Solving Obsolescence with Rochester Electronics

Futureproofing Aerospace Series. Article #4: Rochester Electronics has decades of experience helping customers navigate the complexities of component obsolescence.

Jake Hertz

29 Jul, 2024. 6 min read

Solving Obsolescence with Rochester Electronics

Stay at the cutting edge of the aerospace industry

We are pleased to have partnered with Rochester Electronics to launch the Future-Proofing Aerospace whitepaper.

Whitepaper highlights:

Understand the Importance of Legacy Systems: Discover why preserving legacy avionics systems is crucial for reliability, compliance, and cost-effectiveness.
Navigate Component Obsolescence: Learn about the challenges aerospace designers face due to outdated or discontinued components and how to address them.
Explore Solutions from Rochester Electronics: Gain insights into how Rochester Electronics specializes in preserving and replicating obsolete components to ensure the continued operation of legacy systems.

Download the full whitepaper below.

Solutions to component obsolescence

Throughout this article series, we’ve discussed the causes of component obsolescence and the significant risks it poses to the avionics designer. The extra time, money, and effort incurred due to obsolete components can completely make or break an avionics design. But now it’s time to talk about solutions.

At Rochester Electronics, they’ve made it their mission to help customers overcome the challenges associated with component obsolescence. In this piece, we’ll show you exactly how they have been helping avionics designers skirt the challenges of component obsolescence for over 40 years.

Authorized Distribution and Licensed Manufacturing

One way to approach the challenge when dealing with obsolete components is to seek out specialized suppliers who focus on providing solutions for end-of-life (EOL) and hard-to-find electronics. The aerospace industry, in particular, faces significant hurdles in this area due to the long lifecycles of aircraft and the rapid pace of semiconductor evolution. This situation is further confounded by the prevalence of counterfeit parts in the market, which can lead to performance issues, safety risks, and compliance violations.

Rochester Electronics stands out above the competition thanks to its ability to provide a continuous supply of both active and end-of-life semiconductors through our authorized distribution and licensed manufacturing services^[1]. Thanks to these partnerships, we have amassed an inventory of over 15 billion genuine devices. By having all components go through authorized distribution, we guarantee our inventories are free from counterfeit parts and that they all meet the original manufacturer's specifications.

To complement this, we also have the in-house capability to manufacture over 70,000 different device types. This enables us to ensure that aerospace companies can always access the necessary components without risking exposure to counterfeit parts.

By choosing Rochester Electronics as their partner, aerospace companies can confidently source the components they require for maintaining and repairing their legacy systems, knowing that these parts are authentic and reliable.

Wafer Storage and Processing

Maintaining component integrity in storage is a big challenge for suppliers like us. During long-duration storage, semiconductor wafers and components are susceptible to a variety of degradation factors such as oxidation, moisture absorption, and electrostatic discharge. These environmental stressors can lead to subtle changes in the material properties of the semiconductors, potentially affecting their electrical characteristics, reliability, and overall performance. Without proper preservation techniques, even microscopic contaminants or slight variations in temperature and humidity can compromise the integrity of stored components, rendering them unusable for future manufacturing processes.

This is why we implement rigorous storage protocols and advanced environmental control systems. At Rochester Electronics, we pride ourselves on delivering cutting-edge wafer preservation and handling solutions^[2]. Our advanced facilities in Newburyport, Massachusetts, boast ISO-8 and ISO-7/10 K-certified environments with nitrogen control, precise humidity regulation, and continuous temperature and moisture monitoring. These meticulously managed conditions safeguard wafers against contamination and deterioration so that we can maintain a robust inventory of components without the risks typically associated with extended storage periods.

Our comprehensive services encompass wafer back-side grinding, precision dicing using dual spindle saws, and thorough dice inspection utilizing state-of-the-art Automated Optical Inspection (AOI) systems. These advanced technologies allow us to offer unparalleled defect detection and measurement, ensuring strict adherence to the most rigorous quality standards in the industry. We further extend our offerings to include manual and automated pick-and-place operations conducted under ISO-5 hoods, providing individual dies in various packaging formats, including waffle packs, film frames, gel packs, and tape and reel configurations.

All of these efforts together guarantee that Rochester customers receive safe and reliable components.

Replication Services

One of our most unique tools for fighting component obsolescence is our replication services, which allow us to replicate obsolete devices with authorization from original manufacturers [3].

For instance, our Design team, with over 40 years of combined experience, specializes in authorized porting of products from original fab processes, including DO-254 minor change classification – which avoids the need for system recertification – and DO-178 compliance. To this end, we employ unique proof-of-duplication methodologies and advanced electrical performance replication techniques, such as output edge-rate matching and detailed signal integrity analysis. Our labs perform electrical device characterization of original and replacement devices across temperature and voltage limits. This rigorous process ensures that our ported products match the I/O performance of the original components, maintaining system stability and preventing the introduction of new signal integrity concerns. Our comprehensive approach includes legacy voltage ASIC designs for FPGA replacements and creative board-level solutions to support long-life systems.

By replicating obsolete components, we help aerospace companies avoid the substantial costs and risks of redesigning systems to accommodate new parts. Our ability to provide exact matches to original components guarantees the continued reliability and performance of aerospace systems, mitigating the impact of component obsolescence and supporting the long-term viability of your legacy designs.

Comprehensive Testing and Assembly Services

Before components can be sold to customers, they must be fully tested and validated to ensure proper performance and adherence to standards. That’s why we’ve invested significant resources in cutting-edge testing equipment and modern assembly technologies. We expose all of our components to a comprehensive validation process that ensures all components meet or exceed performance criteria before deployment.

In terms of assembly, we maintain support for both traditional and cutting-edge technologies, encompassing lead frame, QFN, and BGA assemblies [4]. Our expertise spans both hermetic and plastic assembly methods. For hermetic assembly, we utilize automated and semi-automated equipment for eutectic, silver glass, and epoxy die attach processes, and we offer package replications including leadframes. Our plastic assembly line features automated saw, die attach, wire bond, and full automold equipment. We also provide component lead finishing services, including SnPb and 100% tin plating, with versatile rack plating systems and solder dip options. The quality of these processes is assured through DLA-certified procedures and in-house reliability testing.

Our testing capabilities are housed in a 30,000-square-foot facility equipped with state-of-the-art automated test equipment and computer-aided design systems [5]. At these facilities, we offer a wide range of testing services covering digital, analog, RF, memory, ECL, mixed-signal, ASICs, PLDs, and FPGAs. This includes specialized testing for military applications, enhanced screening procedures, up-screening, selected item drawing, source control documents, and tier-2 automotive testing. Furthermore, we provide bespoke, high-quality test solutions, temperature profiling, ATE platform conversion, component programming, and electrical and mechanical interface design.

By integrating these advanced capabilities, we create customized solutions that precisely meet the unique needs of aerospace companies, whether it involves testing legacy components or fabricating new ones to exact specifications. Our comprehensive approach minimizes obsolescence-related risks and guarantees that all components undergo thorough validation before integration into critical systems.

Conclusion

Component obsolescence is undoubtedly a challenge, but that doesn’t make it insurmountable. At Rochester Electronics, their combination of authorized distribution and licensed manufacturing, wafer storage and processing, replication services, and comprehensive testing and assembly services should provide customers with the resources and confidence needed to overcome the impact of obsolete components.

Learn more about aerospace obsolescence in the latest whitepaper.

In the next article in this series, we’ll discuss some proactive strategies for managing avionics obsolescence.

References

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