Thin film deposition applies material layers at the atomic/molecular level, vital for advancing electronics, energy, and aerospace. Key methods like CVD, PVD, and ALD enhance material properties, driving innovations in semiconductors, solar cells, and precision tech.

Thin Film Deposition Technologies: Transforming Electronics, Energy, and Aerospace

<h1 dir="ltr" id="isPasted">Context and Importance</h1><p dir="ltr">The current market size of Cloud computing is estimated to be USD 0.68 trillion, and it is growing at a very rapid pace. According to some estimations, by 2029, the cloud computing market will reach USD 1.44 trillion with a compound annual growth rate of 16.40%. 1&nbsp;</p><p dir="ltr">As cloud computing adoption has accelerated, so too has the energy demand to power the massive data centers that host these services. These energy demands have significant environmental implications, contributing to increased carbon emissions and raising concerns about the sustainability of the digital future. In this regard, the concept of Green Cloud has emerged to be an imperative that mitigates these concerns.</p><p dir="ltr">The aim of this article is to explain the Green Cloud, its underlying principles, and how engineers and organizations can implement sustainable practices in cloud operations.</p><h1 dir="ltr">Defining the Green Cloud</h1><h2 dir="ltr">What is the Green Cloud?</h2><p dir="ltr">The Green Cloud means integrating sustainable practices into cloud computing operations by focusing on energy-efficient, environmentally-friendly cloud services that minimize carbon emissions and reduce resource consumption. Traditionally, cloud computing primarily focuses on factors like scalability, flexibility, and cost-efficiency without environmental aspects as a primary concern. However, in the case of Green Cloud computing, along with the aforementioned factors, the objective is to create a more eco-conscious digital infrastructure that contributes to long-term environmental preservation and seeks to manage resources sustainably via energy usage optimization and e-waste reduction.</p><h2 dir="ltr">Key Environmental Issues in Cloud Computing</h2><p dir="ltr">Data centers are considered the core of cloud computing; however, they consume vast amounts of energy that leads to an excess carbon footprint in the environment. The power required to operate servers, cool systems, and manage data has significant environmental consequences, especially when fueled by non-renewable energy sources like coal and natural gas. Moreover, as the hardware and cooling systems become outdated, data centers also generate significant e-waste that can contribute to resource depletion and hazardous waste production.</p><h1 dir="ltr">Why the Green Cloud Matters</h1><h2 dir="ltr">Impact of Traditional Cloud Practices</h2><p dir="ltr">The energy consumption of traditional cloud computing practices is staggering. For instance, the three hundred thousand servers of Microsoft's Chicago data center alone consume 23.5% of the USA's total coal-generated electric power. Similarly, Google has over one million servers worldwide that also consume a lot of energy.&nbsp;2</p><p dir="ltr">The energy consumption of data centers is expected to further increase, driven by the exponential growth of data. Without intervention, this could lead to even greater carbon emissions, placing unsustainable pressure on global power grids and ecosystems. It is projected that the proportion of global carbon dioxide emissions attributed to information and communication technologies (ICTs) has grown from 1.3% in 2002 to 2.3% by 2020.&nbsp;3&nbsp;Therefore, it is imperative to shift towards sustainable cloud operations that prioritize environmental sustainability.</p><h1 dir="ltr">Principles of a Green Cloud</h1><h2 dir="ltr">Energy Efficiency</h2><p dir="ltr">The principles of a Green Cloud revolve around minimizing environmental impact by using energy-efficient hardware and optimizing server infrastructure. Modern data centers are adopting energy-efficient processors and low-power servers designed to reduce electricity consumption. To improve energy efficiency, one key strategy can be utilizing virtualized environments, where multiple virtual servers can run on a single physical machine enabling workload consolidation, which means that data centers can handle more tasks with fewer resources, significantly reducing idle server energy consumption.</p><h2 dir="ltr">Renewable Energy Adoption</h2><p dir="ltr">Currently cloud processing is heavily dependent on non-renewable energy sources, as evident through the example of Microsoft's Chicago data center using a quarter of the USA's coal-generated energy. Powering data centers with renewable energy is a critical step in achieving sustainable cloud computing as renewable energy sources, such as solar, wind, and hydroelectric power, offer a clean alternative to fossil fuels that can help reduce the carbon footprint of cloud operations.&nbsp;</p><p dir="ltr">In this regard, major cloud providers like Google and Microsoft are prioritizing sustainability by committing to renewable energy use and reducing their carbon footprints. For instance, Microsoft Azure has set a goal to achieve carbon-negative operations by 2030, while Google plans to run entirely carbon-free.&nbsp;4</p><h2 dir="ltr">Carbon Reduction Techniques</h2><p dir="ltr">Another important principle is to utilize carbon reduction techniques, including utilizing low-power processors, energy management software, and cooling system optimizations that minimize the energy required to maintain ideal operating temperatures in data centers. For instance, open-source tools like <a href="https://www.cloudcarbonfootprint.org/">Cloud Carbon Footprint</a> are designed to measure, track, and reduce carbon emissions from cloud usage. This tool generates metrics and projections for potential carbon reductions, which can be communicated to employees, investors, and other relevant stakeholders. 5</p><p dir="ltr">Similarly, carbon offset programs that enable cloud providers to invest in environmental projects that compensate for their carbon emissions are also great initiatives toward Green Cloud.&nbsp;</p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dii" style="width: 822px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1730724156554-Screenshot+2024-09-25+115819.png" width="624" height="291" class="fr-fic fr-dii"><span class="fr-inner"></span></span></span></p><p dir="ltr" id="isPasted">Screenshot from the Cloud Carbon Footprint tool. Credit: cloudcarbonfootprint</p><p></p><h1 dir="ltr">Technological Approaches to Achieving the Green Cloud</h1><h2 dir="ltr">Cloud Infrastructure Optimization</h2><p dir="ltr">Technological approaches to achieve a Green Cloud focus on optimizing cloud infrastructure to minimize energy consumption. For instance, techniques such as power-efficient cooling systems and improved server designs reduce energy usage in data centers.&nbsp;</p><p dir="ltr">Moreover, data centers can minimize their environmental impact by using techniques like resource scheduling and workload management to ensure that resources are not wasted on idle tasks. In this regard, automation also plays a vital role as automated systems can intelligently manage server activity, powering down unused servers or scaling resources based on real-time needs.&nbsp;</p><h2 dir="ltr">Edge Computing and Distributed Data Centers</h2><p dir="ltr">Edge computing is another way of achieving Green Cloud, as it reduces long-distance data transfer requirements by processing data closer to its source. This approach of handling computation locally lowers bandwidth usage and the power required for network operations as well as reducing energy costs.&nbsp;</p><p dir="ltr">Similarly, distributing data across geographically diverse data centers further helps reduce energy intensity by utilizing regional power resources more effectively. These data centers are strategically placed to take advantage of local renewable energy sources and climate conditions for efficient cooling.</p><h2 dir="ltr">Virtualization and Containerization</h2><p dir="ltr">Virtualization and containerization are critical technologies to achieve Green Cloud. Container-based architectures contribute to energy savings by allowing multiple applications to share the same operating system while running in isolated environments with minimal overhead. Containerization allows workloads to run on fewer servers, which reduces the energy required for powering and cooling data centers. Virtualization and containerization help cloud providers achieve significant energy savings by optimizing the utility of available hardware while maintaining flexibility and scalability.</p><h1 dir="ltr">Engineering Challenges in Implementing Green Cloud Practices</h1><h2 dir="ltr">Balancing Performance and Sustainability</h2><p dir="ltr">Implementing Green Cloud practices presents engineering challenges in balancing performance and sustainability. For instance, one significant challenge is the trade-off between energy savings and cloud performance, as energy-saving measures, such as reducing power to idle servers, can sometimes introduce latency or lower performance.&nbsp;</p><p dir="ltr">Exploring new technologies and architectures that can improve energy efficiency without sacrificing performance is imperative to tackle this challenge. In this regard, adopting hybrid architectures that combine traditional and cloud-native solutions can provide the flexibility needed to achieve both sustainability and high performance.</p><h2 dir="ltr">Cost vs. Environmental Benefit</h2><p dir="ltr">The economic challenges of adopting Green Cloud solutions can be significant, especially for smaller organizations, since the upfront costs of transitioning to energy-efficient hardware, renewable energy sources, and optimized cloud infrastructure can be substantial. However, long-term cost savings from reduced energy consumption often outweigh these initial investments.</p><p dir="ltr">Quantifying the return on investment (ROI) for Green Cloud investments, however, adds another layer of complexity. Organizations must balance immediate financial implications against long-term environmental benefits by developing metrics that accurately assess energy savings, reduced operational costs, and potential regulatory incentives. Businesses can utilize cost-benefit analyses and lifecycle assessments to better understand the financial and environmental impact of their investments.</p><h1 dir="ltr">Real-World Examples and Best Practices</h1><h2 dir="ltr">Case Studies of Green Cloud Implementation</h2><p dir="ltr">Major cloud providers are leading the charge toward sustainable cloud computing. For instance, in 2023, for the seventh year in a row, Google matched 100% of its electricity usage with renewable energy. Moreover, Google is aiming for 24/7 carbon-free energy across all its global operations by 2030. 6&nbsp;</p><p dir="ltr">Similarly, AWS achieved to match 100% of their consumed electricity with renewable energy in 2023, and they are aiming to achieve their target of net-zero carbon by 2040.&nbsp;7&nbsp;Microsoft has also made a significant commitment by targeting carbon negativity by 2030.&nbsp;4</p><p dir="ltr">Smaller companies are also aiming to achieve sustainable cloud operations. For instance, Ecosia is a search engine that donates 80% of its profits to reforestation projects worldwide.8&nbsp;Similarly, GreenGeeks is a web hosting company that claims to be 300% green. They use renewable energy credits to offset their carbon footprint and support wind energy projects.&nbsp;9</p><h1 dir="ltr">The Future of the Green Cloud</h1><h2 dir="ltr">Trends in Sustainable Cloud Computing</h2><p dir="ltr">AI and machine learning can contribute a lot to the future of Green Cloud for energy optimization. With AI and machine learning, data centers will be able to analyze vast amounts of operational data, identify inefficiencies, and dynamically adjust resource allocation to minimize energy consumption while maintaining performance.&nbsp;</p><p dir="ltr">Another crucial trend for the future of Green Cloud is the rise of zero-carbon data centers, which aim to eliminate greenhouse gas emissions from their operations. Top companies are aiming to adopt climate-positive operations and go beyond carbon neutrality towards carbon-negative by actively contributing to carbon removal and climate restoration.</p><h1 dir="ltr">Conclusion</h1><p dir="ltr">The Green Cloud is an important step toward addressing the environmental impact of cloud computing. Cloud providers can significantly reduce their carbon footprints via energy-efficient hardware, renewable energy sources, and carbon reduction techniques.&nbsp;</p><p dir="ltr">The Green Cloud is not just a trend but a necessary transformation in how we approach digital infrastructure. In this regard, engineers have a responsibility and a critical role in advancing these technologies and ensuring that cloud computing continues to grow in an environmentally responsible manner. The future of computing can become both powerful and environmentally friendly if Green Clooud practices are adopted widely.</p><h1 dir="ltr">References</h1><ol><li dir="ltr"><p dir="ltr">Cloud Computing Market Size &amp; Share Analysis - Growth Trends &amp; Forecasts (2024 - 2029) [Online]. Mordor Intelligence. Available at: <a href="https://www.mordorintelligence.com/industry-reports/cloud-computing-market">https://www.mordorintelligence.com/industry-reports/cloud-computing-market</a> (Accessed on September 24, 2024)</p></li><li dir="ltr"><p dir="ltr">Bharany, S., et al,. (2022). A systematic survey on energy-efficient techniques in sustainable cloud computing. Sustainability. <a href="https://doi.org/10.3390/su14106256">https://doi.org/10.3390/su14106256</a></p></li><li dir="ltr"><p dir="ltr">Radu, L. D. (2017). Green cloud computing: A literature survey. Symmetry. <a href="https://doi.org/10.3390/sym9120295">https://doi.org/10.3390/sym9120295</a></p></li><li dir="ltr"><p dir="ltr">Who has the greenest cloud? The most sustainable cloud tech in 2024 [Online]. Hive. Available at: <a href="https://www.hivenet.com/post/who-has-the-greenest-cloud-the-most-sustainable-cloud-tech-in-2024">https://www.hivenet.com/post/who-has-the-greenest-cloud-the-most-sustainable-cloud-tech-in-2024</a> (Accessed on September 24, 2024)</p></li><li dir="ltr"><p dir="ltr">Cloud Carbon Emissions Measurement and Analysis Tool [Online]. Cloud Carbon Footprint. Available at: &nbsp;<a href="https://www.cloudcarbonfootprint.org/">https://www.cloudcarbonfootprint.org/</a> (Accessed on September 24, 2024)</p></li><li dir="ltr"><p dir="ltr">24/7 Carbon-Free Energy by 2030. [Online] Google Data Centers. Available at: <a href="https://www.google.com/about/datacenters/cleanenergy/">https://www.google.com/about/datacenters/cleanenergy/</a> (Accessed on September 24, 2024)</p></li><li dir="ltr"><p dir="ltr">AWS enables sustainability solutions. [Online]. AWS. Amazon. Available at: &nbsp;<a href="https://aws.amazon.com/sustainability/">https://aws.amazon.com/sustainability/</a> (Accessed on September 24, 2024)</p></li><li dir="ltr"><p dir="ltr">Ellie Hutchin (2017) Ecosia. The Search Engine That's Saving The World! [Online] The Great Projects. Available at: &nbsp;<a href="https://www.thegreatprojects.com/blog/the-search-engine-that-s-saving-the-world">https://www.thegreatprojects.com/blog/the-search-engine-that-s-saving-the-world</a> (Accessed on September 24, 2024)</p></li><li dir="ltr"><p dir="ltr">Web Hosting that's fast, secure &amp; eco-friendly. [Online] Green Geeks. Available at: &nbsp;<a href="https://www.greengeeks.com/">https://www.greengeeks.com/</a> (Accessed on September 24, 2024)</p></li></ol>

The aim of this article is to explain the Green Cloud, its underlying principles, and how engineers and organizations can implement sustainable practices in cloud operations.

Understanding the Green Cloud: An overview of sustainable cloud computing

An overview of Flip chip technology, its inception, manufacturing process, advancements and performance optimization techniques.

Flip Chip Technology: Advanced Semiconductor Packaging for Next-Generation Electronics

Photoresist, a light-sensitive material, is essential in photolithography for transferring intricate circuit patterns onto semiconductor wafers. This article explores positive vs. negative photoresists, detailing their chemical mechanisms, processing parameters, and performance traits.

Positive vs. Negative Photoresist: A Comprehensive Guide to Photolithography in Semiconductor Fabrication

An in-depth review of PCB potting, its applications, materials, technologies, and the AI-powered advancement in potting techniques and material engineering.

PCB Potting: Fortifying Electronics Against Extreme Elements

<p dir="ltr" id="isPasted">Semiconductors play a pivotal role in shaping our everyday experiences. From the vehicles we drive to the devices we use, semiconductors are omnipresent, enabling functionalities in computers, smartphones, and various industrial automation technologies.&nbsp;</p><p id="isPasted">Nexperia's Hamburg plant has been at the forefront of semiconductor development for a century, contributing to nearly ten percent of the global semiconductor component production. To celebrate this 100-year milestone, we delve into the captivating history of this institution and the engineers and workers that have enabled its success.&nbsp;</p><h2>The Nexperia beginning</h2><p>The journey started in 1924 when the Valvo radio tube factory was established in Hamburg. Three years after being acquired by the Dutch electronics group Philips, the factory initially focused on manufacturing vacuum tubes, which were essential for the emerging radio technology at the time. The world of electronics was on the verge of a revolution with the invention of the transistor by William Shockley's team at Bell Labs (now Nokia Bell Labs) in New Jersey in 1947. This invention ushered in a new era by offering numerous advantages over traditional vacuum tubes, including smaller sizes, lower energy consumption, and greater reliability.</p><p>The team in Hamburg quickly recognized the potential of the new technology, and the site became a center for semiconductor production. The company began developing diodes and transistors as early as 1953. In 1957, large-scale production of transistors began in Hamburg. This innovative work laid the foundation for Hamburg's legacy in transistor technology and established the city as one of the leading locations for the development and manufacture of semiconductor components. The components developed and produced here found their way into a wide range of applications, from consumer electronics to industrial control systems, helping to transform entire industries.</p><p>In 1969, the first component in the pioneering SOT23 plastic housing was produced in Hamburg. This surface-mountable housing allowed for space-saving on the circuit board compared to the through-hole housings available until then. However, it took time for this technology to gain widespread success. It was only during the boom in consumer electronics in the 1980s and early 1990s that SMT (surface mount technology) really began to catch on. The SOT23 quickly became the standard for a three-pin SMT housing due to its compact size, reliability, and flexibility. Even today, it is widely used across all industries as it can accommodate a variety of electronic components such as diodes, bipolar transistors, field effect transistors (FETs), and ESD protection devices.</p><h2>Rise to top semiconductor manufacturer</h2><p>In 1989, the plant produced 2.8 billion semiconductor elements. By 2009, the number had increased to 45 billion, and in 2006, the Philips semiconductor division became NXP Semiconductors. Today, Nexperia, which separated from NXP in 2017 and has been functioning as an independent company, manufactures 100 billion components per year. These components are utilized in a wide range of electronic devices.</p><p>Nexperia's success in Hamburg is attributed to the continuous improvement in production efficiency. The production of semiconductors, specifically the manufacturing of wafers, is a highly intricate process that demands precision and reliability. Wafers are thin slices of semiconductor material, typically silicon used as the foundation for making microelectronic components. These wafers are cut or sawn from a single crystalline semiconductor block and then polished to prepare them for the microchip manufacturing process. Through ongoing innovation and optimization, Nexperia has significantly boosted production capacity while upholding top-notch quality standards. Today, the Hamburg factory stands as the world's largest production facility for small signal diodes and transistors, contributing to approximately a quarter of global production.</p><h3>Focus on energy efficiency and innovation</h3><p>In addition, continuously increasing the energy efficiency of components is a central aspect of product development at Nexperia. This plays a key role in improving everyday products, such as increasing the range of electric cars. In addition to the diodes and transistors manufactured in Hamburg, Nexperia also offers wide-band-gap semiconductor products made of silicon carbide (SiC) and gallium nitride (GaN), which are known for their energy efficiency.</p><p>Since the spin-off from NXP in 2017, Nexperia has invested approximately 260 million US dollars in the Hamburg site. This investment has not only increased the workforce from 950 to around 1,600 but has also modernized the technological infrastructure. The investments were focused on expanding research and development in Hamburg and increasing the capacity of the wafer fab. The majority of this growth occurred in 2019 after Nexperia became part of Wingtech Technology Co. Ltd., a consumer electronics manufacturer listed on the Shanghai stock exchange. In 2023, a design center in Munich was added to complement the development activities of Nexperia Germany GmbH.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1730198863076-News+and+events+header.jpg" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Nexperia has a broad product GaN product range that &nbsp;targets automotive, 5G and datacenter applications. Credit: Nexperia</span></span></span></p><h2>Recognizing successes and staying the course</h2><p>The 100th anniversary of Nexperia in Hamburg signifies a significant milestone in the company's history. It is a testament to the power of innovation and human ingenuity and an opportunity to honor the people behind this success story. From the glassblowers of the early days to the engineers and scientists of today, their contributions have made Nexperia a global leader in the semiconductor industry.</p><p>The <a href="https://www.nexperia.com/about/company-timeline">100th anniversary of Nexperia</a> in Hamburg signifies a significant milestone in the company's history. It is a testament to the power of innovation and human ingenuity and an opportunity to honor the people behind this success story. From the glassblowers of the early days to the engineers and scientists of today, their contributions have made Nexperia a global leader in the semiconductor industry.</p>

Semiconductors play a pivotal role in shaping our everyday experiences. From the vehicles we drive to the devices we use, semiconductors are omnipresent, enabling functionalities in computers, smartphones, and various industrial automation technologies. 

100 years of cutting edge engineering at Nexperia Hamburg plant

<section id="isPasted"><p>Modern computing infrastructures in data centers or distributed computing systems contribute significantly to global electricity use. The increasing demand for electricity in these systems poses problems, as the need for electricity could potentially exceed the world's energy production in the near future.&nbsp;</p><p>To combat this problem, the&nbsp;<a href="https://new.nsf.gov/news/nsf-awards-42-4m-new-grants-support-future-semiconductors" rel="noopener" target="_blank">National Science Foundation has awarded Future of Semiconductor grants totaling $42.4 million to further research on semiconductors.</a> Part of this effort will be led by Dr. Yuxuan 'Cosmi' Lin, assistant professor in the Department of Materials Science and Engineering at Texas A&amp;M University. His team has received $1.8 million to support a collaborative research project on new designs of interconnect technologies to reduce their power consumption and boost the overall performance of microchips.</p><p>Microchips contain interconnects — layers of metal conductors with nanoscale to microscale dimensions that connect different electronic devices in a computer chip. About 20-40% of power in microchips is consumed by its interconnects. Copper is the standard material for interconnects due to its abundance, offering low costs and good electrical conductivity. &nbsp;</p><p>However, when its dimensions are reduced below 10 nanometers, its resistivity increases dramatically, increasing power consumption and heat generation.&nbsp;</p><p>"First, electrons in ultrathin copper nanowires can no longer move freely due to structure and property changes," said Lin. "Second, the surface of copper nanowires must be encapsulated with an insulating layer to make the structure more stable, but this further reduces charge transport."&nbsp;</p></section><blockquote><p>This project offers potential pathways for integrating these new interconnect technologies with silicon integrated circuit chips, paving the way for upscaling such as an emerging industrial development and manufacturing technology.</p><p><cite>- Dr. Yuxuan 'Cosmi' Lin</cite></p></blockquote><section><p>Throughout this three-year project, the team will develop a new way to synthesize copper nanowires and design effective encapsulation layers based on two-dimensional materials. These break the paradigm, limiting current interconnect technology and enabling next-generation high-performance and energy-efficient computer chips.</p><p>"This project offers potential pathways for integrating these new interconnect technologies with silicon integrated circuit chips, paving the way for upscaling such as an emerging industrial development and manufacturing technology," said Lin.&nbsp;</p><p>The proposed research, education, and workforce development efforts will be conducted among five interdisciplinary research groups across three universities, including Texas A&amp;M, University of Texas at Austin, and Purdue University. New research initiatives and semiconductor workforce development activities will be coordinated across the three campuses. This will enhance the technological leadership and broader societal impact of Texas A&amp;M in microelectronics, which is one of the critical technologies of national interest as outlined by the CHIPS &amp; Science Act and the Texas CHIPS Act.</p><p>"New domain knowledge will be established at the forefront of the electronic materials area in materials science and engineering throughout this project," said Lin. "Additionally, the project seeks to engage students at all levels, providing training in physics, materials science, and nanoelectronics to prepare students for industry. "&nbsp;</p><p>Besides Dr. Lin’s group, contributors to the research include the four research groups: Dr. Yuanyue Liu's group and Dr. Jamie Warner's group at UT Austin, as well as Dr. Zhihong Chen's group and Dr. Sumeet Gupta's group at Purdue University.&nbsp;</p></section>

A research team at Texas A&M has received a $1.8M National Science Foundation Future of Semiconductor grant to develop new energy-efficient interconnect technologies for microchips.

New Energy-efficient Interconnect Technologies for Microchips

<p id="isPasted">In the fast-paced world of electronics and innovation, having access to the right tools is essential for designers and engineers looking to bring their concepts to life quickly and efficiently. Development kits are a key resource in this process, offering pre-built solutions that allow for faster prototyping and testing of new ideas. Mouser Electronics, a leading global distributor, is renowned for providing one of the most extensive ranges of off-the-shelf development kits, ensuring that designers can access the tools they need when they need them.</p><p>In this article, Mouser’s Director of Technical Content for EMEA, Mark Patrick, shares his expert insights by presenting his ‘Top 5 Picks’ from the latest development kits available. These kits have been carefully selected based on their innovative features, ease of use, and the potential they offer to accelerate the design process. Whether you're working on AI applications, IoT solutions, or embedded systems, these development kits can give your project the jumpstart it needs.</p><h2><strong>Long-range connectivity</strong></h2><p><em>Digi XBee® XR 868&nbsp;</em></p><p>This development kit includes the Digi XBee 868 RF MHz module with a U.FL antenna connector, antennas, and a development board. It supports long-range connectivity applications in Europe, operating between 863MHz and 870MHz. The module facilitates point-to-point and mesh networking with a line-of-sight range exceeding 14 kilometers, ideal for the agriculture and energy sectors. The device employs intelligent interference management using Listen Before Talk and Adaptive Frequency Agility, reducing interference by scanning frequencies and shifting channels seamlessly.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/digi-xbee-xr-868-kit/n-8mwysZ1npagf">XBee® XR 868 Development Kit - Digi | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582453944-digi.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p><h2><strong>Curiouser and curiouser</strong></h2><p><em>Microchip WBZ450 EV22L65A</em></p><p>Microchip’s WBZ450 Curiosity board is an efficient, modular development platform that supports rapid prototyping and demonstrates the features, capabilities, and interfaces of Microchip’s WBZ450PE BLUETOOTH® Low Energy and Zigbee® RF module. The EV22L65A board offers integrated programming/debugging features using the PICkit™ Onboard 4 (PKOB4) debugger interface. A Micro-USB cable is required to power up and program the board.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/microchip-ev22l65a-board/n-8mwysZ2puw22">WBZ450 Curiosity Board (EV22L65A) - Microchip Technology | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582723571-micro.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p><h2><strong>Arm-based MCU&nbsp;</strong></h2><p><em>STMicro STM32H7S78-DK Discovery kit</em></p><p>STMicroelectronics’ STM32H7S78-DK Discovery kit demonstrates and develops applications for the Arm® Cortex®-M7 core-based STM32H7S7L8H6H microcontroller. The kit comes with various hardware features, including USB Type-C™, Octo-SPI flash memory, Hexadeca-SPI PSRAM devices, audio codec, digital microphones, ADC, user button, and flexible extension connectors. These connectors facilitate easy wireless connectivity, analog applications, and sensor expansion.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/stm-stm32h7s78-dk-kit/n-8mwysZ2cjsva">STM32H7S78-DK Discovery Kit - STMicro | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582777405-st.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p><h2><strong>Rugged and reliable embedded wireless</strong></h2><p><em>Advantech WLNNA&nbsp;</em></p><p>Advantech’s WLNNA Series evaluation kit is a platform for evaluating, testing and developing Airborne Enterprise Device Server Modules. The Advantech WLNNA kit offers size, cost, power consumption, and performance advantages over other wireless solutions. Ideal for rugged and reliable applications needing an embedded IEEE 802.11a/b/g/n compliant wireless engine, the kit includes a WLNNA Series Evaluation Board with connectors and headers providing access to all module interfaces.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/advantech-wlnna-kit/n-8mwysZ27k4mu">WLNNA Series Evaluation Kit - Advantech | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582820389-brief+2.png" style="width: 100%px;" class="fr-fic fr-dib"></p><h2><strong>IoT control</strong></h2><p><em>M5Stack M5NanoC6 board</em></p><p>This board features an ESP32-C6FH4 MCU supporting Wi-Fi 6, Zigbee®, and an infrared emitter for controlling infrared IoT devices. The device's ceramic antenna ensures stable wireless communication. Programmable RGB beads enable personalized visual effects. The Grove interface allows flexible expansion of various M5 devices, which are customizable for different communication protocols.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/m5stack-m5nanoc6-board/n-8mwysZ2sl8dv" id="isPasted">M5NanoC6 Board - M5Stack | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582849615-m5.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p>

In this article,  Mouser’s Director, Technical Content, EMEA, Mark Patrick, presents his ‘Top 5 Pick’ of recently-released dev kits.

The development tools you need

<p id="isPasted">The future of technology has an age-old problem: rust. When iron-containing metal reacts with oxygen and moisture, the resulting corrosion greatly impedes the longevity and use of parts in the automotive industry. While it’s not called “rust” in the semiconductor industry, oxidation is especially problematic in two-dimensional (2D) semiconductor materials, which control the flow of electricity in electronic devices, because any corrosion can render the atomic-thin material useless. Now, a team of academic and enterprise researchers has developed a synthesis process to produce a “rust-resistant” coating with additional properties ideal for creating faster, more durable electronics. &nbsp;&nbsp;</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1727135296605-mrs_bulletin_cover_mos2.gif" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">These materials are made from molybdenum disulfide, a two-dimensional semiconductor, grown on a sapphire surface. The triangular shapes seen are aligned because of a special process called epitaxy, where the material follows the pattern of the surface it's grown on. Insulating layers, like amorphous boron nitride, are added during the process of making these ultra-thin materials, which are used to build next-generation electronic devices. Credit: J.A. Robinson Research Group/Penn State. All Rights Reserved.</span></span></span></p><p>The team, co-led by researchers at Penn State, published their work in <a href="https://www.nature.com/articles/s41467-024-48429-4?afsrc=1&bfsrc=7" rel="noreferrer noopener" target="_blank">Nature Communications</a>.&nbsp;</p><p>2D materials are ultra-thin, just one or a few atoms thick. They hold promise for advanced semiconductors because their thinness provides a shorter and more direct path for electrons to move quickly and with less resistance through the material. This in turn allows for faster and more efficient electronic performance. &nbsp;</p><p>Semiconductors are materials that conduct electricity under some conditions but not others, making them ideal for controlling electrical currents in electronic devices. Electronic devices, the “brains” of computer chips, are made from these materials. &nbsp;</p><p>"One of the biggest issues that we see in 2D semiconductor research these days is the fact that the materials oxidize quickly,” said Joshua Robinson, professor of materials science and engineering and co-corresponding author of the work. “You need to ensure their long-term reliability because these are going into transistors or sensors that are supposed to last years. Right now, these materials don't last more than a week out in the open." &nbsp;</p><p>Traditional methods to protect these materials from rusting involve oxide-based coatings, but these processes often use water, which ironically can accelerate the very oxidation they aim to prevent. The team’s approach to this problem was to seek a coating material and method that could avoid the use of water entirely. Enter amorphous boron nitride (a-BN). &nbsp;</p><p>"We wanted to get away from using water in the process so we started thinking about what sort of 2D materials we can make that do not use water in its processing, and amorphous boron nitride is one of those," Robinson said. &nbsp;</p><p>A non-crystalline form of boron nitride, a-BN is known for its high thermal stability and electrical insulation properties, making it ideal for use in semiconductors to insulate components, prevent unwanted electrical currents and improve device performance, Robinson said.</p><blockquote><p id="isPasted">“One of the biggest issues that we see in 2D semiconductor research these days is the fact that the materials oxidize quickly.”</p><p><strong>Joshua Robinson, professor of materials science and engineering</strong></p></blockquote><p id="isPasted">He explained that a-BN a has high dielectric strength, a measurement indicating the material’s ability to withstand high electric fields without breaking down, a critical factor for reliable electronic performance. &nbsp;</p><p>“The high dielectric strength demonstrated by a-BN is comparable to the best dielectrics available, and we don’t need water to make it,” Robinson said. "What we demonstrated in the paper was that including amorphous boron nitride yields improved device performance compared to conventional dielectrics alone."&nbsp;</p><p>While the coating helped produce a better 2D transistor, getting the coating on the 2D materials proved a challenge, according to Robinson. Two-dimensional materials lack dangling bonds, which are unpaired electrons on the surface of a material that react or bond with other atoms. A standard single-step process that uses higher temperatures to coat the materials resulted in uneven and discontinuous coatings, well below the quality electronics need to function properly. &nbsp;</p><p>To evenly coat 2D materials with the a-BN, the team developed a new two-step atomic layer deposition method, which involves first depositing a thin low-temperature a-BN “seed layer” before heating up the chamber to typical deposition temperatures between 250 and 300 degrees Celsius. This not only allowed the researchers to produce an even a-BN coating over the 2D semiconductors but also led to a 30% to 100% improvement — depending on the transistor design — in transistor performance compared to devices not utilizing the a-BN.&nbsp;</p><p>"When you sandwich 2D semiconductors between the amorphous boron nitride, even though it’s amorphous, you end up with a smoother electronic road, so to speak, that would enable improved electronics,” Robinson said. “The electrons can go faster through the 2D material than they could if they were between other dielectric materials.”&nbsp;</p><p>Robinson noted that even with its high dielectric strength, researchers have only scratched the surface of a-BN's potential as a dielectric material for semiconductor devices. &nbsp;</p><p>“We have room for improvement even though it’s already outperforming other dielectric materials,” Robinson said. "The primary thing that we're trying to do right now is improve the overall quality of the material and then integrate it into some complex structures you would see in future electronics.”&nbsp;</p><p>Along with Robinson, other authors of the study from Penn State include Cindy Chen, graduate student in materials science and engineering; Riccardo Torsi, graduate research assistant in materials science and engineering; Ke Wang, associate research professor in the Materials Research Institute; Bangzhi Liu, associate research professor in the Materials Research Institute. Other co-authors include co-corresponding author Yu-Chuan Lin, National Yang Ming Chiao Tung University in Taiwan; Zhihong Chen and Joerg Appenzeller, Purdue University; Jessica Kachian, Intel Corporation; and Gilber B. Rayner Jr., The Kurt J. Lesker Company.&nbsp;</p><p>The Semiconductor Research Corporation, through a program sponsored by National Institute of Standards and Technology, the Center for Emergent Functional Matter Science of National Yang Ming Chiao Tung University, the Ministry of Education of Taiwan and the U.S. National Science Foundation supported this research. &nbsp;</p>

A team of academic and enterprise researchers has developed a synthesis process to produce a “rust-resistant” coating with additional properties ideal for creating faster, more durable electronics.   

Water-free manufacturing approach could help advance 2D electronics integration

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<p dir="ltr" id="isPasted">Tight schedules and narrow profit margins often challenge innovators in the electronic product development process. Engineers determined to stay at the cutting edge need access to the latest tools and technologies to continue pushing the envelope.</p><p dir="ltr">The global virtual ATCx Electronics for Engineers 2024: Riding the Crest of Innovation event offered valuable insights into how simulation and AI are transforming electronic design across industries. Featured presentations from leading companies demonstrated successful implementations of data-driven design strategies in specialised tracks covering automotive, aerospace, and high-tech sectors.&nbsp;</p><p dir="ltr">In addition, the event featured<a href="https://altair.com/resource/eda-more-critical-more-valuable-more-exciting-than-ever" target="_blank" rel="noopener noreferrer"> a keynote with Joe Costello, former CEO at Metrics </a>and considered to be one of the founders of the modern EDA industry, where he reflected on the last 40 years of the industry and what he predicted for the future of electronics and semiconductor design.</p><p dir="ltr" id="isPasted">In the Altair Resource Library you can find recordings of all featured tracks from the event covering the automotive, aerospace, and high-tech sectors:</p><p dir="ltr"><a href="https://altair.com/resourcelibrary?keywords=2024&category=ATCx%20Electronics&lang=English" target="_blank" id="isPasted" class="button-main-action" rel="noopener noreferrer">View all presentations</a></p><h2 dir="ltr"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI0ODU3NzI2MjAxLWV5SmlkV05yWlhRaU9pSjNaWFp2YkhabGNpMXdjbTlxWldOMExXbHRZV2RsY3lJc0ltdGxlU0k2SW1aeWIyRnNZUzh4TnpJME9EVTFNRGM1T1RZM0xURTNNalE0TlRVd056azVOamN1Y0c1bklpd2laV1JwZEhNaU9uc2ljbVZ6YVhwbElqcDdJbmRwWkhSb0lqbzVOVEFzSW1acGRDSTZJbU52ZG1WeUluMTlmUT09LndlYnAiLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib"></h2><h1 dir="ltr">Featured Presentations</h1><h3 dir="ltr">Panel - The Next Wave: Innovations and Obstacles in Electronics &amp; Semiconductors</h3><p dir="ltr">Sarmad Khemmoro, I SVP – Technical Strategy, Electronics Design and Simulation, Altair I</p><p dir="ltr">Simon Segars | Former CEO | ARM &amp; Joe Costello | Former CEO | Metrics</p><p dir="ltr">In this engaging Fireside Chat, Sarmad Khemmoro, SVP, &nbsp;will lead the discussion around the latest innovations and trends shaping the electronics and semiconductor technology landscape. This engaging and informative discussion will bring together industry pioneers Joe Costello and Simon Segars, who will share their experiences, insights, and forecasts for the future of electronics and semiconductor design.</p><p dir="ltr"><a href="https://altair.com/resource/the-next-wave-innovations-and-obstacles-in-electronics-and-semiconductors" target="_blank" rel="noopener noreferrer">Link to the presentation</a></p><h3 dir="ltr">EDA - More Critical, More Valuable, More Exciting than Ever</h3><p dir="ltr">Joe Costello I Former CEO | Metrics</p><p dir="ltr">Considered to be one of the founders of the modern EDA industry, Joe Costello will be the keynote speaker at this event where he will be reflecting on the last 40 years of the industry and what he predicts for the next 10 years.</p><p dir="ltr" id="isPasted"><a href="https://altair.com/resource/eda-more-critical-more-valuable-more-exciting-than-ever" target="_blank" rel="noopener noreferrer">Link to the presentation</a></p><p dir="ltr"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI0ODU3NTk2OTk2LUFsdGFpcl9MUF9BdXRvbW90aXZlX0hlcm9fZGVza3RvcC5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib"></p><h1 dir="ltr">Track 1: Automotive / Transportation</h1><p dir="ltr">In this track you can engage and learn from global companies on how they are addressing their electronic system design challenges. Presenters from Jaguar Landrover, Tata Motors, Kion Group, Aptiv, AmpX, and Ashok Leyland, are on the agenda.</p><h3 dir="ltr">Accelerating Product Design and Testing for Automotive Power Electronics</h3><p dir="ltr">Dr. Zeyu Zhang | Co-Founder, Vice President Engineering | AmpX</p><p dir="ltr">The design for automotive powertrain components is a comprehensive and sometimes iterative process. There always exists a gap between simulation and testing results. In this presentation, we will share perspectives of how we utilize Altair PSIM to enhance the design and testing process based on an onboard charger example.</p><p dir="ltr" id="isPasted"><a href="https://altair.com/resource/accelerating-product-design-and-testing-for-automotive-power-electronics" target="_blank" rel="noopener noreferrer">Link to the presentation</a></p><h1 dir="ltr">Track 2: Aerospace / Defense</h1><h3 dir="ltr">Compact Converters Using GaN HEMTs for Isolated RF Power Applications</h3><p dir="ltr">Dr. Harish Krishnamoorthy, Associate Professor, University of Houston</p><p dir="ltr">Pulsed power applications require the delivery of high-energy pulses in a controlled and efficient manner. Power converters need to be specifically designed to meet the demanding requirements of pulsed power systems, providing precise voltage and current regulation, fast switching capabilities, and high power density. Power supplies for pulsed power applications contribute to the advancement of various fields, including aerospace, defense, medical, and subsurface characterization.</p><p dir="ltr" id="isPasted"><a href="https://altair.com/resource/compact-converters-using-gan-hemts-for-isolated-rf-power-applications" target="_blank" rel="noopener noreferrer">Link to the presentation</a></p><h3 dir="ltr">Shift Left – Streamline Component Derating and Reliability Analyses in the Design Flow of Mission Critical Electronics</h3><p dir="ltr">Dr. Amir Segal I BQR</p><p dir="ltr">Mission critical electronics must be reliable, safe and robust. Therefore, reliability analyses should be an integral part of the design flow. Despite its crucial nature, reliability analysis is frequently sidelined in the design process, often due to disconnects between reliability departments and designers, compounded by inefficient communication methods such as spreadsheets.</p><p dir="ltr" id="isPasted"><a href="https://altair.com/resource/shift-left-for-reliability-your-secret-weapon-for-robust-mission-critical-electronics" target="_blank" rel="noopener noreferrer">Link to the presentation</a></p><p dir="ltr"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI0ODU3ODE0NDg2LXNodXR0ZXJzdG9ja18xNzE3Nzc3Nzk1LmpwZWciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib"></p><h1 dir="ltr">Track 3: High Tech</h1><h3 dir="ltr">ECAD to 3D PCB Results in a Day with Altair SimSolid®</h3><p dir="ltr">Evan Christensen I Senior Technical Account Manager, Altair</p><p dir="ltr">In conventional 3D PCB simulations, meshing is involved, which can be quite time-consuming but is essential for accurate results. However, SimSolid has revolutionized this process by eliminating the need for meshing, thereby significantly reducing the pre-processing time. Its highly efficient iterative solving technique is capable of handling large models, allowing engineers to evaluate design iterations much faster in their design cycles. This session will showcase hands-on demonstrations of how to quickly and efficiently develop 3D PCB designs.&nbsp;</p><p dir="ltr" id="isPasted"><a href="https://altair.com/resource/ecad-to-3d-pcb-results-in-a-day-with-altair-simsolid" target="_blank" rel="noopener noreferrer">Link to the presentation</a></p><h3 dir="ltr">Explore more presentation from ATCx Electronics 2024&nbsp;</h3><p dir="ltr">In Altair's resource library to discover more presentations from this year's ATCx Electronics for Engineers event.</p><p dir="ltr"><a href="https://altair.com/resourcelibrary?keywords=2024&category=ATCx%20Electronics&lang=English" target="_blank" class="button-main-action" rel="noopener noreferrer">View all presentations</a></p>

Watch featured presentations from the global virtual event.

Elevate Your Engineering Expertise: ATCx Electronics for Engineers 2024

<p dir="ltr" id="isPasted">Traditional mechanical flow sensors, which rely on moving parts, face significant challenges in harsh environments, such as wear and tear, fluid contamination, and pressure drops. These issues lead to inefficiencies and costly maintenance and are exacerbated in applications where precision and durability are paramount, such as water heaters, purifiers, industrial coolant systems, and water management.</p><p dir="ltr">To address these challenges, <a href="https://www.sciosense.com/about/" target="_blank">ScioSense</a> has developed the UFM-01 Ultrasonic Flow Sensing Module. The UFM-01 leverages advanced ultrasonic technology to provide highly accurate and contactless flow measurements, eliminating the drawbacks of mechanical sensors. The UFM-01 stands out for its contactless measurement capabilities because of no moving parts, which ensures long-term reliability by eliminating the wear and tear associated with traditional mechanical flow sensors.</p><p dir="ltr">The UFM-01 is engineered to deliver precise flow measurements across a wide range of applications. Its design is centered around ease of integration, making it an ideal choice for engineers seeking to enhance system performance.</p><h1 dir="ltr">Technological Advantages</h1><p dir="ltr">Traditional mechanical flow sensors that use turbine rotors or actuators often face significant challenges in fluid measurement as they rely on moving parts, which are prone to wear and tear, especially in abrasive or corrosive environments. This wear and tear leads to not only fluid contamination but also reduced accuracy over time, which necessitates constant maintenance and even replacements. Traditional mechanical flow sensors also introduce obstructions into the flow path, causing pressure drops in the system and reducing energy efficiency. Moreover, their performance is often affected by changes in fluid viscosity, temperature, and pressure, leading to inconsistent measurements.</p><p dir="ltr">UFM-01 Ultrasonic Flow Sensing Module bypasses all these challenges by using sound waves to measure fluid velocity, eliminating the need for moving mechanical parts and thus increasing durability. Moreover, due to the non-intrusive nature of these ultrasonic sensors, they do not affect the liquids and are well suited for food applications.&nbsp;</p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dii" style="width: 822px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI0MTM2MDI5MzM0LTE3MjQxMzYwMjkzMzQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" width="624" height="468" id="isPasted" class="fr-fic fr-dii"><span class="fr-inner">Figure 1: UFM-01 Ultrasonic Flow Sensing Module. Source: ScioSense.com</span></span></span></p><h1 dir="ltr">Technical Specifications of UFM-01</h1><h2 dir="ltr">Flow range</h2><p dir="ltr">A wide flow range is always crucial for any flow sensor as it ensures that the sensor can accommodate fluctuations in flow rates without compromising performance. The UFM-01 supports a wide flow range of 10 to 2000 liters per hour, making it suitable in both low and high-flow scenarios for a broad spectrum of applications. For example, in water distribution systems, the sensor can handle everything from small leaks to full-flow scenarios, which eliminates the requirement for multiple sensors to cover different flow ranges.</p><h2 dir="ltr">Accuracy</h2><p dir="ltr">Accuracy is also a critical aspect of flow measurement, especially in processes where precise control of fluid flow is necessary. In this regard, the UFM-01 offers an accuracy of ±5% for flow rates above 60 liters per hour, which ensures that the measurements are dependable even at higher flow rates. This level of accuracy is particularly important in applications like boilers, where incorrect flow &nbsp;measurements can lead to inefficiencies or even safety hazards.</p><h2 dir="ltr">Communication Interfaces</h2><p dir="ltr">The UFM-01 is equipped with a universal asynchronous receiver/transmitter (UART) protocol with 2400 bits per second baud rate and 8 data bit capacity, as well as single-wire communication&nbsp;<iframe id="66a22fbc1e6d3a7555231f98" width="250" class="specs-iframe" height="440" src="https://wevolver.com/iframe/specs/sciosense-ufm-01-ultrasonic-flow-sensing-module?iframe=true" frameborder="0" scrolling="no" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span><span class="fr-mk" style="display: none;">&nbsp;</span></iframe> interfaces, which facilitate easy integration into a variety of systems. These interfaces allow the sensor to communicate seamlessly with microcontrollers, data loggers, or other digital systems, enabling real-time monitoring and control. Moreover, the ease of integration reduces development time and complexity, making the UFM-01 a convenient choice for both new designs and retrofit applications.</p><h2 dir="ltr">Power Requirements</h2><p dir="ltr">The UFM-01 operates at 5V with a low power consumption of just 2mA. This low power draw is beneficial in systems where energy efficiency is critical, such as in continuous monitoring applications or embedded systems where minimizing power consumption helps reduce overall system costs. The efficient power usage of the sensor module also ensures its reliability within power-constrained environments, contributing to the longevity and stability of the entire system without overloading power supplies.</p><h1 dir="ltr">Application Areas</h1><p dir="ltr">The versatility of the UFM-01 makes it suitable for a wide range of applications, as discussed here:</p><h2 dir="ltr">Water Management</h2><p dir="ltr">In water distribution and management systems, accurate flow measurement across a wide range is crucial for efficient resource utilization and conservation. The UFM-01 serves this exact purpose by allowing users to measure flow rates across a wide range. This precise measurement capability supports effective water management strategies, enabling operators to promptly identify inefficiencies and implement corrective actions.&nbsp;</p><p dir="ltr">The UFM-01 helps both households and industries to conserve water, reduce waste, and optimize the distribution of this vital resource. For instance, the UFM-01 supports applications like smart faucets that dispense exact volumes of water for cooking and cleaning, as well as irrigation systems that deliver water based on real-time soil moisture levels. Similarly, in tankless water heaters, the sensor measurements are used to ensure that hot water is delivered only when needed, avoiding the energy waste of maintaining a hot water tank. In this way, the UFM-01 not only helps save water but also supports broader environmental goals by reducing energy consumption and lowering carbon footprints.</p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dii" style="width: 822px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI0MTM2MDY2MzQ1LTE3MjQxMzYwNjYzNDUucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" width="477" height="318" id="isPasted" class="fr-fic fr-dii"><span class="fr-inner">Figure 2: Kitchen setting with tap water Ultrasonic flow module. Source: ScioSense.com</span></span></span></p><h2 dir="ltr">Coolant Systems</h2><p dir="ltr">The UFM-01 is an ideal choice to monitor coolant flow in industrial processes. Coolant systems are critical for maintaining the proper temperature of machinery and processes, and any disruption in coolant flow can lead to overheating equipment damage or process inefficiencies. In this regard, UFM-01's dual capability of providing flow rate as well as temperature measurements provides users with a complete picture of coolant systems, allowing for real-time adjustments to maintain optimal thermal management and preventing costly downtime.</p><h2 dir="ltr">Food and Beverage Processing</h2><p dir="ltr">In food and beverage processing, maintaining cleanliness and safety is paramount. The UFM-01 is particularly suited for the food and beverage industry as it measures flow without direct contact with the fluid, eliminating the risk of contamination and providing a hygienic and non-intrusive environment. This feature is crucial in applications such as beverage dispensers, coffee machines, and other food-grade systems, where even minimal contamination can lead to significant quality and safety issues.</p><h1 dir="ltr">Benefits for Engineers</h1><p dir="ltr">The UFM-01 ultrasonic flow meter is developed to provide a multitude of benefits for engineers looking to simplify the design and deployment of flow-sensing solutions.</p><h2 dir="ltr">Ease of Integration&nbsp;</h2><p dir="ltr">UFM-01 is designed by prioritizing user-friendliness as it comes equipped with standard mechanical and communication interfaces to ensure seamless integration into existing systems. This sensing unit is equipped with a versatile 5-pin connector, a spool piece, and a serial communication module, making it adaptable to diverse application needs. A key feature that simplifies installation is the inclusion of a standard BSP ½" thread, which allows for simple and secure attachment to water lines. These standard interfaces and mounting options enable the UFM-01 to accelerate the development process, allowing engineers to bring products to market more swiftly and with fewer integration challenges.</p><h2 dir="ltr">Food-Grade Applications</h2><p dir="ltr">The UFM-01 is designed for use with food-grade material, making it ideal for applications involving consumable products. This feature is critical for industries such as food and beverage, pharmaceuticals, and biotechnology, where stringent safety and hygiene standards are imperative. Moreover, the sensor is engineered to function effectively in drinking and non-drinking-water systems, withstanding temperatures ranging from 1 to 60°C. Engineers can confidently deploy the UFM-01 in environments where product safety is paramount, knowing that it meets regulatory requirements and protects consumer health.</p><h2 dir="ltr">Enhanced Precision and Reliability</h2><p dir="ltr">The UFM-01 excels in delivering high accuracy and reliability in flow measurements. The advanced ultrasonic technology of UFM-01 provides precise readings, even in challenging environments. Moreover, since it is constructed with no moving, it offers an unlimited lifetime if operated in accordance with the specifications mentioned in the <a href="https://www.sciosense.com/wp-content/uploads/2024/07/UFM-01-Datasheet.pdf" target="_blank" data-lf-fd-inspected-kn9eq4roawkarlvp="true">datasheet.</a> For engineers, this reliability translates into lower operational costs and enhanced trust in the performance of their designs.</p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1724224203327-shutterstock_2200033193.jpeg" style="width: 832px;" class="fr-fic fr-dib"><span class="fr-inner">Figure 3. &nbsp;Pool maintenance using advanced sensors. Source: Shutterstock.</span></span></span></p><h2 dir="ltr">Maintenance</h2><p dir="ltr">Another huge benefit for engineers using UFM-01 is that its design eliminates the need for regular maintenance, providing a hassle-free solution for long-term operation. The risk of failure is significantly reduced due to the absence of moving parts, minimizing the likelihood of breakdowns. This also translates to a longer lifespan and high accuracy over time, lowering operational costs while ensuring reliable performance throughout the sensor's life.</p><p dir="ltr"><strong>The Developers of UFM-01 Ultrasonic Flow Sensing Module<br></strong>The manufacturer behind UFM-01 technology is <a href="https://www.sciosense.com/about/" target="_blank">ScioSense</a>, a leading innovator in sensor technology dedicated to providing cutting-edge solutions that address the evolving needs of various industries. ScioSense has established itself as a trusted partner for engineers and developers seeking advanced sensing capabilities with a strong reputation for quality and reliability. Their team has 30 years of combined experience in the semiconductor industry, and their UFM-01 Ultrasonic Flow Sensing Module is a testament to their commitment to delivering exceptional products that enhance system performance and efficiency.</p><h1 dir="ltr">Call to Action</h1><p dir="ltr">UFM-01 Ultrasonic Flow Sensing Module is a great option for engineers looking for a reliable and efficient flow measurement sensor. Whether working on water management systems, control devices, or food processing equipment, the UFM-01 offers a reliable and accurate solution for flow measurement. To learn more, request a sample, or provide feedback on the module, visit ScioSense's <a href="https://www.sciosense.com/ufm-01-ultrasonic-flow-sensing-module/" target="_blank">website</a>. This is just the first iteration, and the company is keen for engineers to share their needs and ideas with them.</p><h1 dir="ltr">&nbsp;References</h1><ol><li dir="ltr"><p dir="ltr">UFM-01 Ultrasonic Flow Sensing Module. ScioSense [Online], Available at: <a href="https://www.sciosense.com/ufm-01-ultrasonic-flow-sensing-module/" target="_blank">https://www.sciosense.com/ufm-01-ultrasonic-flow-sensing-module/</a></p></li><li dir="ltr"><p dir="ltr">Check your flow to save water and energy. ScioSense [Online], Available at: <a href="https://www.sciosense.com/check-your-flow-to-save-water-and-energy/" target="_blank">https://www.sciosense.com/check-your-flow-to-save-water-and-energy/</a>&nbsp;</p></li></ol>

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Nordic Semiconductor-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Nordic Semiconductor-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Nordic Semiconductor-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Nordic Semiconductor-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Nordic Semiconductor-Tue Oct 31 2023 23:59:59 GMT+0200 (Eastern European Standard Time)

Alif Semiconductor-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

Alif Semiconductor-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Alif Semiconductor-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Alif Semiconductor-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Alif Semiconductor-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Nordic Semiconductor

The Linley Group-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

The Linley Group-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

The Linley Group-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

The Linley Group-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

The Linley Group-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

USound GmbH-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

USound GmbH-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

USound GmbH-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

USound GmbH-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

USound GmbH-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Intrinsic ID-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

Intrinsic ID-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Intrinsic ID-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Intrinsic ID-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Intrinsic ID-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Renesas Electronics-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

Renesas Electronics-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Renesas Electronics-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Renesas Electronics-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Renesas Electronics-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

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semiconductors

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