<h2 dir="ltr" id="isPasted">Introduction</h2><p dir="ltr">Industrial machinery, from robots to crane booms, require sensing and guidance to ensure their effective use. Beyond the industrial world, the latest video cameras detect and compensate for movement and vibration to create high-quality imagery. In fact, accurate sensing of orientation and movement is integral to everything from communication satellites to farming equipment.</p><p dir="ltr">Inertial measurement units (IMUs) allow the precise measurement of motion and orientation. When combined with accurate positioning information provided by global navigation satellite systems (GNSS), IMUs can provide location and velocity information, even when satellite signals are weak or obstructed.</p><p dir="ltr">Selecting the right IMU should be easy. Manufacturer’s data sheets provide access to all the information an engineer needs to choose the perfect component for their application. And yet, engineers are designing inaccuracy into their equipment as they are unable to gain a full understanding of how IMUs perform from data sheets alone.</p><p dir="ltr">In this paper, we will highlight three key challenges that engineers face when specifying an IMU for their next design. We will help them to read between the lines of the data sheet to understand the information they need. We will look at how manufacturers test their products, and we will explain how the environment can affect the performance of IMUs.</p><p dir="ltr"><span contenteditable="false" draggable="true" class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable"><iframe width="540" height="370" src="https://c8056756.sibforms.com/serve/MUIFAFzOYRmakTTHP2FX2FyHP3QxXkV_prDOkSjxVq9r73O2ZYgeTBdxzjryZ1uiV-lwmna05gucMW0bsczCM_L1y82QMtCTmxYMAjh47rKxZQYNnUMylX2XNlQ7TpTNyLxACx2rLDFoQXvwdl20h6UYtI005O05w77j-WIyUR8ngfSBpL3p7bGQ8Cu-7pjUFhSkY3xZfKxVGSlQ" frameborder="0" scrolling="auto" allowfullscreen="" style="display: block;margin-left: auto;margin-right: auto;max-width: 100%;" class="fr-draggable"></iframe></span><br></p><h2 dir="ltr">Chapter 1: Getting the Whole Picture</h2><p dir="ltr">Engineers selecting the components for a new design will rely upon the manufacturer's information. The wealth of information provided by data sheets and catalogues allows the engineer to make decisions based on the component’s predicted performance. The key attributes that must be understood when selecting IMUs are bias instability and angle random walk (ARW). Bias instability is caused by tiny fluctuations in an IMU’s zero-bias level. This is the reading that the sensor delivers when it is at rest, and therefore provides the baseline for an IMU that is stationary. IMUs are affected by a range of external conditions, including variations in temperature and vibration, which reduce the accuracy and stability of the IMU's output. This change is characterized by a slow, long-term drift and is measured in degrees of drift per second (deg/s).</p><p dir="ltr">In contrast to bias instability, angle random walk is caused by random high-frequency noise inside the IMU which causes variations in the measurement of angular velocity over time. The errors that ARW tries to quantify grow with the square root of time, and so the accumulated angle error will grow over a long period.</p><p dir="ltr">Both attributes are, therefore, heavily influenced by time, a problem that is made worse by the dynamic conditions that IMUs are intended to measure. However, the data that is typically provided in IMU data sheets does not reflect this dynamic nature, and both bias instability and ARW are often published as a single number. This reduction of a complex system to a single number does not provide the engineer with a clear prediction of its performance over time. By relying on single attributes, engineers run the risk of designing inaccuracies into their device before it is even used.</p><p dir="ltr">Instead of relying on the single value of the gyro bias instability and ARW, engineers can turn to Allan deviation plots. An Allan deviation plot (or Allan variance plot) is a graphical tool that provides a more useful understanding of the stability and noise characteristics of IMUs. The plot is unique to each IMU and helps identify the effects of different types of noise by showing how the variance of a sensor’s output changes over different averaging times. This is especially useful for assessing the drift and noise behaviour over time.</p><p dir="ltr">This time dependency is the key advantage of using Allan deviation instead of traditional standard deviation. Standard deviation is a useful tool if the mean of the data is expected to be constant, and the measurements do not drift over time. This is not the case with IMUs. An Allan plot is derived from data collected from the IMU over a period of time, calculated at an interval known as tau (𝜏). This represents the averaging time, and the higher the tau, the more that individual extreme readings will be averaged out.</p><p dir="ltr">The image below shows a typical Allan deviation plot for an IMU, in which the low point corresponds to the bias instability, whereas the value corresponding to tau of 1 sec (1 second averaging) represents the angular random walk, reflecting the higher frequency fluctuations that define ARW.</p><p dir="ltr"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1733673242419-banner+epson.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p><p dir="ltr" id="isPasted">Another data point concerns warm-up time. Extreme temperatures can affect the warm-up time of the IMU. This is the period after activation that the IMU needs to reach its operational state. In just one example, after hours exposed to sub-zero temperatures, the warm-up time for an IMU may be considerably longer than published to allow the internal components to stabilize before they can provide accurate readings.</p><p dir="ltr">To avoid designing undesired inaccuracy into a new device, it is therefore vital for the engineers to access the best possible data. The preferred path for the engineer is to work with an IMU manufacturer that can provide this comprehensive information, for the alternative is for the engineer to conduct their own evaluation, a time-consuming process.</p><p dir="ltr">While the information presented in data sheets is important, the engineer will only gain a real insight into the performance of their chosen component by understanding the underlying data and how it will affect their application in the long run.</p><h2 dir="ltr">Chapter 2: IMUs in the Real World</h2><p dir="ltr">Accurate and comprehensive information is therefore vital, but it is important for the engineer to understand the conditions under which it was obtained. Systems and equipment that use IMUs are regularly deployed beyond the safe environment of the laboratory into the real world. The conditions they encounter can have a significant effect on the performance of IMUs.</p><p dir="ltr">An example of these tough conditions can be found in modern farming. The agricultural industry is embracing the latest sensing technology, collecting data to maximize efficiency. &nbsp;This data is used to make decisions, from identifying optimum soil conditions to deploying the right resources.&nbsp;</p><p dir="ltr">Accurate positioning is essential for the smart farm. The ability to precisely control planting, fertilizing and harvesting activities allows the farmer to improve efficiency, yields, and sustainability. The huge growth in the development of autonomous tractors, harvesters, and drones places even more emphasis on navigation and positioning. These systems make use of global navigation satellite systems (GNSS) to allow these machines to operate within centimeters of their intended paths, without the need for human intervention.</p><p dir="ltr">However, GNSS signals may not always be available as satellite signals can become disrupted or blocked. Atmospheric conditions, interference from structures and geographical features, along with the orbital geometry of the satellites themselves can all cause loss of signals. Without satellite guidance, autonomous machinery cannot obtain the accurate position that is so important to precision farming.</p><p dir="ltr">Under these circumstances, the IMU becomes the principal means by which the equipment can locate their position. Using a process of dead reckoning, the IMU can measure the movement from the last known position provided by GNSS until the signal can be reacquired. The same method can be employed by a huge range of industries far from the smart farm, from the delivery of medical supplies by drone into remote locations to the automated loading of ships at ports.</p><p dir="ltr">This reliance on IMUs in the real world means that they must withstand a range of conditions. Some of the most important effects to consider are those caused by shock and vibration. IMUs can be affected by both high and low frequencies. Some frequencies can cause an effect called sensor saturation in which the IMU can no longer work correctly as the vibration exceeds the IMU’s limiting value. Engineers must also be aware of the physical damage that vibration and sudden shock can cause to equipment.</p><p dir="ltr">Engineers must also understand the effect of extreme temperatures on IMUs. In the earlier example, we looked at the need for accurate positioning on the smart farm. The agricultural environment is one of the harshest in the world, and vehicles are designed to function in an extraordinary range of conditions. Whether deployed to the frozen tundra in the Arctic circle or the unforgiving heat of deserts, equipment is exposed to ambient temperatures from -40°C to near the boiling point of water.</p><p dir="ltr">This range of temperatures has a significant impact on the accuracy and performance of IMUs. Bias instability changes with temperature, which can lead to cumulative errors, especially for measurements based on integration over time. To complicate matters further, the drift in bias caused by changes in temperature are often nonlinear. This means that the designer needs to calibrate their system over the expected operating temperature range to ensure accuracy.</p><p dir="ltr">Engineers must therefore understand the environment into which their equipment will be deployed. Identifying harsh conditions on the road or in the factory will allow engineer to choose the correct IMU based on accurate data. This may require information obtained from the IMU manufacture that is not contained in the data sheet. It is essential to understand how temperature will affect warm-up time, and to request a calibration profile that details temperature-dependent drifts.</p><h2 dir="ltr">Chapter 3: Consistency is the Key</h2><p dir="ltr">While it is important for the engineer to understand the conditions to which their design will be exposed, it is also crucial to know how the data provided by the manufacturer was created. This has important implications for consistency. Data sheets for IMUs often present typical performance values, without providing clear information about how this information was obtained. In many cases, the published information is an average, but the data sheet will rarely provide details about the statistical methodology used to obtain the average. Without the all-important description of this typical performance, the engineer can only guess how the IMU will perform in their specific application.</p><p dir="ltr">When evaluating IMUs, it is important to understand the level of statistical confidence behind the performance data. Where some manufacturers will publish performance at a 1-sigma level, others will use 2-sigma. The statistical difference between different sigma levels has important implications for high-performance applications in which consistency is key.</p><p dir="ltr">Sigma levels are use used in statistics to describe a confidence level in the data provided. In a normal distribution of data, a 1-sigma (1σ) level represents one standard deviation away from the mean. At this level, roughly two-thirds (in fact, 68.27%) of the data values will fall within this one standard deviation from the mean. In real terms, it means that there is a two-thirds probability that any single measurement will fall within this range.</p><p dir="ltr">However, if a manufacturer bases their data on a 2-sigma (2σ) level, this probability rises to more than 95%. As a result, any one measurement will fall within the predicted range 19 times out of 20, delivering a far higher level of confidence in the data provided. In the context of IMUs, this confidence translates into an expectation of accuracy over time.</p><p dir="ltr">This variation in predicted consistency is further complicated by the testing regime employed by the manufacturer. Some manufacturers adopt a strategy of batch testing, evaluating only a small number of units to provide the data required. Other manufacturers may conduct multiple tests on a single unit in the expectation that this will provide an accurate prediction of the performance of the entire range. The result is that the listed performance may not accurately reflect the variability between different IMUs from the same production batch. This variability can be significant, particularly for critical characteristics like bias instability.</p><p dir="ltr">Unfortunately, the only way to truly understand how an IMU will perform in a real-world application is for the engineer to perform their own evaluation. While data sheets can provide a baseline, real-world testing is necessary to understand the variability between units and ensure consistent performance in the field. Working with a trusted manufacturer that publishes clear and comprehensive information can go a long way to helping the engineer with their understanding.</p><p dir="ltr"><span contenteditable="false" draggable="true" class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable"><iframe width="540" height="370" src="https://c8056756.sibforms.com/serve/MUIFAFzOYRmakTTHP2FX2FyHP3QxXkV_prDOkSjxVq9r73O2ZYgeTBdxzjryZ1uiV-lwmna05gucMW0bsczCM_L1y82QMtCTmxYMAjh47rKxZQYNnUMylX2XNlQ7TpTNyLxACx2rLDFoQXvwdl20h6UYtI005O05w77j-WIyUR8ngfSBpL3p7bGQ8Cu-7pjUFhSkY3xZfKxVGSlQ" frameborder="0" scrolling="auto" allowfullscreen="" style="display: block;margin-left: auto;margin-right: auto;max-width: 100%;" class="fr-draggable"></iframe></span><br></p><h2 dir="ltr">Conclusion</h2><p dir="ltr">Selecting the right inertial measurement unit is a complex task. Not only are IMUs required to accurately measure movement, but they are expected to deliver high reliability in some of the most demanding conditions..</p><p dir="ltr">Engineers need to understand how these conditions will affect the performance of their IMU. The roles played by extremes of temperature and the physical demands of dynamic applications must be considered before the engineer can have confidence on their design. Unfortunately, some manufacturers do not provide easy access to the detailed information that engineers need. Therefore, when selecting an IMU, here are the key considerations for engineers:</p><ul><li dir="ltr">Remember that the data sheet might not contain the depth of information required. Do not rely on single-number attributes, and obtain Allan deviation plots to gain a full understanding of the device’s performance.</li><li dir="ltr">Device testing takes place in the controlled environment of the laboratory, but the real-world is not so accommodating. Extremes of temperature and physical demands play a huge role in the reliability and accuracy of IMUs. Engineers should ensure that they understand their environment.</li><li dir="ltr">Take the time to understand how IMUs are tested. Confidence in performance comes from extensive testing methods, and clearly published data from the manufacturer. If necessary, engineers should be ready to conduct their own evaluation.</li></ul><p dir="ltr"><a href="https://global.epson.com/products_and_drivers/sensing_system/imu/">Epson</a> manufactures a comprehensive range of IMUs for a huge array of applications, from earthquake detection to the precise positioning of satellites in space. Epson creates highly capable sensing systems that offer outstanding precision, high stability, and low noise to deliver confidence to design engineers in the most demanding industries.</p>

Understanding IMU data sheets, manufacturers' testing methods, and the impact of environmental factors on performance.

Three Key Considerations for Selecting IMUs

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<p id="isPasted">Gallium nitride (GaN) offers significant benefits of increased efficiency and power density, and allows designers to meet far more challenging power supply specifications than they can with silicon MOSFETs. &nbsp;One reasonable concern about any new technology that offers game-changing benefits is robustness and reliability. To address any doubts that potential users may have, let’s discuss the robustness, reliability and quality of GaN.</p><p>GaN, as a power conversion technology, does not have as long a pedigree as silicon. Even so, the bathtub curve as a representation of the failure rate of a device over time is certainly very well established and multiple companies have contributed to fleshing out the details as they pertain to the new GaN devices. It is a useful visualization tool for reliability engineering and deterioration modeling, and serves as a clear mechanism to discuss why failures occur and how to predict and prevent them.&nbsp;</p><p>‘Bathtub' of course, refers to the shape of the curve. The x axis in Figure 1 is the log of time, and the y axis is the probability of failure. The green line – our bathtub curve - is the rate of failure of a typical product over time. In the early phase of a product's life, failures are mainly quality-related due to manufacturing defects. In the center zone, there are devices that were well manufactured, and that haven't yet worn out, but they failed anyway, typically because these parts have been overstressed. Then, after some time, parts wear out, so the failure mode is due to lifetime issues.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1732548346749-PI+Doug+Bailey+Fig+1+1.12+%281%29.jpg" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Figure 1</span></span></span></p><h3><strong>Lifetime</strong></h3><p>If we consider failures in the far distant future, the challenge is that users can’t wait for, say, 100,000 hours (11 years), or a century, one million hours, for a device to fail before the wear-out mechanisms can be investigated. To accelerate time for the purposes of IC testing, a test called High Temperature Operational Life (HTOL) is employed. This leverages the tendency of physical systems to change faster with temperature, under strong electric fields and in the presence of free ions (humidity and metal migration), to accelerate the effects of time and use on the devices under test. Surprisingly, a relatively few parts (48 for commercial and 77 for automotive) when tested with acceleration over 1000 hours provide the information that we need to determine the probability of failure in many years under normal conditions. The test is run on multiple batches of devices to expose any process dependency. Another test, called HALT (highly accelerated life test), applies a similar test under increased humidity but at a slightly lower temperature.&nbsp;</p><p>These tests are standard procedure for analog integrated circuits. But because GaN is a new technology, users and manufacturers must make doubly sure that the GaN switch inside the IC is robust and will have a long life, and there are tests specifically designed for discrete transistors called HTRB (high temperature reverse bias) and HTGB (high temperature gate bias) which address this. HTRB and HTGB test the device for 1000 hours at elevated temperatures under a DC voltage stress to make sure there are no migration issues, or long term degradation mechanisms associated with high voltage operation at high temperature. Hot Carrier Tests (HCI) are also performed to find any places where electrons in the channel can get diverted into oxide layers and become trapped. Electro-migration testing makes sure that the metal conductors on the top of the die are appropriately sized for the current that they carry. And gate oxide integrity tests prove the strength of the gate. All these tests are performed on devices intended for industrial and commercial customers.&nbsp;</p><p>Of course, GaN is also very suitable for the automotive market, which is even more demanding. So in addition to the usual tests just described, for automotive devices we run more tests, primarily H3TRB, which increases the humidity and temperature demands above the standard HTRB. Then we run a series of tests that are designed to switch the part on and off multiple times to prove that the devices are immune to the thermal shock of being switched on. These tests are called Power Temperature Cycling and Intermittent Op Life - the latter was originally a military test. As well as stressing the devices to a higher level, automotive tests are carried out on a larger sample size than for commercial and industrial parts.&nbsp;</p><h3><strong>Manufacturing quality </strong></h3><p>So much for the long term; we also need to address manufacturing quality problems that can cause parts to fail in early life. Power Integrations’ quality policy is to prevent any of these parts from entering the product stream. You might think that a robust final test of finished products would catch all of the mis-manufactured devices, and that is certainly an important part of it. However, in order to create an essentially perfect product stream, we work hard to screen out substandard material in prior manufacturing steps – using so-called “process monitors”. These monitor tests reduce the number of parts with latent defects that make it into final test and are critical for improving final product quality.&nbsp;</p><p>Power Integrations regards epitaxially grown GaN (EPI) as the critical stage in GaN transistor design and production. Because of this, we make our own EPI – we don’t buy it, nor finished wafers, from a third party. Therefore we have complete control over the process, and we can check it continuously. This means that only the best wafers make it through to patterning. After a wafer has been patterned into transistors, we run stress tests to identify parts that are faulty or have a risk of a quality problem.</p><p>To validate that our process monitors, our yield improvements and our final test regime yield a perfect product stream, a test called ELFR (Early Life Failure Rate) is used. ELFR is analogous to the High Temperature Op Life (HTOL) test. But instead of doing a small number of parts for a long time, we do a large number of parts for a relatively short time - 800 parts for 48 hours, across multiple IC lots to ensure that any process dependencies are exposed.&nbsp;</p><h3><strong>Overstress</strong></h3><p>We've spoken about reliability and wear out mechanisms and how to guarantee initial quality. But what happens in the middle section of our bathtub curve? These are parts that have been manufactured perfectly. They haven't worn out yet, yet they are dead anyway due to overstress.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1732548369476-PI+Doug+Bailey+Fig+2+11.19+%281%29.jpg" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Figure 2</span></span></span></p><p>To ensure that our devices are robust under the temperature, voltage and humidity conditions that they will be exposed to during their operational life, we run more tests. These are:</p><p>l&nbsp;MSL - moisture sensitivity level;</p><p>l&nbsp;UHAST - also a moisture test, but under pressure;</p><p>l TMCL - a temperature cycling test which tests for differential heating and cooling; and&nbsp;</p><p>l HTSL - high temperature storage life which is the absolute high temperature test.&nbsp;</p><p>One of the most important attributes of a power semiconductor is its ability to withstand voltage. Power Integrations specifies three types of GaN, with BVs (breakdown voltages) of 750 V, 900 V and 1250 V. However, even though we talk about BV for convenience, GaN transistors are not specified in the same way as a silicon device. There's a property of GaN called dynamic R<sub>DS(ON)&nbsp;</sub>which actually increases when high voltage is applied. It recovers later, but under the initial voltage, and for a short while afterwards, it is higher than the typical value.&nbsp;</p><p>Power Integrations has chosen 5% as being the limit that we can accept as an increase in R<sub>DS(ON)</sub>. This determines the datasheet ‘BV’ of our GaN devices. We choose the conservative values noted above for the datasheet specification, but actual breakdown does not occur until around 1400 V for the lower voltage families and 2200 V for the 1250 V product line – in all cases, a massive margin with respect to the datasheet BV limits. It’s unwise to design systems to use the devices above the datasheet BV, but this headroom is very useful insurance against infrequent line swells and surges, such as lightning strikes.</p><h2><strong>Conclusion</strong></h2><p>With this battery of tests (Figure 2) - process monitors for initial quality, voltage margin to allow for overstressing, wear-out mechanisms that ensure reliability, plus tests related to temperature and moisture sensitivity - whether you're making a smart phone adapter or an automobile, you can have confidence in PowiGaN™, Power Integrations’ GaN technology.</p>

Gallium nitride (GaN) offers superior efficiency and power density, with reliability assessed using the "bathtub curve" to predict and prevent failures from defects, overstress, and aging.

Quality, Robustness and Reliability - Breaking Down the Bathtub

<p id="isPasted">When designing a printed circuit board assembly (PCBA), a crucial aspect is selecting the right width for your copper traces. Key characteristics to consider when selecting a trace width include:</p><p>The important characteristics to consider when selecting a trace width include:</p><ul><li>The current capacity of the trace (how much current will flow through it)</li><li>The allowable spacing between traces</li><li>The size and pitch of the pads that the trace will connect to</li></ul><p>With exceptions made for unique cases such as high-frequency signaling and high-power applications, the above rules can be applied to every PCB assembly.</p><p><br></p><h2><p>What is Trace Width and Why is it Important?</p></h2><p>What is a PCB trace width, and why is its specification important? A copper trace forms the connecting bridge for various electrical signals—power, analog, or digital—between two junctions. Junctions can be an empty pad, a test point, or a component pin.</p><p>Trace width, often expressed in mils or thousands of an inch, can vary in size. Typical trace widths for regular signals without special requirements usually span between 7-12 mil and extend several inches in length. The width and length of a trace are determined based on a multitude of factors, as previously outlined.</p><p>In the design stage, trace width must be balanced with fabrication costs, board density and size, and performance factors. Depending on the board’s design requirements (e.g. noise mitigation, speed optimization, or high current/voltage), trace widths and types may be more important than optimizing for manufacturing costs.</p><p><strong>Listen to this Classic Circuit Break episode when Stephen and Parker talk to computer scientist turned electrical engineer Collin Anderson about quantum wave mechanics and how it relates to electricity flowing through conductors.</strong></p><p><iframe width="100%" height="180" frameborder="no" scrolling="no" seamless="" src="https://share.transistor.fm/e/31c01ae2" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"><span class="fr-mk" style="display: none;">&nbsp;</span></iframe></p><h2><p>Trace Ampere Capacity</p></h2><p>Each trace on a PCBA has a maximum current it can bear before failure. Passing large currents through a trace will cause it to dissipate heat, and given enough current (and time) the trace will be destroyed by either burning through or delaminating from the PCB and breaking the trace.</p><p>Although traces are often perceived as zero-resistance connectors between two components, in reality, all traces have some resistance. Knowing the resistance of a trace and the maximum current that will be passed through it will help inform which width to use.</p><p>Calculating the resistance of a trace is not trivial and can involve a lot of work. Luckily, there are a handful of trace width calculators available online that will help guide the choice of PCB trace width when considering ampere capacity.</p><p>These trace width calculators will prompt you to enter design specifications such as the thickness of copper, the maximum amperage that will pass through the trace, the length of the trace, and the acceptable increase in temperature due to the resistance of the trace dissipating power. After entering these values you will be presented with a calculated trace width. It is important to note that this value is a minimum width required to meet the design criteria inputs.</p><p>Determining the width of a trace based on the current demands is important for most power traces and high-power signals, however, most traces on PCBs pass signals which draw negligible current. For these low-power signal traces, we must look at other characteristics of the PCB to determine the width.</p><h2><p>Trace Spacing</p></h2><p>The size of a PCB is directly connected to the cost of the PCB, so in general, PCBs are kept as small as possible. The downside of reducing board size is that it can limit the available space to route traces. For low-power signal traces, it is generally advised to keep traces small to increase the available space available for routing. Excessively large traces consume valuable PCB space while offering highly diminished returns. 6 to 30 mils are typical for most signal trace widths.</p><p>MacroFab offers a minimum of 5mil traces as a standard and if smaller traces are required, the extended manufacturing option will allow traces all the way down to 3mil.</p><p><strong>Read about the <a href="https://macrofab.com/blog/7-ways-to-set-yourself-up-for-pcb-design-success/" target="_blank">dangers of too-narrow trace widths</a> now.</strong></p><h2><p>Trace Termination</p></h2><p><a href="https://macrofab.com/blog/picking-right-trace-width/#" title="click to enlarge" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1732285763623-1732285763623.png" alt="Traces stemming off from a component pad of similar width" class="fr-fic fr-dii"></a></p><p>Traces stemming off from a component pad of similar width</p><p>The point at which a copper trace meets a pad can also inform the width of a trace. In most cases, trace widths are set to the same width as the pad they terminate to. This will help with routing traces away from the component they connect to and avoid violating spacing between adjacent traces. The image here demonstrates this.</p><p>In the image, we can see two traces stemming from the SOIC-style footprint. The width of these traces is slightly smaller than the width of the component pads. This allows for plenty of clearance between adjacent pads while routing away from the chip.</p><p>Selecting trace widths for BGA components can be more tricky. Read more about <a href="https://macrofab.com/blog/bga-pad-creation-smd-nsmd/" target="_blank">best practices for BGA pad creation</a> and <a href="https://macrofab.com/blog/escaping-bgas-methods-routing-traces-bga-footprints/" target="_blank">methods of routing traces from BGA footprints</a>.</p><p><br></p><p>Need a high-quality PCBA? &nbsp;<a href="https://factory.macrofab.com/quick_quote?" target="_blank" rel="noopener noreferrer">Get an instant quote now</a>.&nbsp;</p>

Your PCB copper traces form the connecting bridge for your electrical signals. 

Why is Picking the Right Trace Width Important?

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The Cutting Edge of Semiconductor Nanodevices: A Comprehensive Overview of Recent Innovations

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Ebook: How to implement Git for hardware design in 30 days?

<p id="isPasted">When constructing a footprint for BGA-style components, choosing between solder mask-defined (SMD) and non-solder mask-defined (NSMD) pads is imperative. The correct pad design can mitigate many manufacturing problems and reduce time spent analyzing failures. This article outlines a few simple principles to guide you in creating the right footprints for BGA components.</p><h2><p>Understanding SMD and NSMD Pads</p></h2><p>There are two basic forms of pads implemented for BGA footprints. One is the Solder Mask Defined pad (SMD) and the other, is the Non-Solder Mask Defined pad (NSMD). Let’s take a look at these two types and discuss how to use them in your BGA designs.</p><p>In electronics, "SMD" can also refer to a surface mount device, but in this case we are using it in a different context.</p><h3>Define SMD (Solder Mask Defined):</h3><ul><li>Definition: In SMD pads, a layer of solder mask covers a portion of the underlying copper pad, creating a smaller solder mask opening.</li><li>Benefits:<ul><li>Enables precise soldering due to the reduced copper pad size.</li><li>Enhances the overall reliability and performance of the final device.</li><li>The solder mask opening acts as a guide during BGA ball placement for soldering</li></ul></li></ul><h3>Define NSMD (Non-Solder Mask Defined):</h3><ul><li>Definition: NSMD pads differ by leaving a gap between the copper pad and the solder mask, exposing the entire pad.</li><li>Benefits:<ul><li>Offers superior solder adhesion due to full pad contact with the solder ball.</li><li>Allows for a smaller pad size, simplifying trace routing, especially for high-density BGAs.</li></ul></li></ul><h2><p>Solder Mask Defined BGA Pads (SMD)</p></h2><p><a href="https://macrofab.com/blog/bga-pad-creation-smd-nsmd/#" title="click to enlarge" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731437204486-1731437204486.png" alt="SMD Style BGA Pad" class="fr-fic fr-dii"></a></p><p>SMD Style BGA Pad</p><p>In SMD pads, the solder mask aperture is outlined to be smaller than the diameter of the pad that it encompasses. This approach limits the size of the copper pad that the component is soldered to, providing two key benefits.</p><ul><li><strong>Enhanced Pad Security:</strong> The solder mask overlay strengthens the connection between the pad and the circuit board. This helps prevent the pad from lifting off (delamination) due to thermal or mechanical stress that the PCB might experience during operation or manufacturing.</li><li><strong>Solder Ball Alignment:</strong> The opening in the solder mask acts as a guide, ensuring proper BGA ball placement during the soldering process. This contributes to precise soldering and overall joint integrity.</li></ul><p>In the top-down view, we can see that the solder mask is specified to cover a portion of the copper pad underneath. Defining pads this way creates two distinct advantages. First, the overlapping mask helps prevent the pads from lifting off of the PCB due to thermal or mechanical stress. Second, the opening in the mask creates a channel for each ball on the BGA to align with while the component progresses through the soldering process.</p><p>The copper layer of an SMD BGA pad typically has a diameter equal to the diameter of the pad on the BGA itself. To create the SMD overlay, a reduction of 20 percent is typically used.</p><h2><p>NSMD Pads for BGA Components</p></h2><p><a href="https://macrofab.com/blog/bga-pad-creation-smd-nsmd/#" title="click to enlarge" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731437204561-1731437204561.png" alt="NSMD Style BGA Pad" class="fr-fic fr-dii"></a></p><p>NSMD Style BGA Pad</p><p>In contrast, NSMD pads are structured differently from SMD pads. With NSMD pads, the solder mask is designed to not interact with the copper pad, leaving a gap between the pad's edge and the solder mask. Instead, the mask is created such that a gap is created between the edge of the pad and the solder mask. The following image shows a top and cross-section view of an NSMD-style pad.</p><p>In this method, the size of the copper landing pad is not defined by the mask layer, but only by the diameter of the copper pad itself. NSMD pads can be smaller than the diameter of the solder ball. Typically, this reduction in pad size is 20% smaller than the ball diameter. Since the pad size is reduced with this approach, the additional room between adjacent pads allows for easier trace routing. This can almost become a necessity when routing high-density, fine-pitch BGA chips.</p><p>By allowing for a smaller pad size, NSMD pads facilitate easier trace routing - an almost necessary feature when dealing with high-density, fine-pitch BGA chips. However, NSMD pads are prone to delamination from the PCB under mechanical and thermal stress. Following standard manufacturing and handling practices should prevent this from occurring.</p><h2><p>Solderability of SMD vs NSMD BGA Pads</p></h2><p><a href="https://macrofab.com/blog/bga-pad-creation-smd-nsmd/#" title="click to enlarge" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731437204354-1731437204354.png" alt="Solder Adherence of SMD and NSMD BGA Pads" class="fr-fic fr-dii"></a></p><p>Solder Adherence of SMD and NSMD BGA Pads</p><p>The following images show examples (highly exaggerated) of how a solder ball adheres to each style of pad:</p><p><br></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731437204638-1731437204638.png" alt="Isometric view of BGA Pad Styles" class="fr-fic fr-dii"></p><p>Isometric view of BGA Pad Styles</p><p>With the entire pad exposed, NSMD pads tend to have better solder adhesion than SMD pads. The solder ball is able to make a connection to the entire NSMD pad instead of the mask-defined portion of SMD pads.</p><p><br></p><h2><p>SMD vs NSMD: Which BGA Pad Style to Use</p></h2><p>It is important to note that component manufacturers typically provide recommended footprints in the datasheets for their components. When these footprints are available, it’s certainly advisable to use them.</p><p>In general, use the NSMD pad style wherever possible due to its improved solderability and pad accuracy. <a href="https://help.macrofab.com/knowledge/what-are-macrofabs-assembly-capabilities/" target="_blank">Visit our Knowledge Base for more information.</a></p><p><br></p><h4 id="isPasted">Ready to start your next project?</h4><p><a href="https://factory.macrofab.com/quick_quote?utm_source=direct&utm_medium=none" target="_blank">Get an instant quote now</a></p><section><h5><br></h5></section>

Choosing between solder-mask-defined and non-solder-mask-defined pads is an imperative when constructing footprints for BGA-style components. 

SMD vs NSMD: Best Practices for BGA Pad Creation

<p dir="ltr" id="isPasted">Following this procedure, the flow of electricity should have ceased, reducing the risk of shocks, fires and other electrical hazards when working with or near electrical systems. It’s a critical component of electrical safety.</p><h2 dir="ltr">Why Is An Electrical Isolation Procedure Necessary?</h2><p dir="ltr">Carrying out an electrical isolation procedure is essential for ensuring the safety of those working on or around electrical systems. In the UK, it’s a legal requirement under the <a title="Regulations" href="https://www.hse.gov.uk/pubns/books/hsr25.htm" target="_blank" rel="nofollow noopener">Electricity at Work Regulations 1989</a> for electrical systems to be isolated and powered down before being worked on.&nbsp;</p><p dir="ltr">Under the regulations, ‘isolation’ means ‘the disconnection and separation of the electrical equipment from every source of electrical energy in such a way that this disconnection and separation is secure’. Having a standard procedure in place ensures that this can be achieved.&nbsp;</p><p dir="ltr">According to the regulations, the procedure must be carried out and ‘no person shall be engaged in any work activity on or near any live conductor’ unless three distinct conditions have been met:</p><ul><li dir="ltr"><p dir="ltr">It is unreasonable for the live conductor to be dead</p></li><li dir="ltr"><p dir="ltr">It is reasonable to be at work or near the conductor while it is live</p></li><li dir="ltr"><p dir="ltr">Suitable precautions have been taken to prevent injury</p></li></ul><p dir="ltr">All three conditions must be met simultaneously to allow for work on live equipment.&nbsp;</p><h2 dir="ltr">Who Should Carry Out An Electrical Isolation Procedure?</h2><p dir="ltr">The electrical isolation procedure should be undertaken by the individual scheduled to perform the work. For high-voltage systems – or primary low-voltage systems – this should be a competent person who has been issued a permit by an authorised person. The individual should be trained and have both the knowledge and experience to safely conduct both the procedure and the planned work.&nbsp;</p><h3 dir="ltr">Types Of Electrical Isolation</h3><p dir="ltr">There are three forms of electrical isolation that may be used to cease&nbsp;<a title="Electrical Connectivity" href="https://www.rowse-automation.co.uk/electrical-connectivity" target="_blank" rel="noopener">electrical connectivity</a>:</p><h4 dir="ltr">Voltage Isolation</h4><p dir="ltr">This is the most common form of isolation and involves disconnecting equipment from its power supply. This may include turning off a circuit breaker, removing a fuse or unplugging the equipment.</p><h4 dir="ltr">Power Isolation</h4><p dir="ltr">Power isolation ensures that all energy sources supplying the equipment are cut off, including any stored energy in the system. It involves disconnecting both power circuits and control circuits.</p><h4 dir="ltr">Galvanic Isolation</h4><p dir="ltr">This means creating a separation between the power source and the equipment using transformers. It’s mostly used in electronic systems to prevent interference from voltage spikes or electrical noise.</p><p dir="ltr">It’s recommended to combine these forms of electrical isolation to ensure the highest level of safety is achieved when working with electrical systems.&nbsp;</p><h2 dir="ltr">Step-By-Step Guide To The Electrical Isolation Procedure</h2><p dir="ltr">To safely isolate electrical equipment, a structured and thorough approach is required. Below is a detailed breakdown of the standard steps involved in most accepted electrical isolation procedures:</p><h3 dir="ltr">1. Preparation&nbsp;</h3><h4 dir="ltr">Source Appropriate PPE</h4><p dir="ltr">Before beginning any isolation procedure, it's crucial to ensure that appropriate PPE is available to protect against potential electrical hazards. The PPE required can vary depending on the type of system and the specific task but may include insulated gloves, arc flash protection and face shields.</p><h4 dir="ltr">Locate The Isolation Point</h4><p dir="ltr">Identifying where the system can be disconnected from its power source is key. This might involve switching off a circuit breaker, using a main disconnect or unplugging the equipment. This step can be relatively simple in domestic environments but more complex for high-energy systems.&nbsp;</p><h4 dir="ltr">Post Warning Signs</h4><p dir="ltr">Danger notices may need to be placed around the work zone to warn others, especially if part of the system remains energised. These signs serve as visual reminders that certain parts of the system are unsafe, helping to prevent accidental exposure to significant electrical hazards.</p><h3 dir="ltr">2. Isolation And Switch Off&nbsp;</h3><h4 dir="ltr">Initiate The Isolation Process</h4><p dir="ltr">This involves disconnecting the power supply. For low-voltage systems, switching off an isolator or circuit breaker may be sufficient. However high-voltage systems may require more detailed procedures where the act of cutting off the supply and isolating the system involves multiple steps.</p><h4 dir="ltr">Begin The ‘<a title="Lockout Tagout" href="https://www.rowse.co.uk/blog/post/what-is-lockout-tagout" target="_blank" rel="noopener">Lockout Tagout</a>’ (LOTO) Process</h4><p dir="ltr">This ensures that equipment can’t be inadvertently energised while work is carried out. A lockout device applied to the power source prevents anyone from re-energising it, while a tag serves as an extra precaution to ensure the equipment is not operated until the lockout device is removed.&nbsp;</p><h3 dir="ltr">3. Safety Checks</h3><h4 dir="ltr">Verify Isolation</h4><p dir="ltr">Before beginning any work, it’s essential to prove that the equipment is completely de-energised. This involves using a voltage tester or indicator to check for residual electricity. The tester should be verified on a known live circuit before and after testing to ensure it’s functioning correctly.</p><h4 dir="ltr">Conduct A ‘Dead Test’</h4><p dir="ltr">After initial checks, a ‘dead test’ should be performed to ensure that no electrical energy is present at the point of work. This confirms that the system is safe to work on. The procedure should be repeated if there’s any doubt. The Health and Safety Executive offers protocols for such a test.&nbsp;</p><h3 dir="ltr">4. Power Restoration&nbsp;</h3><h4 dir="ltr">Re-Energise The System</h4><p dir="ltr">Once all work has been completed, the system can be re-energised. Follow the steps of the isolation procedure in reverse, ensuring that all checks are carried out as power is restored to the equipment, leaving the equipment and environment in a safe condition.&nbsp;</p><p dir="ltr">It’s recommended to use a checklist when carrying out the electrical isolation procedure for peace of mind and to confirm that all necessary safety precautions have been followed before starting work.&nbsp;</p><h2 dir="ltr">The Importance Of Using Safe Isolation Procedures</h2><p dir="ltr">Implementing the proper isolation procedure is an important safety measure in any role that involves working with electrical systems. Every year, many workers are injured – some fatally – from electrical accidents that could have been prevented had the correct safety protocols been put into place. Following a well-documented and carefully executed electrical isolation procedure ensures the risk of electrical accidents is eliminated, helping to keep everyone safe while working in high-risk settings.&nbsp;</p>

The electrical isolation procedure is a process that ensures electrical equipment has been safely, securely and properly disconnected from the power source. 

What Is The Electrical Isolation Procedure?

<p dir="ltr" id="isPasted">The ocean is a hostile environment for humans, so much so that some would consider it even more hostile than space. Like space, the deep ocean is extremely cold and completely dark; but unlike space's absence of pressure, the deep ocean has extreme pressure. Deep ocean explorers can only reach these depths using either a submarine or a submersible.</p><p dir="ltr">Submarines, like those from the US Navy, are ships that can navigate long distances underwater without having to surface. They can navigate the world’s oceans with precision and at speeds upwards of 25 knots (46km/h). Their highly engineered hulls are constructed of layers of steel, titanium, and other metal alloys, capable of withstanding the extreme pressure of the ocean’s depths. These submarines are also highly compartmentalized to help mitigate any potential hull breach.</p><p dir="ltr">Submarines are sleek, self-contained ships with mission-critical redundant safety systems, pinpoint accuracy navigation capabilities, and powerful propulsion systems capable of circumnavigating the globe without refueling. For the most part, a submarine’s crew can move about freely and carry on with normal life, close quarters notwithstanding. &nbsp;</p><p dir="ltr">A submersible’s mission typically revolves around exploration or excursions and, like submarines, they can descend into the ocean’s depths. But that is about where the similarities end. Compared to submarines, submersibles are almost the complete opposite. In general, submersibles tend to be small and clunky and lack sleekness. Submersibles are usually only capable of carrying a limited crew of 1–3 individuals who serve as operators and researchers. Also, their hulls are generally engineered as a unibody structure, not necessarily made of steel, and typically feature port holes or large plexiglass globes as windows for the crew—something submarines lack. Additionally, submersibles have limited propulsion systems powered by batteries that propel the vessel at low speeds.</p><p dir="ltr">Because of their size, submersibles lack water-tight compartmentalization, meaning a hull breach can have disastrous consequences. A submersible’s dive missions are typically short—in the order of hours— and typically rely on a surface mother ship for support, so many of their onboard safety, navigation, and life support systems do not typically employ redundancy.</p><h2 dir="ltr">Extreme Water Pressure</h2><p dir="ltr">To get an idea of the immense pressure at the depth of the Titanic wreckage, let’s consider that the air pressure that surrounds us (referred to as one atmosphere) is 1013mbar or 14.7 pounds per square inch (PSI). We humans do not feel this pressure because the fluids in our bodies are pushing out, helping to equalize this pressure. But this all changes the deeper you go under the ocean; the pressure of the water pushing down on you increases approximately one atmosphere for every 10 meters of water depth. For example, at the depth where the Titanic wreckage lies, the pressure is approximately 385 atmospheres, or 385 times greater than the pressure at sea level. The fact that numerous sea-dwelling creatures face no difficulty coping with this high pressure, frigid 2.5°C water, and total darkness is simply nature at work.</p><h2 dir="ltr">Featured Products</h2><p dir="ltr">This week's New Tech Tuesday introduces two sensing products. One enables wireless monitoring of water leaks, while the other allows monitoring of humidity and temperature in critical electronics. With precise measurements and ultra-low power consumption, these dependable products can help keep water and moisture under control in your future engineering projects.</p><p dir="ltr">The <a href="https://www.mouser.com/new/multitech/multitech-wireless-water-leak-sensors/">LoRaWAN®&nbsp;Wireless Leak Detection Sensors from MultiTech</a> offer a highly effective solution to mitigate water damage in a range of environments. These sensors are available as 1-meter rope sensors for indoor, outdoor, or industrial use. In puck form, these sensors can promptly send alerts over a wireless network upon detection of water to prevent catastrophic damage. Leveraging LoRaWAN technology, these remote detectors can be strategically placed near water heaters, standing tanks, toilets, septic systems, floor drains, and other potential leakage points to preempt costly water damage.</p><p dir="ltr">The sensors are built for IoT applications, engineered for long-range transmission, and offer an extended battery life of 5–10 years at an affordable cost. They feature an open architecture design, allowing for flexible integration with other systems. A notable advantage is the optional web-based console for real-time provisioning, monitoring, and configuration of sensors in the field.</p><p dir="ltr">These sensors also have applications in monitoring plumbing and reservoir leaks, burst water pipe surveillance, data center leak, and water intrusion monitoring. These capabilities make them ideal for complex facilities, with custom designs available to meet specific needs.</p><p dir="ltr">Integrating these sensors on the same network allows monitoring from even the most remote locations. The sensors also feature long-range, excellent wireless penetration through structures, enclosure tamper detection, automatic error reporting, and over-the-air configuration. All these features and benefits reinforce the role of MultiTech's wireless leak detection sensors in effectively managing and reducing liquid leak-related risks.</p><p dir="ltr">The <a href="https://www.mouser.com/new/sensirion/sensirion-sht4x-digital-sensor/">Sensirion 4th Generation SHT4x Digital Humidity and Temperature Sensors</a> offer a range of benefits for climatic management of critical electronics. These sensors feature high accuracy and ultra-low power consumption, making them ideal for mobile and battery-driven applications. With their extended supply voltage range and improved accuracy specifications, they are well-suited for climate control, anti-fogging, and relative humidity/temperature (RH/T) condition monitoring. The sensors are compact and housed in a robust DFN package, allowing for easy integration into challenging designs while meeting the highest reliability standards. Additionally, the <a href="https://www.mouser.com/new/sensirion/sensirion-senseval-sht4xv1-eval-board/">SENSEVAL-SHT4xV1 Evaluation Board</a> simplifies sensor evaluation and prototyping, with compatibility for various STMicroelectronics boards. The I²C interface provides flexibility, and the internal heater enables sensor operation in demanding environments. These sensors are packaged in a surface mount technology (SMT) compatible format, making them suitable for high-volume applications. Sensirion's proven sensor solutions are widely used across different applications and markets.</p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1730708637663-sensor.webp" style="width: 832px;" class="fr-fic fr-dib"><span class="fr-inner">MultiTech LoRaWAN Wireless IoT Sensors</span></span></span></p><h3 id="isPasted"><br></h3><p><br></p><h2>Conclusion</h2><p dir="ltr">The ocean’s immense water pressure at great depths poses a significant threat to humans and machines alike.</p><p dir="ltr">In the realm of technology, this week’s featured products offer innovative solutions for detecting water leaks and monitoring moisture and temperature. The potential damage caused by water leaks and moisture to electronics cannot be overlooked. The featured products from MultiTech and Sensirion play a crucial role in preventing such damage by providing early detection and monitoring capabilities. Implementing these innovative sensing technologies enables engineers to effectively mitigate the risks associated with water leakages or moisture buildup, ensuring the longevity and optimal performance of critical electronic systems.</p>

This article introduces two sensing products. One enables wireless monitoring of water leaks, while the other allows monitoring of humidity and temperature in critical electronics. 

Perils of the Deep: Mission Critical Sensing Technology Solutions

This guide is a comprehensive technical analysis of Motor Control Center systems. It provides detailed insights for engineers into the basics of MCC, as well as advanced protection mechanisms, communication protocols, and optimization techniques for maximum operational efficiency. 

MCC Electrical Systems: Advanced Control Architecture and Industrial Integration Guide

<p dir="ltr" id="isPasted">Semiconductors play a pivotal role in shaping our everyday experiences. From the vehicles we drive to the devices we use, semiconductors are omnipresent, enabling functionalities in computers, smartphones, and various industrial automation technologies.&nbsp;</p><p id="isPasted">Nexperia's Hamburg plant has been at the forefront of semiconductor development for a century, contributing to nearly ten percent of the global semiconductor component production. To celebrate this 100-year milestone, we delve into the captivating history of this institution and the engineers and workers that have enabled its success.&nbsp;</p><h2>The Nexperia beginning</h2><p>The journey started in 1924 when the Valvo radio tube factory was established in Hamburg. Three years after being acquired by the Dutch electronics group Philips, the factory initially focused on manufacturing vacuum tubes, which were essential for the emerging radio technology at the time. The world of electronics was on the verge of a revolution with the invention of the transistor by William Shockley's team at Bell Labs (now Nokia Bell Labs) in New Jersey in 1947. This invention ushered in a new era by offering numerous advantages over traditional vacuum tubes, including smaller sizes, lower energy consumption, and greater reliability.</p><p>The team in Hamburg quickly recognized the potential of the new technology, and the site became a center for semiconductor production. The company began developing diodes and transistors as early as 1953. In 1957, large-scale production of transistors began in Hamburg. This innovative work laid the foundation for Hamburg's legacy in transistor technology and established the city as one of the leading locations for the development and manufacture of semiconductor components. The components developed and produced here found their way into a wide range of applications, from consumer electronics to industrial control systems, helping to transform entire industries.</p><p>In 1969, the first component in the pioneering SOT23 plastic housing was produced in Hamburg. This surface-mountable housing allowed for space-saving on the circuit board compared to the through-hole housings available until then. However, it took time for this technology to gain widespread success. It was only during the boom in consumer electronics in the 1980s and early 1990s that SMT (surface mount technology) really began to catch on. The SOT23 quickly became the standard for a three-pin SMT housing due to its compact size, reliability, and flexibility. Even today, it is widely used across all industries as it can accommodate a variety of electronic components such as diodes, bipolar transistors, field effect transistors (FETs), and ESD protection devices.</p><h2>Rise to top semiconductor manufacturer</h2><p>In 1989, the plant produced 2.8 billion semiconductor elements. By 2009, the number had increased to 45 billion, and in 2006, the Philips semiconductor division became NXP Semiconductors. Today, Nexperia, which separated from NXP in 2017 and has been functioning as an independent company, manufactures 100 billion components per year. These components are utilized in a wide range of electronic devices.</p><p>Nexperia's success in Hamburg is attributed to the continuous improvement in production efficiency. The production of semiconductors, specifically the manufacturing of wafers, is a highly intricate process that demands precision and reliability. Wafers are thin slices of semiconductor material, typically silicon used as the foundation for making microelectronic components. These wafers are cut or sawn from a single crystalline semiconductor block and then polished to prepare them for the microchip manufacturing process. Through ongoing innovation and optimization, Nexperia has significantly boosted production capacity while upholding top-notch quality standards. Today, the Hamburg factory stands as the world's largest production facility for small signal diodes and transistors, contributing to approximately a quarter of global production.</p><h3>Focus on energy efficiency and innovation</h3><p>In addition, continuously increasing the energy efficiency of components is a central aspect of product development at Nexperia. This plays a key role in improving everyday products, such as increasing the range of electric cars. In addition to the diodes and transistors manufactured in Hamburg, Nexperia also offers wide-band-gap semiconductor products made of silicon carbide (SiC) and gallium nitride (GaN), which are known for their energy efficiency.</p><p>Since the spin-off from NXP in 2017, Nexperia has invested approximately 260 million US dollars in the Hamburg site. This investment has not only increased the workforce from 950 to around 1,600 but has also modernized the technological infrastructure. The investments were focused on expanding research and development in Hamburg and increasing the capacity of the wafer fab. The majority of this growth occurred in 2019 after Nexperia became part of Wingtech Technology Co. Ltd., a consumer electronics manufacturer listed on the Shanghai stock exchange. In 2023, a design center in Munich was added to complement the development activities of Nexperia Germany GmbH.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1730198863076-News+and+events+header.jpg" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Nexperia has a broad product GaN product range that &nbsp;targets automotive, 5G and datacenter applications. Credit: Nexperia</span></span></span></p><h2>Recognizing successes and staying the course</h2><p>The 100th anniversary of Nexperia in Hamburg signifies a significant milestone in the company's history. It is a testament to the power of innovation and human ingenuity and an opportunity to honor the people behind this success story. From the glassblowers of the early days to the engineers and scientists of today, their contributions have made Nexperia a global leader in the semiconductor industry.</p><p>The <a href="https://www.nexperia.com/about/company-timeline">100th anniversary of Nexperia</a> in Hamburg signifies a significant milestone in the company's history. It is a testament to the power of innovation and human ingenuity and an opportunity to honor the people behind this success story. From the glassblowers of the early days to the engineers and scientists of today, their contributions have made Nexperia a global leader in the semiconductor industry.</p>

Semiconductors play a pivotal role in shaping our everyday experiences. From the vehicles we drive to the devices we use, semiconductors are omnipresent, enabling functionalities in computers, smartphones, and various industrial automation technologies. 

100 years of cutting edge engineering at Nexperia Hamburg plant

<h2 dir="ltr" id="isPasted">Introduction</h2><p dir="ltr">In modern automotive engineering, Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) are fundamental components that enhance the performance, efficiency, and safety of vehicle electronics. Serving as key components in power management systems, motor controls, safety mechanisms, and various other vehicle subsystems, the reliability and performance of MOSFETs significantly impact the efficiency, safety, and overall driving experience of both electric vehicles (EVs) and internal combustion engine (ICE) vehicles. Consequently, the quality of MOSFETs is a non-negotiable aspect.</p><p dir="ltr">This article provides a detailed look at high-performance MOSFETs tailored for automotive applications, focusing on their essential functions, performance metrics, and rigorous quality standards. Additionally, it examines Nexperia's contributions to the evolution of the technology, highlighting real-world applications and discussing the trends currently shaping the industry.</p><h2 dir="ltr">Understanding Automotive MOSFETs</h2><p dir="ltr">MOSFETs are pivotal components in the architecture of modern automotive electronics. Their ability to efficiently switch and amplify power makes them a critical component across various systems within vehicles.</p><h3 dir="ltr">Function and Importance of MOSFETs in Automotive Systems</h3><p dir="ltr">MOSFETs are integral to the functionality of numerous automotive systems, serving as critical components in power management and signal processing across various applications. Their ability to handle high currents and voltages efficiently while switching and amplifying signals makes them a vital electronic component in modern vehicles. Here’s a closer look at some specific applications:</p><ul><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Powertrain and Vehicle Dynamics:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Advanced Driver Assistance Systems (ADAS) radar sensor module:&nbsp;</strong>MOSFETs regulate the power distribution to the radar components of ADAS, ensuring optimal performance by managing the precise control of high currents needed for the radar's operation.</p></li><li dir="ltr"><p dir="ltr"><strong>Electronic Power Steering (EPS):</strong> MOSFETs modulate the power supplied to the electric motor that drives the steering mechanism, allowing for precise control and responsiveness, enhancing both the efficiency of steering operations and the overall safety and comfort for the driver.</p></li><li dir="ltr"><p dir="ltr"><strong>Anti-locking braking systems/Electronic Stability Control (ABS/ESC):</strong> Critical in providing the rapid switching needed for effective electronic stability control and braking systems.</p></li></ul></li><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Vehicle Comfort and Convenience:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Adaptive Front LED lights and Interior LED lighting:&nbsp;</strong>MOSFETs drive the lighting systems, offering precision control that adapts to varying conditions and user settings.</p></li><li dir="ltr"><p dir="ltr"><strong>Automatic Heating Ventilation and Air Conditioning (HVAC):&nbsp;</strong>Ensures efficient motor control for heating, ventilation, and air conditioning, enhancing passenger comfort.</p></li><li dir="ltr"><p dir="ltr"><strong>Active Suspension System:</strong> MOSFETs facilitate the rapid adjustment of suspension settings to adapt to road conditions to improve ride quality and vehicle handling. This technology contributes to a smoother driving experience by dynamically managing the suspension's response to changes in terrain.</p></li></ul></li><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Safety Systems:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Airbag controller with Safing MOSFET:&nbsp;</strong>Controls the deployment of airbags in a crash situation, ensuring timely and reliable activation.</p></li><li dir="ltr"><p dir="ltr"><strong>Seat Belt Pretensioners and Force Limiters:</strong> MOSFETs control the mechanisms that tighten seat belts instantly during a collision, reducing slack to protect occupants. They also regulate the force limiters to ensure that the belt tightens adequately without causing injury, enhancing passenger safety during severe impacts.</p></li></ul></li></ul><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729694339156-image1.jpg" style="width: 100%px;" class="fr-fic fr-dib" alt="mosfet-applications-vehicle"></p><ul id="isPasted"><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Power Management in EVs/Hybrids:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>High power, high-efficiency DC/DC converter and On-Board Charger (OBC):</strong> Essential for converting and managing power within the vehicle’s electrical system, crucial for electric and hybrid vehicles.</p></li><li dir="ltr"><p dir="ltr"><strong>Zonal Control Units:</strong> MOSFETs facilitate intelligent power distribution controlled by software, optimizing the delivery of power to different zones of the vehicle. This not only enhances the efficiency of electrical systems but also supports advanced features such as customized lighting and climate control across different cabin areas.</p></li><li dir="ltr"><p dir="ltr"><strong>Battery Management System (BMS):&nbsp;</strong>MOSFETs play a crucial role in managing systems that monitor and control battery packs, crucial for EV performance and safety. They also help in the balanced charging of battery cells, a process that is critical for maintaining the health and extending the lifetime of the battery. By ensuring each cell within the battery pack is charged correctly, MOSFETs prevent overcharging and help maintain the overall battery balance, thus safeguarding and maximizing battery life.</p></li></ul></li><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Applications in ICE vehicles:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Cooling Fan and Fluid Pump Controls:&nbsp;</strong>Manage the operation of cooling systems and fluid circulation, which are vital for maintaining the operational integrity of engine and battery systems.</p></li><li dir="ltr"><p dir="ltr"><strong>Electronic Fuel Injection:&nbsp;</strong>Improves the efficiency and control of fuel delivery to the engine, optimizing performance and reducing emissions.</p></li></ul></li></ul><p dir="ltr">MOSFETs’ versatility enables them to support these (and many more) critical functions across various systems within the vehicle, highlighting their importance in the automotive industry.</p><h3 dir="ltr">Key Performance Metrics for MOSFETs</h3><p dir="ltr">The high performance, efficiency, and reliability of MOSFETs in automotive applications are essential for ensuring the smooth operation of vehicle electronics. These metrics include:</p><ul><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Electrical Efficiency:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Switching Efficiency:&nbsp;</strong>Effective switching speeds for automotive power MOSFETs typically range from tens to hundreds of nanoseconds, essential for fast response times in power-intensive applications. Small signal MOSFETs, which are also qualified for automotive use, can switch in just a few nanoseconds, providing even faster response for applications requiring high-speed signal processing.</p></li><li dir="ltr"><p dir="ltr"><strong>On-state Resistance:&nbsp;</strong>Lower on-state resistance increases efficiency by reducing power losses. Typical values range from 10 mΩ to sub &lt;1mΩ, ideal for minimizing heat generation and energy wastage.</p></li><li dir="ltr"><p dir="ltr"><strong>Power Limits:&nbsp;</strong>These are determined by the maximum voltage and current the MOSFET can handle—commonly between 5V to 100V and 10A to 2000A—suitable for a variety of automotive functions.</p></li></ul></li><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Thermal Performance:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Operating Temperature Range:&nbsp;</strong>Automotive MOSFETs must operate effectively within a range of -55°C to +150°C, with short-term tolerance of up to 175°C for high-heat environments such as engine compartments.</p></li><li dir="ltr"><p dir="ltr"><strong>Thermal Resistance of Junction-Base Mounting: &nbsp;</strong>This parameter, ranging from 0.5K/W to 2K/W, indicates the capability of heat dissipation. Lower values are preferable, as they denote superior thermal management.</p></li></ul></li><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Durability and Longevity:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Thermal Cycling Resistance:&nbsp;</strong>MOSFETs are designed to withstand numerous thermal cycles without performance degradation, ensuring long-term reliability. Additionally, they must pass rigorous electrical bias stress tests, including high temperature gate bias, high temperature reverse bias, and humidity bias stress. These tests are critical for assessing the durability of MOSFETs under severe environmental conditions and electrical stresses, further ensuring their robustness and suitability for demanding automotive applications.</p></li></ul></li></ul><p dir="ltr"><em><strong>Suggested reading:&nbsp;</strong></em><a href="https://www.wevolver.com/article/next-generation-mosfet-technology-meets-demand-for-strong-thermal-performance-in-automotive-applications" target="_blank"><strong><em>Next-generation MOSFET technology Meets Demand for Strong Thermal&nbsp;</em>Performance in Automotive Applications.</strong></a></p><h2 dir="ltr">Quality Standards and Certifications</h2><p dir="ltr">MOSFETs used in automotive applications are subject to specific industry standards that dictate their design, testing, and performance criteria. One of the most critical standards is the AEC-Q101, a stringent specification from the Automotive Electronics Council that covers stress tests for semiconductors in automotive applications. This standard ensures that MOSFETs can withstand extreme conditions such as high temperatures, vibrations, and varying electrical loads.</p><p dir="ltr">Compliance with AEC-Q101 involves multiple tests, including thermal shock, moisture resistance, electrostatic discharge susceptibility, and life-cycle testing. These tests are designed to simulate the actual operating conditions that MOSFETs will face in a vehicle, ensuring that only the most robust components make it into automotive systems.&nbsp;</p><p dir="ltr"><strong><em>Suggested reading: <a href="https://www.wevolver.com/article/semiconductor-resilience-with-innovations-in-testing-techniques-and-packaging" target="_blank">Semiconductor Resilience with Innovations in Testing Techniques and Packaging</a></em></strong></p><h2 dir="ltr">Trends and Innovations</h2><p dir="ltr">The automotive industry is on the brink of a big technological transformation, with MOSFETs playing a crucial role in shaping the future of mobility. As the demand for EVs and autonomous driving systems increases, MOSFETs are evolving to meet the new challenges and performance requirements.</p><p dir="ltr">New materials such as Silicon Carbide (SiC) and Gallium Nitride (GaN) are making their way into MOSFET design. These materials offer superior efficiency, higher breakdown voltage, higher temperature tolerance, and faster switching capabilities than traditional silicon MOSFETs, making them ideal for the high-power demands of EV powertrains and charging systems.</p><p dir="ltr">Additionally, the integration of intelligent control features within vehicle subsystems is becoming more common. Smart power converters can provide real-time diagnostics and protection features, enhancing the overall safety, reliability and repairability of automotive electronics.</p><p dir="ltr">Moreover, as vehicles become more connected and autonomous, the number of electronic components and systems is set to increase continuously, necessitating MOSFETs that can perform reliably in a more crowded and interconnected environment. The ongoing development in MOSFET technology also aims to reduce interference and improve communication between components, ensuring seamless operation.</p><h2 dir="ltr">Nexperia's High-Performance MOSFETs: Driving Excellence and Innovation in Automotive Electronics</h2><p dir="ltr">Nexperia distinguishes itself in the automotive electronics market with a strong focus on quality, performance, and innovation. As a semiconductor manufacturer, Nexperia is committed to developing MOSFET technology that meets the stringent requirements of modern automotive systems.</p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729694884790-image3.png" style="width: 100%px;" class="fr-fic fr-dib" alt="lfpak-family"><span class="fr-inner">MOSFETs optimized for Automotive applications by Nexperia in an LFPAK package. Source: Nexperia</span></span></span></p><h3 dir="ltr">Innovative Product Range</h3><p dir="ltr">Nexperia’s automotive MOSFET product portfolio contains over 400 types of power MOSFETs, with specifications ranging from -18 &nbsp;to 500 A for drain currents and drain-source voltage ratings ranging from -60to 100 V. These are housed in robust copper-clip packages featuring cutting-edge technologies, such as flexible leads and wettable flanks for ease of Automatic Optical Inspection (AOI) and improved reliability. This diversity ensures solutions for every automotive electronic need, from simple lamp circuits to complex power requirements of vehicle electrification and hybrid battery systems.</p><p dir="ltr"><em><strong>Suggested reading:&nbsp;</strong></em><a href="https://www.wevolver.com/article/a-story-of-innovation-how-lfpak-revolutionized-an-industry" target="_blank"><strong><em>A story of innovation: How LFPAK revolutionized an industry.</em></strong></a></p><h3 dir="ltr">Focused on Future Needs and Sustainability</h3><p dir="ltr">Nexperia is further advancing MOSFET technology with initiatives like the introduction of the <a href="https://www.nexperia.com/products/sic-mosfets" target="_blank">1200 V Silicon Carbide MOSFETs</a>, which enhance efficiency and reduce energy waste—crucial for extending the driving range of EVs. The company's efforts in scaling down MOSFET sizes allow for more compact system designs without compromising performance or reliability. These innovations support the automotive industry’s goals of reducing carbon footprints and advancing sustainable mobility solutions.<span contenteditable="false" draggable="true" class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable"><iframe width="640" height="360" src="https://www.youtube.com/embed/pD7b3YkhG6s?&amp;pp=ygUPbmV4cGVyaWEgbW9zZmV0&amp;wmode=opaque&amp;rel=0" frameborder="0" allowfullscreen="" class="fr-draggable"><span class="fr-mk" style="display: none;">&nbsp;</span></iframe></span></p><h3 dir="ltr">Specialization for Reliability</h3><p dir="ltr">Tailoring MOSFET offerings to specific automotive needs ensures that each component delivers optimal performance and efficiency. Nexperia’s MOSFETs are essential in systems ranging from adaptive lighting and climate control to critical applications like electric power steering and braking systems. Innovations in packaging and silicon technologies enhance thermal performance and durability, vital attributes where reliability and space economy are most important.</p><p dir="ltr">Nexperia upholds a zero-defect culture, which has been recognized through multiple supplier awards, reflecting their commitment to excellence. Impressively, the company has maintained a complaint rate of less than 0.05 complaints per million since 2019, emphasizing their relentless focus on quality.&nbsp;</p><p dir="ltr">In addition to these innovations, Nexperia provides next-generation support tools for automotive engineers. Their interactive datasheets allow real-time adjustment of parameters like voltage, current, and temperature, instantly visualizing MOSFET behavior. This streamlines design workflows by eliminating manual calculations and circuit simulations. Advanced electrothermal MOSFET models also enable early-stage validation of circuit designs, helping identify EMI and EMC issues upfront.</p><p dir="ltr">Nexperia's ongoing innovations and focus on quality support automotive manufacturers in developing more efficient, reliable, and cost-effective electronic systems. These advancements contribute to vehicles that offer improved safety, comfort, and environmental performance.</p><p dir="ltr"><em>Visit <a href="https://nexperia.com/mosfets" target="_blank"><strong>Nexperia's official website</strong></a> to explore a range of advanced MOSFET solutions built for automotive electronics.</em></p><h2 dir="ltr">Conclusion</h2><p dir="ltr">Nexperia's ongoing commitment to innovation in MOSFET technology highlights the critical role these components play in improving vehicle performance, efficiency, and safety. By leveraging advanced materials and innovative designs, Nexperia ensures that automotive electronics meet stringent contemporary standards and are equipped for the evolving demands of tomorrow. As the shift towards more electric and autonomous vehicles continues, the need for reliable, efficient, and high-performance MOSFETs becomes increasingly apparent.</p><h2 dir="ltr">References</h2><p dir="ltr">[1] Nexperia. Driving solenoids in automotive applications Rev. 1.1 [Internet]. 3 Nov 2023. Available from:<a href="https://assets.nexperia.com/documents/application-note/AN50003.pdf" target="_blank">&nbsp;https://assets.nexperia.com/documents/application-note/AN50003.pdf</a></p><p dir="ltr">[2] Nexperia. MOSFET and GaN FET Application Handbook [Internet]. 19 Nov 2020. Available from:<a href="https://efficiencywins.nexperia.com/efficient-products/mosfet-and-gan-fet-application-handbook" target="_blank">&nbsp;https://efficiencywins.nexperia.com/efficient-products/mosfet-and-gan-fet-application-handbook</a></p><p dir="ltr">[3] Nexperia. Selection Guide: Discrete, MOSFET and GaN FET components, analog &amp; logic ICs [Internet], Available from: <a href="https://assets.nexperia.com/documents/selection-guide/Nexperia_Selection_guide_2023.pdf" target="_blank">https://assets.nexperia.com/documents/selection-guide/Nexperia_Selection_guide_2023.pdf</a></p>

Nexperia's automotive MOSFETs enhance innovation across both traditional and electric vehicles, expertly managing a wide array of applications from simple lighting to advanced electrification systems, ensuring high performance, reliability and superior efficiency in every aspect.

High-Performance MOSFETs Driving Excellence and Innovations in Automotive Electronics

<p id="isPasted">In the fast-paced world of electronics and innovation, having access to the right tools is essential for designers and engineers looking to bring their concepts to life quickly and efficiently. Development kits are a key resource in this process, offering pre-built solutions that allow for faster prototyping and testing of new ideas. Mouser Electronics, a leading global distributor, is renowned for providing one of the most extensive ranges of off-the-shelf development kits, ensuring that designers can access the tools they need when they need them.</p><p>In this article, Mouser’s Director of Technical Content for EMEA, Mark Patrick, shares his expert insights by presenting his ‘Top 5 Picks’ from the latest development kits available. These kits have been carefully selected based on their innovative features, ease of use, and the potential they offer to accelerate the design process. Whether you're working on AI applications, IoT solutions, or embedded systems, these development kits can give your project the jumpstart it needs.</p><h2><strong>Long-range connectivity</strong></h2><p><em>Digi XBee® XR 868&nbsp;</em></p><p>This development kit includes the Digi XBee 868 RF MHz module with a U.FL antenna connector, antennas, and a development board. It supports long-range connectivity applications in Europe, operating between 863MHz and 870MHz. The module facilitates point-to-point and mesh networking with a line-of-sight range exceeding 14 kilometers, ideal for the agriculture and energy sectors. The device employs intelligent interference management using Listen Before Talk and Adaptive Frequency Agility, reducing interference by scanning frequencies and shifting channels seamlessly.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/digi-xbee-xr-868-kit/n-8mwysZ1npagf">XBee® XR 868 Development Kit - Digi | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582453944-digi.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p><h2><strong>Curiouser and curiouser</strong></h2><p><em>Microchip WBZ450 EV22L65A</em></p><p>Microchip’s WBZ450 Curiosity board is an efficient, modular development platform that supports rapid prototyping and demonstrates the features, capabilities, and interfaces of Microchip’s WBZ450PE BLUETOOTH® Low Energy and Zigbee® RF module. The EV22L65A board offers integrated programming/debugging features using the PICkit™ Onboard 4 (PKOB4) debugger interface. A Micro-USB cable is required to power up and program the board.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/microchip-ev22l65a-board/n-8mwysZ2puw22">WBZ450 Curiosity Board (EV22L65A) - Microchip Technology | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582723571-micro.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p><h2><strong>Arm-based MCU&nbsp;</strong></h2><p><em>STMicro STM32H7S78-DK Discovery kit</em></p><p>STMicroelectronics’ STM32H7S78-DK Discovery kit demonstrates and develops applications for the Arm® Cortex®-M7 core-based STM32H7S7L8H6H microcontroller. The kit comes with various hardware features, including USB Type-C™, Octo-SPI flash memory, Hexadeca-SPI PSRAM devices, audio codec, digital microphones, ADC, user button, and flexible extension connectors. These connectors facilitate easy wireless connectivity, analog applications, and sensor expansion.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/stm-stm32h7s78-dk-kit/n-8mwysZ2cjsva">STM32H7S78-DK Discovery Kit - STMicro | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582777405-st.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p><h2><strong>Rugged and reliable embedded wireless</strong></h2><p><em>Advantech WLNNA&nbsp;</em></p><p>Advantech’s WLNNA Series evaluation kit is a platform for evaluating, testing and developing Airborne Enterprise Device Server Modules. The Advantech WLNNA kit offers size, cost, power consumption, and performance advantages over other wireless solutions. Ideal for rugged and reliable applications needing an embedded IEEE 802.11a/b/g/n compliant wireless engine, the kit includes a WLNNA Series Evaluation Board with connectors and headers providing access to all module interfaces.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/advantech-wlnna-kit/n-8mwysZ27k4mu">WLNNA Series Evaluation Kit - Advantech | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582820389-brief+2.png" style="width: 100%px;" class="fr-fic fr-dib"></p><h2><strong>IoT control</strong></h2><p><em>M5Stack M5NanoC6 board</em></p><p>This board features an ESP32-C6FH4 MCU supporting Wi-Fi 6, Zigbee®, and an infrared emitter for controlling infrared IoT devices. The device's ceramic antenna ensures stable wireless communication. Programmable RGB beads enable personalized visual effects. The Grove interface allows flexible expansion of various M5 devices, which are customizable for different communication protocols.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/m5stack-m5nanoc6-board/n-8mwysZ2sl8dv" id="isPasted">M5NanoC6 Board - M5Stack | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582849615-m5.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p>

In this article,  Mouser’s Director, Technical Content, EMEA, Mark Patrick, presents his ‘Top 5 Pick’ of recently-released dev kits.

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