When a leading INDEX multi-spindle machine encountered significant challenges with chip removal, tool life, and coolant management, the introduction of a custom 3D-printed coolant ring provided an innovative solution that dramatically improved performance.The Challenge: Poor Chip Removal and Inconsistent Coolant CoverageThe machining process on an <a href="https://www.index-group.com/en_us/company/about-us/index-corporation" target="_blank" rel="noopener noreferrer">INDEX</a> multi-spindle machine was being compromised by poor chip removal, leading to shortened tool life and heightened fire risks. These issues stemmed from inconsistent coolant coverage, which was exacerbated by the machine’s compact design. Standard coolant nozzles were difficult to install due to limited space, and accessing tools with the probe was challenging. Moreover, operators were required to manually remove coolant lines during each tool change, introducing delays and variability that depended on the skill and experience of the operator.This situation not only reduced the efficiency of the machining process but also posed safety risks, making it clear that a more reliable and effective solution was needed. The Solution: A Custom Metal 3D-Printed Coolant RingTo address these challenges, the engineering team designed a custom metal 3D-printed coolant ring with internal channels optimized for efficient coolant flow. <a href="https://oneclickmetal.com/boldseries/" target="_blank" rel="noopener noreferrer">Metal 3D printing</a> was chosen for its ability to produce highly customized parts that precisely meet the stringent specifications required for this application.The coolant ring was engineered to withstand coolant pressures of up to 40 bar, resist oil, and ensure non-flammability. It was fabricated from non-toxic, non-corrosive materials to maintain an absence of contaminants throughout its life cycle. The design also ensured that the coolant ring was easy to install, space-saving, and allowed for easy probe accessibility.The coolant oil is directed through an adapter block into the inlet of the coolant ring. Inside the ring, the oil flows uniformly, being dispensed evenly from three openings to ensure precise delivery to the tool's tip. This design not only improved coolant coverage but also enhanced process stability, as the coolant ring could be removed and reattached independently of the operator, significantly reducing the time required for tool changes.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1730200060177-Coolant+ring.jpg" style="width: 487px;" class="fr-fic fr-dib">The Benefits: Enhanced Efficiency, Safety, and Tool LifeThe introduction of the custom 3D-printed coolant ring brought numerous benefits to the machining process:<ol><li data-list-indent="1" data-list-type="bulleted">Better Chip Removal: The optimized design of the coolant ring ensured consistent and effective coolant flow, greatly improving chip removal and reducing the risk of tool damage.</li><li data-list-indent="1" data-list-type="bulleted">Increased Tool Life by a Factor of 20: With improved coolant coverage and chip removal, the tool life was extended dramatically, reducing the frequency of tool changes and lowering operating costs.</li><li data-list-indent="1" data-list-type="bulleted">Improved Process Stability: The ability to remove and reattach the coolant ring without relying on the operator reduced variability and enhanced overall process stability.</li><li data-list-indent="1" data-list-type="bulleted">Three Times Faster Tool Change Time: The streamlined design and ease of reattachment allowed for much quicker tool changes, tripling the speed of this critical process and further enhancing productivity.</li><li data-list-indent="1" data-list-type="bulleted">Safer Manufacturing Environment: The consistent coolant coverage and improved chip removal minimized the risk of fire, contributing to a safer working environment.</li></ol>Conclusion: A Custom Solution for Optimized PerformanceThe integration of a custom metal 3D-printed coolant ring into the INDEX multi-spindle machine represents a significant advancement in machining efficiency and safety. By leveraging the capabilities of metal 3D printing, the engineering team was able to overcome the limitations of traditional coolant systems, providing a solution that not only met but exceeded the demands of the application. This case study highlights the transformative potential of 3D printing in creating tailored solutions that enhance the performance and reliability of critical manufacturing processes.

In the world of precision machining, efficiency and reliability are paramount. This case study explores the challenge, solution, and benefits of integrating a metal 3D-printed coolant ring into the machining process.

Improving Efficiency with Customized 3D-Printed Coolant Rings

Schematic Drawing - Design of Electronic Circuit Board

In this technical article, we will explore what are schematics, their purpose, diverse types, critical applications and how to read and interpret them effectively.

What Are Schematics: The Blueprint Language of Engineering Decoded

While the 3D printer itself plays a significant role, the parameters used during the printing process are equally important. This article dives into four critical factors:&nbsp;layer thickness,&nbsp;laser power,&nbsp;scan speed, and&nbsp;hatch distance. Let’s break them down, how they work, and why they matter. 1. Layer Thickness: The Foundation of Detail and StrengthLayer thickness refers to the height of each individual layer of material that is deposited during the printing process. In metal 3D printing, this is typically measured in microns (µm). A smaller layer thickness results in finer detail and smoother surfaces but increases the printing time. Conversely, a larger layer thickness speeds up the process but may result in reduced resolution and potentially weaker bonding between layers.Imagine you are printing a small, intricate part, like a turbine blade. In this case, precision and surface quality are key, so you would use a smaller layer thickness, maybe around 20µm. This ensures that the part’s fine edges and smooth surfaces are accurately captured. However, if you're printing a larger, less detailed object like a simple block for structural support, you might choose a larger layer thickness, such as 50µm, to speed up the process without sacrificing too much in terms of quality. 2. Laser Power: The Fuel Behind the ProcessLaser power determines how much energy is used to melt and fuse the metal powder in each layer. The laser essentially traces the shape of the part, melting the powder in specific areas. The higher the laser power, the more energy is applied to the material.However, laser power must be carefully balanced. Too much power can cause problems, such as excessive heat, which can lead to defects like warping or "mold formation" (unwanted structures due to overheating). On the other hand, too little power may result in incomplete melting, which creates weak or porous parts that can easily break under stress.Consider printing a dense, durable part, like a component that will be used in an engine. You’d want to use enough laser power to ensure the metal fuses solidly. But for lightweight parts, where speed is prioritized, you might opt for a lower power setting, ensuring sufficient bonding while avoiding unnecessary energy use and minimizing defects. 3. Scan Speed: The Dance of Precision and EfficiencyScan speed refers to how quickly the laser moves across the powder bed during printing. Like the other parameters, scan speed must be finely tuned for different materials and designs. Faster scan speeds lead to quicker production, but if the laser moves too fast, it might not deposit enough energy into the material, resulting in poor bonding. If the scan speed is too slow, it can lead to excessive energy deposition, which can cause defects similar to those from high laser power, such as warping.For example, if you are working with a highly conductive material like aluminum, which requires more energy to fuse properly, a slower scan speed may be beneficial. This allows the laser to apply enough energy to melt the material fully. In contrast, for materials that require less energy, like titanium, you can afford to increase the scan speed, reducing production time without compromising quality. 4. Hatch Distance: Bridging the GapsHatch distance is the distance between adjacent scan lines as the laser moves across the powder bed. Picture the process like mowing a lawn. The laser creates paths or "lanes" as it melts the powder, and the hatch distance controls how much overlap there is between these lanes. Too large a hatch distance can leave un-melted gaps, reducing the density and strength of the part. Too small a hatch distance leads to excessive overlap, which can cause excessive heat buildup, resulting in defects similar to those caused by too much laser power or slow scan speed.Finding the right hatch distance is a balancing act. For parts requiring high density and mechanical strength, like those used in critical aerospace applications, reducing the hatch distance ensures consistent layer bonding and part integrity. But for less critical parts where speed and cost-efficiency are more important, increasing the hatch distance can significantly cut down on build time and material consumption. The Art of Balancing ParametersThese four parameters—layer thickness, laser power, scan speed, and hatch distance—don’t exist in isolation. They interact with each other, meaning that changes to one parameter can affect the others. For example, increasing the laser power might allow for a faster scan speed or a larger hatch distance, but it could also increase the risk of defects if not balanced properly.Achieving the right combination of settings depends heavily on the material being used and the specific goals of the project. For example, a manufacturer aiming for high-density parts may focus on optimizing hatch distance and layer thickness to reduce voids. Conversely, someone seeking faster production times might prioritize scan speed and layer thickness, adjusting laser power and hatch distance accordingly. <iframe width="640" height="360" src="https://www.youtube.com/embed/4uoPwWQviqc??si=PP0ym8aTxoXmADWw&amp;wmode=opaque&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe>

Metal 3D printing requires precise control over a variety of parameters to achieve high-quality parts. Whether you're printing aerospace components, medical devices, or complex machinery, understanding the core settings that influence the outcome is crucial. Lets talk about the most important ones.

Importance of Parameters for Metal 3D printing

Metal 3D printing has long been synonymous with industrial applications, powering advancements in sectors like aerospace, automotive, and medical engineering. But its scope reaches far beyond heavy-duty components. A prime example is the drone frame project by designer Till Blaser, which leverages metal additive manufacturing and generative design to create a lightweight, complex, and functional drone frame. This project illustrates the technical possibilities for engineers when combining cutting-edge design software with metal 3D printing technologies.The Engineering Challenge: Designing a Lightweight, Structurally Sound Drone FrameThe drone project centered around a key challenge: developing a drone frame that minimized weight without sacrificing structural integrity. Traditional methods would have been impractical due to the frame’s complex geometry and the demand for rapid prototyping. The design needed to withstand the stresses of flight, optimize battery life, and support payload capacity—all within stringent weight constraints.The Solution: Generative Design Meets Metal Additive ManufacturingTo meet these goals, Blaser utilized <a href="https://www.autodesk.com/asean" target="_blank" rel="noopener noreferrer">Autodesk</a> Fusion 360’s generative design capabilities, which allowed him to explore various optimized design iterations based on strength, material usage, and aerodynamics. The result was a highly optimized, bionic structure that would be near-impossible to manufacture conventionally.The frame was manufactured using Laser Powder Bed Fusion technology, which employed a <a href="https://oneclickmetal.com/boldseries/" target="_blank" rel="noopener noreferrer">One Click Metal printer</a> with 200W fiber laser to fuse fine layers of metal powder with exceptional precision. <a href="https://oneclickmetal.com/powder-management/" target="_blank" rel="noopener noreferrer">StrengthAl</a>, a high-performance aluminum alloy, was selected due to its excellent strength-to-weight ratio, providing structural robustness with minimal mass. The final frame weighed only 59 grams yet maintained strength properties comparable to titanium—a key achievement for the drone’s performance.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729491567617-Drone.jpg" style="width: 100%px;" class="fr-fic fr-dib"> Technical Advantages of Metal 3D Printing for This Project<ol><li data-list-indent="1" data-list-type="bulleted">Weight Reduction: By using StrengthAl and generative design, the frame was optimized for minimal mass without compromising strength. At 59 grams, it allowed for superior flight efficiency and agility, reducing energy consumption during operation.</li><li data-list-indent="1" data-list-type="bulleted">Complex Geometries and Design Freedom: Metal 3D printing unlocked geometric freedom that is impossible with traditional methods. The frame’s intricate, bionic design was printed as a single unit, eliminating the need for joints or fasteners, which are often weak points in assemblies.</li><li data-list-indent="1" data-list-type="bulleted">Fast Development Cycles: One of the standout benefits was the rapid iteration cycle. Generative design coupled with metal AM enabled quick adjustments and testing. The entire build process, which involved printing three drone frames simultaneously, was completed in just 36 hours. This reduced time-to-market significantly compared to traditional prototyping processes.</li><li data-list-indent="1" data-list-type="bulleted">Precision and Surface Quality: LPBF ensured that even the most delicate design features were reproduced with high precision. Post-processing steps such as support removal and sandblasting not only improved the frame’s surface finish but also contributed to its aesthetic appeal without compromising structural function.</li></ol>The Role of Post-ProcessingPost-printing, the drone frame underwent several steps to refine its final appearance and performance. Support structures were carefully removed, and sandblasting was applied to smooth out the surface, improving both aesthetics and functionality. This step is crucial for aerospace-like applications where surface quality can affect aerodynamic performance.Expanding the Use of Metal 3D PrintingThis project serves as a strong case for the potential of metal 3D printing in more consumer-focused designs. By combining Autodesk Fusion 360 and advanced metal AM, the drone frame demonstrated how generative design and metal 3D printing can deliver highly efficient, functional, and visually appealing products quickly. The speed and flexibility provided by this technology open up new avenues for engineers to create components that meet strict performance standards while also pushing the boundaries of design.

Leveraging metal 3D printing and generative design, this drone project showcases the potential for lightweight, complex structures optimized for performance and manufacturability.

Producing a Drone with Metal 3D Printing

<h2 dir="ltr" id="isPasted">Introduction</h2>Ever wondered how collaboration could transform hardware development? In an industry where precision, reliability, and scalability are critical, the arrival of collaborative tools is not just an improvement—it's a revolution. Enter <a href="https://allspice.io" target="_blank">AllSpice</a>.io, a pioneering platform designed to bridge the gap between the tried-and-tested methodologies of software development and the specific needs of hardware engineering.AllSpice allows the hardware developer community to <a href="https://content.allspice.io/en-us/git-for-hardware-guide" target="_blank">harness the power of advanced version control systems</a> like <a href="https://git-scm.com" target="_blank">Git</a>, which have long been the backbone of software development. This integration brings a new era of collaboration, reducing errors, speeding up development cycles, and fostering innovation by connecting minds and ideas in ways previously deemed impractical.This article is the first in a series exploring how platforms like AllSpice reshape hardware development. This series will explain the <a href="https://allspice.io/post/why-use-git-for-hardware-pros-cons" target="_blank">benefits</a> of adopting software-centric approaches, discuss strategies for managing large-scale projects, and illustrate how embracing these tools can lead to unprecedented growth and efficiency in hardware engineering.<hr>This article is part of <a href="https://www.wevolver.com/article/the-future-of-hardware-development-collaborative-tools-and-techniques/" target="_blank" rel="noopener noreferrer">The Future of Hardware Development</a>, a series featuring insights into how cutting-edge collaborative platforms transform traditional hardware development workflows, integrating advanced version control systems and paving the way for more efficient, error-free project management.<hr><h2 dir="ltr">Challenges in traditional hardware development</h2>Traditional hardware development is characterized by a more linear and isolated approach. In this process, hardware engineers and pcb designers typically work in distinct phases without continuous integration of changes or updates. Each team member may work on separate components of the hardware, using manual methods to track changes and document versions, often through physical logs or localized digital files.Communication between team members is generally handled through meetings, phone calls, or emails. This can lead to delays in sharing important updates, resulting in inefficiencies and the potential for errors when integrating different components of hardware projects.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3MTg5MTA3OTQzLWltYWdlNCAoMSkucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib" alt="traditional-hardware-design-cycle">Current hardware design release cycle<a href="https://allspice.io/post/revision-control-concepts-git-for-hardware" target="_blank">Managing different revisions</a> and dealing with conflicts in design changes becomes cumbersome. Hardware engineers manually merge changes, which can lead to oversight and discrepancies in the final product. Testing and debugging also become more challenging as tracking the origin of errors is difficult without a clear record of changes.Overall, the traditional hardware development process is slow, with higher risks of project delays and increased costs due to less efficient communication.<h2 dir="ltr">Understanding version control in hardware development</h2>Version control has historically enabled software developers to manage changes to source code systematically, ensuring traceability and facilitating collaboration. Its significance extends beyond mere file management; it serves as an audit trail for the <a href="https://allspice.io/post/parallelism-hardware-development-lifecycles-vs-software" target="_blank">project lifecycle</a>, a necessity equally applicable to hardware development.<h3 dir="ltr">Hardware design without version control</h3>In hardware design, the absence of version control can lead to numerous operational inefficiencies. Common issues include version confusion, where team members inadvertently work on outdated designs or worse, overwrite each other’s progress. Miscommunication is another frequent challenge, compounded by the physical nature of hardware designs that cannot be "merged" as easily as lines of code. These problems are exacerbated in environments that rely on manual tracking systems, leading to data loss and significant delays in project timelines.<h3 dir="ltr">Adapting version control for hardware</h3>Adapting hardware version control requires rethinking its application to accommodate the unique needs of physical product development. Unlike software, hardware development processes involve multiple dimensions of change management, including iterative physical prototypes and their corresponding digital representations. This complexity necessitates a robust system that handles diverse file types, from CAD designs to electrical schematics.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3MTg4Njc0NzgyLWltYWdlNi5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib" alt="git-model-for-version-control">This Git model for version control shows feature&nbsp;<a href="https://allspice.io/post/pushing-branching-in-git-for-hardware" target="_blank" rel="noopener noreferrer">branches</a> diverging from the main line for independent development of new features, which are then merged back and tagged at significant release points like v0.1, v0.2, and v1.0. Each branch allows engineers to work on specific features without compromising the stability of the main branch.These systems must support large binary files and provide tools that allow engineers to visualize differences between file versions, a crucial feature often taken for granted in software development. Moreover, the integration of these systems with hardware-specific tools and platforms ensures that all components of a product's development are synchronized and documented.<h3 dir="ltr">Benefits of version control in hardware</h3>The benefits of employing version control in hardware development are manifold. It enhances traceability, allowing teams to track every change made to a design file and understand the reasoning behind each decision. Furthermore, hardware version control fosters a collaborative environment by facilitating a clear and structured workflow. Engineers can work in parallel without the risk of conflicts, speeding up the development process while maintaining the integrity of the design.<h2 dir="ltr">The shift towards collaboration in hardware development</h2>In hardware development, traditional, siloed approaches are increasingly considered outdated and inefficient. As projects escalate in complexity and scale, integrating collaboration tools has become critical to <a href="https://allspice.io/post/7-reasons-why-hardware-teams-are-adopting-git" target="_blank">streamline processes</a> and bridge the gaps between different engineering disciplines.<h3 dir="ltr">Limitations of traditional hardware design</h3>Traditionally, hardware development teams often operate in isolation, focusing on specific components without a unified view of the entire project. This isolation can lead to duplicated efforts, inconsistencies across components, and significant delays in project timelines. A common issue in such environments is the misalignment between physical prototypes and their digital counterparts, resulting in costly and time-consuming <a href="https://allspice.io/post/why-digital-design-reviews-are-replacing-so-many-in-person-ones" target="_blank">revisions</a>.<h3 dir="ltr">Emergence of collaborative tools</h3>The digital transformation in manufacturing and design has brought in a new set of collaborative tools. These tools leverage advanced technologies like cloud computing and real-time data synchronization to allow for the real-time sharing, updating, and management of design files. This shift facilitates a more dynamic workflow and supports a more integrated approach to hardware development.<h3 dir="ltr">Benefits of collaborative hardware development</h3>Collaborative tools significantly enhance efficiency by enabling real-time updates and feedback, which reduce the cycle time from design to production. They also improve accuracy and consistency across various stages of development, helping to prevent errors that stem from miscommunication. Moreover, collaborative environments foster innovation and creative problem-solving by bringing diverse perspectives together, which is essential in developing cutting-edge hardware solutions.<h2 dir="ltr">AllSpice: integrating hardware development with Git</h2>Integrating software version control systems like Git into hardware development processes marks a pivotal advancement in the field. AllSpice is a hardware development platform for hardware engineers, PCB designers, and electrical engineers that harnesses this powerful idea to bring <a href="https://www.atlassian.com/devops/what-is-devops/agile-vs-devops" target="_blank">agile and DevOps</a> practices with unprecedented efficiency and <a href="https://allspice.io/post/let-s-chat-hardware-product-development-collaboration-and-documentation" target="_blank">collaboration to hardware projects.</a><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3MTg4NzM1NTY2LWltYWdlMS5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib" alt="allspice-demo-orcad-arduino-uno-clone">An AllSpice demo project for an OrCAD designed&nbsp;<a href="https://hub.allspice.io/AllSpice-demos/KiCAD-Demo" target="_blank" rel="noopener noreferrer">Arduino UNO</a> clone illustrating the platform's functionality<h3 dir="ltr" id="isPasted">Why Git for hardware?</h3><a href="https://allspice.io/post/why-git-is-good-for-hardware-development" target="_blank">Git</a> has revolutionized software development by enabling multiple developers to work simultaneously on the same project with minimal conflicts. This system, primarily designed for managing code, can also be adapted to handle the complex file structures and binary files commonly found in hardware development.<h3 dir="ltr">AllSpice’s unique adaptation</h3>AllSpice takes the core functionalities of Git and tailors them to the specific needs of hardware engineers. This adaptation involves enhancing Git’s capability to handle large binary files and providing intuitive tools that allow hardware developers to visualize changes in designs, much like software developers view code differences.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3MTg4NzY2MjAzLWltYWdlMi5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 832px;" class="fr-fic fr-dib" alt="allspice-platform-git">By leveraging a system similar to Git, AllSpice allows hardware developers to efficiently manage revisions, track changes, and collaborate on projects with ease<h3 dir="ltr" id="isPasted">Core&nbsp;<a href="https://allspice.io/features" target="_blank">features</a> of AllSpice</h3>Version control for hardware designs:&nbsp;AllSpice enables precise tracking and management of changes in hardware designs, ensuring that every modification is recorded and retrievable.Collaborative design reviews:&nbsp;With integrated tools for commenting and discussion, AllSpice allows teams to conduct thorough design reviews in real-time, enhancing the quality and accuracy of the final product.Integration with various tools:&nbsp;AllSpice seamlessly&nbsp;<a href="https://learn.allspice.io/docs/todo-before-your-onboarding-2?highlight=ecad" target="_blank">integrates</a> with popular ECAD tools like KiCAD, Altium, OrCAD, Allegro, and more, allowing engineers to use familiar software while benefiting from enhanced version control and collaboration features.By integrating these features, AllSpice streamlines the workflow and significantly enhances collaboration among team members. It enables hardware teams to work in parallel without the risk of overwriting each other’s work.The implementation of AllSpice in hardware projects brings a level of organization and efficiency that parallels what has been achieved in software development for years. It simplifies the complex process of managing hardware designs, ensures greater accuracy, and fosters a collaborative environment essential for innovation in today's hardware industry.Visit&nbsp;<a href="https://allspice.io/" target="_blank">AllSpice’s official website</a> today to explore how the platform can streamline your hardware development process.<h2 dir="ltr">Conclusion</h2>The traditional hardware development process, characterized by a patchwork of specialized but isolated tools, presents substantial challenges. These include disjointed data management, communication breakdowns, and inefficient workflows, which collectively hinder project progress and amplify the risk of errors. The difficulties in maintaining consistency across various platforms create a necessity for a more integrated approach.&nbsp;By embracing a unified platform that consolidates all aspects of hardware development, teams can enhance collaboration, streamline operations, and improve overall project outcomes. This shift not only optimizes the development cycle but also positions <a href="https://allspice.io/case-studies" target="_blank">teams</a> to better meet the demands of increasingly complex projects, ensuring that innovation continues at a brisk pace without sacrificing quality or efficiency.This series highlights how tools like AllSpice revolutionize hardware development, merging robust version control with dynamic collaboration capabilities. As we've explored, AllSpice enhances efficiency, reduces errors, and fosters innovation across diverse teams.<hr>Download the eBook, '<a href="https://allspice.io/implementing-git-for-hardware-in-30-days" target="_blank">Implementing Git in 30 Days</a>,' to start transforming your hardware development process today.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3MTg4NzkzMzAyLWltYWdlMy5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib" alt="allspice-implementing-git-for-hardware-in-30-days-banner">

The fragmented nature of traditional hardware development tools calls for the adoption of a unified, technology-driven approach that integrates robust version control systems like Git alongside methodologies similar to agile and DevOps to streamline processes and enhance team collaboration. 

The Future of Hardware Development: Collaborative tools and techniques

Discover the critical role of in-circuit testing in modern engineering, exploring its foundational principles, technological advancements, and real-world applications.


What Is In-Circuit Testing? An Essential Guide for Engineers

3D printed fixtures play a key role in agile production workflows, but designing them can eat up valuable time and resources.Additive manufacturing (also known as 3D printing) is invaluable for executing agile production workflows, which are based on the ability to adapt to changing customer demands and new product designs. 3D printing has proven useful not only for creating small-batch end-use parts but also for enabling established production workflows to be supported by fixtures and other manufacturing aids customized to specific products.However, while additive technologies have allowed manufacturers to streamline the production of bespoke fixtures, designing these fixtures has proven to be something of a bottleneck, requiring an in-house expert in CAD design to dedicate hours to designing these vital components. Fortunately, advances in design software tools are facilitating the design process and enabling CAD designers and engineers to design optimized fixtures and production aids more rapidly, freeing up time to focus on challenging design tasks.<h2>The power of design automation</h2>trinckle is one of the software companies addressing the challenges of agile production through design automation. The German-based company was founded in 2013 with the goal of automating design processes as far as possible to leverage the full potential of f 3D printing for product development and manufacturing. In the decade since its founding, the company has delivered on this mission, developing a series of software products that support engineering teams or end users by streamlining the AM design process and making it more accessible for those with and without extensive CAD knowledge.Central to trinckle’s offering is its design automation technology, called paramate, which leverages advanced algorithms to generate designs based on simple inputs (including data sets, 3D assets, or 2D data, which can be adjusted using intuitive tools). The result is a solution that rapidly generates optimized 3D printable designs along with all necessary documentation and analytics. This technology platform can be used to multiple ends, like creating custom orthopedic devices, robotic end-of-arm-tools or—as we’ll see in more detail—fixtures.<h2 dir="ltr">fixturemate: Enabling fast custom fixtures for all</h2>To address the growing demand for 3D printed fixtures and production aids across various industries, trinckle has developed a dedicated software tool called <a href="https://www.trinckle.com/fixturemate" target="_blank">fixturemate</a>. fixturemate is a web-based application based on trinckle’s paramate engine that offers a simple and intuitive workflow for designing fixtures that can then be exported as STL files for 3D printing. Notably, fixturemate was developed so that not only can CAD specialists accelerate design turnarounds, but even those without CAD experience can create custom fixture designs in under 20 minutes.&nbsp;From a user perspective, the online tool is straightforward, simply requiring users to upload a CAD file for the workpiece and define the fixture’s baseplate (this can be standard or customized). From there, users choose the type of support structure (rectangular, cylindrical, conical, or custom) and adapt it with simple click-and-drag behavior.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE4MDMwMTc2MjgwLTEgR2VuZXJhdGVOZWdhdGl2X0lzb21ldHJpY19ibHVlIEJHLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib">trinckle’s fixturemate application streamlines the design of 3D printed fixtures using design automation.Next, fixturemate creates a negative of the product geometry in the structure no matter how complex a free-form might be. This step ensures the 3D printed fixture will be the perfect fit for the product in question and is typically a time-consuming exercise in traditional CAD. In the final step before export, users can choose to add features and components to the fixture, including clamps, holes, cutouts, and text labels.&nbsp;<iframe id="66681d389402dfc217b12f4b" width="250" class="specs-iframe" height="440" src="https://wevolver.com/iframe/specs/trinckle-fixturemate?iframe=true" frameborder="0" scrolling="no" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true">&nbsp;</iframe>Ultimately, the software tool turns what was once a largely manual design process into a highly automated generative process that can deliver significant time and cost benefits—particularly for complex part designs. For experienced CAD users and engineers, this frees up substantial time for more complex design projects and allows for greater productivity.<h2 dir="ltr">fixturemate applications</h2>The ability to generate custom fixture designs and then 3D print them on demand means that manufacturers can benefit from greater productivity and consistency in their manufacturing workflows while still accommodating design changes on the fly. As any manufacturer will know, fixtures play a critical role in the production environments of virtually all industries—from automotive, to construction, to healthcare—helping to secure workpieces in place while they undergo all types of processing.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE4MDMwNDE5Mjk3LTBINkEwMjUzLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib">fixturemate can be used to design many types of fixtures, including assembly fixtures, machining fixtures, and carrier trays.To address the versatile needs of these industries and others, fixturemate can be used for <a href="https://www.trinckle.com/fixtures-you-can-easily-design-with-fixturemate" target="_blank">myriad production aid applications</a>, including assembly fixtures, inspection fixtures, measuring fixtures, bonding and welding fixtures, machining fixtures, tool organization trays, carrier trays, and more. As mentioned, fixturemate users can also easily integrate common features, like clamps and mountings, into the fixture design to facilitate assembly and integration into existing workflows. Moreover, users can add embossed or debossed text for easier part identification and organization.&nbsp;trinckle’s design automation solution is already being used across many industries to streamline production line setups and keep things running smoothly. The company’s customers include key players in the Automotive, Aerospace, Transport, Manufacturing, and Packaging industries.<h2 dir="ltr">Automotive case study: Audi Sport&nbsp;</h2>In the automotive space, trinckle’s fixturemate has become an indispensable tool to German car manufacturer <a href="https://www.trinckle.com/use-case/audi-sport" target="_blank">Audi Sport</a>, which relies on the software to design various fixtures at its Böllinger Höfe facility. Audi Sport started using 3D printing in 2012 at the factory, taking advantage of the technology’s agility and design freedom to produce manufacturing aids and tooling to support its automotive production. In 2019, however, as the automotive company was preparing to launch the production of the Audi e-tron GT electric car, it realized it needed a large number of new production fixtures — as many as 200 — in a short amount of time.While the company had previously designed its fixtures manually in regular CAD software—a process that could take anywhere from two to four hours per part—it now needed a more streamlined process that would enable the rapid design of the necessary fixtures for electric car production. In fixturemate, Audi Sport found the ideal solution to this challenge.<iframe width="640" height="360" src="https://www.youtube.com/embed/Hs7jnWp7jCI?&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true">&nbsp;&nbsp;&nbsp;&nbsp;</iframe>Leveraging the intuitive fixturemate software platform, Audi Sport engineers and trainees were able to design custom fixtures in under 20 minutes and send the designs directly to their in-house 3D printers. This meant that the 200 new fixtures required to get the Audi e-tron GT production up and running were made in record time.&nbsp;For example, Audi Sport<a href="https://www.trinckle.com/use-case/audi-sport" target="_blank">&nbsp;was able to rapidly iterate</a> a tool with integrated clamp holds for the pre-assembly of the vehicle’s air-conditioning compressors and cooling lines. Not only did this 3D printed fixture ensure all components were aligned during assembly, but it also reduced the need for additional staff in the assembly process, which had previously <a href="https://www.audi-mediacenter.com/en/press-releases/audi-demonstrating-3d-printing-expertise-with-in-house-design-software-in-neckarsulm-12587" target="_blank" rel="noopener noreferrer">been needed.</a><blockquote>According to Audi Sport, fixturemate enabled it to cut fixture design time from 2-4 hours to 10-20 minutes, while the combination with 3D printing reduced lead times for fixtures from six weeks to 48 hours and reduced fixture part costs by an astonishing 80%.</blockquote><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE4MDMxMjE2Mjc3LTBINkExODM2IGNvcHkuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 790px;" class="fr-fic fr-dib">AUDI Sport relies on hundreds of 3D-printed fixtures created using fixturemate at its Böllinger Höfe facility. Credit: Trinckle/AudiSportThe design automation workflow also increased Audi Sport’s production agility, allowing it to make last-minute changes without having to spend hours redesigning. Moreover, where previously only CAD experts were able to design the fixtures, fixturemate made the design process more accessible to a wider range of users, including trainees and process and production engineers. This meant that experienced CAD users were able to enlist support from other team members for greater design scalability.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE4MDMxNDg3MTA3LUZpeHR1cmUtMWEgY29weS5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib">With fixturemate, Audi Sport was able to design fixtures in as little as 10 to 20 minutes. This enabled their production team to conserve resources for more complex challenges.&nbsp;Credit: Trinckle/AudiSportSince fixturemate simply exports a printable STL file, it is also easy to use with existing 3D printing workflows. For instance, at Audi Sport’s Böllinger Höfe facility, the software is used alongside the company’s UltiMaker 3D printers and users can easily export fixture geometries from fixturemate into Cura slicer software, where additional features like infill percentage and layer height can be adjusted. From there, the 3D model is sent to one of Audi Sport’s UltiMaker machines, which creates the fixture layer by layer using Tough PLA, TPU (for fixtures with protective surfaces), ABS, PETG, or another thermoplastic material. If an assembly aid ever fails or needs replacing, it is quick and easy to 3D print a replacement.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE4MDMxNjA3OTg0LUZpeHR1cmUtM2IgY29weS5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib">fixturemate has empowered CAD experts at Audi Sport to efficiently create in-house fixtures, even for complex part geometries.&nbsp;Credit: Trinckle/AudiSport<h2 dir="ltr" id="isPasted">Get started with fixturemate</h2>Overall, trinckle’s fixturemate solution offers users an intuitive and highly accessible way to design 3D-printed fixtures. The semi-automated process, which leverages user input to generate optimized fixture geometries, can dramatically speed up lead times for tooling—from weeks to mere days or even hours—and empower a wider range of users to participate in the establishment of agile production chains.&nbsp;To learn more about trinckle’s cutting-edge software solution and its many applications, don’t miss the company’s upcoming <a href="https://bit.ly/3KBeKlz" target="_blank" rel="noopener noreferrer">webinar</a>. on 26th June.&nbsp;<table style="width: 100%;"><tbody><tr><td style="width: 100%;"><h2>Ready to design custom fixtures in minutes?</h2>Get a free 15 day trial of fixturemate software.&nbsp; Follow the link and use the code 'wevolver' <a href="https://bit.ly/3XyxXML" target="_blank" rel="noopener noreferrer" class="button-main-action">TRY IT NOW</a></td></tr></tbody></table>

Fixture design in CAD software is time-consuming – even for experienced engineers. fixturemate is an intuitive web-based software that allows anyone to design fixtures fast, whether you're familiar with CAD or not.

Design custom 3D printed fixtures in under 20 minutes without CAD complexity

Prior to actually 3D printing a component, it is necessary to create a 3D model of the part. Typically, these models are designed in Computer-Aided Design (CAD) software, which enables users to manipulate and build shapes in three dimensions. However, it isn’t possible to send the part directly from <a href="https://www.wevolver.com/article/how-to-design-stl-files-for-3d-printing-in-your-cad-program" target="_blank" rel="noopener noreferrer">CAD software</a> to the 3D printer: the model must be exported as a file and subsequently imported into slicing software. The model must therefore be exported as a 3D printer file format, which is legible by slicing programs and can be converted into <a href="https://www.wevolver.com/article/your-guide-to-3d-printing-g-code" target="_blank" rel="noopener noreferrer">g-code</a>.&nbsp;Today, there are several different file types compatible with 3D printers, each of which has its unique properties and benefits. In this article, we’ll be covering the most common options for 3D printer file formats and answering some key questions that makers and professional users may have on the topic.<h2 dir="ltr">Common 3D printer file formats</h2>3D printer file formats serve as an interface between digital design and the manufacturing process that turns 3D models into physical parts. They encode various properties of a 3D printed model, including its geometry, textures, colors, and potentially more, which can then be understood by slicer programs that generate the build instructions for the 3D printer (these instructions are known as g-code). Ultimately, 3D printer file formats ensure that the intricate details of a design are accurately translated into a physical form, making them indispensable in the realm of 3D printing.There are several different file formats compatible with 3D printing, some of which are more universally applicable than others, and some of which can encode more 3D model properties. The encoding methods also vary, with STL using ASCII or binary encoding, while 3MF files utilizes a package of XML files to comprehensively describe a model, ensuring high compatibility with modern 3D printing technologies.<h3 dir="ltr">STL&nbsp;</h3>The most common file format for 3D printing remains STL (Stereolithography). This file type, the native format of 3D Systems’ SLA 3D printing technology, is regarded for its universal compatibility with slicer programs and is suitable for many applications.[1] STL is among the simpler file formats as it only encodes the surface geometry of a 3D print (no texture or color properties) using triangular facets. This means that STL file formats are generally smaller than file formats that include more 3D model data and are thus faster to process. On the other hand, STL files can be limited for multi-color or multi-material 3D prints.<h3 dir="ltr">OBJ</h3>OBJ is a more advanced 3D printer file format that is also broadly used in the 3D printing industry as well as for 3D graphics in video game design, architectural design and more. In fact, the file format was originally developed for animation software by Wavefront Technologies in the 1990s.[3] In addition to surface geometry data, OBJ files also contain information about texture and color. For that reason, OBJ is a good option for multi-color 3D printing techniques as well as for models that require very high resolutions and precision.<h3 dir="ltr">AMF</h3>Additive Manufacturing File (AMF) format is an XML-based open standard that contains detailed information about the material, color, and more, allowing for more advanced printing options. This file type was specifically developed for 3D printing technologies by the American Society for Testing Materials (ASTM) in 2011 to improve on STL’s limitations.[1] Specifically, it uses the same triangular tessellation approach as SLS but also integrates curves, which allow for greater design fidelity. While AMF is compatible with most slicers, not all CAD programs are able to open or export AMF files.&nbsp;<h3 dir="ltr">3MF</h3>3D Manufacturing Format (3MF) is a more recent file format designed to solve the limitations of other file formats, supporting full-fidelity 3D objects by including information about colors, textures, and print attributes. The file format was developed by the 3MF Consortium (comprising many members like Autodesk, 3D Systems, HP, EOS, and Stratasys) with the aim of establishing a standardized file format across the additive industry.[2]<div dir="ltr" align="left"><table><tbody><tr><td>Feature</td><td>STL</td><td>OBJ</td><td>AMF</td><td>3MF</td></tr><tr><td>Geometry</td><td>Basic</td><td>Advanced</td><td>Advanced</td><td>Advanced</td></tr><tr><td>Color</td><td>No</td><td>Yes</td><td>Yes</td><td>Yes</td></tr><tr><td>Texture</td><td>No</td><td>Yes</td><td>No</td><td>Yes</td></tr><tr><td>Print Attributes</td><td>No</td><td>No</td><td>Yes</td><td>Yes</td></tr></tbody></table></div>There are also other file formats (not specific to 3D printing) that can be used with the technology, including FBX (Filmbox), PLY (Polygon File Format), and VRML (Virtual Reality Modeling Language).Recommended reading: <a href="https://www.wevolver.com/article/what-is-3d-printing-a-comprehensive-guide-to-its-engineering-principles-and-applications" target="_blank" rel="noopener noreferrer">What is 3D Printing: A Comprehensive Guide to its Engineering Principles and Applications</a><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1715674797041-student_learning_3d_printing.jpg" width="624" height="459" class="fr-fic fr-dii" alt="Man looks at 3D model and 3D printer">Once a 3D model is exported from CAD software it can be uploaded into a slicer program for 3D printing.<h3 dir="ltr">Recent Developments in 3D Printing File Formats</h3>It is worth noting that there are continual advancements to 3D printer file formats. For instance, recent advancements in 3D printing file formats have significantly enhanced their functionality, particularly in terms of material properties and metadata support. These improvements allow for more precise control over material distribution and characteristics, which are crucial for creating complex and functional objects. Additionally, updates in software algorithms have facilitated these advancements, enabling more efficient processing and better integration with 3D printing hardware. These developments not only improve the quality of printed objects but also expand the possibilities for innovation in additive manufacturing.<h2 dir="ltr">How 3D printer file formats are used</h2>Selecting what 3D printer file format to use is important and the decision should take into account various factors like 3D model properties, the type of 3D printing technology being used, the resolution required, material properties, and application type. Here are a few examples of how the different file formats can and are used across industrial applications:<ul><li dir="ltr">Aerospace: High-resolution formats like 3MF are chosen to handle complex geometries and precise material properties essential for aerospace components, which must withstand extreme conditions.</li><li dir="ltr">Automotive: Formats like STL and OBJ are commonly used for rapid prototyping of automotive parts, where speed and material efficiency are prioritized.</li><li dir="ltr">Healthcare: AMF and 3MF formats, which support detailed metadata, are preferred for creating customized prosthetics and anatomical models that require exact material gradients and color specifications.</li></ul>These examples illustrate how the selection of file formats is tailored to enhance manufacturing processes by aligning with the technical requirements of each project.Recommended reading:&nbsp;<a href="https://www.wevolver.com/article/your-guide-to-3d-printing-g-code" target="_blank" rel="noopener noreferrer">Your Guide to 3D Printing G-Code</a><h2 dir="ltr">Navigating Challenges: Technical Considerations</h2>Addressing compatibility and standardization issues is a significant challenge in the realm of 3D printing. Different 3D printers and slicer programs can require specific file formats, which can lead to compatibility problems when sharing files between various machines or software.Fortunately, efforts to standardize, through file formats like 3MF, aim to address these issues by providing a comprehensive format that can be universally accepted by various 3D printers.Another technical challenge is related to error rates: high error rates can occur when files are not properly formatted for a specific printer's capabilities. This can lead to failed prints or poor-quality outputs. Tools like Meshmixer and Netfabb provide solutions for repairing and preparing files, ensuring they are optimized for specific printing processes.These technical details highlight the importance of choosing the right file format and utilizing tools to ensure compatibility and reduce errors, ultimately enhancing the 3D printing process.Recommended reading:&nbsp;<a href="https://www.wevolver.com/article/how-to-find-free-stl-files" target="_blank" rel="noopener noreferrer">How to find free STL files</a><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1715674828665-Designer_Working_3D_Printer.jpg" width="624" height="459" class="fr-fic fr-dii" alt="software laptop and 3D printer">While STL is the most widely used file format for 3D printing, more advanced options like AMF and 3MF are aiming for greater interoperability and superior print quality.<h2 dir="ltr">Conclusion</h2>The evolution of 3D printer file formats is a testament to the ongoing innovation in the field of additive manufacturing. From the simplicity and universality of STL to the advanced capabilities of 3MF, each format brings unique benefits and challenges to the table. As the industry continues to push the boundaries of what's possible, we can expect file formats to become even more standardized and sophisticated, incorporating greater support for material properties, higher fidelity in geometric representation, and improved compatibility across different printing platforms. The future of 3D printing hinges on these developments, promising to unlock new levels of efficiency, precision, and creativity in engineering.<h2 dir="ltr">FAQs</h2>Q: What file format is used for 3D printing?A: Several file formats are used for 3D printing, but the most common include STL (Stereolithography), OBJ (Object File Format), AMF (Additive Manufacturing File), and 3MF (3D Manufacturing Format). Each format has its specific uses depending on the requirements of the print job.Q: What 3D printing file format has the smallest file size?A: AMF and STL are known for their compressed file sizes, which enables faster processing by slicer programs.Q: Is STL or OBJ better for 3D printing?A: The choice between STL and OBJ depends on the requirements of your project. STL is widely used and supported by almost all 3D printing software and hardware but is limited to encoding the surface geometry of models without supporting color or texture information. OBJ files, on the other hand, can include color and texture data, making them better suited for multicolor or multi-material 3D printing.Q: What is the best file system for 3D printing?A: The "best" file format can vary based on specific needs, but 3MF is emerging as a strong contender due to its comprehensive support for modern 3D printing features like full-color textures, gradients, and other detailed attributes. It was designed to address the limitations of older formats like STL and OBJ, providing a more robust and versatile solution for advanced 3D printing applications.&nbsp;Q: How do I convert a file to STL?A: To convert a file to STL, you can use a variety of CAD (Computer-Aided Design) software tools. Popular options include Autodesk Fusion 360, SolidWorks, and Tinkercad. These programs allow you to import different file formats and export them as STL files. The process typically involves loading the original file, ensuring the model is suitable for conversion (e.g., checking for and repairing any mesh errors), and then exporting it as an STL file using the software's export function.Q: What are the limitations of STL files in capturing material gradients, and how do newer formats overcome these limitations?A: STL files are limited to encoding the surface geometry using triangular facets and cannot represent material gradients. Newer formats like AMF and 3MF can encode material properties at different points within the object, allowing for more complex and functional prints that accurately mimic the desired material characteristics and visual features.<h2 dir="ltr">References</h2>[1] Iancu C. ABOUT 3D PRINTING FILE FORMATS. Annals of'Constantin Brancusi'University of Targu-Jiu. Engineering Series/Analele Universităţii Constantin Brâncuşi din Târgu-Jiu. Seria Inginerie. 2018 Apr 1(2).&nbsp;[2] Why Use 3MF for Additive Manufacturing? [Internet]. 3MF Consortium, 2023. Available from: <a href="https://3mf.io/resources/why-use-3mf-for-additive-manufacturing/" target="_blank">https://3mf.io/resources/why-use-3mf-for-additive-manufacturing/</a>&nbsp;[3] Wavefront OBJ File Format [Internet]. Library of Congress, 09/11/2020. Available from: <a href="https://www.loc.gov/preservation/digital/formats/fdd/fdd000507.shtml" target="_blank">https://www.loc.gov/preservation/digital/formats/fdd/fdd000507.shtml</a>

A concise guide to the different file formats available for 3D printing technologies, including STL, OBJ, AMF, 3MF, and what their role is in the AM process.


Understanding 3D Printer File Formats (STL, OBJ, 3MF, and more): What Files do 3D Printers Use?

BGAs&nbsp;(Ball Grid Array)&nbsp;are&nbsp;a type of&nbsp;lead-less&nbsp;surface mount&nbsp;semiconductor package&nbsp;that, as the name suggests,&nbsp;features an array of spherical solder balls on the underside of the package.Many motherboard control chips utilize this packaging technology.&nbsp;Memory chips&nbsp;utilizing this package technology&nbsp;can double or triple their capacity without increasing in size&nbsp;and compared to&nbsp;other packages, BGA offer&nbsp;higher pin counts,&nbsp;superior heat dissipation&nbsp;and enhanced electrical performance&nbsp;in a smaller volume.The technological success of&nbsp;compact packages including&nbsp;BGA packages allow us to have&nbsp;supercomputers that fit in the palm of our hands. Microprocessors, FPGAs, and memory chips are increasingly being offered in BGA type packages as general PCB assembly capabilities catch-up and the demand for small and powerful electronics continues to increase. However, their utilization poses challenges for PCB layout and manufacture.Small-pitch BGA packages and packages with higher pin counts encroach on the limits of many modern assembly houses’&nbsp;capabilities and call for complex PCB stack-ups and via technologies, not to mention the power and heat dissipation and signal integrity of the overall design must be considered.Designing with BGAs require significant investment and preparation in terms of researching manufacturing and design techniques, and money as the techniques required to fully route-out fine-pitch and larger BGA packages are advanced and costly, and poor design decisions could increase the manufacturing costs by several factors.Before choosing to design with BGA packages, designers should acquaint themselves with the capabilities of their PCB manufacturer and assembly house and familiarize themselves with the design techniques needed to achieve a reliable design at the best price possible. Failure to do so could result in unexpected expenses or wasted time reworking or restarting a design.In this article, we summarize a few BGA design considerations designers should be aware of before beginning a BGA design, especially fine-pitch BGAs (0.5mm pitch and below BGAs).<h3>Routing&nbsp;Traces&nbsp;Between BGA Pads</h3>The number of traces that can be routed between BGA pads is determined by the BGA pitch (center-to-center spacing) and the PCB fabricators capabilities. Typically traces can be routed between pads for 0.5mm and above pitch BGAs. Two can be squeezed in between 0.8mm pitch and above pitch BGAs. For 0.4mm pitch and below BGAs, routing between them is not feasible due to trace width and spacing limitations. Many PCB manufacturers can produce 4mil (0.1mm) traces reliably and 3-3.5mil is not uncommon if used for limited to necking. Necking of traces is where the trace thickness is reduced in select areas. Necking can allow for routing between 0.5mm pitch BGAs pads and routing of more than one trace between pads of larger pitch BGAs.<h3>BGA Pad Size</h3>To route traces, BGA pads should be sized accordingly to ensure adequate spacing between pads. Manufacturers will modify production files to fit their processes and if the spacings are not adequate, excess copper may be shaved off. If the BGA pads are cut into irregular shapes, the quality of the solder joints could be affected.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE0ODM3ODc0MDI1LUJHQSBiZWZvcmUgYW5kIGFmdGVyIHByb2Nlc3NpbmcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib">Gerber file design before and after post-processing<h3>Via-in-Pad via filling and capping</h3>When pad spacing is tight and routing between pads is not possible (such as for 0.4mm pitch BGAs), vias can be placed directly on top of BGA pads (via-on-pad), allowing for signal transfer to the inner or bottom layers. However, it is important that these vias are filled and capped. If not, solder joint defects are almost certain to occur due to the non-planar surface and solder leaking through the vias.The via filling and capping process involves using specialized equipment to fill the vias with a non-conductive epoxy then capping them by plating over the via, essentially adding a pad on top of the via. The plated over vias are visually indistinguishable from regular BGA pads to the naked eye.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE0ODM4MDUxODczLUJHQSB2aWEtb24tcGFkIHdpdGhvdXQgZmlsbGluZyBhbmQgY2FwcGluZy5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib" alt="Via-on-pads on BGA pads without filling and capping">Via-on-pads on the pads of a BGA land without filling and capping <h3>Tenting of Regular BGA Vias</h3>Regular vias between BGA pads should be covered to prevent the solder ball and molten solder paste wicking away from the BGA pads, short circuits and to protect the via from environmental contaminants. Various methods are available for different quality levels.The most basic is to simply cover the vias with solder mask i.e. tent the vias. The solder mask offers a fine layer of protection from contaminants and electrical shorts, however, the level of coverage depends on the viscosity of the solder mask oil and via size. The holes of larger vias may not be fully covered and there is the risk of the via popping during reflow if there is moisture inside the via.Solder mask plugging is another option which adds an extra production step to press solder mask oil into the vias before the general solder mask covering. This ensures that the via barrel is blocked with solder mask but is not guaranteed to be fully filled.&nbsp;The optimal solution is to have all vias filled with epoxy but since this an expensive process, this is usually reserved for high demand applications where via reliability and lifetime is important.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE0ODM4OTUwMzQ4LUJHQSBDQU0gdmlldy5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib">BGA land pattern on a PCB with the vias closed (no solder mask openings) as indicated by the lack of yellow circles on the vias<h3>Via-In-Pad and HDI Design</h3>For fine-pitch BGA chips where traces cannot be routed between pads, it is advisable to utilize a HDI (high-density-interconnect) design with blind and buried vias. For example, mobile phone boards typically have small BGA chips that do not allow for routing between pads.&nbsp;A HDI design with blind and buried vias can be used to make maximum use of the available space in all layers however, the specific stack-up, types of blind/buried vias and total number of layers can have a significant impact on the PCB manufacture cost. It is recommended to consider all possible options on a cost-benefit basis before beginning a design and choosing the types of blind buried vias to use.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE0ODQwMTcwODA2LUhESSBQQ0IgQkdBIERlc2lnbi5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib"><h2 id="isPasted">Tools for Improving BGA PCB Design</h2>Many considerations go into designing a PCB based on a BGA device beyond the scope of this article. HQDFM is a free software developed by HQ NextPCB (HQ Electronics) that inspects Gerber files or OBD++ files for common design for manufacture errors that may affect reliability, cost or manufacturability.<h3>Via-In-Pad Design</h3>HQDFM can detect via-in-pads and reminds designers that via-in-pads should be filled and plated to prevent solder defects and that this increases production costs significantly. If these can be moved away from the pad and converted to regular vias, this will remove the need for via filling and capping.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE0ODQwNzExODgxLVAgVmlhLWluLXBhZC5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib"><h3>Pad-to-Pin Size&nbsp;Ratio</h3>HQDFM can compare the solder pad size to the size of the BGA ball. A pad diameter less than 20% smaller than the BGA pin size could lead to insufficient space for routing, while more than 25% might result in poor solder joints. In such cases, design engineers need to adjust the ratio of pad diameter to BGA pin diameter.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzE0ODQwNzg4Mzg1LVAgQkdBIFBhZCBzaXplLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib">HQDFM can also detect areas where trace widths and spacings are inadequate, opened vias, poor component placement and spacing and more not just related to BGA design.&nbsp;HQDFM is a free PCB design analysis software covering bare board and populated PCB analysis. With over 200 inspection items under 30 DFM and DFA categories including trace, solder mask and drill clearances, pads dimensions, shorts/opens, drill hole sizes and solder mask dams. HQDFM also provides tools for the designing and manufacturing PCBs including an impedance calculator, panelization tool, footprint, BOM and centroid file checker.Transform your workflow and swiftly integrate DFM methodologies into your product development with the <a href="https://www.nextpcb.com/free-online-gerber-viewer.html" target="_blank" rel="nofollow">HQDFM</a> desktop suite from <a href="http://www.nextpcb.com" target="_blank" rel="noopener noreferrer">HQ Electronics (NextPCB)</a>.

The miniaturization of electronics is widely attributed to advances in semiconductor technology as observed by Moore’s Law, but many overlook the design and manufacturing challenges involved in utilizing small device packages such as ball grid arrays.

Design for Manufacture Considerations for Ball Grid Array (BGA) Packages

<table style="width: 100%;"><tbody><tr><td style="width: 100%;"><h2>Accelerating product design with simulation&nbsp;</h2>When applied early in the development cycle, simulation (CAE, FEA) technologies can rapidly accelerate the creation of high-performance, profitable products. However, choosing and implementing the right simulation solution effectively can be challenging when you have limited resources.If you are considering implementing simulation (CAE, FEA) for the first time or utilize CAD embedded simulation tools but are running into challenges with speed and accuracy or want to take the next step and explore multi-physics analysis, the free virtual event Simulate at the Speed of Design event on &nbsp;May 16, 2024, maybe for you.Learn from your peers and Altair’s experts how a mixture of software, support, and know-how can help you be more efficient and effective in developing new products.<a href="https://wevlv.co/altair_simulate_2024" target="_blank" rel="noopener noreferrer" class="button-main-action">Register now.</a></td></tr></tbody></table>This is an excerpt from a presentation by Keshav Sundaresh, Manager, Business Development of Altair. The full presentation, “The TRICK to Digital Twin Technology Adoption” can be attended at the <a href="https://wevlv.co/altair_simulate_2024" target="_blank" rel="noopener noreferrer">Simulate at the Speed of Design</a> event on May 16, 2024.There is a lot of hype around digital twins. Still, for many years, the ability to actually execute them in a way that contributed to streamlining business through data-backed insights has been limited. Below, Keshav Sundaresh, the Global Director of Product Management – Digital Twin and Digital Thread from Altair, shares his insights into using the TRICK methodology to help separate true digital twin technology from fancy-looking interactive CAD models, which are not digital twins but rather mere digital shadows.&nbsp;<h2 dir="ltr">Simulation all around you</h2>Look around you. The device you’re reading this on right now is one of many machines, devices, and tools that surround you and support your everyday life – at work and outside. At Altair, we say our technology is always around you – even when you’re not conscious of it – keeping you safe, connected, and empowering you to thrive in today’s fast-paced world.&nbsp;But what, exactly, do we mean by that? How is our technology integrated into both consumer goods like smart electronic devices, vehicles, and light fixtures as well as industrial objects like assembly lines, sensors, and wind turbines? The answer is digital twin technology, which has a powerful, wide-ranging impact in business and beyond. What can digital twin capabilities mean for your business?Digital twin capabilities:<ol><li dir="ltr">Drive operational efficiency</li><li dir="ltr">Facilitate a model-based ecosystem, providing access to authoritative data and knowledge for faster, better decision-making</li><li dir="ltr">Drive superior engineering quality and product development performance</li><li dir="ltr">Flatten the disruption curve for production</li></ol>For industrial companies, learning how to use this technology to streamline your production process could be such a changing move for the business. Especially in today’s world where our resources seem to have infinite uses, being able to simulate your production using technologies such as the CAE and FEA technologies are vital. This is where Altair’s Simulate at the Speed of Design event comes in. Coming up on the 16th of May, 2024, this is a must-attend for small and medium organizations looking to reduce the risk and cost of making late design manufacturing changes.<h2 dir="ltr">Digital Twin Took Center Stage at CES 2024</h2>Altair has been talking about digital twins for years. But it’s not just Altair and myself that believe in digital twins – my recent experience at CES 2024 was more than enough proof of that. At this year’s event, digital twin-related booths, presentations, and demonstrations were ubiquitous. It seemed like every organization – no matter their specialty, industry, or size – was talking about digital twin capabilities and showcasing what they were doing (or planned to do) with the technology.&nbsp;Five years ago, a scant few were talking about digital twin technology, let alone creating it. The technology just wasn’t there; people liked the concept of digital twin, but the reality was Frankenstein-ish. Very few companies then had the open architecture-based, flexible, and purpose-driven workflows necessary to implement digital twin capabilities. But now digital twin is firmly in the spotlight.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEzODc0NDQ3NjI3LXRyaWNrIDIuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib">Today, the prevalence of accessible, intuitive data and high-performance computing (HPC) environments – like Altair’s – has changed the digital twin adoption landscape. Now, instead of a hodgepodge of solutions and environments, digital twin is more akin to a living and breathing dynamic system with a single, unbroken thread.Digital twin capabilities have also boomed because people (executives in particular) are finally seeing their true business value. They concretely understand that digital twin can transform their business and propel them into a streamlined, digitalized future. It’s safe to say that these organizations wouldn’t be putting the time, effort, and creativity into showcasing digital twin capabilities at events like CES if they weren’t betting big.&nbsp;However, there are still plenty of organizations – too many, in my opinion – that don’t understand what digital twin technology is and how they can start harnessing its power. Luckily, there’s a TRICK to digital twin – literally.<h2 dir="ltr">Why "TRICK"?</h2>“TRICK” is a simple, compelling acronym to serve you on your digital twin journey. TRICK is neither sequential nor mutually exclusive. It’s merely a framework to help separate true digital twin technology from fancy-looking interactive CAD models, which are not digital twins but rather mere digital shadows. Without further ado, let’s explore the TRICK to digital twin technology.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEzODc0NDc1MDEyLXRyaWNrLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib"><h3 dir="ltr" id="isPasted">T: Think in Systems</h3>Digital twin technology is defined – literally and metaphorically – by its function as a system of systems. Digital twin technology is not merely the sum of its parts, a collection of a bunch of components, processes, and systems. Rather, it’s the interaction of all these things acting as one in a holistic environment.&nbsp;Think of it this way: Imagine you’re tasked with building the best car in the world. To accomplish this, you can mix and match components and systems from any kind of car in the world. Maybe you want your car to have the body of a Maserati, the propulsion system of a Tesla, the infotainment console of a GMC, the steering of a Mercedes-Benz, the seats of a Lexus, and so on. If you threw all these disparate systems into a single car, do you think you’d have the “ultimate” car? You wouldn’t. Why not? Because these sophisticated mechanisms aren’t like Legos that you can just slot in at will, regardless of the pieces’ context. These are complex systems designed to function on their own and as part of a specific, holistic system – that holistic system being a vehicle model, in this case. This same principle applies to wind turbines, semiconductor capital equipment, aircraft, and so on.&nbsp;Digital twin technology enables us to better understand and improve interactions between components and how they function. Everything lives in the spaces where systems interact. Engineers and designers should always be thinking at this level to minimize issues and maximize efficiency.&nbsp;Customer evidence: <a href="https://altair.com/resource/getting-the-signal-with-digital-twin-leonardo-deploys-digital-twin-to-capture-in-flight-behavior-of-helicopter-radar?lang=en" target="_blank">“Leonardo Deploys Digital Twin to Capture In-Flight Behavior of Helicopter Radar”&nbsp;</a><h3 dir="ltr">R: Reduced-Order Modeling&nbsp;</h3>When we want to share insights broadly, we want things to be as simple and actionable as possible. Real-life processes are often incredibly complex and hard to distill into a model or equation. But the beauty of mathematics is that it allows us to abstract, simplify, and standardize real-world knowledge. This is the goal of <a href="https://altair.com/romai" target="_blank">reduced-order modeling</a> (ROM).&nbsp;For people to scale their insights and unlock digital twin breakthroughs, they can’t be bogged down in messy, voluminous data. ROM helps reduce the computational complexity of models in physics-based or statistical simulations. Some of our solutions in <a href="https://altair.com/products/platforms/altair-hyperworks" target="_blank">Altair® HyperWorks®</a>, our design and simulation platform – such as <a href="https://altair.com/physicsai" target="_blank">Altair® physicsAI™</a> and <a href="https://altair.com/romai" target="_blank">Altair® romAI™</a> – specialize in ROM within physics-based and test environments. And <a href="https://altair.com/altair-rapidminer" target="_blank">Altair® RapidMiner®</a>, our data analytics and AI platform, offers targeted, powerful capabilities for <a href="https://altair.com/data-transformation" target="_blank">all other kinds of data.</a> But these are just two sides of the same coin.&nbsp;<h3 dir="ltr">Importance of Explainable, “White Box” Solutions</h3>No matter how you approach ROM, you should always be using explainable, transparent solutions, otherwise known as “white box” solutions. White box solutions allow you to see exactly how AI-based models and algorithms are working, including:<ul><li dir="ltr">Metadata sources</li><li dir="ltr">What datasets were used</li><li dir="ltr">What underlying equations were used</li></ul>This approach gives you greater insight and makes it clear to everyone throughout development how models are functioning and why. This is compared to “black box” solutions, which offer AI capabilities but are fully hidden from users – unexplainable, in other words.Customer evidence: <a href="https://altair.com/resource/leveraging-ai-to-improve-accuracy-in-a-real-time-hardware-application?lang=en" target="_blank">“Leveraging AI to Improve Accuracy in a Real-Time Hardware Application”</a><h3 dir="ltr">I: Integrate</h3>Digital twin approaches work best when all users – including people without specialized engineering and data skill sets and non-coders – can leverage advanced tools without needing to rely on experts or support teams. This requires formalizing and democratizing computational intelligence.&nbsp;With integrated digital twin capabilities, teams can virtualize products, processes, and equipment by integrating the best available models informed by sensor and metrology data, guided by domain knowledge, bolstered with software and hardware compute, and continuously synchronized with physical counterparts.&nbsp;Customer evidence: “<a href="https://altair.com/resource/rolling-out-a-better-process-digital-twin-slashes-waste-15-and-runtime-hours-to-seconds?lang=en" target="_blank">Digital Twin Slashes Waste 15% and Runtime Hours to Seconds</a>”<h3 dir="ltr">C: Convergence is Key</h3>Digital twin is a living, breathing model of systems that is grounded in physics assimilating data from inspections, sensors, etc. These systems can be physical, biological, or business process-related. Developing and sustaining a digital twin ecosystem that connects the infrastructure, environment, and methodology (tools, methods, and processes) requires the convergence of simulation, HPC, <a href="https://altair.com/internet-of-things-applications" target="_blank">Internet of Things</a> (IoT), and AI.&nbsp;Being able to offer this in a single, unified environment is what has helped Altair deliver the market’s <a href="https://altair.com/one-total-twin" target="_blank">premier digital twin offering</a>. Regardless of what industry you’re in or what product or system you want to model, we provide one total digital twin solution that optimizes workflows from concept to real-time in-service operation.Customer evidence: “<a href="https://altair.com/resource/harnessing-the-power-of-big-data-ai-and-simulation-to-accelerate-product-innovation?lang=en" target="_blank">Harnessing the Power of Big Data, AI and Simulation to Accelerate Product Innovation</a>” and “<a href="https://altair.com/resource/developing-sustainability-with-ai?lang=en" target="_blank">Developing Sustainability with AI</a>”&nbsp;<h3 dir="ltr">K: Knowledge-Driven Workflows</h3>Speaking of workflows, that brings us to TRICK’s final letter. As teams progress through the development and testing cycle, they generate a ton of knowledge at each step. But often, they’re losing a lot of knowledge and experience in the spaces between each step because information is trapped in silos. These silos act like a filter that sifts valuable nuggets of insight from between each phase until hardly any is left at the end of the line.When I say digital twin means creating “knowledge-driven workflows,” I mean that it can capture information and experiences into a model-based ecosystem that can then be used to develop traceability and governance and improve product quality. A model-based systems engineering workflow breaks horizontal silos from requirements to product end of life by providing a model as a common language of communication.&nbsp;These knowledge-driven workflows reduce design errors once you finally get to the product testing and release stages. There’s no such thing as a universal mistake-proof workflow, but you can certainly minimize errors and the time spent correcting them by harnessing previously lost knowledge.&nbsp;As the maxim goes, life isn’t so much about being right as it is about being less and less wrong. Digital twin technology gives people a transformational way to innovate, become more efficient, and develop the next generation of standout products. Digital twin is the best way to be less wrong – and continuing to be less wrong is the real “TRICK” to unlocking innovation.&nbsp;To learn more about how Altair is enabling digital twin technology, register to attend the Simulate at the Speed of Design 2024 event, where Keshav will present the TRICK methodology in more detail. You’ll also be able to attend ‘simulation starter;’ events, designed for those who do not currently use simulation technologies, are outsourcing most/all of their analysis, or still use limited CAD embedded simulation tools.&nbsp;In these sessions you can understand the benefits of the technologies from companies that have recently implemented simulation using Altair SimSolid; and through interactive sessions, experience how easy it is to get started, even with limited resources or on the Cloud.<a href="https://events.altair.com/simulate-at-the-speed-of-design-2024/#:~:text=Following%20on%20from%20Altair's%20highly,their%20development%20process,%20developing%20more" target="_blank" rel="noopener noreferrer" class="button-main-action">Read more about the event&nbsp;</a><a href="https://wevlv.co/altair_simulate_2024" target="_blank" rel="noopener noreferrer">here.</a>This article was contributed to by Philemon Mayowa.

“TRICK” is a simple, compelling acronym that serves you on your digital twin journey. It’s a framework to help separate true digital twin technology from fancy-looking interactive CAD models, which are not digital twins but rather mere digital shadows. 

The TRICK to Digital Twin Technology Adoption

Are you an APSX-PIM desktop injection molding machine owner eager to embark on the journey of custom mold design? Crafting your own molds unlocks a realm of possibilities, from rapid prototyping to small-scale production. However, mastering the custom mold design process requires meticulous planning and a keen understanding of your machine's capabilities. In this guide, we'll walk you through the major steps of custom mold design, tailored specifically for APSX-PIM users.Understanding the Basics of Custom Mold Design:Define Your Requirements: Start by clearly defining your project requirements. What are you molding? What are the desired dimensions, materials, and surface finishes? Understanding these aspects will guide your mold design process.Design Conceptualization: Design out your mold design concept, considering factors like parting lines, gating, and ejector pin placement. Utilize CAD software for precise modeling and visualization.Mold Material Selection: With APSX-PIM's air cooling feature in mind, opt for aluminum as your mold material. Its durability and efficient heat dissipation make it ideal for long-term use with the machine.Utilize Blank Mold Templates:&nbsp;Take advantage of the blank mold templates available on the APSX-PIM website. These templates provide a solid foundation for your mold design, saving time and ensuring compatibility with the machine.Tips and Tricks for APSX-PIM Users:Simplify Your Mold Design: Eliminate cosmetic features to streamline your mold design. By keeping it simple, you enhance manufacturability and reduce production costs. Remember, APSX-PIM excels in quick and cost-effective iterations compared to larger industrial machines.No Water Cooling Channels Needed: Since APSX-PIM features air cooling, there's no need for water cooling channels in your mold design. This simplifies the design process and eliminates the complexities associated with water cooling systems.Optimize for Rapid Iterations: APSX-PIM's compact size and quick setup allow for rapid iterations of mold designs. Take advantage of this by designing molds that facilitate fast iteration and testing of new product designs.Precision and Efficiency:&nbsp;APSX-PIM offers precise control over injection parameters. Design your molds with tight tolerances to ensure consistent part quality. Focus on optimizing cycle times and minimizing part warpage for efficient production runs.Conclusion:Custom mold design for APSX-PIM opens up a world of possibilities for desktop-scale injection molding. By understanding the major steps of the design process and leveraging tips and tricks tailored for APSX-PIM users, you can maximize the capabilities of your machine. Whether you're prototyping new products or producing small batches, mastering custom mold design will propel you towards success in the realm of injection molding.#injectionmolding #apsxpim #molddesign #CADCAM

Are you an APSX-PIM desktop injection molding machine owner eager to embark on the journey of custom mold design? Crafting your own molds unlocks a realm of possibilities, from rapid prototyping to small-scale production. 

Mastering Custom Mold Design for APSX-PIM: A Simple Guide

It is easy to take for granted actual scales when zoomed in on modern high-res flat-screens, but in reality, the surfaces of PCB boards are not two-dimensional with precisely defined edges. The layers of copper, solder mask, silkscreen and non-planar surface finishes are raised and allowing for solder mask expansion and dams can reduce space between elements even further.Allowing for sufficient component clearances is something PCB designers know all about, but many inexperienced and experienced designers still end up digging their own graves to avoid a little bit of extra rerouting.&nbsp;As careful engineer Xiao Peng learned, the perfect layout depends not only on one’s experience but also on one’s toolbox. Various tools are freely available to provide a systematic and automated approach to detecting such issues and improving the layout overall.&nbsp;Xiao Peng is a PCB layout engineer with over a decade of industrial experience under his belt from layout to production. But his recent experience caused him to doubt his abilities.As per his standard workflow, Xiao Peng’s pre-production checks consist of meticulous design review covering signal integrity, functionality and performance, design for manufacture (DFM) and design for assembly (DFA). However, for this particular batch undergoing wave soldering, the incidence of cold solder joints and insufficient through-hole barrel fill defects was unusually high. Consequently, the batch failed to meet IPC Class 2 standards.IPC Class 2 standards define strict requirements for solder joints. For through-hole joints, the barrel must have a minimum solder fill ratio of 75%, with 25% sinking allowed.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzExMDE3OTcwNzA3LVdlaXhpbiBJbWFnZV8yMDI0MDMyMTE0MTIyNi5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 478px;" class="fr-fic fr-dib">Xiao Peng suspected that the nearby surface mount resistor could be the culprit and upon inspection, found that the distance between the pads was only 0.2mm. This spacing was more than enough for solder mask dams to form and prevent solder bridges, however, the effect on the through-hole joint was not clear. After consulting the assembly technicians, it was found that the board was suffering from shadowing effects.&nbsp;PCB shadowing is the phenomenon whereby taller parts cast shadows on other lower neighboring parts which can have consequences on soldering, thermal management and signal integrity. For wave soldering, the nearby components can physically block molten solder from reaching certain areas of the PCB, in this case, the through-hole barrels.&nbsp;To remedy the issue, the technicians recommended a clearance of 3mm to mitigate the effects of shadowing, and even more for taller components.&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzExMDE4MDY4OTU1LUhRREZNIENvbXBvbmVudCBzcGFjaW5nLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib">With wave soldering, components can affect neighboring solder joints even with the presence of a solder mask dam.At the same time, HQDFM, the PCB design analysis software from HQ Electronics was recommended to Xiao Peng, which claims to be able to detect PCB shadowing issues and many other DFM issues. HQDFM indeed highlighted the spacing issue among other errors. After following the suggestions, the new design effectively eliminated cold solder and barrel filling defects.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzExMDE4MTIxNjM1LUhRREZNIENoaW5lc2UgVmVyc2lvbiBTY3JlZW5zaG90IG9mIGNvbXBvbmVudCBzcGFjaW5nIHZpb2xhdGlvbi5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib">Tight component spacing detected in HQDFM software (Chinese Version)As Xiao Peng discovered, even the most experienced engineers could do with extra assistance here and then. Unlike in China, where engineers can freely contact their manufacturers and expertise is common, overseas designers outsourcing overseas will have time differences, language barriers and limited resources to contend with.<blockquote>“I am deeply aware of the close relationship between quality and design. A good design can not only improve product performance and quality but also reduce production costs and difficulty. Inbuilt DRCs are one way of detecting issues, but they are often limited and are based on black-and-white values you have to feed in yourself. HQDFM on the other hand is powerful, informative and explicit in its goals to reduce manufacturing issues and improve reliability even if you don’t use HQ for production.&nbsp;</blockquote><blockquote>I especially liked the fact that HQDFM is free yet powerful. HQDFM looks at everything from bare board spacings to component heights and the impact on wave soldering and gives specific recommendations and figures. There aren’t many tools outside of EDA programs that can be considered essential in the designer’s toolbox but HQDFM is one of them and I will be using it extensively from now on.”&nbsp;- Xiao Peng</blockquote><h2>Common spacing pitfalls and guidelines</h2>Knowing what to look out for and the potential impact is the first step for PCB designers to improve their DFM evaluation skills which can then be incorporated at the earliest stage of design. The second is the ability to quickly detect issues, which can be accomplished with tools like HQDFM. HQDFM helps to achieve both of these goals through education and detection. Some of the component spacing issues covered by HQDFM include:<h3>Through-hole to Surface Mount Pad Spacing</h3>In Xiao Peng’s case, the close proximity of the through-hole and surface mount pads resulted in the through-hole being inadequately filled during wave soldering. For reflow soldering, insufficient spacing between through-holes, opened vias, test points, metallic mounting holes, and surface mount pads can result in solder being pulled away from the surface mount pad, resulting in poor wetting and making solder defects such as tombstones more likely.&nbsp; If spacing is limited, consider putting vias on pads, but these should be plugged and capped to prevent solder from leaking through the via. Be aware that via plugging and capping require specialist machinery and come at an additional cost.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzExMDE4NDk4MTE0LUhRREZNIHZpYS1pbi1wYWQgc3BhY2luZy5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 426px;" class="fr-fic fr-dib">Via on SMD pad illustration - HQDFM<h3 id="isPasted">Solder Mask Dams</h3>Any two objects that are so close together that they do not leave room for solder mask dams are at risk of solder bridges. Solder mask, or also accurately named solder&nbsp;resist, is your best friend in both SMT and wave soldering as it helps to prevent solder from building up where it is not wanted. For fine-pitch components, especially chips with underside pads, dams can be a lifesaver. For a single reflow, you can probably get away with suitably sized stencil openings, but when it comes to rework and manual soldering, the lack of dams will require greater skill and patienceharder. Pro-tip: most PCB manufacturers have their own solder mask expansion values and will not necessarily follow the lengths in your Gerber files. So a more accurate way of determining if the spacing is large enough for dams to form is to follow pad-to-pad (copper to copper) spacing from manufacturers. Also, remember that values typically vary according to solder mask color. If color is not important, sticking with regular green will produce the best results. If you need to push the limits further, use ENIG plating for a planar pad surface.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzExMDE4NTM2NTYyLUhRREZNIHNvbGRlciBtYXNrIGRhbS5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 400px;" class="fr-fic fr-dib">SMD Pad Spacing illustration - HQDFM<h3 id="isPasted">Solder Mask Opening to Trace Spacing</h3>Traces positioned too close to pads may inadvertently be exposed as a result of solder mask expansion and be at risk of shorting. Ensure traces are sufficiently covered to protect the trace and ensure it remains sealed by the solder mask film.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzExMDE4NjIyNDk4LUhRREZNIFNvbGRlciBtYXNrLXRvLXRyYWNlIHNwYWNpbmcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 410px;" class="fr-fic fr-dib">Solder mask-to-trace spacing illustration - HQDFM<h3 id="isPasted">Through-hole Spacing</h3>Whether soldered manually or automated, through-hole leads need to be reachable, be it by a soldering iron, wave, lead clippers, etc. Therefore the area around them must be void of obstacles such as tall components and other leads. Insufficient adjacent and overhead clearance could result in tricky soldering positions and accidental melting of other components or oneself.&nbsp;Lower on the ground, leads of adjacent through-hole parts should be far enough to prevent solder bridges. For through-hole parts, solder mask dams are a must, which can be achieved by reducing the diameter of pads or shaving material off the edges.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzExMDE4NjU2MTE0LUhRREZNIFNwYWNpbmctaGVpZ2h0IHJhdGlvLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 399px;" class="fr-fic fr-dib">Spacing/height ratio - HQDFM<h3 id="isPasted">Wave Soldering Considerations</h3>Wave soldering’s main advantage is the ability to solder through-hole parts in volume but comes at a cost. Layout engineers have a whole host of extra restrictions to compete with, limiting placement options and possibly ruling out higher-density designs. In addition to leaving extra space between parts, engineers have to constantly consider the direction of the incoming wave, shadowing effects and the use of glue or fixtures for mixed assembly.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzExMDIxNTkxMzU1LVdhdmUgc29sZGVyaW5nIHBhbGxldCBhbmQgYm9hcmQgd2l0aCByZWQgZ2x1ZSBkb3RzLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 768px;" class="fr-fic fr-dib">Wave soldering fixture with gaps for through-hole leads and mixed assembly board with red glue dotsAs we have explored, the consequences of something as simple as component spacing can have grave consequences, but as the DFM mantra goes, it’s better to be safe than sorry. Experienced layout engineers and beginners should make it part of their workflow to pay special attention to spacings and use tools such as HQDFM to accelerate mundane tasks and act as a safety net.HQDFM is a free PCB design analysis software covering bare board and populated PCB analysis. With over 200 inspection items under 30 DFM and DFA categories including trace, solder mask and drill clearances, pads dimensions, shorts/opens, drill hole sizes and solder mask dams. HQDFM also provides tools for the designing and manufacturing PCBs including an impedance calculator, panelization tool, footprint, BOM and centroid file checker.Transform your workflow and swiftly integrate DFM methodologies into your product development with the <a href="https://www.nextpcb.com/free-online-gerber-viewer.html" target="_blank" rel="noopener noreferrer">HQDFM</a> desktop suite from HQ Electronics (NextPCB).<h2>References</h2><ol><li><a href="https://www.nextpcb.com/blog/consequences-of-insufficient-spacing-between-components-for-surface-mount-assembly" target="_blank" id="isPasted">Consequences of insufficient spacing between components for surface mount assembly (nextpcb.com)</a></li><li><a href="https://www.nextpcb.com/blog/what-is-dfa-in-design-for-manufacturing-and-assembly" target="_blank" id="isPasted">What is DFA in Design for Manufacturing and Assembly? (nextpcb.com)</a></li></ol>

Adequate component spacing is typically not high on the PCB designer's list of priorities, but oversights can be frustrating and could demand substantial re-work. Here we look at an example, give general guidelines and look at how tools can be used to educate designers and save time.

Consequences of Insufficient Component Spacing in PCB Design: A Case Study

This article was discussed in our <a href="https://www.wevolver.com/profile/the.next.byte" rel="noopener noreferrer" target="_blank">Next Byte podcast</a>.&nbsp;<iframe height="200px" width="100%" frameborder="no" scrolling="no" seamless="" src="https://player.simplecast.com/ccebc424-3934-4f8d-9421-365318aa11c9?dark=false" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe> The full article will continue below.<hr>Text-to-image is soooo 2023.&nbsp;This year we're adding a new dimension to generative AI: text-to-3D CAD models, and we need your help! <h3>The Backdrop</h3>We founded <a href="https://polyspectra.com" target="_blank" rel="noopener noreferrer">polySpectra</a> with the mission to help engineers make their ideas real.&nbsp;For the past seven years, we have been focused on turning&nbsp;bits into atoms. 3D models into rugged end-use parts.Recent advances in AI have given us the opportunity to go one step further: ideas into bits.In this post, I'll share some of our challenges in building <a href="https://neThing.xyz" target="_blank" rel="noopener noreferrer">neThing.xyz</a>, our new generative AI tool for 3D CAD models. The tool converts natural language prompts into code, which is then converted into a 3D model. <h3>The Problem, The Insight, The Vision</h3>Problem: We have been incredibly energized by the pace of innovation in generative AI, but we were unable to find a text-to-3d gen AI tool that was able to create objects that we would actually want to manufacture.Insight: The key insight that led to the invention of neThing.xyz was that AI is actually quite good at writing code, and by training our "code gen" AI on domain specific languages, our AI can produce code that can be rapidly converted into a 3D CAD models.&nbsp;This is a fundamentally different approach than other text-to-3D generative AI, and it has some really interesting implications for the future of AI and CAD. Most of the other apps in this space are using Neural Radiance Fields (<a href="https://en.wikipedia.org/wiki/Neural_radiance_field" target="_blank" rel="noopener noreferrer" id="isPasted">NeRFs</a>), which is basically a combination of text-to-image and then 2D-to-3D. (Lumalabs “Genie” and Commonsense Machines “Cube” are our two favorites.)Vision: ideas =&gt; bits =&gt; atomsWhat if you could instantly generate 3D objects from a brief verbal description? <h3>The Challenges</h3>Teaching AI to understand and generate CAD models presents a unique set of challenges:1. The AI is Blind: Traditional language models (LLMs) are inherently "blind" and lack the ability to visualize. This means that they struggle to interpret or generate visual content, such as CAD models, from text descriptions alone. While multimodal models, which can understand both text and images, offer a potential solution, they are still in the early stages of development. Their ability to accurately generate complex CAD models from textual descriptions is not yet reliable.2. "Code-CAD" is Niche: The field of generating CAD models through code is highly specialized. There are few experts and, consequently, limited examples to train AI models on. This scarcity of data poses a significant barrier to teaching AI the nuances of CAD generation. On this topic, we would like to extend a huge shoutout to the <a href="https://build123d.readthedocs.io/en/latest/" target="_blank" rel="noopener noreferrer">Build123D</a> community for their tremendous generosity in helping us get neThing.xyz off of the ground.&nbsp;3. Multiplicity of Correct Solutions: For any given CAD design prompt, there can be numerous correct solutions, each employing different methods and approaches. For example, just watch the <a href="https://www.youtube.com/TooTallToby" target="_blank" rel="noopener noreferrer">Too Tall Toby</a> "CAD vs. CAD" tournaments (the <a href="https://tootalltoby.com/spring/" target="_blank" rel="noopener noreferrer">spring tournament</a> is happening now). Competitors in the speed CAD tournament adopt varied strategies to achieve the same design goals, highlighting the challenge of teaching AI to navigate the vast landscape of valid CAD solutions.&nbsp;As we mentioned in the first point: the inability of AI to "see" or visually understand the models it generates complicates the training process. Coupled with the fact that there are many valid approaches to a single design problem, this creates a complex reasoning challenge. Traditional foundation models may completely lack the necessary context to navigate these intricacies effectively.These challenges underscore the complexity of bridging the gap between textual descriptions and visual, three-dimensional CAD models. As we continue to explore and innovate in this space, addressing these issues will be crucial to generating high quality outputs.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA3ODQ1MDYzMjk0LWJyYWNrZXQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib">What is the "right way" to make this? <h3>Our Approach</h3>Our vision for neThing.xyz is to create a generative AI tool that generates truly useful 3D CAD models from straightforward natural language prompts. With neThing we can dramatically expand the number of people who can participate in engineering. We believe that this tool will be useful for a wide range of people, from engineers to artists to students to hobbyists.&nbsp;Community-driven: Our hope is that this audacious goal can be realized through the support of our community. The AI will only ever be as smart as the sum of the community that trained it, and we are excited to see what you will create.&nbsp;Inspired by Midjourney, we are making the generated models "public by default", which we believe has a number of benefits:&nbsp;First, it will provide a rich showcase of examples for both humans and AI to learn from.Second, it means that even users who aren’t able to contribute financially are contributing to the overall community goal of making an amazing text-to-CAD generative AI tool.Finally, it encourages sharing and openness, which is absolutely essential for a product that strives to be community-supported. <h3>Introducing <a href="https://neThing.xyz" target="_blank" rel="noopener noreferrer">neThing.xyz</a></h3>neThing.xyz (pronounced "any thing dot x,y,z") is free to try. After you sign up, you will be able to...&nbsp; &nbsp; ...query the AI to create a 3D model from your prompt...&nbsp; &nbsp; ...preview your creations in AR (on compatible devices)...&nbsp; &nbsp; ...change the physical appearance of the 3D model...&nbsp; &nbsp; ...share your creations with friends...&nbsp; &nbsp; ...edit the code to change the model...&nbsp; &nbsp; ...download the model as STL, STEP, or GLTF...&nbsp; &nbsp; ...click the "Make it real" button to have polySpectra 3D print the part for you!Here are just two examples of the types of objects that you can create:&nbsp;<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA3ODQ0MjMxMTgzLWhleG51dC5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 300px;" class="fr-fic fr-dib" alt="A hex nut">"A hex nut"<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA3ODQ0MjgwNzE4LXBpcGUucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib">"A pipe with flange fittings" We are hungry for your feedback. There is a long road ahead to train the AI to create truly useful 3D CAD models from natural language prompts. The AI is only as smart as the good examples that we can train it on, and this will be a community effort. (And honestly, our AI is not very smart yet - we need your help!) Check out the tool today: <a href="https://neThing.xyz" rel="nofollow" target="_blank" id="isPasted">https://neThing.xyz</a>&nbsp;Join our community: <a href="https://forum.neThing.xyz" rel="nofollow" target="_blank">https://forum.neThing.xyz</a> Make it real.polySpectra

The vision for text-to-3D generative AI is not without its challenges.

Teaching AI CAD (is hard)

PCB Panels are separated with pre-designed “Mouse Bites” for seamless and realiable operations

Understanding the implementation, advantages drawbacks, and crucial design considerations for optimal circuit board separation and efficiency

Understanding PCB Mouse Bites: A Guide to Breakaway Tabs and V-Groove Techniques

<h1 dir="ltr" id="isPasted">Introduction</h1>Virtual prototyping refers to the use of computer simulations to create and test digital models of physical systems before they are built. As semiconductor and OEM companies grapple with the integration of intricate hardware and software for the next wave of wireless, consumer, and automotive devices, the old guard of serialized development staggers under the weight of new demands. Virtual prototyping slices through these challenges, offering a versatile platform for early software development and meticulous system validation, reshaping timelines, and enhancing product quality.This article discusses virtual prototyping, contrasting it with traditional verification methodologies to reveal its role in accelerating time to market and bolstering communication across the supply chain. Readers will navigate through the transformative powers of virtual prototyping, from the inception of software development pre-silicon availability to the intricacies of system validation. The article uncovers the facets of virtual prototyping tools as we delve into how these innovations forge a path for seamless design verification. &nbsp;We use Synopsys' tools and services to illustrate how virtual prototyping is becoming an indispensable asset in digital design.<h1 dir="ltr">Understanding Virtual Prototyping</h1>Virtual prototyping is defined as the process of using computer simulations to model and validate complex system designs before manufacturing their physical components. This method is increasingly important due to the growing complexity and enhanced functionality of modern systems, which often exceed the capabilities of traditional prototyping methods. By employing virtual prototyping, designers can conduct detailed and comprehensive testing of systems, ensuring they meet stringent performance criteria. This approach not only enables early detection and resolution of potential design issues but also facilitates more efficient development cycles, aligning with the advanced requirements of current digital design practices.The intrinsic value of virtual prototyping lies in its ability to front-load the design process. It provides an interactive, software-based environment where designs can be tested, analyzed, and optimized. Engineers can simulate the behaviors of embedded systems under a wide array of operational conditions and use cases, enabling them to iterate more rapidly and with greater confidence. This simulation-centric approach empowers teams to validate assumptions, evaluate system performance, and conduct feasibility studies without the costs and time constraints associated with physical prototypes.<h2 dir="ltr">Accelerating Product Development with Virtual Prototyping</h2>A notable feature of virtual prototyping is its contribution to embedded software development. It allows software engineers to begin their design and testing work in parallel with, or even in advance of, hardware development. This overlap in development cycles is not feasible with conventional prototyping, which requires a sequential process where software development is contingent on the availability of the hardware.Additionally, virtual prototyping aids in optimizing the implementation of systems. Design teams can explore different architectural choices and hardware configurations to arrive at the most efficient and cost-effective solutions. This systematic exploration is essential for managing power consumption, processing speed, and overall system reliability – factors that are critical in today’s competitive technology landscape.Moreover, virtual prototypes can be integrated into automated testing environments, enabling continuous integration and delivery pipelines for software development. This integration leads to high-quality software being developed and maintained, with the capability to quickly adapt to changing requirements or identify potential issues early in the design cycle.In the broader sense, virtual prototyping transcends beyond the confines of mere pre-silicon validation. It stands as a strategic enabler for lifecycle management, facilitating updates, feature enhancements, and maintenance long after the product has been deployed. As systems become increasingly interconnected and expected to support new functionalities over time, virtual prototyping offers the flexibility and scalability needed to sustain product evolution.Thus, the role of virtual prototyping is multifaceted: it accelerates the design process, enhances product quality, reduces development costs, and extends the lifecycle of digital products. It encapsulates the shift towards a more agile, forward-thinking approach in digital design, one that is instrumental for companies looking to thrive amidst the burgeoning complexities of modern technological innovation.<h1 dir="ltr">Virtual Prototyping Versus Traditional Methods</h1>In digital design and verification, the cost of error escalates as one moves through the development process. Traditional verification methodologies are increasingly seen as inadequate, especially as the complexity of integrated systems grows. This section will conduct a comparative analysis of virtual prototyping against these traditional methodologies, illustrating the efficiencies gained through modern techniques.<h2 dir="ltr">The Stumbling Blocks of Traditional Verification</h2>In traditional verification, the development of software often lags behind hardware completion. This approach is inherently sequential and leaves little room for iterative improvement, which can be particularly detrimental to aggressive product development schedules. Software teams await the physical prototypes to test their code, creating a bottleneck that impedes early detection and resolution of issues.Furthermore, traditional methods often rely on physical testing environments, which can be both costly and limited in scope. The limitations of hardware-based tests—such as the number of available prototypes, the difficulty in re-creating certain operating conditions, and the inability to test every possible scenario—can leave critical bugs undetected until late in the development process.<h2 dir="ltr">The Strategic Edge of Virtual Prototyping</h2>Virtual prototyping offers a stark contrast, delivering a strategic edge by removing the reliance on hardware availability. Software development can commence much earlier, even before the RTL (Register-Transfer Level) stages of hardware design. This shift not only circumvents the wait for physical prototypes but also opens up parallel workflows that can dramatically accelerate the development cycle.<h2 dir="ltr">Efficiency and Scope of Testing</h2>Virtual prototypes enable an extensive scope of testing that physical prototypes cannot match. By simulating various system states and operational conditions, virtual prototypes allow for an exhaustive verification process, including the kind of edge cases that are difficult to replicate with hardware. The flexibility of virtual environments means that software testing and system validation can occur at multiple workstations concurrently, greatly expanding test coverage.<h2 dir="ltr">Cost-Effectiveness and Error Detection</h2>From a financial perspective, virtual prototyping is compelling. By detecting errors early in the design process, it mitigates the high costs associated with late-stage troubleshooting in traditional verification. Early detection not only reduces the expenditure on rectifications but also minimizes the risk of expensive recalls and brand damage post-product release.<h2 dir="ltr">Debugging and Analysis</h2>The debug capabilities of virtual prototyping are a leap forward in verification methodology. The ability to pause, rewind, and replay scenarios in a virtual prototype provides an unprecedented level of control and insight into system behavior. This allows for a more nuanced analysis and a thorough understanding of the root causes of issues, which can be elusive in traditional post-silicon debugging.<h2 dir="ltr">The Quantifiable Benefits</h2>The advantages of virtual prototyping can be quantified in reduced development time, increased product quality, and lowered costs. With the accelerated time-to-market that virtual prototyping allows, companies can stay ahead of the competition and better meet market demands. Additionally, the increased productivity and efficiency across teams contribute to a more streamlined development process, from conceptual design to final product validation.<h1 dir="ltr">Virtual Prototyping Solutions by Synopsys</h1>Synopsys offers a comprehensive virtual prototyping solution that includes several key products and services:<ul><li dir="ltr">Synopsys Virtualizer: The <a href="https://www.synopsys.com/verification/virtual-prototyping/virtualizer.html" target="_blank">Synopsys Virtualizer tool</a> enables the creation of virtual prototypes that can be used for early software development and testing. This tool is a part of a suite that includes Synopsys Platform Architect™ and a vast array of transaction-level models (TLMs). <a href="https://www.synopsys.com/verification/virtual-prototyping/vdk.html" target="_blank">Virtualizer Development Kits (VDKs)</a> are also provided for software development, allowing for early software bring-up before silicon availability.</li><li>Hybrid Prototyping: For hardware and software engineers, Synopsys offers a <a href="https://www.synopsys.com/verification/virtual-prototyping/virtualizer/hybrid-prototyping.html" target="_blank">hybrid prototyping solution</a> that combines virtual and FPGA-based prototypes. This allows for the benefits of both approaches, enabling the start of multi-core SoC prototyping earlier and facilitating high-performance execution of system-level models, which include direct connections to real-world hardware interfaces.</li></ul><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAwMjAxNDU1OTAyLWltYWdlMi5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 300px;" class="fr-fic fr-dib" alt="hybrid-prototyping-framework-synopsis">A block diagram illustrating the hybrid prototyping framework and workflow. Source:&nbsp;<a href="https://www.youtube.com/watch?v=_ux9xPkGfF0&ab_channel=Synopsys" target="_blank" rel="noopener noreferrer">Faster Software Development using Hybrid Prototyping - Synopsys YouTube</a><ul><li dir="ltr">Synopsys Platform Architect for Multi-Core Optimization (MCO): Synopsys provides the&nbsp;<a href="https://www.synopsys.com/verification/virtual-prototyping/platform-architect.html" target="_blank">Platform Architect tool</a> for creating virtual prototypes geared towards architecture design. This tool is designed to cater to the specific requirements for simulation speed and timing accuracy, and it is used alongside Virtualizer for a comprehensive virtual prototyping environment tailored to software development use cases.</li><li dir="ltr">Virtual Prototyping Services: Synopsys provides full-service solutions where they take charge of modeling, assembling, and delivering a virtual prototype tailored to the specific needs of end-user teams. This service may include integrating software tools, environment models, test environments, and customizing virtual prototype tools for debugging and analysis to meet particular requirements.</li></ul>Each of these offerings is designed to support different aspects of the development process, from the early stages of software development to the optimization of multi-core system architectures.<h1 dir="ltr">Conclusion</h1>Virtual prototyping marks a turning point in digital design, fundamentally transforming the way we approach the development of complex systems. By allowing for early software development and thorough system validation, it significantly shortens time-to-market and enhances product quality. The ability to test and iterate designs within a virtual environment translates to a leap in efficiency and cost-effectiveness, driving innovation at a faster clip than ever before.As the complexities of design increase, virtual prototyping offers the agility and foresight needed to keep pace with rapid technological advancements. It is more than a tool; it is a strategic imperative for any organization aiming to lead in the fiercely competitive landscape of digital technology.<h1 dir="ltr">References</h1>[1] What is Virtual Prototyping? – How it Works &amp; Benefits. Synopsys; [Online]. Available from:&nbsp;<a href="https://www.synopsys.com/glossary/what-is-virtual-prototyping.html" target="_blank">https://www.synopsys.com/glossary/what-is-virtual-prototyping.html</a>[2] Chang KH. Introduction to e-Design. In: Chang KH, editor. Design Theory and Methods Using CAD/CAE. Academic Press; 2015. p. 1-37. [Online]. Available from:&nbsp;<a href="https://www.sciencedirect.com/science/article/abs/pii/B9780123985125000013" target="_blank">https://www.sciencedirect.com/science/article/abs/pii/B9780123985125000013</a>[3] Bidanda B, Bártolo PJ, editors. Virtual Prototyping &amp; Bio Manufacturing in Medical Applications. Springer International Publishing; 2020.

Virtual prototyping in digital design streamlines the development of complex systems by allowing early software testing and hardware optimization before the creation of a physical prototype.

computer-aided design

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