Diode Symbols: A Comprehensive Guide to Understanding Circuit Diagrams

Ever wondered how batteries power your gadgets or how metals are refined to their purest forms? The answers lie in the interplay of cathodes and anodes, two simple yet critical components in electrochemistry. This article will delve into their workings, applications, and challenges.


Cathode Anode: The Basics and Applications

<h3 id="isPasted"><strong>introducing Electroforming&nbsp;</strong></h3><p><a href="https://www.vecoprecision.com/electroforming/" rel="noopener" target="_blank">Electroforming&nbsp;</a>is a metal&nbsp;fabrication process&nbsp;in which metal is electrochemically deposited onto a mold,&nbsp;also called&nbsp;a mandrel. The metal is deposited layer by layer, enabling the production of highly accurate and complicated&nbsp;components&nbsp;that would be difficult or impossible to manufacture using traditional methods such as stamping or machining. In contrast to stamping or machining, which are constrained by the intricacy of the part design and can result in substantial material waste,&nbsp;Electroforming may produce extremely complicated patterns with&nbsp;minimal waste.</p><h3>Electroforming for Electronics: what makes it the optical choice</h3><p>Electroforming stands out for its remarkable dimensional accuracy. Contrary to conventional manufacturing techniques, Electroforming may reach tolerances as low as ±1μm, &nbsp;making it perfect for creating electronic components, especially for uses where accuracy and size are crucial, such as wearable technology, drones, and consumer electronics. With Electroforming, tight tolerances, miniaturized size and volume, and consistent quality can be achieved to enhance functionality.&nbsp;</p><p>The Electroforming technology also excels in creating complex, multi-layer geometries that would be impossible or too expensive to produce through traditional manufacturing techniques. With <a href="https://insights.vecoprecision.com/electroforming-can-be-more-than-2d-meet-multi-layer-electroforming" rel="noopener" target="_blank">multi-layer Electroforming</a>, &nbsp;3D or 2.5D structures can be achieved, including complex structures, undercuts, and internal features. This opens up the window for high-precision components that also demand delicate structures, particularly valuable in creating sophisticated electronic components that require complex internal geometries.</p><p><span class="fr-img-caption fr-fic fr-dii" style="width: 823px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1733710771099-1733710771099.png" width="740" height="523" alt=" complex, multi-layer structure made by Electroforming" srcset="https://insights.vecoprecision.com/hs-fs/hubfs/Veco/Images/Complex%20multi-layer%20structure%20created%20by%20Electroforming.jpg?width=370&amp;height=262&amp;name=Complex%20multi-layer%20structure%20created%20by%20Electroforming.jpg 370w, https://insights.vecoprecision.com/hs-fs/hubfs/Veco/Images/Complex%20multi-layer%20structure%20created%20by%20Electroforming.jpg?width=740&amp;height=523&amp;name=Complex%20multi-layer%20structure%20created%20by%20Electroforming.jpg 740w, https://insights.vecoprecision.com/hs-fs/hubfs/Veco/Images/Complex%20multi-layer%20structure%20created%20by%20Electroforming.jpg?width=1110&amp;height=785&amp;name=Complex%20multi-layer%20structure%20created%20by%20Electroforming.jpg 1110w, https://insights.vecoprecision.com/hs-fs/hubfs/Veco/Images/Complex%20multi-layer%20structure%20created%20by%20Electroforming.jpg?width=1480&amp;height=1046&amp;name=Complex%20multi-layer%20structure%20created%20by%20Electroforming.jpg 1480w, https://insights.vecoprecision.com/hs-fs/hubfs/Veco/Images/Complex%20multi-layer%20structure%20created%20by%20Electroforming.jpg?width=1850&amp;height=1308&amp;name=Complex%20multi-layer%20structure%20created%20by%20Electroforming.jpg 1850w, https://insights.vecoprecision.com/hs-fs/hubfs/Veco/Images/Complex%20multi-layer%20structure%20created%20by%20Electroforming.jpg?width=2220&amp;height=1569&amp;name=Complex%20multi-layer%20structure%20created%20by%20Electroforming.jpg 2220w" sizes="(max-width: 740px) 100vw, 740px" class="fr-fic fr-dii"><span class="fr-inner" spellcheck="false">&nbsp;<em id="isPasted">complex, multi-layer structure made by Electroforming</em></span></span></span></p><p>Another significant advantage of Electroforming technology is its high degree of customizability, particularly when combined with Laser Direct Imaging (LDI) technology. The LDI system directly translates digital designs into physical patterns on the substrate, which means no need for physical photo masks anymore. This enables engineers to easily realize complex designs and make rapid design iterations without additional costs of tooling or mask-making. Complex geometric patterns, fine details, and sophisticated features can be incorporated into the design efficiently and cost-effectively. This level of design flexibility proves invaluable in both prototyping and volume production scenarios, empowering engineers to pursue advanced component designs to make next-gen breakthroughs.<br>➡️ <a href="https://insights.vecoprecision.com/advanced-lithographic-electroforming-what-makes-veco-the-industry-leader-of-precision-engineering" rel="noopener" target="_blank">learn more about LDI technology and how it empowers Advanced Lithographic Electroforming</a></p><p>Furthermore, the Electroformed components exhibit superior material properties due to their fine-grain structure. This results in excellent mechanical strength, superior electrical conductivity, and an optimal strength-to-weight ratio – all critical factors in electronic device manufacturing. <a href="https://www.vecoprecision.com/electroforming/materials-used-in-electroforming/" rel="noopener" target="_blank">A</a><a href="https://www.vecoprecision.com/electroforming/materials-used-in-electroforming/" rel="noopener" target="_blank">&nbsp;variety of metals (learn more about materials used in Electroforming in details here)</a>, including copper, nickel, gold, platinum, and silver, can be used with Electroforming technology, offering flexibility in terms of electrical and thermal conductivity, corrosion resistance, and mechanical strength. &nbsp;</p><h3>applications of Electroforming in Electronics</h3><p>The electronics sector, where accuracy and compactness are essential, is already benefiting greatly from Electroforming. Among the applications are: <img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1733710771337-1733710771337.png" width="1024" height="768" alt="electronics img" srcset="https://insights.vecoprecision.com/hs-fs/hubfs/Veco/Images/electronics%20img.jpeg?width=512&amp;height=384&amp;name=electronics%20img.jpeg 512w, https://insights.vecoprecision.com/hs-fs/hubfs/Veco/Images/electronics%20img.jpeg?width=1024&amp;height=768&amp;name=electronics%20img.jpeg 1024w, https://insights.vecoprecision.com/hs-fs/hubfs/Veco/Images/electronics%20img.jpeg?width=1536&amp;height=1152&amp;name=electronics%20img.jpeg 1536w, https://insights.vecoprecision.com/hs-fs/hubfs/Veco/Images/electronics%20img.jpeg?width=2048&amp;height=1536&amp;name=electronics%20img.jpeg 2048w, https://insights.vecoprecision.com/hs-fs/hubfs/Veco/Images/electronics%20img.jpeg?width=2560&amp;height=1920&amp;name=electronics%20img.jpeg 2560w, https://insights.vecoprecision.com/hs-fs/hubfs/Veco/Images/electronics%20img.jpeg?width=3072&amp;height=2304&amp;name=electronics%20img.jpeg 3072w" sizes="(max-width: 1024px) 100vw, 1024px" class="fr-fic fr-dii"></p><ul><li><strong>personal care</strong><strong>:</strong> Personal care: Ultra-thin, sharp shaver foils for high-end electric shavers are made via Electroforming, and electroplating is an option for improved cutting performance and longevity.</li><li><strong>inkjet printing:&nbsp;</strong>With Electroforming, high-quality inkjet nozzle plates with unparalleled jetting performance, superior chemical and mechanical stability can be achieved, enabling optimal printing performance.</li><li><strong>h</strong><strong>earing&nbsp;</strong><strong>a</strong><strong>id&nbsp;</strong><strong>c</strong><strong>omponents:</strong> Electroforming is the choice of technique in the production of high precision and lightweight hearing aid components, which fit within the confined spaces of modern hearing aids.</li><li><strong>n</strong><strong>ebulizer&nbsp;</strong><strong>c</strong><strong>omponents:</strong> In medical electronics, electroformed components such as nebulizer plates play a vital role of controlling airflow and particle size, ensuring the effective delivery of medication.</li><li><strong>d</strong><strong>rones:</strong> Electroforming is used to create lightweight, high strength, high precision components such as battery foils, structural elements, micro sensor components, helping enhance flight efficiency and longevity.</li></ul><p>➡️ <a href="https://www.vecoprecision.com/products/" rel="noopener" target="_blank">learn more about applications of Electroforming&nbsp;</a></p><h3>looking ahead: smaller, smarter, and greener</h3><p>As the electronics industry continues the trend toward miniaturization, Electroforming's capabilities become increasingly suitable for the production of next-gen electronics components. The technology is particularly well-suited for the emerging field of wearable electronics, where components must be not only small and precise but also flexible and biocompatible. Electroforming enables the creation of ultra-thin flexible circuits, integrated antenna structures, and miniature sensor housings that can be comfortably worn on the body.</p><p>The capacity of Electroforming technology to produce intricate structures with high precision at the microscale also makes it perfect for innovative smart applications. For instance, it is also the best option for producing cutting-edge applications like components for quantum computing, micro-battery technology, and 3D semiconductor packaging.</p><p>In addition, the capability to create high-quality <a href="https://www.vecoprecision.com/products/" rel="noopener" target="_blank">precision engineered components&nbsp;</a>with minimal waste and 100% green energy represents a big step toward more sustainable electronics manufacturing. As industries worldwide focus on reducing environmental impact, Electroforming's highly efficient material usage and lower energy demand make it increasingly meaningful. In addition, Veco has made the transition to 100% renewable energy since 2021, obtaining 50% of its energy from solar and 50% from wind sources. This commitment to sustainability extends beyond products to the entire operational philosophy, empowering our customers and pushing boundaries of innovations in a sustainable way.</p>

This blog looks into the Electroforming technology, its technical advantages, why it is the optimal choice for the electronics industry, and its potential to transform the future of the electronics industry.

Electroforming for Electronics: advancing precision manufacturing for smaller, smarter, and greener devices

Have you considered how modern communication systems, like GSM networks, satellite communications, and broadcasting, manage multiple signals with precision? RF diplexers and duplexers make seamless signal sharing and optimal performance possible. Let’s explore the technology in this article.

Duplexer vs Diplexer: A Technical Guide to RF Signal Management Components

<section id="isPasted"><p><strong>The combination of light-based and electronic components on a single computer chip would have many benefits for our computing needs. Chips would be faster and consume less energy when using light. However, the problem with current silicon-based technologies is that they cannot emit light. TU/e full professor Erik Bakkers has big plans to change that, though. Along with colleagues at TU Munich and the University of Twente, the research team has just been awarded a €14 million ERC Synergy grant. €5 million will be used to back groundbreaking research at TU/e, with Bakkers coordinating the international project.</strong></p></section><section tabindex="-1"><p>“Light-emitting chips is the holy grail of future computing technologies – the realization of these chips could revolutionize computing technologies.”</p><p>That’s how&nbsp;<a href="https://www.tue.nl/en/research/researchers/erik-bakkers" target="_blank">Erik Bakkers</a> – Full Professor at the Department of Applied Physics and Science Education – views the promise of light-emitting microchips.</p><h3><strong>SiGe holds the key</strong></h3><p>To get to the promised land, though, a fundamental property of the materials used to make our microchips needs to change.</p><p id="isPasted">“We must change how atoms are arranged relative to each other. In technical terms, we need to move away from the natural cubic structure of many materials to one that is based on the hexagonal arrangement of atoms. If we achieve this, the materials will be able to emit light.”</p><p>This is the central goal of the project ‘Bright Chips’, a collaboration between Bakkers, Professor Floris Zwanenburg from the University of Twente, and Professor Jonathan Finley from the Technical University of Munich. The project has just received significant funding to the tune of €14 million as part of the ERC Synergy grant initiative.</p><p>The material of choice for the ‘Bright Chips’ project is silicon germanium (SiGe) – an alloy that has been shown in recent years to have the suitable properties to emit light.</p><h3><strong>Three’s not a crowd</strong></h3><p>“We want to understand how and why SiGe emits light, both from a classical and quantum physics perspectives,” says Bakkers. “Our project is a truly multidisciplinary project which combines the worlds of materials science, photonics, and electronics. And each member of the ‘Bright Chips’ project team will focus on one of these three topics.”</p><p>At TU/e, the Bakkers’ team will fabricate a new material system based on hexagonal SiGe. Thereafter, the team at TU Munich led by Jonathan Finley will characterize the new SiGe material, and using the material, they plan to demonstrate single photon emitters and lasers.</p><p>Finally, at the University of Twente, Floris Zwanenburg’s group will fabricate and measure the performance of electronic devices that incorporate the SiGe light-emitting components.</p><p>“A major milestone or goal for Bright Chips is to study optically-connected SiGe-spin qubits. These can be quickly changed, upscaled, and they are expected to be long-lived due to the unique properties of the materials we will work with,” says Bakkers. “We’re excited to get started with the project!”</p><h3 id="isPasted"><strong>Making blood cells</strong></h3><p>The second project with TU/e involvement to get an ERC Synergy grant is ‘MakingBlood’.&nbsp;<a href="https://www.tue.nl/en/research/researchers/cecilia-sahlgren" target="_blank">Cecilia Sahlgren</a>, a part-time Full Professor at the Department of Biomedical Engineering and mainly based at Åbo Akademi University in Finland, is one of the four principal investigators on the project.</p><p>“MakingBlood is seeking to make human blood stem cells (also known as hematopoietic stem cells) using human pluripotent stem cells,” says Sahlgren. “At present, blood stem cells are collected from donors.”</p><p>“However, too often, a suitable stem cell donor cannot be found. We will explore the cellular, molecular, and physical features that are important for the generation of blood stem cells. Lessons learned here will be used to make blood cells in the lab using a dedicated&nbsp;<em>in vitro</em> setup.”</p><p>TU/e will play two roles in the project. First, researchers will manufacture a high throughput approach to control flow with magnetic cilia, which will be used to build the embryonic niches that are important for the formation of blood stem cells in the human embryo.</p><p>This will be done in collaboration with&nbsp;<a href="https://research.tue.nl/en/persons/ye-wang" target="_blank" rel="noreferrer">Ye Wang</a>, who is based in the group of Jaap den Toonder at the Department of Mechanical Engineering.</p><p>Second, researchers will create&nbsp;<em>in vitro</em> models of the embryonic niches where blood stem cells are formed in the embryo. The ‘MakingBlood’ project is coordinated by the Hospital del Mar Research Institute in Barcelona, Spain, by Professor Anna Bigas.</p><p>The other principal investigators are Gerald de Haan, Research Director of Sanquin, the Dutch Blood Bank, and Dr Cristina Pina, Senior Lecturer in Biomedical Sciences at Brunel University.</p><hr><h3 id="isPasted"><strong>About the ERC Synergy Grant</strong></h3><p>A group of two to a maximum of four Principal Investigators (PIs) working together and bringing different skills and resources to tackle ambitious research problems. &nbsp;One will be designated as the corresponding PI (cPI).</p><p>No specific eligibility criteria regarding the academic training&nbsp;are foreseen for ERC Synergy Grants.</p><p>PI’s must present a competitive track record that is appropriate to their career stage. Proposals are evaluated on the sole criterion of scientific excellence , which takes on the additional meaning of outstanding intrinsic synergetic effect.</p></section>

Nemea computer chip with light coming out of it. Image: Created by Jason Jung using Midjourney v4

The first project is developing light-based chips to bridge the gap between photonics and electronics. The second project plans to make blood cells using blood stem cells. The two projects are the first ERC Synergy grants for TU/e.

ERC Synergy grants for cutting-edge light-based chips and for blood cells

<p id="isPasted">Now, researchers have introduced a technique for compressing an LLM’s reams of data, which could increase privacy, save energy and lower costs.</p><p>The&nbsp;<a href="https://arxiv.org/abs/2405.18886">new algorithm</a>, developed by engineers at Princeton and Stanford Engineering, works by trimming redundancies and reducing the precision of an LLM’s layers of information. This type of leaner LLM could be stored and accessed locally on a device like a phone or laptop and could provide performance nearly as accurate and nuanced as an uncompressed version.</p><p>“Any time you can reduce the computational complexity, storage and bandwidth requirements of using AI models, you can enable AI on devices and systems that otherwise couldn’t handle such compute- and memory-intensive tasks,” said study coauthor&nbsp;<a href="https://engineering.princeton.edu/faculty/andrea-goldsmith">Andrea Goldsmith</a>, dean of Princeton’s School of Engineering and Applied Science and Arthur LeGrand Doty Professor of&nbsp;<a href="https://ece.princeton.edu/">Electrical and Computer Engineering</a>.</p><p>“When you use ChatGPT, whatever request you give it goes to the back-end servers of OpenAI, which process all of that data, and that is very expensive,” said coauthor&nbsp;<a href="https://sites.google.com/view/rajarshi-saha">Rajarshi Saha</a>, a Stanford Engineering Ph.D. student. “So, you want to be able to do this LLM inference using consumer GPUs [graphics processing units], and the way to do that is by compressing these LLMs.” Saha’s graduate work is coadvised by Goldsmith and coauthor&nbsp;<a href="https://stanford.edu/~pilanci">Mert Pilanci</a>, an assistant professor at Stanford Engineering.</p><p>The researchers will present&nbsp;<a href="https://arxiv.org/abs/2405.18886">their new algorithm</a> CALDERA, which stands for Calibration Aware Low precision DEcomposition with low Rank Adaptation, at the Conference on Neural Information Processing Systems (NeurIPS) in December. Saha and colleagues began this compression research not with LLMs themselves, but with the large collections of information that are used to train LLMs and other complex AI models, such as those used for image classification. This technique, a forerunner to the new LLM compression approach, was&nbsp;<a href="https://openreview.net/forum?id=rxsCTtkqA9">published</a> in 2023.</p><p>Training data sets and AI models are both composed of matrices, or grids of numbers that are used to store data. In the case of LLMs, these are called weight matrices, which are numerical representations of word patterns learned from large swaths of text.</p><p>“We proposed a generic algorithm for compressing large data sets or large matrices,” said Saha. “And then we realized that nowadays, it’s not just the data sets that are large, but the models being deployed are also getting large. So, we could also use our algorithm to compress these models.”</p><p>While the team’s algorithm is not the first to compress LLMs, its novelty lies in an innovative combination of two properties, one called “low-precision,” the other “low-rank.” As digital computers store and process information as bits (zeros and ones), “low-precision” representation reduces the number of bits, speeding up storage and processing while improving energy efficiency. On the other hand, “low-rank” refers to reducing redundancies in the LLM weight matrices.</p><p>“Using both of these properties together, we are able to get much more compression than either of these techniques can achieve individually,” said Saha.</p><p>The team tested their technique using Llama 2 and Llama 3, open-source large language models released by Meta AI, and found that their method, which used low-rank and low-precision components in tandem with each other, can be used to improve other methods which use just low-precision. The improvement can be up to 5%, which is significant for metrics that measure uncertainty in predicting word sequences.</p><p>They evaluated the performance of the compressed language models using several sets of benchmark tasks for LLMs. The tasks included determining the logical order of two statements, or answering questions involving physical reasoning, such as how to separate an egg white from a yolk or how to make a cup of tea.</p><p>“I think it’s encouraging and a bit surprising that we were able to get such good performance in this compression scheme,” said Goldsmith, who moved to Princeton from Stanford Engineering in 2020. “By taking advantage of the weight matrix rather than just using a generic compression algorithm for the bits that are representing the weight matrix, we were able to do much better.”</p><p>Using an LLM compressed in this way could be suitable for situations that don’t require the highest possible precision. Moreover, the ability to fine-tune compressed LLMs on edge devices like a smartphone or laptop enhances privacy by allowing organizations and individuals to adapt models to their specific needs without sharing sensitive data with third-party providers. This reduces the risk of data breaches or unauthorized access to confidential information during the training process. To enable this, the LLMs must initially be compressed enough to fit on consumer-grade GPUs.</p><p>Saha also cautioned that running LLMs on a smartphone or laptop could hog the device’s memory for a period of time. “You won’t be happy if you are running an LLM and your phone drains out of charge in an hour,” said Saha. Low-precision computation can help reduce power consumption, he added. “But I wouldn’t say that there’s one single technique that solves all the problems. What we propose in this paper is one technique that is used in combination with techniques proposed in prior works. And I think this combination will enable us to use LLMs on mobile devices more efficiently and get more accurate results.”</p><p><em>The paper, “</em><a href="https://arxiv.org/abs/2405.18886"><em>Compressing Large Language Models using Low Rank and Low Precision Decomposition</em></a><em>,” will be presented at the Conference on Neural Information Processing Systems (NeurIPS) in December 2024. In addition to Goldsmith, Saha and Pilanci, coauthors include Stanford Engineering researchers Naomi Sagan and Varun Srivastava. This work was supported in part by the U.S. National Science Foundation, the U.S. Army Research Office, and the Office of Naval Research.</em></p>

Large language models (LLMs) are increasingly automating tasks like translation, text classification and customer service. But tapping into an LLM’s power typically requires users to send their requests to a centralized server — a process that’s expensive, energy-intensive and often slow.

Leaner large language models could enable efficient local use on phones and laptops

Plasma cleaning is a high-tech surface treatment that uses ionized gas to remove microscopic contaminants, enhancing adhesion and durability in materials. This article explains plasma cleaning’s role across industries, its eco-friendly benefits, and emerging trends in sustainable manufacturing.

Plasma Cleaning: Cutting-Edge Innovations, Core Principles, and Real-World Applications

<p>From November 12 to 15, Munich became the epicenter of the global electronics industry as <strong>Electronica 2024</strong> brought together 3,480 exhibitors and nearly 80,000 visitors from across the world. Renowned as the industry’s leading trade fair, this year’s event was more international than ever, offering a glimpse into how digital technologies are shaping the path to a carbon-neutral future. Spanning 18 exhibition halls, the event highlighted groundbreaking advancements in <strong>artificial intelligence (AI)</strong>, <strong>sustainability</strong>, and the <strong>future of mobility</strong>, alongside the critical need to foster young talent in electronics.</p><h2>Key Topics Shaping the Electronics Landscape</h2><h3><strong>Sustainability: Electronics Driving the Green Revolution</strong></h3><p>At the heart of this year’s event was the drive to achieve carbon neutrality, with many exhibitors showcasing how electronics play a crucial role in environmental sustainability. From energy-efficient semiconductor solutions to IoT technologies that enable smarter energy management, it was clear that the industry is stepping up to address climate challenges.</p><p>Sustainability discussions centered on:</p><ul><li><strong>Smart Grids and Renewable Energy:</strong> Innovations in optimizing energy systems for greater efficiency.</li><li><strong>Circular Economy:</strong> Efforts to design electronics for recyclability and longevity.</li><li><strong>Green Electronics Manufacturing:</strong> Reducing the environmental footprint of production processes.</li></ul><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1732193109394-electronica-infineon.jpg" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Smart and sustainable mobility was one of the main topics at this year's Electronica.</span></span></span></p><h3><strong>Artificial Intelligence: Powering the Industry</strong></h3><p>AI continued to dominate conversations, underscoring its influence across sectors. At Electronica 2024, AI’s transformative power was evident in:</p><ul><li><strong>Smart Manufacturing:</strong> Machine learning-driven solutions to optimize production lines and reduce waste.</li><li><strong>AI-powered Sensors:</strong> New sensor technologies with AI integration for predictive analytics in industrial and healthcare applications.</li><li><strong>Autonomous Mobility:</strong> The role of AI in enhancing vehicle safety and energy efficiency.</li></ul><h3><strong>Future of Mobility: Shifting Gears with Electronics</strong></h3><p>The push toward sustainable transportation took center stage, with electronics enabling electric vehicles (EVs), autonomous systems, and advanced battery technologies. Key themes included:</p><ul><li><strong>Electrification:</strong> Efficient power management and battery advancements for EVs.</li><li><strong>Connectivity:</strong> V2X (vehicle-to-everything) communication for smarter traffic ecosystems.</li><li><strong>Safety Systems:</strong> Innovations in sensor fusion and AI-enhanced driver-assistance technologies.</li></ul><h3><strong>Fostering Talent: Investing in the Future</strong></h3><p>With the global electronics industry facing a talent shortage, Electronica 2024 placed special emphasis on nurturing the next generation of engineers and innovators. Events, workshops, and mentorship programs were tailored to inspire students and young professionals to take up roles in this rapidly evolving field.</p><h2>Exhibitor Highlights: Innovations to Watch</h2><h3><strong>Infineon Technologies: AI and Sustainability at the Core</strong></h3><p><a href="https://www.infineon.com/cms/en/product/promopages/electronica/" target="_blank" rel="noopener noreferrer">Infineon</a> stole the spotlight with its dual focus on <strong>sustainability and digitalization</strong>. Showcasing AI-enabled semiconductor solutions, the company emphasized its commitment to green energy and smart mobility. Their technologies are pivotal in advancing applications such as solar energy systems, electric drives, and secure IoT solutions.</p><h3><strong>Altium: Transforming Electronics Design</strong></h3><p><a href="https://www.messe.tv/en/2024/electronica/altium-life-cycle-electronics-development" target="_blank" rel="noopener noreferrer">Altium</a>, a multinational software company specializing in electronic design automation, unveiled a trifecta of solutions—<strong>Altium</strong> <strong>Discover</strong>, <strong id="isPasted">Altium&nbsp;</strong><strong>Develop</strong>, and <strong id="isPasted">Altium</strong> <strong>Lifecycle</strong>—aimed at streamlining the electronics design process. From conceptualization to product lifecycle management, these tools empower engineers to innovate faster and with greater efficiency.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1732192928529-novelties_altium_booth_electronica_2024_fair_munich-large.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Altium presented their three new solutions for solutions for the entire electronics development life cycle: Discover, Develop and Lifecycle. Source:&nbsp;<a href="https://www.messe.tv/en/2024/electronica/altium-life-cycle-electronics-development" target="_blank" rel="noopener noreferrer">Altium</a></span></span></span></p><h3><strong>Nordic Semiconductor: The New Standard in Bluetooth LE</strong></h3><p>Nordic Semiconductor introduced the <a href="https://www.nordicsemi.com/Nordic-news/2023/10/Nordic-announces-nRF54L-Series-expanding-industrys-most-efficient-Bluetooth-LE-portfolio" target="_blank" rel="noopener noreferrer"><strong>nRF54L Series</strong>,</a> expanding the world’s most energy-efficient Bluetooth Low Energy (LE) portfolio. With a focus on ultra-low power consumption, this series is ideal for applications like wearables, medical devices, and IoT solutions, pushing the boundaries of connectivity.</p><h3><strong>Analog Devices: Agile Manufacturing Robotics</strong></h3><p><a href="https://www.analog.com/en/lp/001/electronica.html" target="_blank" rel="noopener noreferrer">Analog Devices</a> showcased robotics innovations for agile manufacturing, demonstrating how precision sensors and edge computing can revolutionize production lines. Their solutions highlighted the growing importance of flexibility and efficiency in Industry 4.0 environments.</p><h3><strong>Ignion: IoT Innovation</strong></h3><p>Ignion focused on smart antenna solutions designed to improve IoT device performance, showcasing their new <a href="https://ignion.io/landing-page/discover-omnia-mxtend/" target="_blank" rel="noopener noreferrer">OMNIA mXTEND™</a>, a one-of-a-kind three-port Virtual Antenna® component designed to simplify RF connectivity for IoT applications.&nbsp;</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1732194027984-ignion-omnia-mxtend-antenna.jpg" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Ignion unveiled their new OMNIA mXTEND™ Virtual Antenna.&nbsp;</span></span></span></p><h2>From Carbon Goals to Connectivity: Electronica’s Blueprint for the Future</h2><p>Electronica 2024 left attendees with a clear message: the future of electronics is deeply intertwined with global efforts to create a sustainable, connected, and intelligent world. Innovations showcased at the event demonstrated the industry’s resilience and ability to address pressing challenges, from climate change to supply chain disruptions.</p><p>As we look ahead, several trends stand out:</p><ol><li><strong>AI as the Catalyst:</strong> Expect deeper integration of AI across all electronics applications, driving efficiency and unlocking new capabilities.</li><li><strong>Sustainability as a Mandate:</strong> Green manufacturing and circular design will become non-negotiable for businesses aiming to stay competitive.</li><li><strong>Talent Development:</strong> The need for a robust talent pipeline will see continued investment in education and mentorship.</li></ol><p>For engineers, technologists, and industry stakeholders, Electronica 2024 served as both a showcase of current advancements and a roadmap for the exciting developments yet to come. As the industry evolves, platforms like Electronica will remain indispensable for fostering collaboration, innovation, and progress.</p>

Over 80,000 visitors and 3,400 exhibitors attended this year's Electronica in Munich. Image source: Electronica.

From AI-powered manufacturing to sustainable mobility solutions, Electronica 2024 revealed how electronics are paving the way to a carbon-neutral world. This year’s record-breaking event featured game-changing technologies and fostered collaboration across the global industry.

Electronica 2024: Key Insights and Innovations Driving the Electronics Industry Forward

Thin film deposition applies material layers at the atomic/molecular level, vital for advancing electronics, energy, and aerospace. Key methods like CVD, PVD, and ALD enhance material properties, driving innovations in semiconductors, solar cells, and precision tech.

Thin Film Deposition Technologies: Transforming Electronics, Energy, and Aerospace

This article presents a comprehensive technical analysis of CPLD vs FPGA, focusing on their architectural distinctions, performance metrics, design flows, and implementation methodologies. 

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<p id="isPasted">In <a href="https://xometry.eu/en/cnc-machining/" target="_blank" rel="noreferrer noopener">traditional manufacturing</a> and <a href="https://xometry.eu/en/3d-printing/" target="_blank" rel="noreferrer noopener">additive manufacturing</a>, the design and production phases are often the main focus. However, end products, whether they are industrial machines or electronic devices, often require post-processing to enhance their appearance or durability characteristics.</p><p><a href="https://xometry.pro/en-eu/articles/post-processing-eu/">Post-processing</a> in traditional manufacturing includes machining, polishing, and coating to smooth surfaces, remove excess material, or apply protective finishes. Additive manufacturing employs specific methods like support removal, surface smoothing, spray painting, and curing. For instance, resin 3D prints require UV light or heat post-curing to solidify and enhance their mechanical properties.</p><p>But what impact does post-processing have on the dimensional accuracy of parts? Will the part expand or contract? These are critical questions to consider when creating a 3D model to ensure that the part meets design specifications, functions correctly, and fits together seamlessly.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731520083327-vapor-smoothed-part-accuracy-1536x1152.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Measuring the accuracy of a vapor-smoothed 3D-printed part using a digital caliper.</span></span></span></p><h2 data-counter-attr="value0" id="isPasted"><strong>Common Post-Processing Techniques in Manufacturing</strong></h2><p>In designing, post-processing is important since it enhances part aesthetics as well as functionality. This also implies that it affects dimensional accuracy. There are several typical post-processing methods which are employed in CNC machining, sheet metal fabrication, and 3D printing:</p><ul><li><strong>Bead blasting:</strong> This technique uses a high-pressure stream of small beads, often made from glass or plastic, directed at the surface of the part, removing any faults it has and making it even all over. The process can smooth sharp edges slightly, thereby possibly changing key dimensions, particularly where intricate detail abounds.</li><li><strong>Electropolishing:</strong> This is an electrochemical method that removes very thin layers from steel, ensuring shiny surfaces after cleaning. However, the removal process produces bluntness, and results in minimal adjustments to fit precision requirements due to dimension changes.</li><li><strong>Vapor smoothing:</strong> Vapor smoothing involves bringing objects created from 3D printing in contact with chemical vapors, resulting in melting and regulating the outer surfaces. This process may alter small features and round off sharp edges, particularly for finely detailed parts.</li><li><strong>Media tumbling:&nbsp;</strong>In addition to burr removal, media tumbling also polishes surfaces through placing them into vibratory containers fitted with abrasive media. This process is not suitable for fragile part features like sharp edges.</li><li><strong>Sandblasting:</strong> Sandblasting uses high-speed particles for cleaning surfaces as well as texturing prior to painting or other treatments.</li><li><strong>Powder coating:</strong> Here, dry powders are applied electrostatically onto an object that will then be heated to cure the coat into a long-lasting one. However, the process increases dimensions slightly and may cause trouble in fitting tight components together.</li><li><strong>Plating:</strong> Plating involves depositing a metallic coating onto a surface to enhance electrical conductivity, wear resistance, and corrosion protection.</li><li><strong>Anodizing:</strong> Anodizing, which comes in different types (Type II and Type III being the most commonly used), is an electrochemical process used for increasing the oxide layer on metal surfaces.</li><li><strong>Passivation:</strong> This is the process by which stainless steel parts are treated to remove free iron and obtain better resistance to corrosion through the formation of a protective oxide layer.</li><li><strong>Spray painting:</strong> This process is used to apply paint to parts for aesthetics and protection, potentially altering dimensions slightly.</li></ul><section><p>Some post-processing methods can be combined for enhanced results, such as vapor smoothing followed by spray painting to achieve a smooth, colored surface, or sandblasting followed by anodizing for a matte, corrosion-resistant finish.</p><h2 data-counter-attr="value1" id="isPasted"><strong>How Different Post-processing Techniques Impact Dimensional Accuracy</strong></h2><p>When considering post-processing for parts, it is important to understand how each technique impacts both dimensional accuracy and surface finish. The table below compares different post-processing methods (all available on <a href="https://get.xometry.eu/?locale=en" target="_blank" rel="noreferrer noopener">Xometry’s Instant Quoting Engine®</a>), including their effects on the material’s dimensional accuracy and the typical surface finish you can expect.</p><table><thead><tr><th>Technique</th><th>Dimensional Change</th><th>Surface Finish</th><th>Typical Applications</th><th>Materials They Work With</th></tr></thead><tbody><tr><td>Bead Blasting</td><td>Negligible&nbsp;</td><td>Matte/satin,<br>grainy</td><td>Aesthetic finishing, surface<br>preparation for coatings</td><td>Metals, plastics,<br>composites</td></tr><tr><td>Electropolishing</td><td>Slight reduction (0.00635 mm)</td><td>Bright, smooth</td><td>Improving corrosion resistance and smoothing out micro-peaks and valleys</td><td>Stainless steel, aluminium, copper</td></tr><tr><td>Vapor Smoothing</td><td>Minor reduction (~0.023 mm)</td><td>Glossy, smooth</td><td>Enhancing surface quality of 3D printed parts</td><td>Thermoplastics</td></tr><tr><td>Media Tumbling</td><td>Negligible</td><td>Satin-like finish</td><td>Parts with smoothed surface</td><td>Metals, plastics</td></tr><tr><td>Sand Blasting</td><td>Slight reduction (~0.005–0.025 mm)</td><td>Dull finish</td><td>Surface preparation for paint</td><td>Metals, plastics</td></tr><tr><td>Powder Coating</td><td>Addition (~0.02–0.05 mm)</td><td>Matte or glossy, colored</td><td>Wear-resistant parts, aesthetics</td><td>Metals, plastics</td></tr><tr><td>Plating</td><td>Addition (~0.005–0.025 mm)</td><td>Metallic finish</td><td>Electrical components, wear-resistant parts</td><td>Metals (e.g., copper, nickel)</td></tr><tr><td>Passivation</td><td>Negligible</td><td>Matte, enhanced resistance</td><td>Aesthetic enhancements, surface protection</td><td>Stainless steel</td></tr><tr><td>Spray Painting</td><td>Addition (~0.02–0.1 mm)</td><td>Smooth, colored</td><td>Surface enhancement and protection&nbsp;</td><td>Metals, plastics</td></tr><tr><td>Anodizing (Type II)</td><td>Addition (~0.0025 mm)</td><td>Matte or glossy, colored</td><td>Corrosion resistance, durable parts</td><td>Aluminium</td></tr><tr><td>Anodizing (Type III)</td><td>Addition (~0.025 mm)</td><td>Matte or slightly rough, colored</td><td>High-wear applications, mechanical components, corrosion resistance, &nbsp;durable parts</td><td>Aluminium</td></tr><tr><td>Spray painting and vapor polishing</td><td>Addition (~0.012–0.25 mm); slight reduction (negligible)</td><td>Smooth, colored; Glossy, smooth</td><td>Combining surface enhancement/protection and quality improvement for 3D printed parts</td><td>Thermoplastic</td></tr><tr><td>Sand blasting and anodizing</td><td>Negligible reduction (~0.0025–0.025 mm)</td><td>Matte or satin, grainy; Matte or glossy, colored</td><td>Surface preparation and protection for aluminium parts</td><td>Aluminum</td></tr></tbody></table><h2 data-counter-attr="value2"><strong>Regulations and Standards for Maintaining Dimensional Accuracy During Post-processing</strong></h2><p>Here is a brief overview of standards related to dimensional accuracy maintenance during post-processing commonly used in Europe, the UK and Turkey:</p><table><thead><tr><th>Standard</th><th>Usage</th><th>Objective</th><th>Example of Application</th></tr></thead><tbody><tr><td><a href="https://www.iso.org/standard/7748.html" target="_blank" rel="noopener">ISO 2768</a></td><td>Establishes general tolerances for linear dimensions, angular dimensions, and geometrical tolerances in unassociated metal parts</td><td>Ensures consistency in size throughout different manufacturing processes and post-production stages</td><td>Indicating medium tolerances for a CNC-machined metal shaft with a 50 mm diameter as “ISO 2768-m” on the drawing</td></tr><tr><td><a href="https://www.iso.org/standard/66777.html" target="_blank" rel="noopener">ISO 1101</a></td><td>Sets permissible limits for variations in part geometry, focusing on form and position tolerances</td><td>Ensures components meet geometric standards despite dimensional changes during finishing operations</td><td>Specifying perpendicularity: ⊥ 0.1 ISO 1101 for a hole to remain within a 0.1 mm tolerance zone relative to a given datum plane</td></tr><tr><td><a href="https://www.gdandtbasics.com/asme-y14-5-gdt-standard/" target="_blank" rel="noopener">ASME Y14.5</a></td><td>Describes how GD&amp;T symbols specify allowable variations in sizes and shapes of parts using controls such as position control</td><td>Ensures uniformity and high accuracy during and after manufacturing</td><td>Using positional tolerance symbol on the drawing:&nbsp;Position: Ⓟ 0.2 | ⌀10 | A B C*</td></tr><tr><td><a href="https://www.astm.org/d0618-21.html" target="_blank" rel="noopener">ASTM D618</a></td><td>Describes the practice for conditioning plastics for testing purposes after molding to test for thermal or chemical smoothing effects</td><td>Ensures dimensional accuracy by conditioning samples for equilibrium before further operations</td><td>Conditioning plastic samples for 48 hours at 50°C, then 96 hours at 23°C with 50% relative humidity before chemical smoothing</td></tr></tbody></table><p>*The center of the hole must fall within a zone of 0.2mm diameter about datums ‘A,’ ‘B,’ and ‘C’ so that accurate assembly can be achieved during post-processing.</p><h2 data-counter-attr="value3"><strong>Tools and Technology for Monitoring and Controlling Dimensional Changes</strong></h2><p>Monitoring/controlling dimensional changes during post-processing requires accurate tools/technologies. Some key solutions include:</p><ul><li><strong>Coordinate Measuring Machines (CMMs):</strong> These machines use a probe to accurately measure the physical shapes of an object. They are useful for checking measurements as well as detecting any deviation from design specifications. They excel in precision, often achieving measurements within micrometers (0.001 mm), far surpassing the typical accuracy of digital calipers, which is around 0.01 mm.</li><li><strong>Laser scanners:</strong> Laser scanners provide non-contact measurement. They generate high-resolution 3D models of parts that are then compared to CAD designs to ascertain any dimensional change.</li><li><strong>Optical comparators:</strong> These devices project the profile of a part onto a screen and allow for visual comparison against pre-set standards. They are most useful in monitoring dimensional changes in small and intricate parts.</li><li><strong>Digital calipers and micrometers:</strong> For fast, accurate measurements, digital calipers and micrometers provide excellent accuracy when it comes to measuring lengths or thicknesses, which is imperative for quality control.</li><li><strong>Surface roughness testers:</strong> These determine surface finish quality by identifying changes that would affect dimensional accuracy resulting from practices like sanding or polishing through post-processing.</li></ul><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731520160516-engineer-using-cmm-measuring-3d-printed-part-close-up-1536x1024.webp" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Engineer inspecting a part using a coordinate measuring machine (CMM) for dimensional accuracy</span></span></span></p><h2 data-counter-attr="value4" id="isPasted"><strong>How to Reflect Tolerances on Technical Drawings</strong></h2><ul><li>To reflect the finishing processes, such as anodizing, on technical drawings, it is necessary to indicate post-treatment tolerances for any specific customer requirement (e.g. hard anodizing 50µm).&nbsp;</li><li>Clearly specify on the drawing that tolerances on the drawing are&nbsp;<strong>post-treatment</strong>.</li><li>For thin treatments (&lt;10 µm), final tolerances can often be assured. For any treatments thicker than 10 µm, it is recommended to mask certain surfaces to prevent unpredictable dimensional changes post-treatment (e.g. mask threaded holes to ensure they remain within tolerance and functional after a thick anodizing layer is applied).</li><li>Add any surface finish symbols (roughness) and specific tolerances (linear or geometric) that will ensure the part meets its functional requirements.</li></ul></section>

This article will discuss the different post-processing methods and their impact on dimensional accuracy, helping you navigate potential challenges and ensuring your designs achieve the precision and quality they require.

Impact of Post-Processing on Dimensional Accuracy of Parts

<p><span contenteditable="false" draggable="true" class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable"><iframe width="640" height="360" src="https://www.youtube.com/embed/1pLhHg2N34Q?&amp;wmode=opaque&amp;rel=0&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe></span><br></p><p id="isPasted">Kapsula is an innovative solution designed to provide extreme protection for electronic devices in harsh environments. Utilizing advanced materials like polyphenylene sulfide reinforced with carbon fiber (PPS CF), Kapsula offers unparalleled durability against physical impacts, high temperatures, and environmental stressors.</p><p>This robust protection ensures the integrity and functionality of critical electronic equipment and vials containing medicines or biological samples, making Kapsula essential for both civilian and military applications.</p><p>Despite its high resistance, Kapsula remains lightweight at only 250g and can be produced cost-effectively via 3D printing, allowing for on-site manufacturing even in war zones. Kapsula can be deployed in various ways, including drone drops from significant heights or carried by personnel due to its ergonomic design.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731519472292-kapsula-10.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p><h4 id="isPasted">Technical Approach</h4><p>Kapsula is designed as a 3D printed truncated icosahedron, using PPS CF material for high strength and thermal stability. It features a TPU core with a gyroid fill pattern for impact absorption, structural textures for reinforcement, and customizable internal shells.</p><p>The truncated icosahedron was selected due to its superior mechanical properties. This shape is renowned for its ability to evenly distribute forces, minimizing stress concentrations that could lead to material failure.</p><p>The 3D printer used is the new UltiMaker Factor 4, specifically designed to print challenging materials such as PPS CF.</p><p>Advanced features include an integrated GPS sensor and potential additional electronic countermeasures.</p><h4>Ergonomic Design and Manual Operation</h4><p>Kapsula's design is not only robust but also ergonomic. It is small enough to fit comfortably in one hand, making it easy to carry and manipulate.</p><p>The capsule features a simple manual opening mechanism, designed to be operated without tools, ensuring quick and easy access in the field.</p><p>This "rustic" approach to opening means that soldiers and field personnel can rapidly deploy the device without needing specialized equipment.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731519509529-1731519509529.png" class="fr-fic fr-dib"></p><h4 id="isPasted">Advanced Internal Features</h4><p>Inside, Kapsula can include a layer of thermoplastic polyurethane (TPU) printed with a gyroid fill pattern. This gyroid structure is particularly effective at absorbing impacts, providing an additional layer of protection for the electronic devices housed within.</p><p>The TPU core acts as a shock absorber, preventing damage from drops and other impacts.</p><p>This internal design can be customized to fit various objects, ensuring optimal protection for a wide range of equipment.</p><h4>Structural Textures and Reinforcements</h4><p>To further enhance its durability, Kapsula incorporates structural textures applied to its internal surfaces. These textures are designed to reinforce the model, increasing its resistance to impacts and environmental stressors.</p><p>The textures and topologies are carefully calculated and designed to maximize strength while minimizing weight, ensuring that Kapsula remains both lightweight and incredibly strong.</p><p>It can be scaled to different sizes to accommodate various applications and can be enhanced with an intermediate metal layer for additional resistance.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731519534588-kapsula-6.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p><h4 id="isPasted">Development Status</h4><p>Prototype: successfully demonstrated in relevant environments, including high-temperature and high-impact scenarios (drone drop).</p><p>Testing: conducted in various conditions to validate performance claims. Ongoing test campaigns include extended environmental exposure and cyber-physical stress testing.</p><h4>Multiple use potential</h4><p>Kapsula effectively meets both military and civilian needs. In military contexts, it protects battlefield communication devices, ensuring reliable data transmission and preventing data loss during combat. Its lightweight, drone-compatible design allows for the safe delivery of sensitive equipment or supplies to remote locations.</p><p>Additionally, Kapsula acts as a durable black box for drones, safeguarding data in crashes.</p><p>For disaster response or civilian use, Kapsula ensures continuous operation of monitoring equipment and safe transport of medical samples, biological specimens, or evidence requiring secure handling or drone delivery.</p><p>In commercial applications, it protects industrial equipment from hazards.</p>

Kapsula is an innovative solution designed to provide extreme protection for electronic devices in harsh environments. Utilizing advanced materials like polyphenylene sulfide reinforced with carbon fiber (PPS CF), Kapsula offers unparalleled durability against physical impacts, high temperatures

Kapsula: Extreme Protection for Sensitive Devices

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<p id="isPasted">When constructing a footprint for BGA-style components, choosing between solder mask-defined (SMD) and non-solder mask-defined (NSMD) pads is imperative. The correct pad design can mitigate many manufacturing problems and reduce time spent analyzing failures. This article outlines a few simple principles to guide you in creating the right footprints for BGA components.</p><h2><p>Understanding SMD and NSMD Pads</p></h2><p>There are two basic forms of pads implemented for BGA footprints. One is the Solder Mask Defined pad (SMD) and the other, is the Non-Solder Mask Defined pad (NSMD). Let’s take a look at these two types and discuss how to use them in your BGA designs.</p><p>In electronics, "SMD" can also refer to a surface mount device, but in this case we are using it in a different context.</p><h3>Define SMD (Solder Mask Defined):</h3><ul><li>Definition: In SMD pads, a layer of solder mask covers a portion of the underlying copper pad, creating a smaller solder mask opening.</li><li>Benefits:<ul><li>Enables precise soldering due to the reduced copper pad size.</li><li>Enhances the overall reliability and performance of the final device.</li><li>The solder mask opening acts as a guide during BGA ball placement for soldering</li></ul></li></ul><h3>Define NSMD (Non-Solder Mask Defined):</h3><ul><li>Definition: NSMD pads differ by leaving a gap between the copper pad and the solder mask, exposing the entire pad.</li><li>Benefits:<ul><li>Offers superior solder adhesion due to full pad contact with the solder ball.</li><li>Allows for a smaller pad size, simplifying trace routing, especially for high-density BGAs.</li></ul></li></ul><h2><p>Solder Mask Defined BGA Pads (SMD)</p></h2><p><a href="https://macrofab.com/blog/bga-pad-creation-smd-nsmd/#" title="click to enlarge" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731437204486-1731437204486.png" alt="SMD Style BGA Pad" class="fr-fic fr-dii"></a></p><p>SMD Style BGA Pad</p><p>In SMD pads, the solder mask aperture is outlined to be smaller than the diameter of the pad that it encompasses. This approach limits the size of the copper pad that the component is soldered to, providing two key benefits.</p><ul><li><strong>Enhanced Pad Security:</strong> The solder mask overlay strengthens the connection between the pad and the circuit board. This helps prevent the pad from lifting off (delamination) due to thermal or mechanical stress that the PCB might experience during operation or manufacturing.</li><li><strong>Solder Ball Alignment:</strong> The opening in the solder mask acts as a guide, ensuring proper BGA ball placement during the soldering process. This contributes to precise soldering and overall joint integrity.</li></ul><p>In the top-down view, we can see that the solder mask is specified to cover a portion of the copper pad underneath. Defining pads this way creates two distinct advantages. First, the overlapping mask helps prevent the pads from lifting off of the PCB due to thermal or mechanical stress. Second, the opening in the mask creates a channel for each ball on the BGA to align with while the component progresses through the soldering process.</p><p>The copper layer of an SMD BGA pad typically has a diameter equal to the diameter of the pad on the BGA itself. To create the SMD overlay, a reduction of 20 percent is typically used.</p><h2><p>NSMD Pads for BGA Components</p></h2><p><a href="https://macrofab.com/blog/bga-pad-creation-smd-nsmd/#" title="click to enlarge" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731437204561-1731437204561.png" alt="NSMD Style BGA Pad" class="fr-fic fr-dii"></a></p><p>NSMD Style BGA Pad</p><p>In contrast, NSMD pads are structured differently from SMD pads. With NSMD pads, the solder mask is designed to not interact with the copper pad, leaving a gap between the pad's edge and the solder mask. Instead, the mask is created such that a gap is created between the edge of the pad and the solder mask. The following image shows a top and cross-section view of an NSMD-style pad.</p><p>In this method, the size of the copper landing pad is not defined by the mask layer, but only by the diameter of the copper pad itself. NSMD pads can be smaller than the diameter of the solder ball. Typically, this reduction in pad size is 20% smaller than the ball diameter. Since the pad size is reduced with this approach, the additional room between adjacent pads allows for easier trace routing. This can almost become a necessity when routing high-density, fine-pitch BGA chips.</p><p>By allowing for a smaller pad size, NSMD pads facilitate easier trace routing - an almost necessary feature when dealing with high-density, fine-pitch BGA chips. However, NSMD pads are prone to delamination from the PCB under mechanical and thermal stress. Following standard manufacturing and handling practices should prevent this from occurring.</p><h2><p>Solderability of SMD vs NSMD BGA Pads</p></h2><p><a href="https://macrofab.com/blog/bga-pad-creation-smd-nsmd/#" title="click to enlarge" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731437204354-1731437204354.png" alt="Solder Adherence of SMD and NSMD BGA Pads" class="fr-fic fr-dii"></a></p><p>Solder Adherence of SMD and NSMD BGA Pads</p><p>The following images show examples (highly exaggerated) of how a solder ball adheres to each style of pad:</p><p><br></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731437204638-1731437204638.png" alt="Isometric view of BGA Pad Styles" class="fr-fic fr-dii"></p><p>Isometric view of BGA Pad Styles</p><p>With the entire pad exposed, NSMD pads tend to have better solder adhesion than SMD pads. The solder ball is able to make a connection to the entire NSMD pad instead of the mask-defined portion of SMD pads.</p><p><br></p><h2><p>SMD vs NSMD: Which BGA Pad Style to Use</p></h2><p>It is important to note that component manufacturers typically provide recommended footprints in the datasheets for their components. When these footprints are available, it’s certainly advisable to use them.</p><p>In general, use the NSMD pad style wherever possible due to its improved solderability and pad accuracy. <a href="https://help.macrofab.com/knowledge/what-are-macrofabs-assembly-capabilities/" target="_blank">Visit our Knowledge Base for more information.</a></p><p><br></p><h4 id="isPasted">Ready to start your next project?</h4><p><a href="https://factory.macrofab.com/quick_quote?utm_source=direct&utm_medium=none" target="_blank">Get an instant quote now</a></p><section><h5><br></h5></section>

Choosing between solder-mask-defined and non-solder-mask-defined pads is an imperative when constructing footprints for BGA-style components. 

SMD vs NSMD: Best Practices for BGA Pad Creation

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Digi-Key Electronics-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Digi-Key Electronics-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Digi-Key Electronics-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Renesas Electronics-Fri Jun 30 2023 23:59:59 GMT+0200 (Central European Summer Time)

Renesas Electronics-Mon Jul 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Renesas Electronics-Thu Aug 31 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

Renesas Electronics-Thu Aug 31 2023 23:59:59 GMT+0200 (Central European Summer Time)

Renesas Electronics-Sat Sep 30 2023 23:59:59 GMT+0300 (Eastern European Summer Time)

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