When a leading INDEX multi-spindle machine encountered significant challenges with chip removal, tool life, and coolant management, the introduction of a custom 3D-printed coolant ring provided an innovative solution that dramatically improved performance.The Challenge: Poor Chip Removal and Inconsistent Coolant CoverageThe machining process on an <a href="https://www.index-group.com/en_us/company/about-us/index-corporation" target="_blank" rel="noopener noreferrer">INDEX</a> multi-spindle machine was being compromised by poor chip removal, leading to shortened tool life and heightened fire risks. These issues stemmed from inconsistent coolant coverage, which was exacerbated by the machine’s compact design. Standard coolant nozzles were difficult to install due to limited space, and accessing tools with the probe was challenging. Moreover, operators were required to manually remove coolant lines during each tool change, introducing delays and variability that depended on the skill and experience of the operator.This situation not only reduced the efficiency of the machining process but also posed safety risks, making it clear that a more reliable and effective solution was needed. The Solution: A Custom Metal 3D-Printed Coolant RingTo address these challenges, the engineering team designed a custom metal 3D-printed coolant ring with internal channels optimized for efficient coolant flow. <a href="https://oneclickmetal.com/boldseries/" target="_blank" rel="noopener noreferrer">Metal 3D printing</a> was chosen for its ability to produce highly customized parts that precisely meet the stringent specifications required for this application.The coolant ring was engineered to withstand coolant pressures of up to 40 bar, resist oil, and ensure non-flammability. It was fabricated from non-toxic, non-corrosive materials to maintain an absence of contaminants throughout its life cycle. The design also ensured that the coolant ring was easy to install, space-saving, and allowed for easy probe accessibility.The coolant oil is directed through an adapter block into the inlet of the coolant ring. Inside the ring, the oil flows uniformly, being dispensed evenly from three openings to ensure precise delivery to the tool's tip. This design not only improved coolant coverage but also enhanced process stability, as the coolant ring could be removed and reattached independently of the operator, significantly reducing the time required for tool changes.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1730200060177-Coolant+ring.jpg" style="width: 487px;" class="fr-fic fr-dib">The Benefits: Enhanced Efficiency, Safety, and Tool LifeThe introduction of the custom 3D-printed coolant ring brought numerous benefits to the machining process:<ol><li data-list-indent="1" data-list-type="bulleted">Better Chip Removal: The optimized design of the coolant ring ensured consistent and effective coolant flow, greatly improving chip removal and reducing the risk of tool damage.</li><li data-list-indent="1" data-list-type="bulleted">Increased Tool Life by a Factor of 20: With improved coolant coverage and chip removal, the tool life was extended dramatically, reducing the frequency of tool changes and lowering operating costs.</li><li data-list-indent="1" data-list-type="bulleted">Improved Process Stability: The ability to remove and reattach the coolant ring without relying on the operator reduced variability and enhanced overall process stability.</li><li data-list-indent="1" data-list-type="bulleted">Three Times Faster Tool Change Time: The streamlined design and ease of reattachment allowed for much quicker tool changes, tripling the speed of this critical process and further enhancing productivity.</li><li data-list-indent="1" data-list-type="bulleted">Safer Manufacturing Environment: The consistent coolant coverage and improved chip removal minimized the risk of fire, contributing to a safer working environment.</li></ol>Conclusion: A Custom Solution for Optimized PerformanceThe integration of a custom metal 3D-printed coolant ring into the INDEX multi-spindle machine represents a significant advancement in machining efficiency and safety. By leveraging the capabilities of metal 3D printing, the engineering team was able to overcome the limitations of traditional coolant systems, providing a solution that not only met but exceeded the demands of the application. This case study highlights the transformative potential of 3D printing in creating tailored solutions that enhance the performance and reliability of critical manufacturing processes.

In the world of precision machining, efficiency and reliability are paramount. This case study explores the challenge, solution, and benefits of integrating a metal 3D-printed coolant ring into the machining process.

Improving Efficiency with Customized 3D-Printed Coolant Rings

Schematic Drawing - Design of Electronic Circuit Board

In this technical article, we will explore what are schematics, their purpose, diverse types, critical applications and how to read and interpret them effectively.

What Are Schematics: The Blueprint Language of Engineering Decoded

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Pneumatic vs Hydraulic Power Systems: Working Principles, Differences, and Selection Criteria

<section id="isPasted">Imagine pouring countless hours, resources, and brainpower into designing the perfect Printed Circuit Board Assembly (PCBA) for your cutting-edge product. It’s a labor of love, a technical masterpiece. Then imagine someone else, a competitor perhaps, quickly reverse engineering your design, essentially decoding your hard work and using it to their advantage. That’s a scenario no innovator–or innovative company–wants to face.Reverse engineering (RE) is a real and persistent threat in the world of electronics. It is performed to glean a product’s inner workings, replicate, create similar or better products, or, in worst-case scenarios, infiltrate a system to exploit vulnerabilities. Undeniably, it’s a threat that can potentially undercut your market position and dilute your product’s unique value proposition.However, guarding against RE, or ‘hardening’ your PCB assembly design, can drive up development time and manufacturing difficulty, creating a more expensive bill of materials (BOM).This article offers valuable tips and effective strategies on how to protect your PCBA designs from various reverse engineering techniques so that it’s more challenging, time-consuming, and expensive for anyone to reverse engineer them, from both hardware and software perspectives.<h2>Understanding Piracy of Intellectual Property (IP) in Hardware</h2>IP refers to creations of the mind, such as inventions, literary and artistic works, designs, symbols, names, and images used in commerce. In the hardware world, IP can manifest as proprietary technologies or a reusable unit of logic, cell or unique design layouts, and custom software algorithms, among other things.Hardware IP piracy involves the unauthorized use or duplication of another’s hardware design or proprietary technology. This can take several forms in the PCBA industry:<ul><li>Unauthorized Replication: This is a common form of IP piracy where an entity copies a PCBA design without permission. They may manufacture identical or near-identical units, often sold at a lower price. It hurts the profits of the original developers through unfair competition and can harm their brand reputation if counterfeit products are of inferior quality but are confused with the originals.</li><li>Technology Theft: This involves the theft of proprietary technology developed by a company. A competitor might reverse engineer a product to gain access to its technical secrets and then use those secrets to create their own products. This kind of piracy can dilute a company’s competitive advantage.</li><li>Trademark and Brand Piracy: This form of piracy involves the unauthorized use of a company’s branding or trademarks. For instance, a pirate may manufacture PCBAs that are visually identical to a legitimate product, complete with counterfeit logos and branding. This can mislead consumers and damage the reputation of the original brand.</li></ul>IP embodies the heart and soul of your product – it is the unique blueprint that distinguishes your work from others. Defend your hardware IP from adversaries who are capable of reverse engineering, piracy, and malicious changes.<h2>Understanding the Purpose of Reverse Engineering</h2><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1726065887454-1726065887454.png" alt="Purpose reverse engineering" class="fr-fic fr-dii">Reverse engineering, often seen as the art of ‘undesigning,’ involves disassembling an existing product to understand its inner workings, designs, and structures. Like solving a complex puzzle, the final image is known, but finding how the pieces fit together is the challenge.The goal of reverse engineering PCBAs is manifold. On one hand, it is useful for benign applications like analyzing the PCBA for potential enhancements, identifying and fixing faults (chip- and board-level failure analysis and testing), ensuring compatibility with other products, or re-creating a previous design that has lost its documentation. It is benign, however, only if the original IP owner consents and knows about it.In contrast, a malicious party could reverse engineer your PCBA to extract your intellectual property. They could then use your IP for the creation of products for sale or integration into their own products without compensating you, the rightful IP owner. Besides reverse engineering, they might also find security vulnerabilities in your IP, exploit them later, or even add a backdoor once they gain a white-box understanding of it.<h3>Techniques Used in Reverse Engineering of PCBAs</h3>PCBAs consist of PCBs, which are constructed with layers of thin copper foil (conductive) layers laminated to insulating (non-conductive) layers. These layers form the physical foundation for electronic components and provide electrical pathways between them. By disassembling the PCBA and imaging each individual copper layer of the PCB, it is possible to reverse engineer the entire PCBA layout.Key techniques used in reverse engineering a PCBA include:<ul><li>Solder Mask Removal: The solder mask is a protective layer covering most of the PCBA, preventing solder bridges from forming between closely spaced pads. However, it also hides the copper traces beneath. The primary goal of this process is to expose the copper traces on the top and/or bottom layers with minimal damage.</li><li>Delayering: This is a destructive technique used to access the inner copper layers of a multi-layer PCB. The aim is to reveal the circuitry on each layer of the PCB, which is particularly useful when dealing with complex, multi-layer designs. Like solder mask removal, this technique is typically used on unpopulated PCBs. Dremel tools, CNC milling machines, and surface grinders can be used for delayering.</li><li>Imaging: The technique can be used even on fully populated PCBs as it helps document the PCB’s design and layout at different stages of reverse engineering. This process involves the use of X-ray inspection equipment, which allows for internal imaging without physical disassembly or delayering</li></ul><h3>Why Protect Your PCBA Designs from Reverse Engineering?</h3>Your PCBA designs are more than just circuit layouts and component lists; they’re the embodiments of your unique ideas, countless hours of development, and substantial investment in research and development (R&amp;D).<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1726065887027-1726065887027.png" alt="Checkpoint securing pcbas" class="fr-fic fr-dii">The implications of not securing your PCBA designs from reverse engineering are significant. Not only can it lead to financial losses due to reduced market share and eroded profit margins, but it can also result in a loss of trust from your customers and partners. If your product can be easily copied and sold at a lower price, why should customers remain loyal to your brand? Furthermore, it could discourage your R&amp;D team, who may feel their hard work and innovation are not adequately protected.But the threats aren’t just from competitors. If your PCBA designs contain security-sensitive elements or is used as part of a security-sensitive device, reverse engineering can lead to vulnerabilities being exploited, causing severe harm to your customers and potential legal repercussions for your company. A <a href="https://spectrum.ieee.org/three-ways-to-hack-a-printed-circuit-board" target="_blank">2020 article in IEEE Spectrum</a> noted that “the vulnerabilities of the printed circuit board itself are only now starting to get the attention they deserve.”Moving into an increasingly global economy, IP protection cannot solely rely on passive methods such as patents and copyrights. While these provide legal recourse, the enforcement of such rights can be a complex and expensive process, especially when infringements occur in jurisdictions with different legal systems and attitudes toward IP protection.Therefore, a more active form of protection is necessary – one that makes reverse engineering your PCBA designs a more difficult, time-consuming, and costly endeavor. This is where obfuscation techniques come into play.Want to know more about how we keep your designs safe? Read <a href="https://www.macrofab.com/documents/securing-data-in-electronics-manufacturing/" target="_blank">Securing Data in Electronics Manufacturing: MacroFab’s Approach</a> now.<h2>Strategies for Obfuscating PCBA Designs</h2>Obfuscation refers to the practice of deliberately making a product more difficult to understand or decipher by hiding its true meaning or functionality to protect the IP inherent in the product.Here are some key strategies for obfuscating your PCBA designs during the design process:<h3>Sealing the PCBA or parts of the PCBA in epoxy:</h3>This technique involves encapsulating the entire PCBA or specific critical components in a layer of epoxy resin. Epoxy sealing provides a physical barrier that makes it difficult to access or tamper with the PCBA, thereby hindering reverse engineering attempts.However, sealing the PCBA in epoxy may make repairs and maintenance more challenging. Additionally, the epoxy itself can add weight and bulk to the final product. Moreover, epoxy can change the thermal properties of your board and lead to other design challenges.<h3>Washing the markings off ICs:</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1726065887546-1726065887546.png" alt="Washing markings ics" class="fr-fic fr-dii">This method entails removing the identifying markings from the integrated circuits (ICs) on your PCBA, making it more difficult for someone to determine which components are being used.Washing off IC markings can impede reverse engineering efforts by making it harder to identify the specific components and their functions within the design. In some cases, designers go so far as to rename components with misleading identifiers that will confuse potential hackers. But, a skilled reverse engineer might still be able to identify the ICs based on their physical characteristics.<h3>Using blind vias:</h3>Blind vias are non-through holes that connect one external layer of a PCB to one or more internal layers but do not pass through the entire board. By using blind vias in your PCBA design, you can make the circuit layout more challenging to decipher, as connections between layers become less obvious.Nonetheless, blind vias can increase manufacturing complexity and costs, as well as reduce the overall reliability of the PCBA due to potential issues with the interconnections between layers.<h3>Using a custom IC:</h3>A custom IC, also known as an application-specific integrated circuit (ASIC), is designed specifically for your product and tailored to perform a unique function. An ASIC makes it more difficult for competitors to reverse engineer your design, as they would need to design their own IC or find an off-the-shelf alternative that may not offer the same performance or functionality.However, custom ICs can be expensive to develop and manufacture, particularly for smaller production runs. Additionally, you may face challenges related to sourcing and supply chain management, as you’ll be dependent on the specific IC provider for continued availability. In addition, you should consider how you will keep all documentation relating to the ASIC secure for the foreseeable future.<h2>Other Protection Techniques to Consider</h2><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1726065887720-1726065887720.png" alt="Protecting hardware copying" class="fr-fic fr-dii">Further security may be provided by tamper detection or encryption on any programmable device on your PCBA. Regularly updating and patching software or firmware can also help to protect any programmable component against reverse engineering.Protecting hardware from copying often involves programming an MCU in One-Time-Programmable (OTP) mode, disabling external data access. This includes turning off JTAG and debug facilities. However, this strategy restricts debugging and remote updates, limiting improvements to system integrity or service quality.Certain MCUs, like Texas Instruments’ MSP430FR family, offer secure methods for on-chip memory access. It allows either password-based JTAG port security or complete disablement. It also enables the creation of secure and non-secure zones within the memory space using IP Encapsulation (IPE), with the secure area impervious to external access but permitting intra-area data interaction.Other MCUs, like the Microchip PIC32MZ family, have a built-in hardware crypto engine. This engine supports common encryption and decryption ciphers, like AES, DES, and Triple DES, and uses a secret key for data protection. It also provides hardware-implemented data authentication. This hardware crypto engine’s performance is vital for systems requiring frequent, high-volume data processing, like during high-speed transmissions or boot processes.<h2>Threats in the Supply Chain</h2>While much of the focus on PCBA protection is geared towards external threats such as reverse engineering by competitors, it’s crucial not to overlook potential threats within your supply chain. Supply chain threats can occur at your design house or at the PCBA manufacturer.<h3>Design House:</h3>This is where the ideation and creation of your PCBA design occur. Threats at this stage can come in various forms:Sometimes, the risk comes from within. Disgruntled employees, for example, could leak sensitive design information. Unsecure networks or insufficient cybersecurity measures can also leave your designs vulnerable to hacking or unauthorized access.<h3>PCBA Manufacturing Partners:</h3>The production stage also presents its own set of challenges:Unscrupulous manufacturers: When outsourcing manufacturing, particularly to overseas partners, there’s a risk of IP theft if your designs are not adequately protected. Unscrupulous manufacturers might sell your designs to other parties or use them to produce unauthorized versions of your product.Unauthorized Production: Some manufacturers might be tempted to produce more units of your product than agreed upon. These unauthorized units could be sold without your knowledge, cutting into your profits and potentially damaging your brand’s reputation. To mitigate these risks, there are non-engineering tactics you can use.<h2>Non-engineering Methods for Protecting PCBA IP Design</h2>Beyond technical obfuscation and embedded security measures, several non-engineering methods can further secure your PCBA design IP. These strategies involve the careful selection of partners and the strategic management of your designs.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1726065887762-1726065887762.png" alt="Protecting pcba ip design" class="fr-fic fr-dii"><ul><li>Pick a Trustworthy Manufacturer: Choose your manufacturing partner carefully. An ethical, trustworthy manufacturer is a cornerstone of protecting your PCBA designs. Conduct due diligence, check references, and establish solid contractual agreements that bind the manufacturer to respect and protect your IP.</li><li>Manufacture Under Robust IP Laws: Opt for countries with robust IP laws, such as the United States or Mexico. These countries have well- established legal frameworks that safeguard intellectual property and provide recourse in case of infringement.</li><li>Maintain Digital Design Control: Retain digital control of your design at all times. Limit access to your design files and securely store them using encryption or other cybersecurity measures. This ensures that only authorized personnel can access and modify your design data, reducing the risk of unauthorized use or leakage.</li><li>Contracts and Non-Disclosure Agreements (NDAs): Legal agreements play a crucial role in IP protection. A well-drafted contract or NDA can provide substantial legal protection for your designs, offering a clear recourse in the event of a breach.</li></ul>Remember, while engineering methods are crucial for protecting your PCBA designs, these non-engineering strategies offer valuable additional layers of security. They may not be the first line of defense, but they are certainly an important part of a comprehensive IP protection plan.<h2>Conclusion</h2><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1726065887797-1726065887797.png" alt="Reverse engineering threat" class="fr-fic fr-dii">The threat of reverse engineering is real, and the consequences, ranging from lost profits to brand reputation damage, can be severe.As we’ve explored, various methods can help secure your designs – from obfuscation techniques to embedding “Easter eggs” in code and addressing supply chain threats. Each approach has its pros and cons, and the most effective strategy is often a combination of these methods, tailored to your specific needs.By implementing a multi-faceted approach, you’ll be well-equipped to safeguard your valuable PCBA designs from reverse engineering threats and maintain your competitive edge.</section>Read more about design essentials now.&nbsp;Download<a href="https://www.macrofab.com/documents/pcba-design-handbook-2023/" target="_blank" rel="noopener noreferrer">&nbsp;MacroFab’s Engineering Essentials: The PCBA Design Handbook</a> <section><h5> </h5></section>

Leaving your design unsecured can lead to financial losses due to reduced market share from copycats.  It can also affect customer and partner trust  

Protect PCBA Designs From Reverse Engineering: Tips and Tricks

Wire Electrical Discharge Machining (Wire EDM) has revolutionized precision machining, empowering manufacturers to tackle with intricacies in aerospace, medical devices, and electronics. This latest technology pushes boundaries with its ability to create complex shapes and achieve point accuracy.

Wire EDM: Precision of Modern Engineering

PCB Panels are separated with pre-designed “Mouse Bites” for seamless and realiable operations

Understanding the implementation, advantages drawbacks, and crucial design considerations for optimal circuit board separation and efficiency

Understanding PCB Mouse Bites: A Guide to Breakaway Tabs and V-Groove Techniques

Discover strategies and best practices in design for injection molding, a method for producing cost-effective plastic and metal parts.

Design for Injection Molding: A Comprehensive Guide

Designing waterproof enclosures involves understanding some key principles, and this guide is here to help. It will walk you through the necessary steps to develop a high-quality waterproof product that not only meets large-scale production requirements but also excels in functionality and water resistance, ensuring it performs exactly as required. <h2>What's an IP Rating?</h2>When we talk about making a waterproof enclosure for electronics, we're really talking about its IP rating. This rating tells you how good the product is at keeping stuff like dust and water out.<h3 data-elementor-setting-key="title" contenteditable="true" data-pen-placeholder="Type Here..." id="isPasted"> </h3><h3>Decoding the IP Code</h3>The IP code has two numbers, in the format IPXX. The first number is about keeping out solids—anything from fingers to dust. It goes from 0 (not protected) to 6 (totally sealed off). The second number is for water. It starts at 0 (no protection) and goes up to 8 (can handle being under water for a while), and sometimes you'll see a 9K, which is extra tough, handling hot water. <h3>What the Ratings Mean</h3>These ratings are super important because they give you a quick idea of what your product can handle:IPX6: Can take strong jets of water from any side.IPX6K: Like IPX6 but even stronger against high pressure.IPX7: Can be underwater for 30 minutes at a depth of 1 meter.IPX8: Can go deeper than 1 meter—usually around 3 meters—and stay there for 30 minutes.IPX9K: This one's a big deal—it can take hot, high-pressure water from different angles.&nbsp;<h2>Starting with the Basics: Waterproof Industrial Design</h2>When we talk about starting with 'industrial design', we're referring to the initial concept—the 'make it pretty' phase. But don’t worry, our focus is on the 'make it work' aspect. It’s about ensuring that the design is not only aesthetically pleasing but also functional, especially when it comes to waterproof design.&nbsp;For this article, we’ll use a two-part case molded in ABS as an example. <h3 data-elementor-setting-key="title" contenteditable="true" data-pen-placeholder="Type Here..." id="isPasted">Selecting Appropriate Materials in Waterproof Enclosure Projects</h3>For those of you looking into how to make a waterproof box for electronics, the material choice is critical. If you need more strength, you might lean towards an ABS/PC blend. But beware, this blend doesn't play well with oils or solvents—it can weaken the material and lead to damage. Any screws used need to be clean, as any oil on them can seep into the plastic over time, causing the parts to fail. <h3 data-elementor-setting-key="title" contenteditable="true" data-pen-placeholder="Type Here..." id="isPasted">Optimizing Corner Design for Enhanced Waterproofing</h3>Sharp corners can be problematic. They're harder to seal and more prone to damage. A more gradual flow between faces, with rounded corners, can improve both the seal and the durability of the case.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAxNzc3NjIwNzMwLUNvcm5lcnMucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 442px;" class="fr-fic fr-dib" alt="designing enclosure corners"><h3 data-elementor-setting-key="title" contenteditable="true" data-pen-placeholder="Type Here..." id="isPasted">Effective Assembly Strategies for Enclosure Water Resistance</h3>When it comes to putting the case together, we want to avoid the unsightliness of exterior nuts and bolts. Using internal threaded inserts like brass or stainless steel is an option, especially for larger products or those that require regular servicing. However, these can be tricky to implement and can introduce their own problems.Instead, we'll be using M2 Plastite trilobular thread-forming screws with TORX heads - these drivers are more factory friendly. These screws create a strong hold without damaging the material and are ideal for a waterproof enclosure design aiming for higher IP ratings like IPX6K or IPX7. The use of washer heads can distribute the load, preventing the screws from digging into the case, which is essential for maintaining a good seal.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAxNzc3NjA3NTQ5LUFzc2VtYmx5LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 464px;" class="fr-fic fr-dib" alt="screws design">For a less conspicuous finish, we can opt for chemical blackening of the screws. However, the shiny steel can also add a nice touch to the design.You might think M2 screws are small, and you could go up to M2.5 or M3, but the size increase doesn't significantly enhance strength and can make the case bulkier. For bigger products, M2 screws are usually sufficient, but you have the flexibility to go larger if the design allows for it.<h2 data-elementor-setting-key="title" contenteditable="true" data-pen-placeholder="Type Here..."> </h2><h2 data-elementor-setting-key="title" contenteditable="true" data-pen-placeholder="Type Here..." id="isPasted">Advanced Sealing Techniques in Enclosure Design</h2>Sealing your waterproof enclosure is the crux of ensuring its effectiveness, and there are several ways to achieve this. However, not all methods are equal when you're looking to produce at scale. The Challenge with O-RingsWhile O-rings might seem like a go-to solution, they come with their own set of challenges. They can be tricky to assemble without causing twists or misplacements, and any minor error can compromise the waterproofing—especially when aiming for an IPX6 rating or higher. They might work for handcrafted, low-volume products, but they're not ideal for large-scale production. Custom Rubber Gaskets: A Step UpMoving to a custom rubber gasket that combines all sealing elements into one is a significant improvement. It <a href="https://jiga.io/resource-center/manufacturing/design-for-assembly-principles-applications-guidelines/" target="_blank" id="isPasted">simplifies assembly</a> and reduces the chance of misplaced seals. However, it's not without flaws. The gasket needs to be large enough to handle, which can result in a bulkier look that might not be desirable for every product. It's a decent choice for moderate production volumes but might not be the fastest to assemble. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAxNzc3NTc5NDMyLUdhc2tldC5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 461px;" class="fr-fic fr-dib" alt="Industrial Design Waterproofing Gasket"> The Winning Strategy: OvermoldingFor mass-produced waterproof products, overmolding the seal is the standout method. It takes the burden off assembly workers since the seal is integrated into the product during manufacturing. This not only speeds up the process but also minimizes human error, as the seal placement is consistent and no longer reliant on manual dexterity.The upfront investment in an extra tool for overmolding might seem steep, but considering the cost of field failures—not to mention the potential damage to customer relationships—the investment pays off rapidly, especially if your product has a higher price point.As Henry Ford pointed out, the cost of not having the right tool can exceed the investment in the tool itself. By choosing overmolding, you're not just buying a tool; you're investing in the reliability and efficiency of your waterproof product's future. The Importance of Seal PressureSeal clamping is another crucial aspect of designing a waterproof enclosure for electronics. It's not just about keeping water out; it's also about handling internal pressure changes due to temperature variations. Handheld products often experience significant temperature shifts, which can cause the internal pressure to fluctuate. Dealing with Temperature-Induced Pressure Changes<ul id="isPasted"><li>Air Expulsion: When a product heats up and the internal pressure increases, it might expel air, which seems harmless initially.</li><li>Air Ingression: The real issue arises when the product cools down. This reverse pressure gradient can cause the product to suck in air. If this air is moist, it can lead to internal damage, either quickly or over time.</li><li>Desiccant Pouches: While these can delay moisture-related issues, they are not a permanent solution. Moisture trapped inside can still fog up display windows and corrode the electronics, especially when the product warms up.</li><li>Venting as a Solution: Venting with a moisture barrier can be effective, but it requires meticulous maintenance. The hydrophobic layer of the barrier must remain clean; otherwise, it can easily become ineffective. Moreover, rapid heating or cooling can overwhelm the barrier, leading to pressure spikes.</li></ul> A Comprehensive Approach to Seal ClampingGiven these challenges, a more robust approach to seal pressure is advisable. The goal is to ensure that the enclosure can't bulge between the fixings, which might compromise the seal. Adding extra screws is a cost-effective way to reinforce the seal, and with an overmolded seal, the additional holes pose minimal risk. Ideal Fixing DistributionThe original industrial design might have had a certain distribution of fixings, adequate for an IPX6 rating but not sufficient for higher standards like IPX6K or IPX7. Based on experience, a more effective layout would involve placing fixings no more than 35mm apart. This closer distribution of screws ensures a more consistent and reliable seal, crucial for achieving higher IP ratings. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAxNzc3NjU4MjA5LVNlYWxpbmcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 508px;" class="fr-fic fr-dib" alt="enclosure design fixings"> <h3 data-elementor-setting-key="title" contenteditable="true" data-pen-placeholder="Type Here..." id="isPasted">Key Considerations for the Gasket</h3>The gasket is the linchpin of a waterproof design. Its effectiveness hinges on two critical factors: its correct placement without any faults, and high compression at potential leakage points. <h3 id="isPasted">Different Scenarios and Gasket Choices</h3>1. For a Single Product: If you're making just one item, and it's going to be hand-assembled, O-rings can be sufficient. They’re manageable for a one-off project.&nbsp;2. For a Moderate Volume Production: If you're aiming to produce about 100 units, and you have skilled assemblers, then a custom-molded rubber gasket is a viable option. It's more labor-intensive and requires careful inspection, but it's doable.3. For High-Volume Production: When the goal is to produce hundreds of units daily, with a fast-moving production line and less skilled labor, overmolding the gasket becomes essential. Without this, you risk facing a high percentage of seal-related failures.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAxNzg1MDA4MTE3LU92ZXJtb2xkZWQgR2Fza2V0LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 732px;" class="fr-fic fr-dib" alt="Overmolded Gasket">The Advantages of OvermoldingOvermolded gaskets offer <a href="https://www.plastikcity.co.uk/blog/advantages-disadvantages-of-injection-moulding/" target="_blank" id="isPasted">unparalleled precision and reliability</a>. This precision allows for exact compression, ensuring both the effectiveness and durability of the seal. This method is proven in mass production environments, where keeping the elements out is non-negotiable. Cost-Effectiveness and Quality AssuranceThe cost of the extra tooling for overmolding can vary widely, but the investment is justified when you consider the broader economic picture. For instance, if a product costs $50 to produce and a field failure incurs a cost of $200, a $3,000 tool would pay for itself after preventing just 15 failures.Moreover, this approach streamlines assembly and reduces the need for extensive quality assurance checks associated with less precise gasket solutions. Detailed Gasket FeaturesLooking closely at a well-designed, overmolded gasket, you'll notice features like ‘pinch points’—small, pointed ridges around screw holes and along the enclosure's perimeter. These ridges ensure consistent compression, accommodating the varying forces exerted by screws and the minor flexing of the case.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAxNzc1OTU0NzkwLUdhc2tldC1Db21wcmVzc2lvbi1GZWF0dXJlcy03Njh4NDc2LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 728px;" class="fr-fic fr-dib" alt="Gasket Compression Features"><h3 data-elementor-setting-key="title" contenteditable="true" data-pen-placeholder="Type Here..." id="isPasted">Gasket Placement and Control</h3>In waterproof enclosure design, especially for electronics, the placement and control of the gasket are crucial for ensuring a durable and effective seal. Let's delve into the specific design elements that make a significant difference. Gasket Size and Containment <ul id="isPasted"><li>Groove Dimensions: In the case we're examining, the groove in the bottom wall is 1.8mm wide and 1mm deep, with an overall wall thickness of 2.4mm. The resulting 0.5mm wide skirts provide essential containment, preventing the gasket from bulging under pressure.</li></ul><ul><li>Tooling Considerations: The groove's shallow depth means it doesn't require much draft; its parallel structure can be easily removed from the tooling due to its formation from the force side.</li></ul><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAxNzg1MTQ1NDE5LUdyb292ZSBhbmQgc3RlcC5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 300px;" class="fr-fic fr-dib" alt="Groove and step waterproof design"> Aesthetic and Functional Design Elements<ul id="isPasted"><li>Step at the Joint Line: There's a deliberate small step at the product's joint line. This not only facilitates cleaner tooling but also helps mask any imperfections in the component parting line, enhancing the product's overall appearance.</li></ul><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAxNzc4NjQwNDA0LWZlZWRlci5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 300px;" class="fr-fic fr-dib" alt="gasket feeder design"> Detailed Features for Effective SealingCase Top Features<ul id="isPasted"><li>Compression Ridges: A 90° pointed ridge on the screw post compresses each screw gasket, while a small skirt wraps over the gasket to prevent bulging and maintain pressure.</li><li>Double Row Ridge: Along the box's periphery, a double row ridge is used where compression forces are relatively lower.</li></ul> Screw Pillar Design<ul id="isPasted"><li>Screw Pillar Adaptation: The screw hole expands to the outside diameter of the thread for a depth of 1.5mm, creating an undamaged collar of plastic at the top of the pillar. This feature is critical for maintaining the integrity of the pillar, even if the thread causes some damage.</li></ul><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAxNzc4NTYxMDY1LW1hdGNoaW5nIGZlYXR1cmVzIG9uIHRoZSBjYXNlIHRvcC5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 300px;" class="fr-fic fr-dib" alt="90° pointed ridge waterproof design"><h3 data-elementor-setting-key="title" contenteditable="true" data-pen-placeholder="Type Here..." id="isPasted">Selecting the Right Screw</h3>The screw is a central element in the design of waterproof enclosures, especially when aiming for high IP ratings. A specialized screw can make a significant difference in both the assembly process and the long-term reliability of the product. Characteristics of the Ideal Screw<ul id="isPasted"><li>Head Type: T6 or T7 Torx heads are recommended. They provide excellent engagement and can be easily driven with hand tools or automated equipment.</li><li>Thread Type: A trilobe plastite M2 thread is suggested, based on our extensive experience. This is a thread-rolling type rather than thread-cutting, which is gentler on the material and forms a stronger bond.</li><li>Material and Durability: The screws are made of hardened 420 stainless steel, which is robust enough to prevent the head from being torqued off. This material choice ensures durability and longevity.</li></ul><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzAxNzc4NTQ1ODA5LVVudGl0bGVkICgxKS5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 300px;" class="fr-fic fr-dib" alt="Screw design waterproof">Fine-Tuning Screw Implementation<ul id="isPasted"><li>Pillar Hole Sizing: Finding the ideal screw pillar hole size is essential. Typically, a diameter hole of about 1.4-1.55mm works well for an M2 nominal screw. However, this can vary based on the screw manufacturer and the specific polymer used in the molding.</li><li>Adjustments for Different Polymers: The hole size may need to be adjusted depending on the type of polymer used in the enclosure's construction. Different materials can react differently to the screw, affecting the overall integrity of the seal.</li></ul>&nbsp;&nbsp;<h2 data-elementor-setting-key="title" contenteditable="true" data-pen-placeholder="Type Here..." id="isPasted">Sealing the Deal: Key Takeaways</h2>Designing waterproof enclosures for electronics is a blend of choosing the right materials, like ABS, and paying attention to details such as IP ratings and overmolded gaskets for sealing. The selection of specialized screws is also crucial. This approach balances functionality with ease of manufacturing, ensuring that the final product is not only technically sound but also practical in real-world use.

Designing waterproof enclosures for electronics is a blend of choosing the right materials, like ABS, and paying attention to details.

Designing a Waterproof Enclosure: A Simple Guide

Backplane PCBs are interconnect systems that integrate various electronic modules, creating a unified and scalable system. As IC bandwidths skyrocket, the need for high-speed backplane buses has grown significantly. Yet, they’re challenging to design.These backplanes are crucial in sectors like defense, telecommunications, and data centers where high data transfer rates are essential. But herein lies the challenge: designers are met with intricate signal integrity concerns, including impedance control, lumped parasitics, and noise degradation.Wondering how to enhance the reliability of your high-speed backplane bus? This article has the expert design tips you need. With a reliable system bus in place, you can focus on component functionality, assured that everything will sync seamlessly at the hardware level.<h2></h2><h3>Design Considerations</h3>A high-speed backplane is a sophisticated interconnection system, tailored to support data transmission at exceptionally high rates. But as data rates soar into the multi-gigabit range, signal integrity issues like crosstalk, impedance mismatches, and insertion losses become pronounced. This makes designing high-speed backplanes a tricky task.Here’s a basic step-by-step for creating a high-speed backplane:Step-by-Step Guide For Your High-speed Backplane PCBA Design<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698409299798-1698409299798.png" alt="Pcb electric circuit on the pc screen" class="fr-fic fr-dii"><ol><li>High-Level Design with Functional Block Diagrams: At this phase, the objective is to capture the big picture of the system: how different components or circuit packs interconnect, the number of signals involved, power requirements, etc.</li><li>Sketch a Preliminary Routing Outline: This involves a rough estimation of where tracks (connections) will go. It’s about understanding how tracks might be routed and identifying potential problems early on. Having a sense of the spatial layout can help in understanding the complexity of the design.</li><li>Make a Pin-list Summary: Create a spreadsheet listing all the pins for every circuit module. This helps in estimating the number of layers required, organizing signals, selecting appropriate high-speed backplane connectors, and more.</li><li>Select the Right Connectors: The connector is crucial. The choice can dictate design longevity and adaptability. Ensure it’s robust( since backplanes experience multiple insertions and removals), meets future high-speed requirements, and has the right pin configurations.</li><li>Define the Geometry for Differential Pairs: Properly configure your differential pairs. Having consistent spacing and identical length traces within the pair reduces EMI and crosstalk and upholds characteristic impedance.</li><li>Preliminary Stack-Up: This step involves deciding the arrangement of layers in a multi-stack high-speed backplane PCB.</li><li>Make a Detailed Route Plan: Building on the preliminary routing plan, this phase involves a more detailed look at how the actual routes will run, ensuring that signals have clear paths and minimizing the potential for interference.</li><li>Analyze Vertical Trace Space: Confirm there’s adequate room for traces to run vertically between connectors. This can influence your choice of connector or overall strategy.</li><li>Conduct a Signal Clarity Check: Here, verify that your signals will travel cleanly without unwanted distortions. Utilize simulations and tools to ensure the integrity of your transmitted data.</li></ol><h2></h2><h3>Challenges in High-Speed Backplane Design</h3>As the signal travels from its source to its destination via a high-speed backplane, several factors can compromise its integrity. Here’s a breakdown of the core challenges faced:<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698409299234-1698409299234.png" alt="Hs backplane design challenges" class="fr-fic fr-dii"> <img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698409299997-1698409299997.png" alt="Male laboratory worker in whitecoat studying" class="fr-fic fr-dii"><ol><li>Conductor Skin Effects &amp; Dielectric Losses: At high frequencies, signals prefer the outer “skin” of conductors rather than using its entire cross-section. This phenomenon is known as the “skin effect”. As the effective area of the conductor decreases, the resistance it offers to the signal increases, leading to signal loss. Also, the high-speed backplane PCB’s dielectrics are not perfect insulators and can absorb some of the signal’s energy.</li><li>Return Loss &amp; Impedance Discontinuities: The vias, connector pins, and differences in layer stacking on the backplane can introduce mismatches in impedance. When the signal hits these discontinuities, a part of it gets reflected back, diminishing the energy that reaches the endpoint.</li><li>Signal Stubs: Stubs can cause parts of the signal to get trapped or delayed, leading to signal degradation and potential interference. Stubs are commonly caused by poorly designed vias, un-terminated branches in the trace routing, unused connector pins, elongated component leads, and mismatched layer transitions in the high-speed backplane PCB.</li><li>Lumped Parasitics: Unintended resistances, capacitances, and inductances from components and board features can distort and degrade the signal.</li><li>Noise Degradation On high-speed backplanes, daughterboards have multiple transceivers with differential pairs running parallel on the PCBA. When too close, they can cause crosstalk.</li></ol><h2></h2><h3>Tips for Better Signal Integrity in a High-Speed Backplane</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698409300042-1698409300042.png" alt="Large green pcb microcircuit board" class="fr-fic fr-dii">To address the aforementioned signal integrity concerns, consider the following board design strategies:<ol><li>Choose the Right Equalizer: High-speed backplane links do not have a simple attenuation curve. They have multiple fluctuations due to reflections, crosstalk, and specific frequency resonances. Pick the right equalizer to compensate for these imperfections.</li><li>Material and Component Evaluation: Pay attention to the choice of vias, stack-ups, and connector pins. These choices directly impact signal integrity. Always monitor the ‘eye-closure’ to gauge this effect.</li><li>Prioritize High-Resolution Measurements: Always measure the high-speed backplane’s passive components as well as the near-end eye and far-end eye between daughter boards in both the frequency and time domains. A higher resolution in measurements means better pinpointing of potential issues like crosstalk or unexpected impedance changes.</li><li>Use a Good Vector Network Analyzer (VNA): Ensure your VNA has an adequate frequency range, offers reliable time-domain performance, and provides a diverse set of de-embedding techniques.</li><li>Manage the distributed capacitance on the Backplane: Capacitance on a backplane affects signal speed and quality. Over half of this capacitance originates from the transceiver’s input/ output pins. To improve signal integrity, select low-capacitance ICs for transceivers, increase trace impedance, and minimize stub lengths.</li><li>Use a well-matched termination resistor: Place a termination resistor at the end of a signal trace to prevent reflections. Ensure its value matches the loaded impedance of the backplane trace for best signal integrity.</li><li>Optimize for low-power consumption: For better power efficiency, reduce the backplane’s capacitance by using tighter slot spaces, shorter stubs, and low-capacitance components. This allows for higher termination resistor values, drawing less current.</li><li>Incorporate Ground Pours for Enhanced Isolation: Use ground pours on your backplane PCB for better isolation and consistent impedance. This provides a stable ground reference, minimizing electromagnetic interference and ensuring strong signal integrity.</li><li>Transform Unused Signal Layers into Plane Layers: Convert unused signal layers in multi- layered backplane PCBs to plane layers, either ground or power. This boosts electromagnetic interference shielding, aids heat dissipation, and can function as decoupling capacitors, reducing power noise and stabilizing impedance.</li></ol><h2></h2><h3>Connector, Pinout, and Routing Best Practices</h3>A well-functioning high-speed backplane is heavily reliant on its connectors, pinouts, and routing techniques. Here are some best practices to consider:<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698409300588-1698409300588.png" alt="Best practices table" class="fr-fic fr-dii"> <h2></h2><h3>Comparison Between Common Backplane Standards</h3>Over the years, several standards have emerged, each tailored to specific application needs. Here’s a concise comparison of three prominent backplane standards: VME, CompactPCI, and VPX.VME (VMEbus): The Versa Module Europa bus is an open-source backplane standard started in the 1980s. It was made so parts from different companies could work together in one system. While reliable, its parallel bus architecture makes it slower compared to newer technologies, especially for data-heavy tasks.cPCI (CompactPCI): CompactPCI was introduced in the mid-1990s as an adaptation of the desktop PCI standard for industrial and embedded applications. It is particularly popular in telecom applications due to its high data rates and support for hot swapping.VPX : VPX was developed in response to the growing demand for higher data transfer rates, particularly in the defense and aerospace sectors. Unlike older standards such as VME and CompactPCI, VPX adopts a switched fabric architecture, which directly addresses the limitations of traditional bus-based systems. This architecture not only facilitates multi-gigabit per second transfers but also enhances scalability and reduces contention.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1698409300688-1698409300688.png" alt="Binary code numbers in blue abstract speed motion" class="fr-fic fr-dii"> <h2></h2><h3>Conclusion</h3>High-speed backplanes are pivotal for designs that need fast data transfer. Different industries use specific backplane standards; for instance, the defense sector often opts for the Sensor Open Systems Architecture (SOSA).However, crafting these backplanes is no easy task due to signal integrity challenges such as conductor skin effects, return loss, impedance discontinuities, signal stubs, and noise degradation. You need an expert design team and the right design tools in place, along with a reliable PCB manufacturer to get it right.<section id="isPasted"><h4>Have production challenges? Get help now.</h4><a href="https://www.macrofab.com/pcba/engineer-benefits/" target="_blank">CHECK OUT MACROFAB'S ENGINEER-FRIENDLY FEATURES</a></section><section><div data-bs-ride="carousel"><h5> </h5></div></section>

Learn step-by-step how to create a high-speed backplane

Expert Tips for High-Speed Backplane PCB Design

Surface finish standards establish a common language that upholds uniformity and accuracy.

The Ultimate Guide to Surface Finish Standards: Symbols, Charts, Techniques, & Applications

In this episode, we unveil the astounding achievement of a student team that created an electric vehicle (EV) capable of shattering the 0-62mph speed record, leaving even the most capable state of the art supercars trailing behind.

Podcast: Student-Built EV Shatters 0-62mph Record, Leaving Supercars in the Rearview

Design for Assembly is a systematic approach to optimize product design to streamline the assembly process earlier and more thoroughly.

Design for Assembly: Principles, Application and Guidelines

This article was discussed in our <a data-saferedirecturl="https://www.google.com/url?q=https://www.wevolver.com/profile/the.next.byte&source=gmail&ust=1672821999265000&usg=AOvVaw3lLKdHdEN0YvCEsaHI7hx9" href="https://www.wevolver.com/profile/the.next.byte" rel="noopener noreferrer" target="_blank">Next Byte podcast</a>.&nbsp;<iframe height="200px" width="100%" frameborder="no" scrolling="no" seamless="" src="https://player.simplecast.com/5af262f5-0967-4c6a-8b58-6de660cf0e47?dark=false" class="fr-draggable" data-gtm-yt-inspected-6="true" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe> The full article will continue below.<hr>While lightning rarely strikes the same place twice, the <a href="https://www.amzracing.ch/en/world-record" target="_blank" rel="noopener noreferrer">Academic Motorsports Club Zurich (AMZ)</a> has somehow made it strike thrice. As they clinch the EV world acceleration record for the third time since 2014, one has to wonder: is it the seasoned giants of the automobile world or passionate students who are setting the benchmark for speed?Having already painted their legacy on the canvas of speed by breaking the same record in 2014 and 2016, this quest wasn&rsquo;t merely to reclaim their title. It was about stretching the boundaries of innovation, transforming academic prowess into tangible, ground-shaking technological feats. As Yann Bernard, head of motor development at AMZ, <a href="https://ethz.ch/en/news-and-events/eth-news/news/2023/09/from-zero-to-one-hundred-in-0-956-seconds.html" target="_blank" rel="noopener noreferrer">articulated</a>, their venture marries dedication with the thrill of tackling real-world challenges. <iframe width="640" height="360" src="https://www.youtube.com/embed/mvoFemftA34?&wmode=opaque&rel=0&enablejsapi=1&origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true" data-gtm-yt-inspected-6="true" id="70611535" title="New World Record – from 0 to 100 km/h in 0.956 seconds">&nbsp;</iframe> <h3>A world record, obliterated</h3>The vanguard students from ETH Zurich and Lucerne University of Applied Sciences and Arts, forming the spirited team at AMZ, have proven that when innovation meets ambition, records are not just broken &ndash; but obliterated.Their latest electric vehicle masterpiece, <a href="https://www.amzracing.ch/en/cars/2023%20WR" target="_blank" rel="noopener noreferrer">Mythen</a>, has left the world astounded, achieving a meteoric 0-62mph (0-100 km/h) acceleration world record for EVs in a staggering 0.956 seconds. To put this performance in perspective, it <a href="https://ethz.ch/en/news-and-events/eth-news/news/2023/09/from-zero-to-one-hundred-in-0-956-seconds.html" target="_blank" rel="noopener noreferrer">shattered</a> the previous record of 1.461 seconds, which was achieved by a team from the University of Stuttgart in 2022.This is not only the world record, but also <a href="https://www.amzracing.ch/en/world-record" target="_blank" rel="noopener noreferrer">the first time</a> that an electric vehicle has accomplished the feat below the one-second barrier. It&#39;s also pertinent to note that it only took Mythen&nbsp;about 40 feet, or just over 12 meters, to break this record. The AMZ team executed their record attempt at a racetrack but astoundingly,&nbsp;would have only needed about half the length of a regulation tennis court to reach 62mph. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0NjI0MjYzMTY0LUVUSF9BTVoyM18zNi5qcGVnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 532px;" class="fr-fic fr-dib">Mythen in action (credit: ETH Zurich / Alessandro Della Bella)<h3>The secret sauce behind their success</h3>Some of the main technical factors driving <a href="https://www.amzracing.ch/en/cars/2023%20WR" target="_blank" rel="noopener noreferrer">Mythen</a>&#39;s immense success are outlined below:<ol><li>In-House Mastery: Mythen, a beacon of student innovation, was birthed entirely by the AMZ team &ndash; from the printed circuit boards to its chassis. This in-depth involvement at every stage ensured that each component was meticulously optimized for record-breaking performance. </li><li>Power to Weight Paradigm: At a mere 309 pounds (140 kilos), Mythen&#39;s lightweight carbon and aluminum honeycomb structure stands in stark contrast to its immense power. With its student-developed, four-wheel hub motors, it boasts a remarkable 326 horsepower (240 kW), giving it a power-to-weight ratio of over one horsepower per pound of weight. Juxtapose this with many supercars, which despite having more horsepower and added weight, don&#39;t come anywhere close to&nbsp;Mythen&#39;s 0-62mph time. </li><li>Aerodynamics &amp; Ground-Effect Synergy: Dario Messerli, head of aerodynamics at AMZ,&nbsp;<a href="https://ethz.ch/en/news-and-events/eth-news/news/2023/09/from-zero-to-one-hundred-in-0-956-seconds.html" target="_blank" rel="noopener noreferrer" id="isPasted">emphasized</a> the necessity of not just raw power, but its efficient transfer to the ground. One of the main technical challenges AMZ encountered is that during the 0-62mph speed window, a traditional wing (such as those often seen on high-speed vehicles like Formula One racecars) would not generate sufficient downforce to ensure efficient power transfer. The team&#39;s innovative solution? A vacuum mechanism, acting as a gargantuan suction pad, that ensures maximum traction, alongside an underbody that also leverages ground effects to maintain unparalleled stability during its explosive acceleration. </li><li>Battery Efficiency: Mythen&#39;s battery stands at roughly one-third the size of a standard Formula Student EV. This design choice is strategic, allowing unparalleled speed without the encumbrance of a bulky battery &ndash; further amplifying its acceleration prowess.</li></ol><h3> </h3><h3>Significance</h3>This isn&rsquo;t just a victory lap for the team at AMZ. Mythen&rsquo;s success is a herald of the boundless horizon of electric vehicles. As the world increasingly leans towards sustainable mobility, such feats highlight the untapped potential of EVs.Mythen&#39;s success also serves as a reminder to automobile giants: the next automotive marvel may not emerge from a sprawling corporate lab but from a buzzing university workshop, replete with passionate students and audacious dreams.

How a hand-built electric race car from Swiss university students shattered the 0-62mph (0-100km/h) acceleration record in a mere 0.956 seconds, outpacing the giants of the automotive world.

Student-Built EV Shatters 0-62mph Record, Leaving Supercars in the Rearview

<h2 id="isPasted">Introduction</h2>Modern hardware engineering teams are facing a productivity crisis. Research commissioned by Dassault Syst&egrave;mes shows that, on average, engineers spend just 51%[1]<a href="https://www.getanneal.com/engineering-productivity.html#ref" target="_blank"></a> of their time on innovation and design work. It also shows that they are typically working with outdated information 20% <a href="https://www.getanneal.com/engineering-productivity.html#ref" target="_blank"></a>[1] of the time, meaning that engineers are able to dedicate just 41% of their time to innovative, productive work with up-to-date input data.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0MDg5NjQ5NzI2LUVuZ2luZWVyVGltZVV0aWxpc2F0aW9uLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 302px;" class="fr-fic fr-dib">Derived from [1]. Drawing office challenges of this nature are adversely affecting both product quality and time-to-market for product businesses, with Autodesk research indicating that 35%[2]<a href="https://www.getanneal.com/engineering-productivity.html#ref" target="_blank"></a> of engineers report missing due dates during the design process. These challenges are also recognised by engineering leaders, with more than 94% [3] of engineering executives shown to recognise the need for improved mechanical engineering productivity.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0MDg5NjgwOTgxLURlc2lyZWRJbXByb3ZlbWVudC5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 300px;" class="fr-fic fr-dib">Reproduced from [3]. <hr><h2 id="isPasted">The Cause</h2><h3>A Fragmented Approach to Information Management</h3>Dassault&#39;s research[1]<a href="https://www.getanneal.com/engineering-productivity.html#ref" target="_blank"></a> permits further breakdown of engineer time demands. It shows that 25% of all &#39;non-value-added&#39; engineer time is consumed by simply searching for information, with significant time also spent collecting data for other stakeholders, and repeating work when information could not be found.Considering why this may be the case, an engineering practices and procedures survey[4]<a href="https://www.getanneal.com/engineering-productivity.html#ref" target="_blank"></a> provides some indication, with results demonstrating that e-mail, meetings, and telephone remain the dominant mechanisms for communication and collaboration in contemporary engineering teams. These channels are private by design, with participants having to take active, post-hoc steps to share outcomes with team members. Important technical information shared via these routes is also frequently rendered undiscoverable; hidden from other team members, exempted from version control, and put beyond the ready reach of any new hire.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0MDg5NzE0NDY1LUNvbGxhYm9yYXRpb25Ub29sLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 300px;" class="fr-fic fr-dib">Drawn from the results of [4]. &#39;Issue Tracking System&#39; refers to software development-focused products: JIRA, GitHub, GitLab etc. <h3 id="isPasted">Design Review Procedures: A Persistent Threat</h3>Checking and approval procedures are a key component of engineering best practice. Many organisations run a stage-gate process, typically with at least two review stages, but often with more. In general, there are two broad categories of review and approval procedures involved in physical system design and development:<ol><li>A high-level concept review, typically completed earlier in the design process. This review assesses the design concept against broad objectives, and does not address minor design or manufacturing details.</li><li>A detailed checking and approval procedure for finalised drawings, completed prior to system components being formally released via an ECN or ECO procedure.</li></ol>The results of <a href="https://www.getanneal.com/engineering-productivity.html#ref" target="_blank">[4]</a> tell a story of inadequate tooling, with in-person meetings and e-mailed screenshots dominating the approaches taken by modern engineering teams. In both cases, these methods offer very poor visibility&mdash;typically failing to capture topics discussed, decisions taken, and action items agreed.However, the latter approach is considered particularly pernicious: it places vast time demands on the engineer requesting review. They are obligated to manually select and annotate salient views of their design, then distribute these to a wider set of stakeholders. This set of stakeholders then returns the documents with their own annotations, and the engineer initiating the review must collate and address multiple possibly conflicting comments from disparate sources.&dagger; <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0MDg5NzQ1OTQ2LVJldmlld01ldGhvZG9sb2d5LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 300px;" class="fr-fic fr-dib">Drawn from the results of [4].&dagger;Though Anneal currently has no robust data to support a quantitative assessment of the impact of the screenshot and e-mail based design review process, it is a topic frequently encountered during customer conversations, with the typical procedure involving the assembly of a multiple page PowerPoint presentation of salient views which is then e-mailed to a number of reviewers for comment.<hr><h2 id="isPasted">The Cost</h2>The damaging consequences of poor visibility and discoverability of technical information are clear to see: engineers must spend more time looking for information, they must repeat previously completed tasks, and they must complete remedial rework in the wake of design progressing with out-of-date values. Dassault&#39;s research[1] provides values for the most frequently reported consequences of bottlenecks in collaboration and shortcomings in information discoverability that result in outdated information feeding into the design process.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0MDg5ODAyMzQ4LUNvc3QucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib">Recreated from [1]. Further considering the impact of outdated information in design, survey results indicate that more than half of engineering organisations[4]<a href="https://www.getanneal.com/engineering-productivity.html#ref" target="_blank"></a> have encountered problems arising from out-of-date values persisting through design iterations, with these ranging from time-pressured and costly late-stage rework of a given design, through to catastrophic failure of a large-scale product prototype.All considered, the prevailing approach to managing the design and development of complex hardware systems appears to be failing for many teams. Engineers are bogged down in non-technical workload, and their tools are not providing adequate support. With engineers spending just 41% of their time&mdash;two days per week&mdash;on productive, innovative work, individual companies are spending hundreds of thousands of dollars on misdirected engineering resource, and could be losing millions in the marketplace through degraded product quality, stretched development cycles, and delayed product introductions.<hr><h2 id="isPasted">The Solution</h2>For most teams, the best mitigation for this productivity crisis will require two things: modified behaviour, and modified tools.On behaviour, engineering teams must adopt more open, collaboration-centric mechanisms for communication. They should consider reducing task scope, mixing disciplines, and assigning ownership to all work. More importantly, they should prioritise seeding a writing culture, take steps to make engineering decision making readily interrogable, and champion visibility and transparency amongst their team.On tools, software should be sought or developed to support the behavioural change. Engineering teams should seek access to software that enables both real-time and asynchronous peer review of drawings, CAD files, and technical reports. They should seek software that allows engineering topics to be discussed in context, that allows them to view task progression and workload distribution across a project, and that allows them to leverage modern web application technology to accelerate product development and improve product quality&mdash;wherever the team is.<hr><ul><li>[1]: Reduce Non Value Added Work, Dassault Syst&egrave;mes &amp; Tech Clarity&nbsp;</li><li>[2]: Extending PDM Beyond Design Data Management, Autodesk &amp; Tech Clarity&nbsp;</li><li>[3]: The CAD Productivity Research Report, Siemens &amp; Lifecycle Insights&nbsp;</li><li>[4]: Engineering Practices &amp; Procedures Survey, Anneal</li></ul>

The average engineer spends just 41% of their time on productive, innovative work⏱️

The Engineering Productivity Crisis

<h2 dir="ltr" id="isPasted">Introduction</h2>3D printing requires knowledge from various engineering and design areas, including 3D design, materials science, and mechanical engineering. No matter the scale of your additive manufacturing project, having a deep understanding of these elements is essential for success. One way for engineers to expand their 3D printing knowledge is through engagement with online courses. In this article, we look at the <a href="https://bigrep.com/academy/" target="_blank" rel="noopener noreferrer">BigRep Academy</a>, an online 3D printing knowledge resource from the German-based 3D printing company Big Rep.<h2 dir="ltr">BigRep Academy</h2>The BigRep Academy is a valuable asset for engineers and designers throughout the 3D printing industry who are looking to expand their knowledge of large-format digital fabrication. 3D printing is an industry that is continuously evolving, so it is essential for engineers and designers to stay ahead of trends with the right technical knowledge.&nbsp;The BigRep Academy has an extensive repertoire of courses, tutorials, and insights, catered specifically for engineers and designers looking to expand their technical knowledge.&nbsp;<h2 dir="ltr">Basic Training (eLearning Platform):</h2>The BigRep Academy e-learning platform includes course materials that provide the necessary fundamental knowledge for efficient 3D printing. These fundamental courses include:&nbsp;<ul><li dir="ltr">Blade Basics:&nbsp;Find out how to get about and get the most of BigRep&rsquo;s potent slicing program, BLADE. This session will teach you everything you need to know, from preparing your model to optimizing your print settings to producing professional-quality prints. By learning about the various slicing parameters, infill patterns, and support structures, you&#39;ll be able to fine-tune the quality and efficiency of your prints.</li><li dir="ltr">Design for Additive Manufacturing: Explore the fundamentals of design used in additive manufacturing. Learn the basics of designing for 3D printing, such as taking into account the geometry, material qualities, and support structures of your creations. Using the skills and knowledge provided by this program, you will be able to develop designs that make full use of the diverse potential of additive manufacturing. You will learn how to optimize designs for strength, utility, and effective use of materials, which will enable you to build complex parts that were previously impossible to make using standard manufacturing methods. You will also learn how to optimize designs for optimal use of space.</li><li dir="ltr">Operating Your BigRep Printer:&nbsp;Gain complete self-assurance in your ability to operate your BigRep printer. This session covers key features such as setting up the machine, calibrating it, loading it with material, and successfully printing. You will acquire a comprehensive knowledge of the operations of the printer, such as how to manage the temperature, load filament, and level the bed. You will be able to get the most out of your equipment and produce results that are reliable and of a high standard if you are familiar with the peculiarities of its operation.</li><li dir="ltr">Troubleshooting:&nbsp;Utilizing their troubleshooting module, you can locate and fix typical mechanical faults as well as difficulties with the print quality. Learn how to diagnose problems with your printing process, such as layer adhesion, warping, or nozzle clogging, and adopt efficient solutions to maintain a smooth and uninterrupted printing process. You will develop skills in troubleshooting that will allow you to recognize potential issues and take necessary actions, so ensuring that your printing experience will go off without a hitch.</li></ul>Each module takes approximately 2 hours to complete. There is a test at the end of each training module, except for the introduction module. When participants pass the test, they receive a certificate.<h2 dir="ltr">Advanced Training</h2>Users who are interested in further improving their 3D printing abilities can take advantage of the advanced training choices provided by BigRep Academy, which is available in addition to their eLearning platform. These modules consist of the following:<ul><li dir="ltr">Blade Advanced:&nbsp;Improve your cutting prowess by learning more about the powerful tools available in the BLADE program. Gain an advantage in the 3D printing market by learning how to maximise print speed, material economy, and productivity. Adaptive layer height, variable infill density, and intelligent support generation are just a few of the cutting-edge techniques you&#39;ll learn about. You can save time and resources without sacrificing print quality by using these methods to fine-tune prints for specific needs.</li><li dir="ltr">Printer Maintenance:&nbsp;You can extend the life of your BigRep printer and keep it running well with regular maintenance. If you want to maintain your machine running smoothly and efficiently and cut down on downtime, this training package will show you the ropes. You&#39;ll gain an understanding of how to clean the print bed, lubricate moving parts, and inspect for signs of wear and tear, among other routine maintenance tasks. Maintaining your printer regularly will increase its lifespan and guarantee reliable operation.</li><li dir="ltr">Individual Training:&nbsp;BigRep recognizes that each customer has particular needs. BigRep can tailor training to meet your unique needs, whether those needs are related to completing a particular project or overcoming a particular difficulty. By tailoring your education to your unique needs, you can learn about the specifics of 3D printing that will have the most impact on your process.&nbsp;</li></ul><h2 dir="ltr">Why Choose BigRep Academy?</h2><a href="https://bigrep.com/academy/" target="_blank" rel="noopener noreferrer">The BigRep Academy</a> is currently available to all BiG Rep customers. It is a unique offering that provides specialized knowledge about large-format 3D printing. As a 3D printing company that covers printers, materials, and a service platform, the company has the depth of experience to elevate your designs through its knowledge sharing. Learn more about the academy <a href="https://bigrep.com/academy/" target="_blank" rel="noopener noreferrer">here</a>.&nbsp;

Deepen your 3D printing knowledge by exploring the BigRep Academy. Explore foundational and advanced techniques through courses such as Design for Additive Manufacturing and 3D Printing Troubleshooting. 


Expanding Professional  3D Printing Knowledge Through Online Learning Academy

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