stimulation (TENS) devices, and in-body bioelectronics like implantable neurostimulators, are anticipated to grow at the highest rate, driven by advancements in technology and increased research and development investments. 2</p><h2 dir="ltr">On-Body Bioelectronics</h2><p dir="ltr">On-body bioelectronics refers to electronic devices and systems that are designed to be worn directly on the skin or embedded into wearable materials to monitor, stimulate, or interact with biological processes in the human body. Wearable devices like smartwatches and fitness trackers that monitor heart rate, body temperature, and other vital signs in real time are among the most common applications of on-body bioelectronics. Similarly, smart textiles are another type of on-body bioelectronics that include fabrics integrated with electronic components that can measure biomechanical movements, making them advantageous in sports, rehabilitation, and clinical monitoring.</p><h2 dir="ltr">In-Body Bioelectronics</h2><p dir="ltr">In-body bioelectronics, like pacemakers, cochlear implants, and neural interfaces, are implanted or inserted within the human body to monitor physiological processes, deliver therapies, or interact with biological tissues at a deeper level. For instance, neural interfaces enable direct communication between the brain and external devices, providing a unique approach to treating conditions like Parkinson's disease and epilepsy.&nbsp;</p><h2 dir="ltr">Multifunctional Bioelectronics</h2><p dir="ltr">Multifunctional bioelectronics aims to combine several functions, such as drug delivery, diagnostics, and therapeutic interventions, into a single device, enhancing their biomedical applications. For instance, silk-based transient bioelectronics, powered by triboelectric nanogenerators (TENGs) enable real-time in vivo monitoring and therapeutic treatments. These systems are self-powered and biodegradable, with adjustable lifespans and sensitivity through silk molecular customization.&nbsp;3&nbsp;These multifunctional devices have the potential to revolutionize personalized medicine by providing more comprehensive health solutions.</p><h2 dir="ltr">Challenges&nbsp;</h2><p dir="ltr">Integrating bioelectronics into healthcare presents significant inherent regulatory and ethical challenges. As bioelectronic devices are advancing, especially those used in the medical industry like pacemakers and neural implants, the impact on users' health means that regulatory and ethical considerations are increasing in importance.</p><p dir="ltr">Ensuring the safety and efficacy of these devices requires rigorous testing and compliance with regulatory standards. Ethical considerations also arise regarding user privacy, data security, and informed consent, especially when sensitive health information is collected and shared. Addressing these challenges is crucial to building public trust and ensuring the responsible use of bioelectronics.</p><p dir="ltr">Moreover, although on-body bioelectronics are beneficial, there are also challenges in developing on-body bioelectronics, particularly regarding power supply, and user comfort. These challenges require innovative solutions, and some solutions, like <a href="https://www.voltera.io/application-whitepapers/printing-magnesium-zinc-battery-saral-inks-pet?utm_campaign=Wevolver&utm_source=wevolver&utm_term=intersection-biology-technology-future-bioelectronics&utm_content=mg-zn-battery-white-paper">flexible batteries</a>, have already made significant differences in tackling some of these challenges.</p><p dir="ltr">Biocompatibility is another key challenge in developing in-body bioelectronics as these devices are placed inside the body; they must be made from compatible materials that do not provoke immune responses and can operate without causing harm to surrounding tissues. Moreover, maintaining the device's functionality over time, despite the harsh environment within the body, which includes exposure to fluids, enzymes, and mechanical stresses, is also a significant challenge.</p><h2 dir="ltr">Opportunities and Emerging Trends: The Future of Bioelectronics</h2><p dir="ltr">Currently, one of the most compelling emerging trends in bioelectronics is the development of smart bioinks. These bioinks have enhanced functionalities, such as responding to environmental changes like temperature, pH, and chemical stimuli. For instance, smart bioinks can be designed to release therapeutic agents in response to specific stimuli, promoting targeted healing and enhancing treatment efficacy.&nbsp;4&nbsp;This adaptability of smart bioinks can lead to future bioelectronic devices that dynamically adjust to the body's needs, further improving their therapeutic potential.</p><h1 dir="ltr">Voltera's Role in Advancing Bioelectronics and Biocompatible Inks</h1><p dir="ltr"><span contenteditable="false" draggable="true" class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable"><iframe src="https://www.youtube.com/embed/zsniZR1if1s?&amp;wmode=opaque&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true" style="width: 640px; height: 460px;" data-gtm-yt-inspected-24="true" id="654705223" title="Printing ECG Electrodes with Gold Ink on Voltera NOVA"><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span></iframe></span><a href="https://www.wevolver.com/profile/voltera">Voltera</a> is a leading provider of advanced materials dispensing solutions for printing bioelectronics prototypes. Voltera's <a href="https://www.voltera.io/nova?utm_campaign=Wevolver&utm_source=wevolver&utm_term=intersection-biology-technology-future-bioelectronics&utm_content=nova-lp">NOVA</a> supports a wide range of materials, allowing researchers to test and experiment with various substrates and conductive inks. This flexibility allows innovation in bioelectronics, offering opportunities for breakthroughs in multifunctional bioelectronics devices. For instance, NOVA enables researchers to print biocompatible inks, such as gold and silver-silver chloride with exceptional precision to facilitate prototyping complex bioelectronics. This advanced system supports the development of traditional rigid electronics, as well as flexible hybrid electronics (flexible, stretchable, and conformable).&nbsp;</p><p dir="ltr">In particular, with a minimum line width of 100 µm and temperature-controlled dispensing, NOVA enables users to dispense biocompatible inks, pastes, gels, and adhesives on stretchable, soft, and flexible substrates, unlocking the ability to print bioelectronics that conform to the body’s natural contours.</p><h2 dir="ltr">Supporting Research and Innovation</h2><p dir="ltr">Researchers worldwide are using Voltera's tools to push the boundaries of bioelectronics. For example, in a 2024 <a href="https://iopscience.iop.org/article/10.1088/2634-4386/ad63c6/meta">study</a>, researchers utilized the Voltera’s NOVA PCB printer to fabricate organic electrochemical transistors (OECTs) as part of their investigation into electrochemical organic neuromorphic devices (ENODes). NOVA was employed to directly print transistors with specific PEDOT formulations onto glass substrates, enabling the precise patterning of silver feedlines and contact pads. The team achieved a compact design with a high degree of control over the devices' channel and gate structures, facilitating the integration of biocompatible gel-electrolytes. This method allowed the study to examine ENODe performance under varied electrolyte conditions, specifically focusing on short- and long-term plasticity for potential applications in brain-chip interfacing.5</p><p dir="ltr">Similarly, in another 2022 <a href="https://doi.org/10.1109/FLEPS53764.2022.9781535">study</a>, researchers utilized Voltera's NOVA to fabricate silver-based tattoo electrodes to monitor bioelectric signals. NOVA enabled precise extrusion printing of high-viscosity silver flake ink on porous tattoo paper, leading to electrodes with lower sheet resistance and better electrical performance compared to inkjet-printed alternatives. This improved efficiency by minimizing ink absorption into the substrate, and reducing impedance in bioelectrical measurements.&nbsp;6</p><p dir="ltr">These researches, along with many others, are a testament to Voltera's commitment to supporting the next generation of bioelectronic innovations. Voltera's products, like NOVA and V-One, ensure that the next generation of devices continues to improve the quality of life for patients worldwide.</p><h1 dir="ltr">Conclusion</h1><p dir="ltr">The importance of bioelectronics is self-evident, as these technologies have immense significance in advancing modern personalized medicine, real-time health monitoring, and patient outcomes, which ultimately have the potential to revolutionize the future of medicine. DIW technology is integral to these advancement as it enables precise prototyping of bioelectronic devices with biocompatible inks in both on-body and in-body applications.&nbsp;</p><p dir="ltr">The projected market growth of bioelectronics is up to $33.6 billion by 2029, which indicates that this field is rapidly advancing and holds immense potential to reshape the future of healthcare.</p><h2 dir="ltr">Explore the future of bioelectronics applications&nbsp;</h2><p dir="ltr">For researchers and engineers looking to explore the next frontier of bioelectronics, Voltera's platforms provide the tools and support necessary to advance the field. <a href="https://www.voltera.io/book-a-meeting?utm_campaign=Wevolver&utm_source=wevolver&utm_term=intersection-biology-technology-future-bioelectronics&utm_content=book-a-meeting">Book a call with Voltera</a> to learn how their technology can contribute to <a href="https://www.voltera.io/applications/bioelectronics?utm_campaign=Wevolver&utm_source=wevolver&utm_term=intersection-biology-technology-future-bioelectronics&utm_content=bioelectronics-application-page">your bioelectronics applications</a>.</p><h1 dir="ltr">References</h1><ol><li dir="ltr"><p dir="ltr">Stavrinidou, E., &amp; Proctor, C. M. (Eds.). (2022). Introduction to Bioelectronics: Materials, Devices, and Applications. AIP Publishing LLC. <a href="https://doi.org/10.1063/9780735424470_001">https://doi.org/10.1063/9780735424470_001</a></p></li><li dir="ltr"><p dir="ltr">Electroceuticals/Bioelectric Medicine Market worth $33.6 billion by 2029. [Online] Markets and Markets. Available at: <a href="https://www.marketsandmarkets.com/PressReleases/electroceutical.asp">https://www.marketsandmarkets.com/PressReleases/electroceutical.asp</a> (Accessed on September 4, 2024)</p></li><li dir="ltr"><p dir="ltr">Zhang, Y., Zhou, Z., Fan, Z., Zhang, S., Zheng, F., Liu, K., ... &amp; Tao, T. H. (2018). Self‐powered multifunctional transient bioelectronics. Small. <a href="https://doi.org/10.1002/smll.201802050">https://doi.org/10.1002/smll.201802050</a></p></li><li dir="ltr"><p dir="ltr">Maan, Z., Masri, N. Z., &amp; Willerth, S. M. (2022). Smart bioinks for the printing of human tissue models. Biomolecules. <a href="https://doi.org/10.3390/biom12010141">https://doi.org/10.3390/biom12010141</a></p></li><li dir="ltr"><p dir="ltr">Rana, D., Kim, C. H., Wang, M., Cicoira, F., &amp; Santoro, F. (2024). Tissue-like interfacing of planar electrochemical organic neuromorphic devices. Neuromorphic Computing and Engineering. <a href="https://iopscience.iop.org/article/10.1088/2634-4386/ad63c6/meta">https://iopscience.iop.org/article/10.1088/2634-4386/ad63c6/meta</a></p></li><li dir="ltr"><p dir="ltr">El-Hajj, Y., Ghalamboran, M., &amp; Grau, G. (2022, July). Inkjet and extrusion printed silver biomedical tattoo electrodes. In 2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) IEEE. <a href="https://doi.org/10.1109/FLEPS53764.2022.9781535">https://doi.org/10.1109/FLEPS53764.2022.9781535</a></p></li><li dir="ltr"><p dir="ltr">Voltera [Online] Wevolver, Available at: <a href="https://www.wevolver.com/profile/voltera">https://www.wevolver.com/profile/voltera</a> (Accessed on September 4, 2024)</p></li><li dir="ltr"><p dir="ltr">NOVA. The future of printed electronics [Online] Voltera, Available at: <a href="https://www.voltera.io/nova">https://www.voltera.io/nova</a> (Accessed on September 4, 2024)</p></li><li dir="ltr"><p dir="ltr">V-One. PCB prototyping made easy [Online] Voltera, Available at: <a href="https://www.voltera.io/v-one">https://www.voltera.io/v-one</a> (Accessed on September 4, 2024)</p></li></ol>

This article explores the role of biocompatible inks in bioelectronics, particularly within Direct Ink Writing (DIW) systems and forecasts future trends and challenges in on-body and in-body bioelectronic technologies over the next decade.

The Intersection of Biology and Technology: Exploring the Future of Bioelectronics

Schematic Drawing - Design of Electronic Circuit Board

In this technical article, we will explore what are schematics, their purpose, diverse types, critical applications and how to read and interpret them effectively.

What Are Schematics: The Blueprint Language of Engineering Decoded

Explore Voltera's innovative project to create a seven-layer magnesium-zinc battery using printable technology. Developed with Saral Designs and employing the NOVA system, the project focuses on building lightweight, flexible, and environmentally friendly batteries on PET substrates.

The Future of Batteries is Flexible: Printing a Magnesium Zinc Battery with Saral Inks on PET

Circuit board being checked by an engineer using a test head connected to the Multimeter

This article will guide you through the fundamentals of how to read a circuit board, decoding key elements, essential symbols and markings, exploring techniques for tracing circuits, and examining advanced analysis methods.

How to Read a Circuit Board: Mastering the Language of Electronics

Green Printed Circuit Board - Raspberry Pi

This article delves into the history and science behind the green color of circuit boards, shedding light on the reasons and advantages that have kept it at the forefront of electronics manufacturing.

Why Are Circuit Boards Green? Unraveling the Mystery Behind the Iconic Color

<p>If you are familiar with solder paste, you know how it can make for messy work — applying it to a stencil, solder paste getting all mixed up with your circuits — it can end up being more trouble than it’s worth. This is a problem we have solved with our printers, <a href="https://www.voltera.io/v-one" target="_blank">V-One</a> and <a href="https://www.voltera.io/nova" target="_blank">NOVA</a>, which use direct-write printing technology to dispense solder paste exactly where you need it — and nowhere else. If this is somewhat of a new concept and material, our hope is by the end of this blog, it won’t be.</p><p>So, what exactly is solder paste? Great question — we can’t wait to tell you!</p><h2>What is solder paste?</h2><p>Solder paste is a sticky, non-Newtonian fluid composed of flux and a metal alloy. It’s used in the manufacturing of printed circuit boards (PCBs) to hold components in place, just like regular solder wire would. Once applied to the circuit and all dressed up with its needed components, the board is then heated to melt the paste and form a mechanical bond as well as an electrical connection in a process known as reflow.</p><p>But let’s not get ahead of ourselves. How does one choose a solder paste? Let’s break it down. Any solder paste is made up of two main components — the powdered solder and flux.</p><h3>Solder</h3><p>Powdered solder is a fusible metal alloy. Under a microscope it appears to be a smooth cluster of tiny metal balls — which is exactly what it is! These metal particles can range in size from T1 to T8. They are rated on a scale where the lowest number of powder type (T1) corresponds with the largest powder size in microns.</p><p>Size is important to keep in mind, because you’ll need to adjust what nozzle you use based on the type of solder paste in order to avoid clogging. A good rule of thumb is to use an aperture six times larger than the particle size of the solder paste you are using. Not following this rule and using a 150 micron nozzle with a T4 paste would result in clogging. Clog city is a destination no one wants to arrive to when the goal is clean and smooth circuits done simply. Even though the powdered metal alloy makes up most of the solder paste, they are all suspended in the second component of solder paste, flux.</p><h3>Flux</h3><p>Flux is a chemical cleaning agent, flowing agent, or purifying agent. In traditional soldering, it is directly applied to the soldering iron to help with the wetting process when combining with soldering wire. The wetting process is the crucial part of soldering — it’s when the metal in the solder bonds with the metal on the PCB or component. The solder then becomes a molten fluid and can adhere to the component for an optimal solder joint. I think we all know that if we want any kind of solder joint it’s an optimal one.</p><p>Typically flux is a separate substance from the solder itself but just like an efficient 2-in-1 shampoo and body wash, solder paste combines flux with powdered solder. When combined, the flux operates as a carrier for the metal and also protects the particles from oxidizing — which will lead to issues like solderability loss and graping. Just like with traditional flux, it’s main benefit is the ability to help with the wetting process. Flux comes in different varieties that are broken down by type, activity and halide content.</p><p><strong>Type</strong>: Refers to the main vehicle that facilitates the heat transfer while also offering protection from oxidation to the hot metal surface by acting as an oxygen barrier — rosin ( RO), resin (RE), organic (OR), and inorganic (IN)</p><p><strong>Activity</strong>: Refers to the ability to dissolve existing oxides on the metal surface and promote wetting. The activity level is scaled by indicating L: low, M: moderate, or H: high.</p><p><strong>Halide Content</strong>: Refers to the halogen (usually chlorine or bromine) present in the solder paste which functions to remove oxidation and boost the wetting properties of your solder paste. Halide content is split into two different categories:</p><h2>Voltera’s solder paste</h2><table style="width: 100%;"><tbody><tr><td style="width: 100%;"><h3><strong id="isPasted">FUN TIP</strong>: At Voltera, we use a REL0 tack flux, that is made of resin (RE) with a low activity (L) and a halide content with a weight less than 0.05% (0).</h3>After extensive comprehensive testing and experimenting trying to find what worked best with conductive ink, this was what worked. There’s a lot of guesswork that goes hand in hand with solder in regards to how the composition will influence performance, where even small changes in alloy composition can impact compatibility. It’s crucial to test what works best. We did the work using our engineering minds and scientific perspectives to do that work for you on what works best with our silver conductive ink on the V-One so you don’t have to.</td></tr></tbody></table><p>It’s important to know which solder paste works best for the project you’re working on and the corresponding tools needed to complete the job. Here at Voltera, our <a href="https://store.voltera.io/collections/materials?filter.p.m.custom.product_type=Solder+Paste" target="_blank">solder paste</a> features the trio of tin, bismuth, and silver. This is important, because the common metal used in soldering wire, traditional solders, and in the HASL finish on prefabricated boards likely contain lead. Why is this crucial to note? Well, bismuth and lead are not friends — they will argue and ruin your party. If you switch printing methods or materials without keeping this in mind and thoroughly cleaning your iron in between, you could have a real bad time. But you wouldn’t need to worry about that as much if you’re using the V-One. Just sayin’. The reason why we use a tin-bismuth-silver solder paste is that it melts at low temperatures — ~140°C —and because it has a small quantity of silver already mixed in. Both of these factors help it create a strong bond with the silver in the conductive ink in your traces as opposed to dissolving them like a tin-lead solder paste would. When it comes to the V-one and its printed boards, a solder paste with thicker flux works best, too — which is exactly how our solder paste is made.</p><h2>How to properly maintain it</h2><p>There are a couple maintenance things to consider, such as: Don’t force it! If you can’t get anything to come out of the nozzle and you apply force, it’ll most likely rupture the cartridge.</p><p>The simple solution?</p><p>Swap out the nozzle and purge it if the paste isn’t flowing smoothly. Also, make sure to check your cartridge for flux leakage around the piston.</p><p>A little is alright but when in doubt, throw it out. You also want to keep in mind that if the flux dries up or the paste separates it goes from solder paste to solder waste. A dry paste is one with less tack. The tack component of our flux is important because liquid flux can spread everywhere and not transfer heat well, while tack flux holds its shape until you heat it. When you lose tack, you lose solder paste’s ability to maintain its stickiness over time. So, always make sure to properly store it and do not leave it sitting more than two hours before reflowing.</p><p>Now that you have a better understanding of what solder paste is, what it’s made of, and how we use it here at Voltera, we encourage you to give it a go. Solder paste is just one way we can print anything on everything — with the <a href="https://www.voltera.io/v-one" target="_blank">V-One</a>.</p><p>Have you checked out our <a href="https://www.youtube.com/watch?v=UKiR9WMrUaU" target="_blank">YouTube video</a> about solder paste? You really should. Mike, our support-hero-turned-content-creator has some excellent tips on working with solder paste and your V-One!&nbsp;</p><p id="isPasted">Visit Voltera's&nbsp;<a href="https://www.voltera.io/" target="_blank" rel="nofollow" id="isPasted">website</a> to learn more about their cutting-edge solutions for solder paste dispensing. If you're ready to discuss how Voltera's advanced solder paste solutions can enhance your electronics development, you can book a meeting directly with the team:</p><p><a href="https://meetings.hubspot.com/royperez/v-one-or-nova-demo?utm_campaign=Wevolver&utm_source=Wevolver&utm_medium=Book%20a%20meeting" target="_blank" rel="nofollow" class="button-main-action">Get in touch with the team</a></p>

Discover how flux and solder merge to form solder paste, a vital ingredient in the reliability of electronics.

Flux Meets Solder: The Chemistry Behind Solder Paste's Role in PCB Assembly

<h3 dir="ltr">The Importance of Prototyping in PCB Development</h3><p dir="ltr">Prototyping is a crucial step to test and validate design before mass production. In the context of PCBs, prototyping helps identify issues in the board layout such as incorrect trace connections, and checks if the design can carry out its primary functions.</p><h3 dir="ltr">The Challenges of Traditional PCB Prototyping</h3><p dir="ltr">For years, traditional PCB prototyping methods played a key role in electronics development. However, these methods come with its fair share of challenges that hinder efficiency, cost-effectiveness, and speed.<br><br>For many small and mid-size businesses, especially startups, setting up traditional PCB prototyping equipment can be prohibitively expensive. Outsourcing to third-party manufacturers is another option, but it comes with its own set of challenges. Coordinating with external suppliers can result in long lead times and additional costs considering each design iteration requires programming their machines with your updated design files. On top of that, suppliers usually impose minimum order quantities, which means you could end up paying for more boards than you need.</p><h3 dir="ltr">A New Approach to Rapid PCB Prototyping</h3><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI1OTgwMTk3NTc3LWxhcmdlVm9uZS5qcGVnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: Voltera V-One desktop PCB printer (Source:&nbsp;<a href="https://www.voltera.io/v-one?utm_campaign=Wevolver&utm_source=Blog&utm_content=V-One" target="_blank" rel="noopener noreferrer">Voltera</a>)</span></span></span>In today’s competitive market, getting your product to market quickly is crucial. That’s why rapid prototyping techniques are needed to stay ahead of the competition. The <a href="https://www.voltera.io/v-one?utm_campaign=Wevolver&utm_source=Blog&utm_content=V-One" target="_blank">Voltera V-One</a> desktop PCB printer is a game-changer in this space. It’s compact, cost-effective, and speeds up your product development process. In this article, we’ll dive into the V-One’s features and show you how to make the most of its capabilities so you can hit the ground running with this innovative tool.</p><h1 dir="ltr">What is the Voltera V-One?</h1><p dir="ltr">If you’re not familiar with PCB printers, picture them as similar to 3D printers, but instead of creating physical objects, they print intricate circuit patterns onto boards. Just as a 3D printer builds up layers of material to create a three-dimensional object, a PCB printer lays down conductive ink or other materials layer by layer to form the electrical pathways on a circuit board.</p><h3 dir="ltr">Why Choose the V-One for Prototyping?</h3><p dir="ltr">The V-One offers massive advantages over traditional prototyping processes by integrating PCB printing, drilling, and solder paste dispensing into a single system. This combination cuts iteration time from days and weeks to mere hours, allowing you to identify design errors early and reduce time to market.</p><p dir="ltr">The device supports an aligned printing feature, which comes in handy for printing on substrates with pre-existing features. This means you can print on popular development boards like Arduino and Raspberry Pi to create useful add-ons. It’s also perfect for creating double-sided PCBs without any hassle.</p><p dir="ltr">The V-One is a plug-and-play machine with user-friendly software. It is powerful enough to be trusted by experts at NASA, yet straightforward enough for a student to quickly learn. Whether you’re a seasoned engineer or just starting out, the V-One is designed for all skill levels.</p><p dir="ltr">Prototyping your PCBs in-house has the added perk of keeping your intellectual property safe. When you outsource PCB prototyping, there’s a chance of exposing your designs to unauthorized use, especially if you’re working with suppliers in areas where IP protection isn’t as strong.</p><h1 dir="ltr" id="isPasted">Double-Sided PCB Prototyping with the Voltera V-One</h1><p dir="ltr">In this tutorial, we’ll walk through the process of creating a double-sided PCB using the Voltera V-One, using a punk console as our example.</p><p dir="ltr"><strong>Step 1: Prepare and Upload Your Gerber File</strong></p><p dir="ltr">You can design your PCB layout using a variety of computer-aided design (CAD) software. The next step is to export your designs in Gerber files. Depending on your software of choice, Voltera offers a detailed Gerber export guide for KiCad, OrCAD, EAGLE, and Altium. Open the V-One software and upload your Gerber file. The software will automatically calculate the tool paths required for your design.</p><p dir="ltr"><strong>Step 2: Set Up the Printing Surface</strong></p><p dir="ltr">Since we’ll be drilling to make a double-sided board, place a sacrificial layer underneath the PCB to protect the bed from any potential damage. Secure the board and sacrificial layer in place by clamping them down onto the printer's bed.</p><p dir="ltr"><strong>Step 3: Surface Mapping</strong></p><p dir="ltr">Attach the proximity probe to the V-One. The software will map the board in XYZ space, preparing it for accurate drilling and trace printing.</p><p dir="ltr"><strong>Step 4: Drilling</strong></p><p dir="ltr">Replace the proximity probe with the drill head. Begin by drilling small holes for vias. Next, drill larger holes for through-hole components. The software will prompt you to change the drill bit as needed.</p><p dir="ltr"><strong>Step 5: Print Traces on the Top Side</strong></p><p dir="ltr">After drilling, clean off any debris from the board’s surface to ensure smooth printing. Swap out the drill head for the dispenser, and allow it to calibrate. Start printing the conductive traces on the top layer. If you notice any mistakes, the V-One offers a selective printing option that allows you to fix specific areas.</p><p dir="ltr"><strong>Step 6: Curing the Top Side</strong></p><p dir="ltr">After printing, remove the sacrificial layer. Flip the board over and rest it on the baking ledges of the clamps. The curing process takes about 40 minutes. Let the board cool down afterward.</p><p dir="ltr"><strong>Step 7: Print Traces on the Bottom Side</strong></p><p dir="ltr">Once the top side has cured, flip the board over to prepare for the bottom side printing. Use the aligned print option in the software, utilizing drilled holes to ensure the top and bottom sides are perfectly aligned.</p><p dir="ltr">Begin printing the conductive traces on the bottom side. Cure it using the same procedure as explained in step 6.</p><p dir="ltr"><strong>Step 8: Add Rivets to Connect Sides</strong></p><p dir="ltr">After both sides are printed, use rivets to connect the top and bottom sides at the drilled holes, ensuring proper electrical connectivity between the sides.</p><p dir="ltr"><strong>Step 9: Dispense Solder Paste</strong></p><p dir="ltr">Clamp the board back onto the printer, snap in the proximity probe, and remap the board to ensure accuracy. Replace the probe with the dispenser, this time with a cartridge of solder paste installed, rather than conductive ink. Dispense solder paste onto the designated pads for precise application.</p><p dir="ltr"><strong>Step 10: Reflow and Solder Components</strong></p><p dir="ltr">Place your components on the board and use the heated bed to reflow all surface-mount components in a single step. For through-hole components, use a soldering gun and solder wire to manually solder them in place.</p><h2 dir="ltr">Case Study: Creating a Wearable Device for Robotic Hand Control</h2><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI1OTgwMzI5NzY3LXZvbHRlcmFfYXJ0MS5qcGVnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Image: Printed Strain Gauges on TPU laminated on a Glove for Remote Hand Control (Source:&nbsp;<a href="https://www.voltera.io/application-whitepapers/printing-strain-gauges-tpu-laminated-glove-remote-hand-control" target="_blank" rel="noopener noreferrer">Voltera</a>)</span></span></span></p><p dir="ltr" id="isPasted">Read how Voltera’s V-One PCB printer and NOVA materials dispensing system enabled a second-year undergrad studying Mechatronics, Robotics, and Automation Engineering at the University of Waterloo to design and build a fully functional robotic hand that mimics the movements of an operator wearing a control glove – in just two months.&nbsp;</p><p dir="ltr"><a href="https://www.voltera.io/application-whitepapers/printing-strain-gauges-tpu-laminated-glove-remote-hand-control" target="_blank">Printing Strain Gauges on TPU laminated on a Glove for Remote Hand Control</a></p><h2 dir="ltr" id="isPasted">Industries and applications where the V-One has made a significant impact</h2><p dir="ltr">Voltera V-One has been making significant contributions across various industries, showcasing its impact on research and development projects.</p><h3 dir="ltr">Advancing Solar Technology</h3><p dir="ltr">Researchers at The University of Akron used the V-One PCB printer to prototype modular solar (photovoltaic) shingles. Their goal was to create a more efficient manufacturing process using 3D printing and automated circuitry. By leveraging the V-One, they aimed to reduce both the cost and time required compared to traditional manufacturing methods. This innovative approach has the potential to make solar technology more accessible.</p><h3 dir="ltr">Eco-Friendly Supercapacitors</h3><p dir="ltr">At Tampere University, researchers utilized the V-One alongside additive manufacturing techniques to develop a functional supercapacitor. What sets this project apart is its focus on sustainability. The entire process used only environmentally safe and biodegradable materials. This achievement demonstrates the V-One's ability to drive green technology initiatives.</p><h3 dir="ltr">Aerospace Innovations with CubeSats</h3><p dir="ltr">The aerospace industry has also benefited from the V-One's capabilities. At Princeton University, the V-One was instrumental in <a href="https://www.voltera.io/customer-stories/princeton-university?utm_campaign=Wevolver&utm_source=Wevolver&utm_content=Princeton%20Customer%20Story" target="_blank">building CubeSats</a>—small, cube-shaped satellites used for space research. These miniature satellites are essential for studying various aspects of space and planetary science. The V-One’s ability to quickly produce PCBs helped streamline the development process, enabling Princeton’s research students to focus on innovation and experimentation.</p><p dir="ltr">These partnerships not only showcase V-One's adaptability but also underscore its potential to accelerate research and development in advanced technological fields.</p><h1 dir="ltr" id="isPasted">Future-Proofing Your Prototyping Process</h1><h3 dir="ltr">How the V-One can be integrated into a larger prototyping workflow</h3><p dir="ltr">Incorporating the Voltera V-One PCB printer into a broader prototyping workflow can accelerate your product development process. By pairing the V-One with other prototyping tools like 3D printers, you can design and create PCBs along with enclosures or other mechanical parts in-house. This integrated approach not only saves time but also allows for rapid iteration and refinement of designs.</p><h1 dir="ltr">Conclusion</h1><p dir="ltr">The V-One speeds up the prototyping process significantly. With its ability to quickly print PCBs, drill vias, and dispense solder paste, you can iterate on designs in hours rather than days or weeks. By handling PCB prototyping in-house, the V-One cuts out costly third-party manufacturing and logistics expenses. It also helps protect your designs and intellectual property. Plus, its plug-and-play setup makes it easy to use and shortens the learning curve.</p><p>Curious to see how the V-One can fit into your workflow? Book a call with the team at Voltera to explore how this innovative tool can meet your prototyping needs.</p><p><a href="https://meetings.hubspot.com/royperez/v-one-or-nova-demo?utm_campaign=Wevolver&utm_source=Wevolver&utm_medium=Book%20a%20meeting" target="_blank" rel="noopener noreferrer" class="button-main-action">Get in touch with the team</a></p>

Everything You Need to Know About Prototyping with the Voltera V-One: A Focus on Double-Sided PCBs

A Complete Guide to Prototyping Double-Sided PCBs in One Day

Explore key methods like Direct Ink Writing, screen printing, and jet dispensing, and learn how Voltera’s V-One and NOVA are transforming the solder paste application process for improved accuracy and efficiency.

Cutting-Edge Methods of Solder Paste Application for Electronics Manufacturing

Understanding the complexities and differences between the IPC Class 2 vs Class 3 electronics manufacturing standards to help engineers choose the right options for their commercial and research-based applications. 

IPC Class 2 vs Class 3: Understanding the Critical Differences in Electronics Manufacturing Standards

<p data-pm-slice="1 1 []" id="isPasted">Author: &nbsp;Mr. Naveen Balla, <a href="mailto:info@hamamatsu.de" rel=" noopener" target="_blank" data-hook="WebLink"><u>info@hamamatsu.de</u></a></p><p id="isPasted">The production of printed electronics represents a transformative approach to manufacturing electronic devices. Switching from complex technologies like etching or lithography to a printing process significantly simplifies production, offering a cost-effective, versatile, and straightforward pathway to fabricating electronic components on various substrates. As a result, printed electronics are used in a wide range of devices, including flexible displays, thin-film transistors, sensors, and photovoltaic cells.</p><p>While already common in various industries, production equipment for printed electronics still has room for improvement to optimize manufacturing efficiency. One important aspect of this optimization, especially when using metal nanoparticle inks, is the sintering process. The sintering step includes fusing the metal nanoparticles in ink ensuring the required low resistivity of the finished circuits. For this task, heating ovens, NIR emitters, and broadband flash lamps are established technologies, but they suffer from drawbacks that limit the speed or efficiency of production.</p><p>In this article, we present five aspects of printing equipment that can be improved by switching to laser sintering.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1723630490891-Screenshot+2024-08-14+103530.png" style="width: 100%px;" class="fr-fic fr-dib"></p><figure data-id="a40d2fcd-0356-4948-96f1-48a3495831b9" id="isPasted"><figcaption>Table 1: Comparison of different sintering methods</figcaption></figure><hr><h2>We are exhibiting!</h2><p><a rel="noopener noreferrer" href="https://www.techblick.com/electronicsreshaped" target="_blank">Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024.</a> Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, &nbsp;Wearable, Structural, and 3D.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIyNjA5NzQ0NDUzLUhhbWFtYXRzdS1Cb290aC1CZXJsaW4yMDI0LmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib"></p><h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1723630520058-Screenshot+2024-08-14+103712.png" style="width: 100%px;" class="fr-fic fr-dib"></h3><h3 id="isPasted">1. Reducing the footprint of the printing machine</h3><p id="isPasted">Furnaces for sintering printed electronics can be large, particularly for serial production. As the sintering process in the oven takes a few to tens of minutes, it typically does not match the production rate of the preceding printing process. To maintain high production rates, more furnaces or long conveyors are required, resulting in a large machine footprint.</p><p>Laser sintering offers a solution for developing more compact machines. Since the sintering process using NIR laser takes only milliseconds, it can be performed on the conveyor directly after printing, making roll-to-roll processes possible. For machines with limited space, laser sintering provides even more flexibility. As the laser light is coupled into a fibre, it can be flexibly guided over longer distances, allowing separation of the light output from the laser source and its electronics. This minimizes the space required at the light output, enabling smaller sintering machines for confined production areas.</p><p data-placeholder="Write here. You can also include @mentions."><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1723630540435-Screenshot+2024-08-14+104251.png" style="width: 430px;" class="fr-fic fr-dib"></p><p>Laser sintering is the process where laser is used to heat metal nano/ micro particles to the point that they fuse without completely melting.</p><h3>2. Increase production speed.</h3><p>Switching from a furnace-based sintering process to laser sintering reduces space requirements and helps increase production speed. While the sintering process in a hot air oven takes a few to tens of minutes, NIR laser light sinters the metal ink within milliseconds. This allows high printing speeds and ensures that the sintering step is no longer the production bottleneck. Laser sintering significantly enhances production speed due to the easily scalable laser power, which maintains precise focus with line optics. Depending on the ink and substrate, laser technology allows for speeds of several hundred millimeters per second in roll-to-roll production, substantially increasing output rates.</p><p data-placeholder="Write here. You can also include @mentions."><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1723630595820-Image-1.jpg" style="width: 600px;" class="fr-fic fr-dib"></p><p data-placeholder="Write here. You can also include @mentions.">Example of Hamamatsu's SPOLD® laser sintering of conductive inks.</p><h3>3. Optimizing energy efficiency</h3><p id="isPasted">Energy efficiency is now one of the most important aspects of any production process. Minimizing energy consumption is essential to meet sustainability goals and to reduce production costs, given rising energy prices.</p><p>The production of printed electronics involves many energy-intensive processes. One example is the sintering step, which requires intense heating to achieve the desired conductivity of the ink, often exceeding 100°C, depending on the nanoparticles. It is an energy-intensive process with significant production costs. Large ovens, commonly used for this process, must heat both the part and the air inside the oven to the target temperature, consuming substantial amounts of power, often 60kW or more. Alternative sintering technologies, such as photonic sintering, also demand considerable power. For instance, flash lamps used during a roll-to-roll process require 5kW of electrical power or more.</p><p>Laser sintering offers a more energy-efficient solution, due to its high conversion efficiency from electrical power to light power and excellent conversion rate. Typical laser sources for laser sintering, such as the <a rel="noopener noreferrer" href="https://www.hamamatsu.com/eu/en/product/lasers/applied-products-of-semiconductor-lasers.html" target="_blank">Hamamatsu SPOLD® [1,2]</a> consume around 1kW, while still enabling fast roll-to-roll production. This improved efficiency can significantly reduce production costs over the lifetime of a production machine.</p><p data-placeholder="Write here. You can also include @mentions."><br></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1723630641370-Screenshot+2024-08-14+104810.png" style="width: 100%px;" class="fr-fic fr-dib"></p><figure data-id="4853d99d-1f37-4121-bfd8-0f8654721f23" id="isPasted"><figcaption>Table 2: Comparison of different sintering temperatures for different nanoparticle inks on glass substrates.[3]</figcaption></figure><hr><h3>We are speaking!</h3><p><a rel="noopener noreferrer" href="https://www.techblick.com/electronicsreshaped" target="_blank">Join us at the flagship TechBlick event in Berlin on 23-24 October 2024.</a> Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, &nbsp;Wearable, Structural, and 3D.&nbsp;</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIyNjA5ODE3MTE2LUhhbWFtYXRzdSBQaG90b25pY3MtU3BlYWtlciBDYXJkcyAoQkVSTElOLU9jdC0yMDI0KS5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib"></p><h3 id="isPasted">4. Enabling the use of thermo-sensitive materials</h3><p id="isPasted">One of the significant advantages of printed electronics is the versatility of substrates, enabling electronics to be integrated into various materials like packaging or clothing. However, high sintering temperatures, typically around 200°C for materials like silver nanoparticles, limit the substrates that can be used. For instance, plastics such as polyethylene (PE) begin to soften at temperatures above 70°C, making it impractical to sinter them in furnaces operating at 200°C or higher.</p><p>Laser sintering provides the solution. As ink and substrates have different absorption properties, it is possible to select a wavelength where the light is only absorbed in the ink while the substrate remains transparent. As a result, only the ink is heated to the required sintering temperature while the substrate remains unaffected. This allows thermo-sensitive materials, such as plastic foils, to be used, which is advantageous for the packaging industry.</p><p>However, heat dissipation from the ink into the substrate can still indirectly heat and damage it. Therefore, it is essential to tailor the heating illumination to the properties of the materials. Laser sintering has many advantages over photonic sintering using flash lamps as the optimum wavelengths can be chosen depending on the application. The Hamamatsu SPOLD®, for example, is available at 940nm (optional 808nm), minimizing substrate heating compared to the broader spectrum of tungsten lamps.</p><p>The laser also offers more precise control of power compared to flash lamps, allowing fine adjustment to stay below the melting temperature of the substrate. This precise control further reduces potential substrate damage, crucial when printing on highly thermo-sensitive materials like PET.</p><p data-placeholder="Write here. You can also include @mentions."><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1723630676979-Screenshot+2024-08-14+104943.png" style="width: 100%px;" class="fr-fic fr-dib"></p><p data-placeholder="Write here. You can also include @mentions.">Hamamatsu's LD irradiation light source (SPOLD®)</p><h3>5. Reducing ink costs</h3><p id="isPasted">In addition to the flexibility of substrates, one of the significant advantages of printed electronics is the low production cost. Laser sintering can further reduce costs by switching to less expensive inks. Due to the silver nanoparticles dissolved in the ink, it becomes quite an expensive consumable. Indeed, cheaper alternatives, like copper or aluminium offer similar conductivity values but require different sintering parameters to find the optimum conductivity, strength, and adhesion results.</p><p>For this optimization, the flexibility of laser sintering is beneficial. Hamamatsu collaborates with several ink manufacturers worldwide to support manufacturers when switching ink materials. Together, they test several micro and nano ink formulations to find their optimum sintering parameters, giving customers a head start when switching to cheaper inks.</p><p data-placeholder="Write here. You can also include @mentions."><br></p><h3>Laser Sintering increases productivity</h3><p id="isPasted">Switching to laser sintering can significantly impact the productivity of printed electronics production. The laser adds the necessary flexibility to your process and enables the optimization of important parameters like resistivity, density, and adhesion by choosing the optimum ink type, laser power, or conveyor belt speed. Application tests are essential to maximize this increase in productivity. Hamamatsu Photonics supports customers with dedicated application engineers who conduct sintering tests to identify the optimum set of parameters. This simplifies the transition to new laser sintering technology and ensures customers get the most out of their printed electronics production.</p><p>For more information on our SPOLD® device or on this topic, please contact: <a rel="noopener noreferrer" href="mailto:info@hamamatsu.de" target="_blank">info@hamamatsu.de</a></p><hr><h3 id="isPasted">References</h3><p>[1] Hamamatsu Photonics, LD irradiation light sources (SPOLD®): <a rel="noopener noreferrer" href="http://www.hamamatsu.com/eu/en/product/lasers/applied-products-of-semiconductor-lasers" target="_blank">www.hamamatsu.com/eu/en/product/lasers/applied-products-of-semiconductor-lasers</a></p><p><a rel="noopener noreferrer" href="https://www.hamamatsu.com/eu/en/product/lasers/applied-products-of-semiconductor-lasers.html" target="_blank">[2] Hamamatsu Photonics, "Weld, Solder, Cure or Sinter with SPOLD®":</a>&nbsp; <a rel="noopener noreferrer" href="http://www.youtube.com/watch?v=I0sLZBR9u_I" target="_blank">www.youtube.com/watch?v=I0sLZBR9u_I</a></p><p>[3] A Review on Printed Electronics, 2021: Fabrication Methods, Inks, Substrates, Applications and Environmental Impacts: <a rel="noopener noreferrer" href="http://doi.org/10.3390/jmmp5030089" target="_blank">doi.org/10.3390/jmmp5030089</a></p><hr><h2 data-pm-slice="1 1 []" id="isPasted"><a href="https://www.techblick.com/electronicsreshaped" rel="noreferrer noopener" target="_blank" data-hook="WebLink"><u>Join us at the flagship TechBlick event in Berlin on 23-24 October 2024.</u></a></h2><h3 data-pm-slice="1 1 []"><span data-hook="FOREGROUND_COLOR">Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, &nbsp;Wearable, Structural, and 3D.</span></h3><p data-pm-slice="1 1 []"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIyNjA5OTM4Nzk3LUJlcmxpbiAyMDI0LUxPR08tU3BlYWtlcnMtRXhoaWJpdG9ycy5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib"></p><h2>Save the Date! The Future of Electronics RESHAPED 2025</h2><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIyNjEwMDA3MTY0LVNlZS15b3UtbmV4dC15ZWFyICgxOTIweDEwODApLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib"></p><p id="isPasted">The production of printed electronics represents a transformative approach to manufacturing electronic devices. Switching from complex technologies like etching or lithography to a printing process significantly simplifies production, offering a cost-effective, versatile, and straightforward pathway to fabricating electronic components on various substrates. As a result, printed electronics are used in a wide range of devices, including flexible displays, thin-film transistors, sensors, and photovoltaic cells.</p><p>While already common in various industries, production equipment for printed electronics still has room for improvement to optimize manufacturing efficiency. One important aspect of this optimization, especially when using metal nanoparticle inks, is the sintering process. The sintering step includes fusing the metal nanoparticles in ink ensuring the required low resistivity of the finished circuits. For this task, heating ovens, NIR emitters, and broadband flash lamps are established technologies, but they suffer from drawbacks that limit the speed or efficiency of production.</p><p>In this article, we present five aspects of printing equipment that can be improved by switching to laser sintering.</p>

The production of printed electronics represents a transformative approach to manufacturing electronic devices. But it is difficult and time and space consuming to sinter/cure printed electronics using conventional methods. Learn how laser sintering helps, saving time, energy, equipment space, etc?

Optimize printed electronics manufacturing with laser sintering

<p>Dr. Lena Reinke |&nbsp;<a target="_blank" href="mailto:lena.reinke@panacol.de" rel="noopener" data-hook="WebLink" id="isPasted"><u>lena.reinke@panacol.de</u></a></p><p id="isPasted">Perovskite-based (PSC) and organic photovoltaic (OPV) cells represent a promising frontier in renewable energy generation technologies due to their potential for lightweight, flexible and potentially cost-effective solar power generation. However one of the critical challenges in the commercialization and long-term reliability of OPV cells is their encapsulation. Effective encapsulation protects the delicate photoactive materials from environmental factors such as moisture, oxygen and mechanical stress. Adhesives play a crucial role in this encapsulation process, offering not only mechanical stability but also environmental protection. This article focuses on the various types of adhesives used in the encapsulation of OPV or PSC cells.</p><div contenteditable="false"><hr></div><h3>We are exhibiting!</h3><p><a rel="noopener noreferrer" href="https://www.techblick.com/electronicsreshaped" target="_blank">Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024.</a> Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, &nbsp;Wearable, Structural, and 3D.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIyNjAxNTYyMTIzLVBhbmFjb2wtRWxvc29sLUJvb3RoKEJlcmxpbjIwMjQpLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib"></p><h3 id="isPasted">Encapsulation adhesives for OPV or PSC cells must meet several stringent criteria:</h3><ol><li><p><strong>Moisture and Oxygen Barrier:&nbsp;</strong>As the active materials are sensitive towards humidity and/or oxygen, the adhesive should therefore provide good barrier properties to prevent a degradation caused by moisture or oxygen ingress. The adhesive barrier properties can be tuned using to different strategies. One can either use quite hydrophobic raw materials to chemically prevent the ingress of water molecules or the cross-linking properties of some multifunctional components can build up a dense polymer network after curing so that the water ingress is blocked mechanically.</p></li><li><p><strong>UV stability:</strong> The adhesive should also withstand prolonged exposure to sunlight without turning yellowish or getting brittle. This is especially important for PV applications that will be used outside.</p></li><li><p><strong>Adhesion strength:</strong> It is important to ensure the mechanical integrity of the devices. Therefore, the adhesive needs to firmly bond the encapsulant material to the PV cell layers. Within initial tests, we check the adhesive performance by conducting T-Peel tests. Often it is very helpful to use a pretreatment technology such as corona or plasma to ensure sufficient surface energy and thus an enhanced T-Peel strength.</p></li><li><p><strong>Compatibility:</strong> While sufficient adhesion strength is crucial, we also need to address the compatibility between the adhesive and the active layers. While an effective binding towards plastic substrates can often be provided by using monomeric raw materials, those can be quite harmful for the sensitive photoactive materials especially if a pronounced polarity is present. To overcome this issue, chemists need to balance out the ratio between oligomeric and monomeric compounds.</p></li></ol><hr><p><strong>We are speaking!</strong></p><p><a rel="noopener noreferrer" href="https://www.techblick.com/electronicsreshaped" target="_blank">Join us at the flagship TechBlick event in Berlin on 23-24 October 2024.</a> Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, &nbsp;Wearable, Structural, and 3D.&nbsp;</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIyNjAxNjEzMjEwLVBhbmFjb2wtU3BlYWtlciBDYXJkcyAoQkVSTElOLU9jdC0yMDI0KS5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib"></p><p id="isPasted">For the encapsulation process, there are several types of adhesives that can be interesting. Epoxy-based formulations are widely used as they typically bring chemical resistance and thermal stability. This is due to the durable bonds that are formed during the polymerization process and accompanied by significantly improved barrier properties.</p><p>Acrylic-type adhesives are also commonly used, especially if it comes to more challenging substrates as for example PET. Here, the required flexibility can be achieved more easily as for the usually more rigid epoxies. An additional advantage for acrylic-based adhesives is the typically faster polymerization. As time often is a critical criteria the curing speed should always be taken into consideration. In Table 1 a qualitative comparison between the two adhesive groups is listed.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIyNjAxNjM1MTA3LVRhYmxlIDEgLSBRdWFsaXRhdGl2ZSBjb21wYXJpc29uIG9mIHRoZSBtYWluIGZlYXR1cmVzIG9mIGVwb3h5LSBhbmQgYWNyeWxhdGUtYmFzZWQgYWRoZXNpdmVzLi5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib"></p><p>Table 1 &nbsp; &nbsp;Qualitative comparison of the main features of epoxy- and acrylate-based adhesives.</p><p id="isPasted">It is obvious that for both adhesive types there are advantages and drawbacks. This is caused by the adhesive’s properties influencing each other. The best example is that the barrier properties of a flexible acrylate-based adhesive are often worse in comparison to a highly crosslinked material. On the other hand, the flexibility of an adhesive also strongly influences the adhesion properties on flexible substrates positively. Therefore, it is required to balance out the adhesive’s flexibility and barrier properties.</p><p>Another interesting binding task for adhesives is the contacting of the PV cells. To address this topic, it is possible to use electrically conductive adhesives. Those adhesives typically have the drawback that a deep frozen storage and delivery is required as the metal particles tend to settle down. As the particles block UV light, a photoinduced curing is also not possible often resulting in a slow curing speed and high temperatures that are required for curing. With Elecolit 3648, Panacol has developed an adhesive that can be cured under relatively mild conditions (see table 2). The comparatively low viscosity of about 10.000 – 15.000 mPas (at shear rate 10, 25 °C) allows it to be dispensed easily.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIyNjAxNjc1OTg2LVRhYmxlIDIgLSBQb3NzaWJsZSBjdXJpbmcgcGFyYW1ldGVycyBmb3IgRWxlY29saXQgMzY0OC4ucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib"></p><p>Table 2 &nbsp; &nbsp;Possible curing parameters for Elecolit 3648.</p><p><br></p><p id="isPasted">The previously mentioned adhesive properties are complemented by the adhesives' impressive flexibility which allows Elecolit 3648 to be used within flexible PV devices.</p><p data-placeholder="Write here. You can also include @mentions."><br></p><h3>Join us at the flagship <a href="https://www.techblick.com/electronicsreshaped" target="_blank" rel="noopener noreferrer">TechBlick event in Berlin on 23-24 October 2024.</a></h3><p>Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, &nbsp;Wearable, Structural, and 3D.&nbsp;</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIyNjAxNzQwODgyLUJlcmxpbiAyMDI0LUFnZW5kYS5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib"></p><h3 id="isPasted">Save the Date!<br><a href="https://www.techblick.com/" target="_blank" rel="noopener noreferrer">The Future of Electronics RESHAPED 2025 | USA | Europe</a></h3><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzIyNjAxNzYxMzM5LVNlZS15b3UtbmV4dC15ZWFyICgxOTIweDEwODApLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib"></p><p><br></p>

Perovskite-based (PSC) and organic photovoltaic (OPV) cells are promising solar technologies. Adhesives play a crucial role offering not only mechanical stability but also environmental protection. This article focuses on the various types of adhesives used in the encapsulation of OPV or PSC cells.

Adhesive Solutions for Perovskite-based and Organic Photovoltaic Applications

This article delves into the core principles, process parameters, and material compatibility of PVD vs CVD, empowering researchers and engineers to make informed decisions for their advanced thin film endeavors.

PVD vs CVD: Mastering Advanced Thin Film Deposition Techniques

Optical Micro-Electro-Mechanical Systems (MEMS) Sensor 

This article delves deeper into the microscopic world of MEMS sensors, exploring their operating principles, diverse applications, and the cutting-edge advancements propelling them into the future.

MEMS Sensors: Miniature Marvels Revolutionizing Modern Technology

Mouser Electronics-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

Mouser Electronics-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Mouser Electronics-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Mouser Electronics-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Mouser Electronics-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Mouser Electronics-Mon Oct 30 2023 14:34:39 GMT+0200 (Eastern European Standard Time)

Mouser Electronics-Tue Oct 31 2023 23:59:59 GMT+0200 (Eastern European Standard Time)

Murata Electronics Europe-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

Murata Electronics Europe-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Murata Electronics Europe-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Murata Electronics Europe-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Murata Electronics Europe-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Digi-Key Electronics-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

Digi-Key Electronics-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Digi-Key Electronics-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Digi-Key Electronics-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Digi-Key Electronics-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Renesas Electronics-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

Renesas Electronics-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Renesas Electronics-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Renesas Electronics-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Renesas Electronics-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

printed electronics

Printed Electronics

Profiles