<p id="isPasted">When constructing a footprint for BGA-style components, choosing between solder mask-defined (SMD) and non-solder mask-defined (NSMD) pads is imperative. The correct pad design can mitigate many manufacturing problems and reduce time spent analyzing failures. This article outlines a few simple principles to guide you in creating the right footprints for BGA components.</p><h2><p>Understanding SMD and NSMD Pads</p></h2><p>There are two basic forms of pads implemented for BGA footprints. One is the Solder Mask Defined pad (SMD) and the other, is the Non-Solder Mask Defined pad (NSMD). Let’s take a look at these two types and discuss how to use them in your BGA designs.</p><p>In electronics, "SMD" can also refer to a surface mount device, but in this case we are using it in a different context.</p><h3>Define SMD (Solder Mask Defined):</h3><ul><li>Definition: In SMD pads, a layer of solder mask covers a portion of the underlying copper pad, creating a smaller solder mask opening.</li><li>Benefits:<ul><li>Enables precise soldering due to the reduced copper pad size.</li><li>Enhances the overall reliability and performance of the final device.</li><li>The solder mask opening acts as a guide during BGA ball placement for soldering</li></ul></li></ul><h3>Define NSMD (Non-Solder Mask Defined):</h3><ul><li>Definition: NSMD pads differ by leaving a gap between the copper pad and the solder mask, exposing the entire pad.</li><li>Benefits:<ul><li>Offers superior solder adhesion due to full pad contact with the solder ball.</li><li>Allows for a smaller pad size, simplifying trace routing, especially for high-density BGAs.</li></ul></li></ul><h2><p>Solder Mask Defined BGA Pads (SMD)</p></h2><p><a href="https://macrofab.com/blog/bga-pad-creation-smd-nsmd/#" title="click to enlarge" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731437204486-1731437204486.png" alt="SMD Style BGA Pad" class="fr-fic fr-dii"></a></p><p>SMD Style BGA Pad</p><p>In SMD pads, the solder mask aperture is outlined to be smaller than the diameter of the pad that it encompasses. This approach limits the size of the copper pad that the component is soldered to, providing two key benefits.</p><ul><li><strong>Enhanced Pad Security:</strong> The solder mask overlay strengthens the connection between the pad and the circuit board. This helps prevent the pad from lifting off (delamination) due to thermal or mechanical stress that the PCB might experience during operation or manufacturing.</li><li><strong>Solder Ball Alignment:</strong> The opening in the solder mask acts as a guide, ensuring proper BGA ball placement during the soldering process. This contributes to precise soldering and overall joint integrity.</li></ul><p>In the top-down view, we can see that the solder mask is specified to cover a portion of the copper pad underneath. Defining pads this way creates two distinct advantages. First, the overlapping mask helps prevent the pads from lifting off of the PCB due to thermal or mechanical stress. Second, the opening in the mask creates a channel for each ball on the BGA to align with while the component progresses through the soldering process.</p><p>The copper layer of an SMD BGA pad typically has a diameter equal to the diameter of the pad on the BGA itself. To create the SMD overlay, a reduction of 20 percent is typically used.</p><h2><p>NSMD Pads for BGA Components</p></h2><p><a href="https://macrofab.com/blog/bga-pad-creation-smd-nsmd/#" title="click to enlarge" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731437204561-1731437204561.png" alt="NSMD Style BGA Pad" class="fr-fic fr-dii"></a></p><p>NSMD Style BGA Pad</p><p>In contrast, NSMD pads are structured differently from SMD pads. With NSMD pads, the solder mask is designed to not interact with the copper pad, leaving a gap between the pad's edge and the solder mask. Instead, the mask is created such that a gap is created between the edge of the pad and the solder mask. The following image shows a top and cross-section view of an NSMD-style pad.</p><p>In this method, the size of the copper landing pad is not defined by the mask layer, but only by the diameter of the copper pad itself. NSMD pads can be smaller than the diameter of the solder ball. Typically, this reduction in pad size is 20% smaller than the ball diameter. Since the pad size is reduced with this approach, the additional room between adjacent pads allows for easier trace routing. This can almost become a necessity when routing high-density, fine-pitch BGA chips.</p><p>By allowing for a smaller pad size, NSMD pads facilitate easier trace routing - an almost necessary feature when dealing with high-density, fine-pitch BGA chips. However, NSMD pads are prone to delamination from the PCB under mechanical and thermal stress. Following standard manufacturing and handling practices should prevent this from occurring.</p><h2><p>Solderability of SMD vs NSMD BGA Pads</p></h2><p><a href="https://macrofab.com/blog/bga-pad-creation-smd-nsmd/#" title="click to enlarge" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731437204354-1731437204354.png" alt="Solder Adherence of SMD and NSMD BGA Pads" class="fr-fic fr-dii"></a></p><p>Solder Adherence of SMD and NSMD BGA Pads</p><p>The following images show examples (highly exaggerated) of how a solder ball adheres to each style of pad:</p><p><br></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1731437204638-1731437204638.png" alt="Isometric view of BGA Pad Styles" class="fr-fic fr-dii"></p><p>Isometric view of BGA Pad Styles</p><p>With the entire pad exposed, NSMD pads tend to have better solder adhesion than SMD pads. The solder ball is able to make a connection to the entire NSMD pad instead of the mask-defined portion of SMD pads.</p><p><br></p><h2><p>SMD vs NSMD: Which BGA Pad Style to Use</p></h2><p>It is important to note that component manufacturers typically provide recommended footprints in the datasheets for their components. When these footprints are available, it’s certainly advisable to use them.</p><p>In general, use the NSMD pad style wherever possible due to its improved solderability and pad accuracy. <a href="https://help.macrofab.com/knowledge/what-are-macrofabs-assembly-capabilities/" target="_blank">Visit our Knowledge Base for more information.</a></p><p><br></p><h4 id="isPasted">Ready to start your next project?</h4><p><a href="https://factory.macrofab.com/quick_quote?utm_source=direct&utm_medium=none" target="_blank">Get an instant quote now</a></p><section><h5><br></h5></section>

Choosing between solder-mask-defined and non-solder-mask-defined pads is an imperative when constructing footprints for BGA-style components. 

SMD vs NSMD: Best Practices for BGA Pad Creation

<p dir="ltr" id="isPasted">The ocean is a hostile environment for humans, so much so that some would consider it even more hostile than space. Like space, the deep ocean is extremely cold and completely dark; but unlike space's absence of pressure, the deep ocean has extreme pressure. Deep ocean explorers can only reach these depths using either a submarine or a submersible.</p><p dir="ltr">Submarines, like those from the US Navy, are ships that can navigate long distances underwater without having to surface. They can navigate the world’s oceans with precision and at speeds upwards of 25 knots (46km/h). Their highly engineered hulls are constructed of layers of steel, titanium, and other metal alloys, capable of withstanding the extreme pressure of the ocean’s depths. These submarines are also highly compartmentalized to help mitigate any potential hull breach.</p><p dir="ltr">Submarines are sleek, self-contained ships with mission-critical redundant safety systems, pinpoint accuracy navigation capabilities, and powerful propulsion systems capable of circumnavigating the globe without refueling. For the most part, a submarine’s crew can move about freely and carry on with normal life, close quarters notwithstanding. &nbsp;</p><p dir="ltr">A submersible’s mission typically revolves around exploration or excursions and, like submarines, they can descend into the ocean’s depths. But that is about where the similarities end. Compared to submarines, submersibles are almost the complete opposite. In general, submersibles tend to be small and clunky and lack sleekness. Submersibles are usually only capable of carrying a limited crew of 1–3 individuals who serve as operators and researchers. Also, their hulls are generally engineered as a unibody structure, not necessarily made of steel, and typically feature port holes or large plexiglass globes as windows for the crew—something submarines lack. Additionally, submersibles have limited propulsion systems powered by batteries that propel the vessel at low speeds.</p><p dir="ltr">Because of their size, submersibles lack water-tight compartmentalization, meaning a hull breach can have disastrous consequences. A submersible’s dive missions are typically short—in the order of hours— and typically rely on a surface mother ship for support, so many of their onboard safety, navigation, and life support systems do not typically employ redundancy.</p><h2 dir="ltr">Extreme Water Pressure</h2><p dir="ltr">To get an idea of the immense pressure at the depth of the Titanic wreckage, let’s consider that the air pressure that surrounds us (referred to as one atmosphere) is 1013mbar or 14.7 pounds per square inch (PSI). We humans do not feel this pressure because the fluids in our bodies are pushing out, helping to equalize this pressure. But this all changes the deeper you go under the ocean; the pressure of the water pushing down on you increases approximately one atmosphere for every 10 meters of water depth. For example, at the depth where the Titanic wreckage lies, the pressure is approximately 385 atmospheres, or 385 times greater than the pressure at sea level. The fact that numerous sea-dwelling creatures face no difficulty coping with this high pressure, frigid 2.5°C water, and total darkness is simply nature at work.</p><h2 dir="ltr">Featured Products</h2><p dir="ltr">This week's New Tech Tuesday introduces two sensing products. One enables wireless monitoring of water leaks, while the other allows monitoring of humidity and temperature in critical electronics. With precise measurements and ultra-low power consumption, these dependable products can help keep water and moisture under control in your future engineering projects.</p><p dir="ltr">The <a href="https://www.mouser.com/new/multitech/multitech-wireless-water-leak-sensors/">LoRaWAN®&nbsp;Wireless Leak Detection Sensors from MultiTech</a> offer a highly effective solution to mitigate water damage in a range of environments. These sensors are available as 1-meter rope sensors for indoor, outdoor, or industrial use. In puck form, these sensors can promptly send alerts over a wireless network upon detection of water to prevent catastrophic damage. Leveraging LoRaWAN technology, these remote detectors can be strategically placed near water heaters, standing tanks, toilets, septic systems, floor drains, and other potential leakage points to preempt costly water damage.</p><p dir="ltr">The sensors are built for IoT applications, engineered for long-range transmission, and offer an extended battery life of 5–10 years at an affordable cost. They feature an open architecture design, allowing for flexible integration with other systems. A notable advantage is the optional web-based console for real-time provisioning, monitoring, and configuration of sensors in the field.</p><p dir="ltr">These sensors also have applications in monitoring plumbing and reservoir leaks, burst water pipe surveillance, data center leak, and water intrusion monitoring. These capabilities make them ideal for complex facilities, with custom designs available to meet specific needs.</p><p dir="ltr">Integrating these sensors on the same network allows monitoring from even the most remote locations. The sensors also feature long-range, excellent wireless penetration through structures, enclosure tamper detection, automatic error reporting, and over-the-air configuration. All these features and benefits reinforce the role of MultiTech's wireless leak detection sensors in effectively managing and reducing liquid leak-related risks.</p><p dir="ltr">The <a href="https://www.mouser.com/new/sensirion/sensirion-sht4x-digital-sensor/">Sensirion 4th Generation SHT4x Digital Humidity and Temperature Sensors</a> offer a range of benefits for climatic management of critical electronics. These sensors feature high accuracy and ultra-low power consumption, making them ideal for mobile and battery-driven applications. With their extended supply voltage range and improved accuracy specifications, they are well-suited for climate control, anti-fogging, and relative humidity/temperature (RH/T) condition monitoring. The sensors are compact and housed in a robust DFN package, allowing for easy integration into challenging designs while meeting the highest reliability standards. Additionally, the <a href="https://www.mouser.com/new/sensirion/sensirion-senseval-sht4xv1-eval-board/">SENSEVAL-SHT4xV1 Evaluation Board</a> simplifies sensor evaluation and prototyping, with compatibility for various STMicroelectronics boards. The I²C interface provides flexibility, and the internal heater enables sensor operation in demanding environments. These sensors are packaged in a surface mount technology (SMT) compatible format, making them suitable for high-volume applications. Sensirion's proven sensor solutions are widely used across different applications and markets.</p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1730708637663-sensor.webp" style="width: 832px;" class="fr-fic fr-dib"><span class="fr-inner">MultiTech LoRaWAN Wireless IoT Sensors</span></span></span></p><h3 id="isPasted"><br></h3><p><br></p><h2>Conclusion</h2><p dir="ltr">The ocean’s immense water pressure at great depths poses a significant threat to humans and machines alike.</p><p dir="ltr">In the realm of technology, this week’s featured products offer innovative solutions for detecting water leaks and monitoring moisture and temperature. The potential damage caused by water leaks and moisture to electronics cannot be overlooked. The featured products from MultiTech and Sensirion play a crucial role in preventing such damage by providing early detection and monitoring capabilities. Implementing these innovative sensing technologies enables engineers to effectively mitigate the risks associated with water leakages or moisture buildup, ensuring the longevity and optimal performance of critical electronic systems.</p>

This article introduces two sensing products. One enables wireless monitoring of water leaks, while the other allows monitoring of humidity and temperature in critical electronics. 

Perils of the Deep: Mission Critical Sensing Technology Solutions

This guide is a comprehensive technical analysis of Motor Control Center systems. It provides detailed insights for engineers into the basics of MCC, as well as advanced protection mechanisms, communication protocols, and optimization techniques for maximum operational efficiency. 

MCC Electrical Systems: Advanced Control Architecture and Industrial Integration Guide

<p dir="ltr" id="isPasted">Semiconductors play a pivotal role in shaping our everyday experiences. From the vehicles we drive to the devices we use, semiconductors are omnipresent, enabling functionalities in computers, smartphones, and various industrial automation technologies.&nbsp;</p><p id="isPasted">Nexperia's Hamburg plant has been at the forefront of semiconductor development for a century, contributing to nearly ten percent of the global semiconductor component production. To celebrate this 100-year milestone, we delve into the captivating history of this institution and the engineers and workers that have enabled its success.&nbsp;</p><h2>The Nexperia beginning</h2><p>The journey started in 1924 when the Valvo radio tube factory was established in Hamburg. Three years after being acquired by the Dutch electronics group Philips, the factory initially focused on manufacturing vacuum tubes, which were essential for the emerging radio technology at the time. The world of electronics was on the verge of a revolution with the invention of the transistor by William Shockley's team at Bell Labs (now Nokia Bell Labs) in New Jersey in 1947. This invention ushered in a new era by offering numerous advantages over traditional vacuum tubes, including smaller sizes, lower energy consumption, and greater reliability.</p><p>The team in Hamburg quickly recognized the potential of the new technology, and the site became a center for semiconductor production. The company began developing diodes and transistors as early as 1953. In 1957, large-scale production of transistors began in Hamburg. This innovative work laid the foundation for Hamburg's legacy in transistor technology and established the city as one of the leading locations for the development and manufacture of semiconductor components. The components developed and produced here found their way into a wide range of applications, from consumer electronics to industrial control systems, helping to transform entire industries.</p><p>In 1969, the first component in the pioneering SOT23 plastic housing was produced in Hamburg. This surface-mountable housing allowed for space-saving on the circuit board compared to the through-hole housings available until then. However, it took time for this technology to gain widespread success. It was only during the boom in consumer electronics in the 1980s and early 1990s that SMT (surface mount technology) really began to catch on. The SOT23 quickly became the standard for a three-pin SMT housing due to its compact size, reliability, and flexibility. Even today, it is widely used across all industries as it can accommodate a variety of electronic components such as diodes, bipolar transistors, field effect transistors (FETs), and ESD protection devices.</p><h2>Rise to top semiconductor manufacturer</h2><p>In 1989, the plant produced 2.8 billion semiconductor elements. By 2009, the number had increased to 45 billion, and in 2006, the Philips semiconductor division became NXP Semiconductors. Today, Nexperia, which separated from NXP in 2017 and has been functioning as an independent company, manufactures 100 billion components per year. These components are utilized in a wide range of electronic devices.</p><p>Nexperia's success in Hamburg is attributed to the continuous improvement in production efficiency. The production of semiconductors, specifically the manufacturing of wafers, is a highly intricate process that demands precision and reliability. Wafers are thin slices of semiconductor material, typically silicon used as the foundation for making microelectronic components. These wafers are cut or sawn from a single crystalline semiconductor block and then polished to prepare them for the microchip manufacturing process. Through ongoing innovation and optimization, Nexperia has significantly boosted production capacity while upholding top-notch quality standards. Today, the Hamburg factory stands as the world's largest production facility for small signal diodes and transistors, contributing to approximately a quarter of global production.</p><h3>Focus on energy efficiency and innovation</h3><p>In addition, continuously increasing the energy efficiency of components is a central aspect of product development at Nexperia. This plays a key role in improving everyday products, such as increasing the range of electric cars. In addition to the diodes and transistors manufactured in Hamburg, Nexperia also offers wide-band-gap semiconductor products made of silicon carbide (SiC) and gallium nitride (GaN), which are known for their energy efficiency.</p><p>Since the spin-off from NXP in 2017, Nexperia has invested approximately 260 million US dollars in the Hamburg site. This investment has not only increased the workforce from 950 to around 1,600 but has also modernized the technological infrastructure. The investments were focused on expanding research and development in Hamburg and increasing the capacity of the wafer fab. The majority of this growth occurred in 2019 after Nexperia became part of Wingtech Technology Co. Ltd., a consumer electronics manufacturer listed on the Shanghai stock exchange. In 2023, a design center in Munich was added to complement the development activities of Nexperia Germany GmbH.</p><p><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1730198863076-News+and+events+header.jpg" style="width: 100%px;" class="fr-fic fr-dib"><span class="fr-inner">Nexperia has a broad product GaN product range that &nbsp;targets automotive, 5G and datacenter applications. Credit: Nexperia</span></span></span></p><h2>Recognizing successes and staying the course</h2><p>The 100th anniversary of Nexperia in Hamburg signifies a significant milestone in the company's history. It is a testament to the power of innovation and human ingenuity and an opportunity to honor the people behind this success story. From the glassblowers of the early days to the engineers and scientists of today, their contributions have made Nexperia a global leader in the semiconductor industry.</p><p>The <a href="https://www.nexperia.com/about/company-timeline">100th anniversary of Nexperia</a> in Hamburg signifies a significant milestone in the company's history. It is a testament to the power of innovation and human ingenuity and an opportunity to honor the people behind this success story. From the glassblowers of the early days to the engineers and scientists of today, their contributions have made Nexperia a global leader in the semiconductor industry.</p>

Semiconductors play a pivotal role in shaping our everyday experiences. From the vehicles we drive to the devices we use, semiconductors are omnipresent, enabling functionalities in computers, smartphones, and various industrial automation technologies. 

100 years of cutting edge engineering at Nexperia Hamburg plant

<h2 dir="ltr" id="isPasted">Introduction</h2><p dir="ltr">In modern automotive engineering, Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) are fundamental components that enhance the performance, efficiency, and safety of vehicle electronics. Serving as key components in power management systems, motor controls, safety mechanisms, and various other vehicle subsystems, the reliability and performance of MOSFETs significantly impact the efficiency, safety, and overall driving experience of both electric vehicles (EVs) and internal combustion engine (ICE) vehicles. Consequently, the quality of MOSFETs is a non-negotiable aspect.</p><p dir="ltr">This article provides a detailed look at high-performance MOSFETs tailored for automotive applications, focusing on their essential functions, performance metrics, and rigorous quality standards. Additionally, it examines Nexperia's contributions to the evolution of the technology, highlighting real-world applications and discussing the trends currently shaping the industry.</p><h2 dir="ltr">Understanding Automotive MOSFETs</h2><p dir="ltr">MOSFETs are pivotal components in the architecture of modern automotive electronics. Their ability to efficiently switch and amplify power makes them a critical component across various systems within vehicles.</p><h3 dir="ltr">Function and Importance of MOSFETs in Automotive Systems</h3><p dir="ltr">MOSFETs are integral to the functionality of numerous automotive systems, serving as critical components in power management and signal processing across various applications. Their ability to handle high currents and voltages efficiently while switching and amplifying signals makes them a vital electronic component in modern vehicles. Here’s a closer look at some specific applications:</p><ul><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Powertrain and Vehicle Dynamics:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Advanced Driver Assistance Systems (ADAS) radar sensor module:&nbsp;</strong>MOSFETs regulate the power distribution to the radar components of ADAS, ensuring optimal performance by managing the precise control of high currents needed for the radar's operation.</p></li><li dir="ltr"><p dir="ltr"><strong>Electronic Power Steering (EPS):</strong> MOSFETs modulate the power supplied to the electric motor that drives the steering mechanism, allowing for precise control and responsiveness, enhancing both the efficiency of steering operations and the overall safety and comfort for the driver.</p></li><li dir="ltr"><p dir="ltr"><strong>Anti-locking braking systems/Electronic Stability Control (ABS/ESC):</strong> Critical in providing the rapid switching needed for effective electronic stability control and braking systems.</p></li></ul></li><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Vehicle Comfort and Convenience:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Adaptive Front LED lights and Interior LED lighting:&nbsp;</strong>MOSFETs drive the lighting systems, offering precision control that adapts to varying conditions and user settings.</p></li><li dir="ltr"><p dir="ltr"><strong>Automatic Heating Ventilation and Air Conditioning (HVAC):&nbsp;</strong>Ensures efficient motor control for heating, ventilation, and air conditioning, enhancing passenger comfort.</p></li><li dir="ltr"><p dir="ltr"><strong>Active Suspension System:</strong> MOSFETs facilitate the rapid adjustment of suspension settings to adapt to road conditions to improve ride quality and vehicle handling. This technology contributes to a smoother driving experience by dynamically managing the suspension's response to changes in terrain.</p></li></ul></li><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Safety Systems:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Airbag controller with Safing MOSFET:&nbsp;</strong>Controls the deployment of airbags in a crash situation, ensuring timely and reliable activation.</p></li><li dir="ltr"><p dir="ltr"><strong>Seat Belt Pretensioners and Force Limiters:</strong> MOSFETs control the mechanisms that tighten seat belts instantly during a collision, reducing slack to protect occupants. They also regulate the force limiters to ensure that the belt tightens adequately without causing injury, enhancing passenger safety during severe impacts.</p></li></ul></li></ul><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729694339156-image1.jpg" style="width: 100%px;" class="fr-fic fr-dib" alt="mosfet-applications-vehicle"></p><ul id="isPasted"><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Power Management in EVs/Hybrids:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>High power, high-efficiency DC/DC converter and On-Board Charger (OBC):</strong> Essential for converting and managing power within the vehicle’s electrical system, crucial for electric and hybrid vehicles.</p></li><li dir="ltr"><p dir="ltr"><strong>Zonal Control Units:</strong> MOSFETs facilitate intelligent power distribution controlled by software, optimizing the delivery of power to different zones of the vehicle. This not only enhances the efficiency of electrical systems but also supports advanced features such as customized lighting and climate control across different cabin areas.</p></li><li dir="ltr"><p dir="ltr"><strong>Battery Management System (BMS):&nbsp;</strong>MOSFETs play a crucial role in managing systems that monitor and control battery packs, crucial for EV performance and safety. They also help in the balanced charging of battery cells, a process that is critical for maintaining the health and extending the lifetime of the battery. By ensuring each cell within the battery pack is charged correctly, MOSFETs prevent overcharging and help maintain the overall battery balance, thus safeguarding and maximizing battery life.</p></li></ul></li><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Applications in ICE vehicles:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Cooling Fan and Fluid Pump Controls:&nbsp;</strong>Manage the operation of cooling systems and fluid circulation, which are vital for maintaining the operational integrity of engine and battery systems.</p></li><li dir="ltr"><p dir="ltr"><strong>Electronic Fuel Injection:&nbsp;</strong>Improves the efficiency and control of fuel delivery to the engine, optimizing performance and reducing emissions.</p></li></ul></li></ul><p dir="ltr">MOSFETs’ versatility enables them to support these (and many more) critical functions across various systems within the vehicle, highlighting their importance in the automotive industry.</p><h3 dir="ltr">Key Performance Metrics for MOSFETs</h3><p dir="ltr">The high performance, efficiency, and reliability of MOSFETs in automotive applications are essential for ensuring the smooth operation of vehicle electronics. These metrics include:</p><ul><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Electrical Efficiency:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Switching Efficiency:&nbsp;</strong>Effective switching speeds for automotive power MOSFETs typically range from tens to hundreds of nanoseconds, essential for fast response times in power-intensive applications. Small signal MOSFETs, which are also qualified for automotive use, can switch in just a few nanoseconds, providing even faster response for applications requiring high-speed signal processing.</p></li><li dir="ltr"><p dir="ltr"><strong>On-state Resistance:&nbsp;</strong>Lower on-state resistance increases efficiency by reducing power losses. Typical values range from 10 mΩ to sub &lt;1mΩ, ideal for minimizing heat generation and energy wastage.</p></li><li dir="ltr"><p dir="ltr"><strong>Power Limits:&nbsp;</strong>These are determined by the maximum voltage and current the MOSFET can handle—commonly between 5V to 100V and 10A to 2000A—suitable for a variety of automotive functions.</p></li></ul></li><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Thermal Performance:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Operating Temperature Range:&nbsp;</strong>Automotive MOSFETs must operate effectively within a range of -55°C to +150°C, with short-term tolerance of up to 175°C for high-heat environments such as engine compartments.</p></li><li dir="ltr"><p dir="ltr"><strong>Thermal Resistance of Junction-Base Mounting: &nbsp;</strong>This parameter, ranging from 0.5K/W to 2K/W, indicates the capability of heat dissipation. Lower values are preferable, as they denote superior thermal management.</p></li></ul></li><li dir="ltr" style="font-weight: bold;"><p dir="ltr"><strong>Durability and Longevity:</strong></p><ul style="font-weight: initial;"><li dir="ltr"><p dir="ltr"><strong>Thermal Cycling Resistance:&nbsp;</strong>MOSFETs are designed to withstand numerous thermal cycles without performance degradation, ensuring long-term reliability. Additionally, they must pass rigorous electrical bias stress tests, including high temperature gate bias, high temperature reverse bias, and humidity bias stress. These tests are critical for assessing the durability of MOSFETs under severe environmental conditions and electrical stresses, further ensuring their robustness and suitability for demanding automotive applications.</p></li></ul></li></ul><p dir="ltr"><em><strong>Suggested reading:&nbsp;</strong></em><a href="https://www.wevolver.com/article/next-generation-mosfet-technology-meets-demand-for-strong-thermal-performance-in-automotive-applications" target="_blank"><strong><em>Next-generation MOSFET technology Meets Demand for Strong Thermal&nbsp;</em>Performance in Automotive Applications.</strong></a></p><h2 dir="ltr">Quality Standards and Certifications</h2><p dir="ltr">MOSFETs used in automotive applications are subject to specific industry standards that dictate their design, testing, and performance criteria. One of the most critical standards is the AEC-Q101, a stringent specification from the Automotive Electronics Council that covers stress tests for semiconductors in automotive applications. This standard ensures that MOSFETs can withstand extreme conditions such as high temperatures, vibrations, and varying electrical loads.</p><p dir="ltr">Compliance with AEC-Q101 involves multiple tests, including thermal shock, moisture resistance, electrostatic discharge susceptibility, and life-cycle testing. These tests are designed to simulate the actual operating conditions that MOSFETs will face in a vehicle, ensuring that only the most robust components make it into automotive systems.&nbsp;</p><p dir="ltr"><strong><em>Suggested reading: <a href="https://www.wevolver.com/article/semiconductor-resilience-with-innovations-in-testing-techniques-and-packaging" target="_blank">Semiconductor Resilience with Innovations in Testing Techniques and Packaging</a></em></strong></p><h2 dir="ltr">Trends and Innovations</h2><p dir="ltr">The automotive industry is on the brink of a big technological transformation, with MOSFETs playing a crucial role in shaping the future of mobility. As the demand for EVs and autonomous driving systems increases, MOSFETs are evolving to meet the new challenges and performance requirements.</p><p dir="ltr">New materials such as Silicon Carbide (SiC) and Gallium Nitride (GaN) are making their way into MOSFET design. These materials offer superior efficiency, higher breakdown voltage, higher temperature tolerance, and faster switching capabilities than traditional silicon MOSFETs, making them ideal for the high-power demands of EV powertrains and charging systems.</p><p dir="ltr">Additionally, the integration of intelligent control features within vehicle subsystems is becoming more common. Smart power converters can provide real-time diagnostics and protection features, enhancing the overall safety, reliability and repairability of automotive electronics.</p><p dir="ltr">Moreover, as vehicles become more connected and autonomous, the number of electronic components and systems is set to increase continuously, necessitating MOSFETs that can perform reliably in a more crowded and interconnected environment. The ongoing development in MOSFET technology also aims to reduce interference and improve communication between components, ensuring seamless operation.</p><h2 dir="ltr">Nexperia's High-Performance MOSFETs: Driving Excellence and Innovation in Automotive Electronics</h2><p dir="ltr">Nexperia distinguishes itself in the automotive electronics market with a strong focus on quality, performance, and innovation. As a semiconductor manufacturer, Nexperia is committed to developing MOSFET technology that meets the stringent requirements of modern automotive systems.</p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729694884790-image3.png" style="width: 100%px;" class="fr-fic fr-dib" alt="lfpak-family"><span class="fr-inner">MOSFETs optimized for Automotive applications by Nexperia in an LFPAK package. Source: Nexperia</span></span></span></p><h3 dir="ltr">Innovative Product Range</h3><p dir="ltr">Nexperia’s automotive MOSFET product portfolio contains over 400 types of power MOSFETs, with specifications ranging from -18 &nbsp;to 500 A for drain currents and drain-source voltage ratings ranging from -60to 100 V. These are housed in robust copper-clip packages featuring cutting-edge technologies, such as flexible leads and wettable flanks for ease of Automatic Optical Inspection (AOI) and improved reliability. This diversity ensures solutions for every automotive electronic need, from simple lamp circuits to complex power requirements of vehicle electrification and hybrid battery systems.</p><p dir="ltr"><em><strong>Suggested reading:&nbsp;</strong></em><a href="https://www.wevolver.com/article/a-story-of-innovation-how-lfpak-revolutionized-an-industry" target="_blank"><strong><em>A story of innovation: How LFPAK revolutionized an industry.</em></strong></a></p><h3 dir="ltr">Focused on Future Needs and Sustainability</h3><p dir="ltr">Nexperia is further advancing MOSFET technology with initiatives like the introduction of the <a href="https://www.nexperia.com/products/sic-mosfets" target="_blank">1200 V Silicon Carbide MOSFETs</a>, which enhance efficiency and reduce energy waste—crucial for extending the driving range of EVs. The company's efforts in scaling down MOSFET sizes allow for more compact system designs without compromising performance or reliability. These innovations support the automotive industry’s goals of reducing carbon footprints and advancing sustainable mobility solutions.<span contenteditable="false" draggable="true" class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable"><iframe width="640" height="360" src="https://www.youtube.com/embed/pD7b3YkhG6s?&amp;pp=ygUPbmV4cGVyaWEgbW9zZmV0&amp;wmode=opaque&amp;rel=0" frameborder="0" allowfullscreen="" class="fr-draggable"><span class="fr-mk" style="display: none;">&nbsp;</span></iframe></span></p><h3 dir="ltr">Specialization for Reliability</h3><p dir="ltr">Tailoring MOSFET offerings to specific automotive needs ensures that each component delivers optimal performance and efficiency. Nexperia’s MOSFETs are essential in systems ranging from adaptive lighting and climate control to critical applications like electric power steering and braking systems. Innovations in packaging and silicon technologies enhance thermal performance and durability, vital attributes where reliability and space economy are most important.</p><p dir="ltr">Nexperia upholds a zero-defect culture, which has been recognized through multiple supplier awards, reflecting their commitment to excellence. Impressively, the company has maintained a complaint rate of less than 0.05 complaints per million since 2019, emphasizing their relentless focus on quality.&nbsp;</p><p dir="ltr">In addition to these innovations, Nexperia provides next-generation support tools for automotive engineers. Their interactive datasheets allow real-time adjustment of parameters like voltage, current, and temperature, instantly visualizing MOSFET behavior. This streamlines design workflows by eliminating manual calculations and circuit simulations. Advanced electrothermal MOSFET models also enable early-stage validation of circuit designs, helping identify EMI and EMC issues upfront.</p><p dir="ltr">Nexperia's ongoing innovations and focus on quality support automotive manufacturers in developing more efficient, reliable, and cost-effective electronic systems. These advancements contribute to vehicles that offer improved safety, comfort, and environmental performance.</p><p dir="ltr"><em>Visit <a href="https://nexperia.com/mosfets" target="_blank"><strong>Nexperia's official website</strong></a> to explore a range of advanced MOSFET solutions built for automotive electronics.</em></p><h2 dir="ltr">Conclusion</h2><p dir="ltr">Nexperia's ongoing commitment to innovation in MOSFET technology highlights the critical role these components play in improving vehicle performance, efficiency, and safety. By leveraging advanced materials and innovative designs, Nexperia ensures that automotive electronics meet stringent contemporary standards and are equipped for the evolving demands of tomorrow. As the shift towards more electric and autonomous vehicles continues, the need for reliable, efficient, and high-performance MOSFETs becomes increasingly apparent.</p><h2 dir="ltr">References</h2><p dir="ltr">[1] Nexperia. Driving solenoids in automotive applications Rev. 1.1 [Internet]. 3 Nov 2023. Available from:<a href="https://assets.nexperia.com/documents/application-note/AN50003.pdf" target="_blank">&nbsp;https://assets.nexperia.com/documents/application-note/AN50003.pdf</a></p><p dir="ltr">[2] Nexperia. MOSFET and GaN FET Application Handbook [Internet]. 19 Nov 2020. Available from:<a href="https://efficiencywins.nexperia.com/efficient-products/mosfet-and-gan-fet-application-handbook" target="_blank">&nbsp;https://efficiencywins.nexperia.com/efficient-products/mosfet-and-gan-fet-application-handbook</a></p><p dir="ltr">[3] Nexperia. Selection Guide: Discrete, MOSFET and GaN FET components, analog &amp; logic ICs [Internet], Available from: <a href="https://assets.nexperia.com/documents/selection-guide/Nexperia_Selection_guide_2023.pdf" target="_blank">https://assets.nexperia.com/documents/selection-guide/Nexperia_Selection_guide_2023.pdf</a></p>

Nexperia's automotive MOSFETs enhance innovation across both traditional and electric vehicles, expertly managing a wide array of applications from simple lighting to advanced electrification systems, ensuring high performance, reliability and superior efficiency in every aspect.

High-Performance MOSFETs Driving Excellence and Innovations in Automotive Electronics

<p id="isPasted">In the fast-paced world of electronics and innovation, having access to the right tools is essential for designers and engineers looking to bring their concepts to life quickly and efficiently. Development kits are a key resource in this process, offering pre-built solutions that allow for faster prototyping and testing of new ideas. Mouser Electronics, a leading global distributor, is renowned for providing one of the most extensive ranges of off-the-shelf development kits, ensuring that designers can access the tools they need when they need them.</p><p>In this article, Mouser’s Director of Technical Content for EMEA, Mark Patrick, shares his expert insights by presenting his ‘Top 5 Picks’ from the latest development kits available. These kits have been carefully selected based on their innovative features, ease of use, and the potential they offer to accelerate the design process. Whether you're working on AI applications, IoT solutions, or embedded systems, these development kits can give your project the jumpstart it needs.</p><h2><strong>Long-range connectivity</strong></h2><p><em>Digi XBee® XR 868&nbsp;</em></p><p>This development kit includes the Digi XBee 868 RF MHz module with a U.FL antenna connector, antennas, and a development board. It supports long-range connectivity applications in Europe, operating between 863MHz and 870MHz. The module facilitates point-to-point and mesh networking with a line-of-sight range exceeding 14 kilometers, ideal for the agriculture and energy sectors. The device employs intelligent interference management using Listen Before Talk and Adaptive Frequency Agility, reducing interference by scanning frequencies and shifting channels seamlessly.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/digi-xbee-xr-868-kit/n-8mwysZ1npagf">XBee® XR 868 Development Kit - Digi | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582453944-digi.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p><h2><strong>Curiouser and curiouser</strong></h2><p><em>Microchip WBZ450 EV22L65A</em></p><p>Microchip’s WBZ450 Curiosity board is an efficient, modular development platform that supports rapid prototyping and demonstrates the features, capabilities, and interfaces of Microchip’s WBZ450PE BLUETOOTH® Low Energy and Zigbee® RF module. The EV22L65A board offers integrated programming/debugging features using the PICkit™ Onboard 4 (PKOB4) debugger interface. A Micro-USB cable is required to power up and program the board.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/microchip-ev22l65a-board/n-8mwysZ2puw22">WBZ450 Curiosity Board (EV22L65A) - Microchip Technology | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582723571-micro.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p><h2><strong>Arm-based MCU&nbsp;</strong></h2><p><em>STMicro STM32H7S78-DK Discovery kit</em></p><p>STMicroelectronics’ STM32H7S78-DK Discovery kit demonstrates and develops applications for the Arm® Cortex®-M7 core-based STM32H7S7L8H6H microcontroller. The kit comes with various hardware features, including USB Type-C™, Octo-SPI flash memory, Hexadeca-SPI PSRAM devices, audio codec, digital microphones, ADC, user button, and flexible extension connectors. These connectors facilitate easy wireless connectivity, analog applications, and sensor expansion.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/stm-stm32h7s78-dk-kit/n-8mwysZ2cjsva">STM32H7S78-DK Discovery Kit - STMicro | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582777405-st.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p><h2><strong>Rugged and reliable embedded wireless</strong></h2><p><em>Advantech WLNNA&nbsp;</em></p><p>Advantech’s WLNNA Series evaluation kit is a platform for evaluating, testing and developing Airborne Enterprise Device Server Modules. The Advantech WLNNA kit offers size, cost, power consumption, and performance advantages over other wireless solutions. Ideal for rugged and reliable applications needing an embedded IEEE 802.11a/b/g/n compliant wireless engine, the kit includes a WLNNA Series Evaluation Board with connectors and headers providing access to all module interfaces.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/advantech-wlnna-kit/n-8mwysZ27k4mu">WLNNA Series Evaluation Kit - Advantech | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582820389-brief+2.png" style="width: 100%px;" class="fr-fic fr-dib"></p><h2><strong>IoT control</strong></h2><p><em>M5Stack M5NanoC6 board</em></p><p>This board features an ESP32-C6FH4 MCU supporting Wi-Fi 6, Zigbee®, and an infrared emitter for controlling infrared IoT devices. The device's ceramic antenna ensures stable wireless communication. Programmable RGB beads enable personalized visual effects. The Grove interface allows flexible expansion of various M5 devices, which are customizable for different communication protocols.</p><p><a href="https://www.mouser.com/new/embedded-solutions/engineering-tools/m5stack-m5nanoc6-board/n-8mwysZ2sl8dv" id="isPasted">M5NanoC6 Board - M5Stack | Mouser</a></p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1729582849615-m5.jpg" style="width: 100%px;" class="fr-fic fr-dib"></p>

In this article,  Mouser’s Director, Technical Content, EMEA, Mark Patrick, presents his ‘Top 5 Pick’ of recently-released dev kits.

The development tools you need

Circuit board being checked by an engineer using a test head connected to the Multimeter

This article will guide you through the fundamentals of how to read a circuit board, decoding key elements, essential symbols and markings, exploring techniques for tracing circuits, and examining advanced analysis methods.

How to Read a Circuit Board: Mastering the Language of Electronics

Green Printed Circuit Board - Raspberry Pi

This article delves into the history and science behind the green color of circuit boards, shedding light on the reasons and advantages that have kept it at the forefront of electronics manufacturing.

Why Are Circuit Boards Green? Unraveling the Mystery Behind the Iconic Color

<h2 dir="ltr" id="isPasted">Introduction</h2><p dir="ltr">In the fast-paced world of technology, the ability to adapt and learn from various disciplines is invaluable. One of the most influential tools in software development is Git, a version control system that has revolutionized how engineering teams collaborate and manage code changes. While Git is traditionally associated with software, its principles and practices offer significant advantages when applied to hardware development, a field where managing complex workflows and collaboration are equally critical.</p><p dir="ltr">Hardware development, like software, involves intricate design and testing phases, but it faces unique challenges due to its physical componentry and integration needs. By examining and adapting the methodologies used in Git, hardware engineers can potentially streamline their workflows and enhance productivity. This article explores the role of software practices, specifically those associated with Git, in transforming hardware development processes facilitated by platforms like <a href="http://www.allspice.io" target="_blank">AllSpice</a> that integrate these methodologies seamlessly into hardware projects.</p><hr><p><em>This article is part of </em><a href="https://www.wevolver.com/article/the-future-of-hardware-development-collaborative-tools-and-techniques" target="_blank" rel="noopener noreferrer"><strong><em>The Future of Hardware Development</em></strong></a><em>, a series featuring insights into how cutting-edge collaborative platforms transform traditional hardware development workflows, integrating advanced version control systems and paving the way for more efficient, error-free project management.</em></p><hr><h2 dir="ltr">Bringing agility to hardware development</h2><p dir="ltr">Agile methodologies, traditionally rooted in software development, emphasize flexibility, efficiency, and continuous improvement through iterative development and frequent reassessment. These principles can also be beneficial in hardware development, which often suffers from long development cycles and complex integration challenges.</p><h3 dir="ltr">Adapting Agile practices for hardware development</h3><p dir="ltr">Incorporating Agile, a responsive and adaptive approach to project management, into hardware development involves breaking down large projects into smaller, manageable increments that are continuously evaluated. This method allows teams to focus on delivering functional segments of a product regularly, facilitating early detection of design flaws and integration issues. Moreover, Agile encourages cross-functional collaboration, ensuring that mechanical, electrical, and software components are aligned and integrated from the early stages of development.</p><h3 dir="ltr">Implementing CI/CD in hardware development</h3><p dir="ltr">The incorporation of software methodologies such as <a href="https://allspice.io/post/ci-cds-impact-on-hardware-development-life-cycles" target="_blank">Continuous Integration (CI)</a> and Continuous Delivery (CD) into hardware development represents a significant shift towards more dynamic and responsive design processes. Originally pioneered in the software industry to facilitate rapid development cycles and enhance product quality, these methodologies are now being adapted to meet the unique challenges of hardware engineering.&nbsp;</p><p dir="ltr">CI is a practice where developers frequently integrate their changes into a shared repository several times a day. Each integration can then be verified by an automated build and automated tests. While this concept is straightforward in software, applying it to hardware development involves adapting these principles to accommodate physical products. Sophisticated automated testing architecture is required that can immediately test hardware components as they are designed or modified. These systems might include simulation software that can predict how a change in one component affects others or physical testing rigs that automatically run tests on actual hardware pieces.</p><p dir="ltr">CI in hardware involves the regular integration of component designs and sub-assemblies into a central repository where automated builds and tests ensure early detection of potential integration issues. This approach reduces the risks associated with integrating hardware components late in the development cycle, thus minimizing costly delays and errors.</p><p dir="ltr">CD extends CI by ensuring that hardware designs can be released into production at any time. &nbsp;Establishing routines where hardware designs are regularly updated and integrated into the main project repository. This practice helps in identifying integration issues early, preventing the last-minute surprises that can delay product releases. It streamlines the path from design to manufacture, allowing teams to quickly respond to market changes and customer feedback.</p><p dir="ltr">Building on the foundation of Agile and CI/CD, the adoption of Git practices in hardware development can further streamline processes. Git, with its robust version control system, provides the tools to manage complex design files much like software code is managed.</p><h2 dir="ltr">Core concepts of Git relevant to hardware development</h2><p dir="ltr">Git has fundamentally transformed software development practices, offering a robust framework for managing complex projects through its decentralized approach and powerful tools for collaboration. The principles that make Git effective for software are equally applicable to hardware development, where managing iterations, collaboration, and integration are paramount.&nbsp;</p><p dir="ltr">By dissecting the core concepts of Git, we can uncover how these can be translated into the hardware development process, offering a systematic approach to managing the complexities inherent in physical product design and production.</p><h3 dir="ltr">Version control</h3><p dir="ltr">Git's primary function is to serve as a version control system, allowing developers to track changes over time. This function is crucial in hardware development, where each component's design might evolve through multiple iterations. Implementing version control allows engineers to maintain a comprehensive history of changes, revert to previous versions when needed, and understand the evolution of each component.</p><h3 dir="ltr">Branching and merging</h3><p dir="ltr">Branching is one of Git’s standout features, permitting multiple developers to work on different features simultaneously without affecting the main project. This methodology can be incredibly beneficial in a multidisciplinary hardware project where electrical, mechanical, and software teams need to develop parts independently before integrating them into a single product. Merging then allows these independent lines of development to come together in a controlled and recorded manner, ensuring that all contributions are aligned and functional.<span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1728320239653-Alice+Martins+VPGM+Industrial+Solutions%2C+Sensata+Technologies+Anisha+Raj+Seli+Director+of+Design+Evaluation+Engineering%2C+Analog+Devices+Alice+Martins+is+a+dynamic+leader+with+a+global+perspective++%282%29.jpg" style="width: 100%px;" class="fr-fic fr-dib" alt="git-flow-branching-strategy"><span class="fr-inner" spellcheck="false">Git flow branching strategy: Git flow strategy is a process that starts off with the dev-main branch pair but adds additional feature branches as the development continues. Source: AllSpice</span></span></span></p><h3 dir="ltr">Commits</h3><p dir="ltr">In Git, <a href="https://allspice.io/post/git-for-hardware-commit-best-practices" target="_blank">commits act as checkpoints</a> where individual changes to files are saved. Each commit includes a message describing the change, providing a clear audit trail of who did what and why. For hardware development, this means every change to the design files, from a small modification in a component to a major architectural overhaul, can be tracked and documented. This level of detail is invaluable, particularly for complex projects requiring certification or regulatory compliance.</p><p dir="ltr">By adopting these core Git concepts, hardware development teams can achieve greater control over project complexities, improve the accuracy of their documentation, and enhance collaboration across different areas of expertise, all of which are essential for successful hardware innovation.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1728320256270-image6.jpg" style="width: 100%px;" class="fr-fic fr-dib" alt="git-for-hardware-banner"></p><p dir="ltr" id="isPasted"><em>Check out an eBook by AllSpice about mastering Git for hardware engineering:&nbsp;</em><a href="https://content.allspice.io/en-us/git-for-hardware-guide" target="_blank"><em><strong>The Git for Hardware Guide</strong></em></a></p><h2 dir="ltr">Benefits for the hardware industry</h2><p dir="ltr">The adaptation of software practices such as Agile and CI/CD into hardware development brings numerous tangible benefits that significantly elevate industry standards.</p><ul><li dir="ltr"><p dir="ltr"><strong>Reduced Time to Market:</strong>&nbsp;By enabling more frequent integration and quicker feedback loops, CI/CD practices help hardware teams accelerate their design and development cycles. This rapid iteration capability allows companies to bring products to market faster than ever before, responding swiftly to consumer demands and technological advancements.</p></li><li dir="ltr"><p dir="ltr"><strong>Enhanced Product Quality: </strong>Continuous testing and integration ensure that any discrepancies or defects are identified and addressed early in the development process. This not only improves the reliability of the final product but also boosts consumer trust and satisfaction.</p></li><li dir="ltr"><p dir="ltr"><strong>Cost Efficiency:</strong>&nbsp;Streamlined workflows and automated processes reduce the need for repeated manual interventions, cutting down on labor costs and minimizing the risk of expensive errors. These efficiencies make the overall development process more cost-effective, allowing companies to allocate resources more strategically.</p></li><li dir="ltr"><p dir="ltr"><strong>Environmental Sustainability:</strong>&nbsp;Efficient use of resources and reduction in waste are key benefits of integrating CI/CD into hardware development. These practices promote sustainability by minimizing the ecological footprint of manufacturing processes, in line with global efforts towards environmental conservation.</p></li></ul><p dir="ltr">These benefits clearly illustrate how incorporating software methodologies into hardware development can lead to smarter, faster, and more responsible manufacturing practices.</p><h2 dir="ltr">AllSpice's role in modernizing hardware development</h2><p dir="ltr">AllSpice is a Git-based collaboration platform that leverages the principles of software development to transform hardware engineering practices. By integrating CI/CD into the hardware development process, AllSpice enhances operational efficiency and significantly reduces environmental impact. Now, let's look at some of the practical benefits of using the AllSpice platform.</p><h3 dir="ltr">Automated workflows</h3><p>AllSpice Actions enhances Agile workflows in hardware development by introducing automated tasks and workflows that are seamlessly integrated into the Agile sprint cycles. <a href="https://allspice.io/post/automating-component-validation-tests-with-allspice-actions-for-electrical-engineers" target="_blank">By automating design checks, validation processes, and documentation updates</a>, teams can focus more on iterative design improvements and less on repetitive tasks. This integration allows for faster sprint cycles, improved team collaboration, and real-time feedback, which are crucial for Agile environments where quick pivoting and iterative updates are standard.<span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1728320290002-image3.png" style="width: 100%px;" class="fr-fic fr-dib" alt="allspice-actions"><span class="fr-inner" spellcheck="false">A diagram illustrating the components of AllSpice Actions</span></span></span></p><h3 dir="ltr">CI/CD with AllSpice actions</h3><p dir="ltr"><a href="https://allspice.io/actions" target="_blank">AllSpice Actions</a> is a feature designed to foster a robust CI environment specifically tailored for hardware development. With features like automated Bill of Materials (BOM) generation, netlist analysis checks, and design review audit logs, hardware engineers can ensure that every design iteration is tested and validated from the start of the development process. This reduces the integration issues typically faced at the later stages of hardware design, ensuring a smoother, more reliable integration of new design changes.<span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1728320311059-image5.png" style="width: 100%px;" class="fr-fic fr-dib" alt="allspice-actions-demo"><span class="fr-inner" spellcheck="false">Any manual operation in AllSpice, such as performing tests or generating reports of design feedback, can be automated using AllSpice Actions. Source: AllSpice</span></span></span></p><p dir="ltr" id="isPasted">In hardware engineering, where changes can be costly and time-consuming, CD is facilitated by AllSpice Actions through automated workflows that streamline the release process. From automated compliance reports to final release packaging, AllSpice ensures that each design iteration is not only tested but also ready for deployment at any stage. This capability is crucial for maintaining a competitive edge by enabling faster market entry of new and updated products.</p><h3 dir="ltr">Error detection and resolution</h3><p dir="ltr">Early and immediate error detection is a core requirement of effective CI/CD pipelines. With AllSpice, engineers can integrate early error detection mechanisms directly into the design process, catching issues like incomplete libraries or invalid part numbers as soon as they arise. This immediate feedback loop helps in the quick resolution of issues, significantly reducing downtime and backtracking in design workflows, which is especially beneficial in an Agile setup.<span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1728320348424-image1.png" style="width: 100%px;" class="fr-fic fr-dib" alt="allspice-issues"><span class="fr-inner" spellcheck="false">Issues that are identified during design reviews can be efficiently raised and tracked in AllSpice. Source: AllSpice</span></span></span></p><h3 dir="ltr">Standardization and compliance</h3><p dir="ltr">Maintaining standardization across projects is vital for scaling operations in hardware development. AllSpice supports this by allowing teams to define standard workflow templates and checklists that ensure compliance with internal and industry standards. This standardization helps reduce variability in the outcomes and simplifies the onboarding process for new team members, aligning with the principles of both Agile and CI/CD methodologies.</p><h3 dir="ltr">Efficiency and productivity</h3><p dir="ltr">By reducing manual checks and fostering an environment of automated validations and checks, AllSpice notably increases engineering productivity. Teams can allocate more resources towards innovation and development rather than getting bogged down by routine checks and validations. This efficiency is a direct benefit of integrating CI/CD principles, which focus on automating as much of the software development process as possible to increase release rates and improve product quality.</p><p dir="ltr"><em>Visit <a href="https://allspice.io/" target="_blank"><strong>AllSpice’s official website</strong></a> today to explore how the platform can streamline your hardware development process.</em></p><h2 dir="ltr">Conclusion</h2><p dir="ltr">Overcoming challenges in hardware engineering requires a committed approach to adopting new technologies and practices. By leveraging platforms like AllSpice and adopting a gradual, informed strategy to integration, hardware development teams can reap the substantial benefits of software methodologies, making way for more efficient, agile, and sustainable product development.</p><h2 dir="ltr">References</h2><p dir="ltr">[1] Jamie. CI/CD's impact on hardware development life cycles [Internet]. AllSpice. Available from: <a href="https://allspice.io/post/ci-cds-impact-on-hardware-development-life-cycles" target="_blank">https://allspice.io/post/ci-cds-impact-on-hardware-development-life-cycles</a></p><p dir="ltr">[2] Jamie. Benefits of Git for hardware: Branches &amp; branch protections [Internet]. AllSpice. Available from: <a href="https://allspice.io/post/benefits-of-git-for-hardware-branches-branch-protections" target="_blank">https://allspice.io/post/benefits-of-git-for-hardware-branches-branch-protections</a></p><hr><p><em>Download the eBook, '<a href="https://allspice.io/implementing-git-for-hardware-in-30-days" target="_blank"><strong>Implementing Git in 30 Days</strong></a>,' to start transforming your hardware development process today.</em><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1728320365081-image4.jpg" style="width: 100%px;" class="fr-fic fr-dib" alt="allspice-implementing-git-for-hardware-in-30-days-banner"></p>

AllSpice is a Git-based collaboration platform that transforms hardware development by streamlining project workflows, enhancing design precision, and reducing time to market through established software engineering practices such as Agile and CI/CD.

Learning from Git: The Role of Software Practices in Hardware Development

<p id="isPasted">In this fast-paced competition, nothing goes as planned, and that’s what makes<a href="https://eu.mouser.com/circuit-showdown">&nbsp;<em>Circuit Showdown</em></a> so exciting. As the contestants regroup after a day filled with setbacks and last-minute adjustments, the pressure is on to redeem themselves and bring their projects to life. None of them expected to get another chance, but the judges just couldn’t decide who to send home given the circumstances of the first day.</p><blockquote><p>"Nobody's project ended up how they originally intended," said Nicolette Emmino, Circuit Showdown Co-Host.</p></blockquote><p id="isPasted">The first round of challenges was a snapshot of a concept that engineers know too well: <strong>adaptability is key</strong>. After reflecting on the first round with the judges, it was clear that the word of the day was resilience. Each contestant encountered the unexpected, but they all demonstrated their ability to pivot.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3ODY0MDYzODY1LUNpcmN1aXQgU2hvd2Rvd24gLSBQcmVtaWVyaW5nIE5leHQgTW9udGggXyBNb3VzZXIgRWxlY3Ryb25pY3MgMC0zNCBzY3JlZW5zaG90LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib"></p><p id="isPasted">“They all had to shift at some point, and they all had software issues at some point too. So, it was really interesting to see how they dealt with it in order to complete their project,” said Bryan DeLuca, <em>Circuit Showdown</em> cohost.</p><p>But a new day brings a new challenge, and now the stakes are higher. With industrial automation as the theme, the contestants are pushed to think beyond the everyday and address complex, real-world applications.</p><p>“Precision is critical,” the judges remind them, emphasizing the importance of accuracy in environments where a single misstep means the difference between success and failure.</p><p>Charles, Michael, and Renee came prepared with renewed strategies they assembled based on the experiences they had in round one. Michael hopes to streamline his work by leveraging open-source Arduino libraries to cut down programming time. Renee aims for consistency, determined to stick with her chosen parts this time. And Charles plans to start simple and build on his success, adding functionality as his confidence increases.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3ODY0MDQwNTc1LUNpcmN1aXQgU2hvd2Rvd24gLSBQcmVtaWVyaW5nIE5leHQgTW9udGggXyBNb3VzZXIgRWxlY3Ryb25pY3MgMC0zOCBzY3JlZW5zaG90LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib"></p><p id="isPasted">As they were all set with their designs and ready to start building and coding, the judges reflected on their selections. “I think all three projects have challenges in there, so it'd be interesting to see how they actually implement the ideas. And I'm pretty sure maybe a couple of these ideas might evolve during the four hours,” said Massimo Banzi, cofounder of Arduino.</p><p>Just when they think they’ve found a rhythm, laughing and helping each other along, Chief Mentor Raymond Yin throws them a surprise challenge. It’s a sudden shift that will demand quick thinking and adaptability. Can they handle it?</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3ODY0MDUxMzg5LUNpcmN1aXQgU2hvd2Rvd24gLSBQcmVtaWVyaW5nIE5leHQgTW9udGggXyBNb3VzZXIgRWxlY3Ryb25pY3MgMC01MCBzY3JlZW5zaG90LnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib"></p><p id="isPasted">With only four hours on the clock, they’re fully aware that the essence of this battle is their ability to fight against time and their own limitations. “Today is a new day and a new competition,” the hosts remind everyone. The question looms: Who will rise to the challenge and be crowned the first-ever <em>Circuit Showdown</em> champion?</p><p>To catch all the action, tune in for <a href="https://www.mouser.com/circuit-showdown/?utm_source=wevolver&utm_medium=circuitshowdown&utm_campaign=episode3">episode 3</a> of <em>Circuit Showdown</em>, powered by Mouser Electronics and hosted by eeDesignIt. <em>Circuit Showdown</em> is sponsored by <a href="https://www.mouser.com/manufacturer/arduino/">Arduino</a>, <a href="https://www.mouser.com/manufacturer/keysight/">Keysight</a>, <a href="https://www.mouser.com/manufacturer/molex/">Molex</a>, <a href="https://www.mouser.com/manufacturer/renesas/">Renesas</a>, and <a href="https://www.mouser.com/manufacturer/vishay/">Vishay</a>.</p><p data-f-id="pbf" style="text-align: center; font-size: 14px; margin-top: 30px; opacity: 0.65; font-family: sans-serif;">Powered by <a href="https://www.froala.com/wysiwyg-editor?pb=1" title="Froala Editor">Froala Editor</a></p>

In Circuit Showdown, contestants must regroup after setbacks as they face a surprise twist in the industrial automation challenge. With only 4 hours to get it all done, their resilience is put to the test.

Circuit Showdown Contestants Face an Unforeseen Challenge

<p id="isPasted">Three contestants. Three judges. Two competition rounds. One champion.</p><p>Welcome to Circuit Showdown, where the next generation of engineers battle in a unique design competition.</p><p>Our industry is driven by innovation, and that innovation depends on the next generation of engineers. Circuit Showdown brings electrical and mechanical engineering students from various universities together to compete head-to-head in the first-of-its-kind design standoff. In just four hours, contestants must build a themed project from scratch using pre-determined hardware, components, and test equipment provided on-site.</p><p>Powered by Mouser Electronics and hosted by eeDesignIt, Circuit Showdown isn't just a design competition; it's a place where aspiring engineers their opportunity to display their engineering prowess in front of industry experts while blending creativity, technical skill, and pressure.</p><p><span contenteditable="false" draggable="true" class="fr-video fr-deletable fr-fvc fr-dvb fr-draggable"><iframe width="640" height="360" src="https://www.youtube.com/embed/LzqyWOH7zTU?&amp;wmode=opaque&amp;rel=0&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe></span><br></p><p><strong>Each contestant brings an impressive background and motivation to the competition.&nbsp;</strong></p><ul><li><strong>Renee Wrysinski</strong> (Rice University) is driven by a mission close to her heart: "What inspired me to pursue a career in engineering is I really wanted to work on solutions that help improve the lives of disabled people. And since then, I've kind of just fallen in love with the problem-solving."</li><li><strong>Charles Morales</strong> (Texas State University) reflected on his journey to engineering. He shared, "I was always interested in physics… I didn't just want to know the answers. I also wanted to understand. Okay, what can I do with this? And that's what engineering does—takes it from beyond just why and how things work to what you can do with it."</li><li><strong>Michael Vidales</strong> (Prairie View A&amp;M University) expressed a similar passion: "I like to use engineering in my everyday life. A lot of the principles that we use can be applicable to all situations. I mean, you use a lot of your critical thinking skills to kind of map out problems, figure out new solutions, research, and think outside the box, and that's one of the reasons I love engineering."</li></ul><p>Their goal? To emerge as the Circuit Showdown champion. With $40,000 in cash and equipment prizes on the line for the contestants and their universities, the tension is building.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1727863006090-Screenshot+2024-09-26+115950.png" style="width: 100%px;" class="fr-fic fr-dib"></p><h2>Guided by the Experts</h2><p>When they're in the heat of the competition, they're not alone. Their Chief Mentor, Raymond Yin, Mouser's technical content director, provides guidance and advice, helping them navigate their challenges. Raymond reflected on the contestants' progress, noting the impressive creativity displayed under intense conditions. Contestants have access to components from brands like Arduino, Molex, Renesas, and Vishay, along with state-of-the-art test equipment from Keysight.</p><h2>Judges' Perspective</h2><p>The judges, including experts from Molex, FIRST Robotics, and Arduino, will evaluate each design based on functionality, adherence to the theme, resourcefulness, and originality.</p><p><strong>Meet the judges:</strong></p><ul><li>Kirk Ulery, Distribution Business Development Manager, Molex</li><li>Chris Moore, CEO, FIRST Robotics</li><li>Massimo Banzi, Co-Founder, Arduino</li></ul><p>Each judge brings a different perspective to the competition, from fostering innovation in robotics to driving advancements in connected technologies. They're very clear about what they're looking for, and it's not just projects that work—they're looking for designs that push boundaries and showcase creativity in problem-solving.</p><p><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1727863015783-Screenshot+2024-09-26+120010.png" style="width: 100%px;" class="fr-fic fr-dib"></p><h2>The Competition Begins</h2><p>Hosted by Bryan DeLuca and Nicolette Emmino from eeDesignIt, the show kicks off with the first challenge theme: Smart Home.</p><p>The clock starts ticking, and the contestants dive into their projects. Charles, Renee, and Michael need to make quick decisions, select components from the Mouser pop-up warehouse, and adapt on the fly when things don't go as planned.</p><p>And things certainly do not go as planned on the first day of competition…</p><p>The contestants faced unexpected technical hurdles, from smoked boards to sensor issues and library mishaps.</p><h2>Who Will Rise to the Challenge?</h2><p>With some tips from their Chief Mentor, each contestant modified their original path and presented final projects to the judges.</p><p>Tune in to <a href="https://www.mouser.com/circuit-showdown/?utm_source=wevolver&utm_medium=circuitshowdown&utm_campaign=episodes1_2" target="_blank">episodes 1 and 2</a> of Circuit Showdown to meet the contestants and witness the drama unfold as plans go awry. Which contestant will advance? Who will stumble? And who will ultimately claim the title of Circuit Showdown champion? The journey is just beginning. <a href="https://www.youtube.com/@MouserElec" target="_blank" rel="noopener noreferrer">Subscribe to the Mousuer YT channel to watch first!</a></p>

Circuit Showdown pits three engineering students against each other in a high-pressure design competition. With just four hours to build projects from scratch, they must showcase creativity and technical skills to impress the judges and win $40,000 in prizes.

The Competition Heats Up at Circuit Showdown

<p dir="ltr" id="isPasted">The purpose of any cable connection is to transfer a seamless electrical signal via a mechanical connector, with minimum loss of performance.&nbsp;</p><p dir="ltr">When installing any type of wired device, you’ll end up with a continuous line of cable connecting all the various sections. The points where these connections occur are the cable terminations. At each end of any cable they’re called terminal heads, whereas if a cable is spliced in the middle, they’re known as intermediate splices.&nbsp;</p><h2 dir="ltr">Why Use Cable Terminations?</h2><p dir="ltr">There’s an argument that pure wire-to-wire connections offer the best electrical contact, so a better circuit connection is achieved. But twisting uninsulated wires together and fixing electrical tape over them isn’t a reliable or safe way to connect devices. It should only ever be a stop-gap measure. A more permanent solution is to solder the wires together – a tried-and-tested method proven over the long term in industrial electrical engineering.&nbsp;</p><p dir="ltr">Applying liquid solder to a joint fuses the cable ends and the solder then solidifies to create a durable, electrically-efficient and low-resistance connection. Soldering a joint also makes it air-tight, insulating it against possible oxidisation of copper conductors. But soldering can be labour-intensive, making it a better solution for low-volume or high-density connections.</p><p dir="ltr">There are several advantages to using cable terminations over bare or soldered joints, including:</p><ul><li dir="ltr"><p dir="ltr">Improved safety</p></li><li dir="ltr"><p dir="ltr">Enhanced durability</p></li><li dir="ltr"><p dir="ltr">Better electrical performance</p></li><li dir="ltr"><p dir="ltr">Ease of installation and maintenance</p></li></ul><p dir="ltr">Cable terminations are a lot easier to install and maintain, safer and more efficient. You’ll get a better connection and less likelihood of signal leakage or interruption, so your applications will work more efficiently and for longer. As well as forming a seamless electrical circuit, cable terminations seal the cable’s connection points. This helps insulate the power line from dust, dirt, water and vibration, ensuring it operates reliably.</p><h2 dir="ltr">Cable Termination – Methods and Types</h2><p dir="ltr">Other common connection methods include crimping, compression, wire wrapping and insulation displacement. To help you make an informed decision when selecting cable terminations, we’ll look at the range of methods and the most common choices of termination type. We’ll also outline their most common use cases and highlight their advantages.&nbsp;</p><h3 dir="ltr">Crimped Terminations</h3><p dir="ltr">Crimped terminations are a popular choice, providing a robust and efficient connection method for a wide range of materials and sizes. You’ll need a&nbsp;<a title="Crimping Tool" href="https://www.rowse-automation.co.uk/harting-09990000021" target="_blank">crimping tool</a> to connect conductors in this way, which will compress and tightly secure a ferrule or metal sleeve around the conductor.</p><p dir="ltr">This compression creates an electrically conductive, air-tight joint that offers considerable mechanical strength, as it resists movement, vibration and pull-out forces. Its popularity lies in its long-term reliability and suitability for high-volume production, as the process is fast and repeatable. To achieve the best results, purchase the appropriate crimping tool and terminals for each conductor and application.</p><h3 dir="ltr">Compression Terminations</h3><p dir="ltr">This method relies on compressive forces to make secure cable connections, such as mechanical connectors with set screws or bolts. This type of termination is good for high voltage and current applications, as it offers excellent conductivity and minimal resistance. It can stand up to environmental exposure and thermal cycling, is simple to connect and disconnect and is reusable.</p><p dir="ltr">The drawback to compression terminations is that they’re time-consuming, especially if you have multiple conductors. You have to tighten the connectors according to specified torque values to get the best performance and durability, or they may work loose over time. To avoid damage to the conductors, you need some skill to install compression terminations correctly.</p><h3 dir="ltr">Wire Wrap Terminations</h3><p dir="ltr">Wire wrap terminations are often used in electronics. They offer a unique way of making connections on items like integrated circuits and connectors and are fairly reliable for small-scale projects like rapid prototyping. This technique requires a wrapping tool, which secures a thin, solid wire in place around a conductive post or pin. The tool has sharp edges that penetrate the wire’s insulation, creating a temporary air-tight connection.</p><h3 dir="ltr">Insulation Displacement Terminations (IDTs)</h3><p dir="ltr">IDTs offer an efficient and convenient termination method, which eliminates the need to strip off cable insulation. The connector is fitted with sharp teeth or blades that pierce the cable insulation to make direct contact with the core of the conductor. It’s faster and easier than the traditional way of stripping insulation and is often used in domestic environments as well as data cabling and telecommunications.</p><p dir="ltr">Other advantages of IDTs include a lower likelihood of accidentally damaging the conductor. They’re air-tight and work well in mass termination applications, although displacing the conductor’s insulation may cause some signal attenuation.&nbsp;</p><h2 dir="ltr">Cable Termination – Types</h2><h3 dir="ltr">Pre-Insulated Terminals</h3><h4 dir="ltr">Description</h4><p dir="ltr">Pre-insulated terminals consist of a metal body enclosed in plastic insulation. There are several types of pre-insulated terminals, including the tubular, circular or fork-type, and what are known as ferrules. These are usually some form of narrow circular ring that fits over the end of a stripped electrical cable. They’re typically made of metals like copper or aluminium, or sometimes plastic.</p><h4 dir="ltr">Purpose</h4><p dir="ltr">You can insert wires into the holes provided at both ends of the terminal and tighten or loosen the connection with screws. It’s an easy way to connect or disconnect two wires without twisting or soldering them. It provides additional safety to equipment and users.&nbsp;</p><h4 dir="ltr">When To Use</h4><p dir="ltr">Pre-insulated terminals are widely used in industrial automation, especially in applications where insulation is critical to prevent short circuits or electric shocks.&nbsp;</p><h4 dir="ltr">Advantages</h4><p dir="ltr">The main advantages of pre-insulated terminals are that they’re quick and easy to install, provide good electrical insulation and reduce the risk of corrosion.</p><h3 dir="ltr">Bootlace Ferrules&nbsp;</h3><h4 dir="ltr">Description</h4><p dir="ltr">Bootlace ferrules are copper tubes that fit on the end of a stripped cable. They’re available with or without an insulating end sleeve and are usually crimped over the stripped wires at the end of a cable to form a reliable electrical connection.&nbsp;</p><h4 dir="ltr">Purpose</h4><p dir="ltr">They provide optimum electrical contact, with no potential for wire strands to unravel, spread or break. This is especially important for small wire applications or those where the housing is frequently removed, such as control units, switch boxes, function units, screw and spring terminals, or row and terminal connectors. They also prevent any unwanted contacts being connected in the terminal, which removes the potential for short circuits.</p><h4 dir="ltr">When To Use</h4><p dir="ltr">This type of termination doesn’t connect cables. It is used specifically for the end-point of a cable, where it protects the exposed wire strands. You’ll usually find it in control panels and other electrical installations that demand a secure and safe connection.</p><h4 dir="ltr">Advantages</h4><p dir="ltr">Bootlace ferrules help to prevent wire strands from fraying. They simplify the insertion of cables into terminal blocks and ensure a solid and reliable connection.</p><h3 dir="ltr">Copper Tube Terminals&nbsp;</h3><h4 dir="ltr">Description</h4><p dir="ltr">Copper tube terminals consist of a seamless copper tube that usually has a corrosion-resistant coating. This type of terminal is also known as a battery eyelet (as you’ll often find them on batteries) as well as eyelet terminals, starter rings and more. You’ll see a hole at the terminal’s end where you can connect a stud and a wide opening at the other end for easy cable insertion.&nbsp;</p><h4 dir="ltr">Purpose</h4><p dir="ltr">Copper tube terminals offer a high level of conductivity and so are ideal for heavy-duty industrial and high-current applications.</p><h4 dir="ltr">When To Use</h4><p dir="ltr">You’d be most likely to use a copper tube terminal for terminating cables carrying higher currents, such as primary power feeds and main battery connections.</p><h4 dir="ltr">Advantages</h4><p dir="ltr">Copper tube terminals offer excellent mechanical strength, combined with a high level of electrical conductivity and resistance to corrosion.</p><h3 dir="ltr">Copper Tube Splices&nbsp;</h3><h4 dir="ltr">Description</h4><p dir="ltr">Copper tube splices are a type of intermediate cable termination that are often tapered internally at both ends to make inserting the conductors easier. Many also have a central stop point to help position both cables correctly.&nbsp;</p><h4 dir="ltr">Purpose</h4><p dir="ltr">These intermediate terminations are for joining together low-voltage conductors, so you can connect two cables together securely.</p><h4 dir="ltr">When to use</h4><p dir="ltr">You’ll use this kind of terminal when joining cables together in a power distribution system.</p><h4 dir="ltr">Advantages</h4><p dir="ltr">Copper tube splices are capable of handling high current loads. They are strong and reliable connections that are resistant to damage by environmental factors.</p><h3 dir="ltr">Copper Pin Terminals&nbsp;</h3><h4 dir="ltr">Description</h4><p dir="ltr">Copper pin terminals are most commonly used as an easy method of connecting individual cables to terminal blocks. They usually combine a tube for the cable with a grooved profile pin that goes into the connector and easily connects wires and cables to an electrical system.</p><h4 dir="ltr">Purpose</h4><p dir="ltr">Copper pin terminals make it faster and easier to insert cables into terminal blocks, especially in applications that require a clamp or screw.</p><h4 dir="ltr">When To Use</h4><p dir="ltr">You’ll use these most commonly for connecting wires to a terminal block. They’re ideal for situations where frequent connection and disconnection are required.</p><h4 dir="ltr">Advantages</h4><p dir="ltr">Their main advantage is simplicity of use, combined with good electrical&nbsp;conductivity and a reliable connection.</p><h3 dir="ltr">Aluminium Terminals&nbsp;</h3><h4 dir="ltr">Description</h4><p dir="ltr">Aluminium terminals offer a more corrosion-resistant alternative to copper or other materials, especially when weight or environmental factors have an impact. They come in various forms, including crimped, compression or combination-type with copper. Aluminium connectors can be easily machined and are easy to process.</p><h4 dir="ltr">Purpose</h4><p dir="ltr">Aluminium is lightweight and offers good conductivity. &nbsp;It’s more resistant to corrosion than copper or other metals, so aluminium terminals are a good choice for outdoor applications.&nbsp;</p><h4 dir="ltr">When To Use</h4><p dir="ltr">You should use aluminium terminals if your cabling is also aluminium. Choose them also for applications where weight reduction is a factor or in difficult environmental conditions, including fire hazards.</p><h4 dir="ltr">Advantages<strong>&nbsp;</strong></h4><p dir="ltr">Aluminium terminals offer a cost-effective, lightweight solution with good corrosion resistance.</p><h2 dir="ltr">Cable Terminations – Other Factors</h2><p dir="ltr">There are additional ways to classify electrical cable terminations, depending on several factors. These include whether they’re to be installed in interior or exterior locations, what materials they’re made from and whether they’re a complete set or for intermediate electrical power cables. You can get cold or heat shrinkable installation types, or those installed using epoxy resin or dry wrap. Cable terminations are typically classified according to the operating voltage, ranging from 1kV to 220kV.</p><p dir="ltr">Terminations are also divided by what material the electrical cable is made of, such as copper or aluminium, and how many conductors they need. There’s even a range of sub-categories relating to the joint material, starting with a choice between plastic and metal, and subdivided into categories including flexibility and waterproof, anti-bending and double locking capabilities.&nbsp;</p><h2 dir="ltr">Choosing The Right Cable Termination</h2><p dir="ltr">Cable terminations come in many different designs and materials, with several different attachment styles. This can sometimes make it tricky to determine which one is right for your particular application. It’s important to use the correct termination so that both ends of the connector match and form a perfect bond. Incorrectly matched terminations might lead to short-term or intermittent functioning or complete circuit failure. Many <a title="International Standards" href="https://www.topcable.com/blog-electric-cable/en/electric-cable-standards/" target="_blank">international standards</a> govern different types of cable and connections, so you need to assess your application needs carefully.</p><p dir="ltr">Prefabricated terminals are generally quicker and easier to install, requiring fewer tools. They’ll last longer and be more robust as well as easier to maintain. But you do need to select your cable terminations carefully according to the specific needs of your application. Some factors you’ll have to consider include:</p><ul><li dir="ltr"><p dir="ltr">Electrical requirements such as the nominal voltage and rated current</p></li><li dir="ltr"><p dir="ltr">Environmental conditions such as ambient temperature and humidity</p></li><li dir="ltr"><p dir="ltr">Mechanical strength required</p></li><li dir="ltr"><p dir="ltr">Cost considerations, especially if a lot of terminations are necessary</p></li></ul><p dir="ltr">Rowse Automation has many years of collective experience installing cabling and terminations, and we’re always happy to be of assistance. If you’d like any help with your projects or purchases, please give us a call.</p>

Contacts and conductors for electrical equipment are joined at a terminal to form a continuous circuit. Here, cable splices or terminations provide a detachable, stable connection for wires, inlets and sockets.

Cable Terminations: Everything You Need To Know

<h2 dir="ltr" id="isPasted">Introduction</h2><p dir="ltr">Ever wondered how collaboration could transform hardware development? In an industry where precision, reliability, and scalability are critical, the arrival of collaborative tools is not just an improvement—it's a revolution. Enter <a href="https://allspice.io" target="_blank">AllSpice</a>.io, a pioneering platform designed to bridge the gap between the tried-and-tested methodologies of software development and the specific needs of hardware engineering.</p><p dir="ltr">AllSpice allows the hardware developer community to <a href="https://content.allspice.io/en-us/git-for-hardware-guide" target="_blank">harness the power of advanced version control systems</a> like <a href="https://git-scm.com" target="_blank">Git</a>, which have long been the backbone of software development. This integration brings a new era of collaboration, reducing errors, speeding up development cycles, and fostering innovation by connecting minds and ideas in ways previously deemed impractical.</p><p dir="ltr">This article is the first in a series exploring how platforms like AllSpice reshape hardware development. This series will explain the <a href="https://allspice.io/post/why-use-git-for-hardware-pros-cons" target="_blank">benefits</a> of adopting software-centric approaches, discuss strategies for managing large-scale projects, and illustrate how embracing these tools can lead to unprecedented growth and efficiency in hardware engineering.</p><hr><p><em>This article is part of <a href="https://www.wevolver.com/article/the-future-of-hardware-development-collaborative-tools-and-techniques/" target="_blank" rel="noopener noreferrer"><strong>The Future of Hardware Development</strong></a>, a series featuring insights into how cutting-edge collaborative platforms transform traditional hardware development workflows, integrating advanced version control systems and paving the way for more efficient, error-free project management.</em></p><hr><h2 dir="ltr">Challenges in traditional hardware development</h2><p dir="ltr">Traditional hardware development is characterized by a more linear and isolated approach. In this process, hardware engineers and pcb designers typically work in distinct phases without continuous integration of changes or updates. Each team member may work on separate components of the hardware, using manual methods to track changes and document versions, often through physical logs or localized digital files.</p><p dir="ltr">Communication between team members is generally handled through meetings, phone calls, or emails. This can lead to delays in sharing important updates, resulting in inefficiencies and the potential for errors when integrating different components of hardware projects.</p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3MTg5MTA3OTQzLWltYWdlNCAoMSkucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib" alt="traditional-hardware-design-cycle"><span class="fr-inner" spellcheck="false">Current hardware design release cycle</span></span></span></p><p dir="ltr" id="isPasted"><a href="https://allspice.io/post/revision-control-concepts-git-for-hardware" target="_blank">Managing different revisions</a> and dealing with conflicts in design changes becomes cumbersome. Hardware engineers manually merge changes, which can lead to oversight and discrepancies in the final product. Testing and debugging also become more challenging as tracking the origin of errors is difficult without a clear record of changes.</p><p dir="ltr">Overall, the traditional hardware development process is slow, with higher risks of project delays and increased costs due to less efficient communication.</p><h2 dir="ltr">Understanding version control in hardware development</h2><p dir="ltr">Version control has historically enabled software developers to manage changes to source code systematically, ensuring traceability and facilitating collaboration. Its significance extends beyond mere file management; it serves as an audit trail for the <a href="https://allspice.io/post/parallelism-hardware-development-lifecycles-vs-software" target="_blank">project lifecycle</a>, a necessity equally applicable to hardware development.</p><h3 dir="ltr">Hardware design without version control</h3><p dir="ltr">In hardware design, the absence of version control can lead to numerous operational inefficiencies. Common issues include version confusion, where team members inadvertently work on outdated designs or worse, overwrite each other’s progress. Miscommunication is another frequent challenge, compounded by the physical nature of hardware designs that cannot be "merged" as easily as lines of code. These problems are exacerbated in environments that rely on manual tracking systems, leading to data loss and significant delays in project timelines.</p><h3 dir="ltr">Adapting version control for hardware</h3><p dir="ltr">Adapting hardware version control requires rethinking its application to accommodate the unique needs of physical product development. Unlike software, hardware development processes involve multiple dimensions of change management, including iterative physical prototypes and their corresponding digital representations. This complexity necessitates a robust system that handles diverse file types, from CAD designs to electrical schematics.</p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3MTg4Njc0NzgyLWltYWdlNi5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib" alt="git-model-for-version-control"><span class="fr-inner" spellcheck="false">This Git model for version control shows feature&nbsp;<a href="https://allspice.io/post/pushing-branching-in-git-for-hardware" target="_blank" rel="noopener noreferrer">branches</a> diverging from the main line for independent development of new features, which are then merged back and tagged at significant release points like v0.1, v0.2, and v1.0. Each branch allows engineers to work on specific features without compromising the stability of the main branch.</span></span></span></p><p dir="ltr" id="isPasted">These systems must support large binary files and provide tools that allow engineers to visualize differences between file versions, a crucial feature often taken for granted in software development. Moreover, the integration of these systems with hardware-specific tools and platforms ensures that all components of a product's development are synchronized and documented.</p><h3 dir="ltr">Benefits of version control in hardware</h3><p dir="ltr">The benefits of employing version control in hardware development are manifold. It enhances traceability, allowing teams to track every change made to a design file and understand the reasoning behind each decision. Furthermore, hardware version control fosters a collaborative environment by facilitating a clear and structured workflow. Engineers can work in parallel without the risk of conflicts, speeding up the development process while maintaining the integrity of the design.</p><h2 dir="ltr">The shift towards collaboration in hardware development</h2><p dir="ltr">In hardware development, traditional, siloed approaches are increasingly considered outdated and inefficient. As projects escalate in complexity and scale, integrating collaboration tools has become critical to <a href="https://allspice.io/post/7-reasons-why-hardware-teams-are-adopting-git" target="_blank">streamline processes</a> and bridge the gaps between different engineering disciplines.</p><h3 dir="ltr">Limitations of traditional hardware design</h3><p dir="ltr">Traditionally, hardware development teams often operate in isolation, focusing on specific components without a unified view of the entire project. This isolation can lead to duplicated efforts, inconsistencies across components, and significant delays in project timelines. A common issue in such environments is the misalignment between physical prototypes and their digital counterparts, resulting in costly and time-consuming <a href="https://allspice.io/post/why-digital-design-reviews-are-replacing-so-many-in-person-ones" target="_blank">revisions</a>.</p><h3 dir="ltr">Emergence of collaborative tools</h3><p dir="ltr">The digital transformation in manufacturing and design has brought in a new set of collaborative tools. These tools leverage advanced technologies like cloud computing and real-time data synchronization to allow for the real-time sharing, updating, and management of design files. This shift facilitates a more dynamic workflow and supports a more integrated approach to hardware development.</p><h3 dir="ltr">Benefits of collaborative hardware development</h3><p dir="ltr">Collaborative tools significantly enhance efficiency by enabling real-time updates and feedback, which reduce the cycle time from design to production. They also improve accuracy and consistency across various stages of development, helping to prevent errors that stem from miscommunication. Moreover, collaborative environments foster innovation and creative problem-solving by bringing diverse perspectives together, which is essential in developing cutting-edge hardware solutions.</p><h2 dir="ltr">AllSpice: integrating hardware development with Git</h2><p dir="ltr">Integrating software version control systems like Git into hardware development processes marks a pivotal advancement in the field. AllSpice is a hardware development platform for hardware engineers, PCB designers, and electrical engineers that harnesses this powerful idea to bring <a href="https://www.atlassian.com/devops/what-is-devops/agile-vs-devops" target="_blank">agile and DevOps</a> practices with unprecedented efficiency and <a href="https://allspice.io/post/let-s-chat-hardware-product-development-collaboration-and-documentation" target="_blank">collaboration to hardware projects.</a></p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3MTg4NzM1NTY2LWltYWdlMS5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib" alt="allspice-demo-orcad-arduino-uno-clone"><span class="fr-inner" spellcheck="false">An AllSpice demo project for an OrCAD designed&nbsp;<a href="https://hub.allspice.io/AllSpice-demos/KiCAD-Demo" target="_blank" rel="noopener noreferrer">Arduino UNO</a> clone illustrating the platform's functionality</span></span></span></p><h3 dir="ltr" id="isPasted">Why Git for hardware?</h3><p dir="ltr"><a href="https://allspice.io/post/why-git-is-good-for-hardware-development" target="_blank">Git</a> has revolutionized software development by enabling multiple developers to work simultaneously on the same project with minimal conflicts. This system, primarily designed for managing code, can also be adapted to handle the complex file structures and binary files commonly found in hardware development.</p><h3 dir="ltr">AllSpice’s unique adaptation</h3><p dir="ltr">AllSpice takes the core functionalities of Git and tailors them to the specific needs of hardware engineers. This adaptation involves enhancing Git’s capability to handle large binary files and providing intuitive tools that allow hardware developers to visualize changes in designs, much like software developers view code differences.</p><p dir="ltr"><span class="fr-img-caption fr-fic fr-dib" style="width: 832px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3MTg4NzY2MjAzLWltYWdlMi5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 832px;" class="fr-fic fr-dib" alt="allspice-platform-git"><span class="fr-inner" spellcheck="false">By leveraging a system similar to Git, AllSpice allows hardware developers to efficiently manage revisions, track changes, and collaborate on projects with ease</span></span></span></p><h3 dir="ltr" id="isPasted">Core&nbsp;<a href="https://allspice.io/features" target="_blank">features</a> of AllSpice</h3><p dir="ltr">Version control for hardware designs:&nbsp;AllSpice enables precise tracking and management of changes in hardware designs, ensuring that every modification is recorded and retrievable.</p><p dir="ltr">Collaborative design reviews:&nbsp;With integrated tools for commenting and discussion, AllSpice allows teams to conduct thorough design reviews in real-time, enhancing the quality and accuracy of the final product.</p><p dir="ltr">Integration with various tools:&nbsp;AllSpice seamlessly&nbsp;<a href="https://learn.allspice.io/docs/todo-before-your-onboarding-2?highlight=ecad" target="_blank">integrates</a> with popular ECAD tools like KiCAD, Altium, OrCAD, Allegro, and more, allowing engineers to use familiar software while benefiting from enhanced version control and collaboration features.</p><p dir="ltr">By integrating these features, AllSpice streamlines the workflow and significantly enhances collaboration among team members. It enables hardware teams to work in parallel without the risk of overwriting each other’s work.</p><p dir="ltr">The implementation of AllSpice in hardware projects brings a level of organization and efficiency that parallels what has been achieved in software development for years. It simplifies the complex process of managing hardware designs, ensures greater accuracy, and fosters a collaborative environment essential for innovation in today's hardware industry.</p><p dir="ltr"><em>Visit&nbsp;<a href="https://allspice.io/" target="_blank">AllSpice’s official website</a> today to explore how the platform can streamline your hardware development process.</em></p><h2 dir="ltr">Conclusion</h2><p dir="ltr">The traditional hardware development process, characterized by a patchwork of specialized but isolated tools, presents substantial challenges. These include disjointed data management, communication breakdowns, and inefficient workflows, which collectively hinder project progress and amplify the risk of errors. The difficulties in maintaining consistency across various platforms create a necessity for a more integrated approach.&nbsp;</p><p dir="ltr">By embracing a unified platform that consolidates all aspects of hardware development, teams can enhance collaboration, streamline operations, and improve overall project outcomes. This shift not only optimizes the development cycle but also positions <a href="https://allspice.io/case-studies" target="_blank">teams</a> to better meet the demands of increasingly complex projects, ensuring that innovation continues at a brisk pace without sacrificing quality or efficiency.</p><p dir="ltr">This series highlights how tools like AllSpice revolutionize hardware development, merging robust version control with dynamic collaboration capabilities. As we've explored, AllSpice enhances efficiency, reduces errors, and fosters innovation across diverse teams.</p><hr><p><em>Download the eBook, '<a href="https://allspice.io/implementing-git-for-hardware-in-30-days" target="_blank">Implementing Git in 30 Days</a>,' to start transforming your hardware development process today.</em></p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzI3MTg4NzkzMzAyLWltYWdlMy5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 100%px;" class="fr-fic fr-dib" alt="allspice-implementing-git-for-hardware-in-30-days-banner"></p><p><br></p>

The fragmented nature of traditional hardware development tools calls for the adoption of a unified, technology-driven approach that integrates robust version control systems like Git alongside methodologies similar to agile and DevOps to streamline processes and enhance team collaboration. 

The Future of Hardware Development: Collaborative tools and techniques

The 10,000 microfarad 35 V electrolytic capacitors, used in electronic device.

This article explores the basics, types, and key considerations surrounding decoupling capacitors in electronic systems, providing insights into mastering power integrity in modern designs.

Decoupling Capacitors: Mastering Power Integrity in Electronic Design

<p id="isPasted">This impedance means the conductor can't sustain a consistent voltage level throughout its length. Loss of voltage through all or part of the circuit is measured as voltage drop.</p><h2>What Causes Voltage Drop?</h2><p>Voltage drop occurs normally when a current passes through an electrical cable. It results in the amount of voltage being reduced over a run of cable from input to output. This means that any electrical equipment will receive an input voltage below the value of the input supply. The level of voltage drop is also affected by passive elements in the circuits, such as other cables, connectors and contacts.</p><p>The resistance and reactance increase proportionally as you increase the length of the cable. Voltage drop is, therefore, a recognised problem with long cable runs, like those you might need in larger buildings or extended properties. Voltage drop can also have a significant impact on your electrical equipment. Your motors may run too slowly, overheat and burn out. Your heaters wont heat as well as they should, and your lights might start to flicker or dim.</p><p><br></p><p>This loss of voltage can easily be measured using a voltage drop calculator. You need to use this calculation for single-phase, line-to-line electrical circuits so you may properly size the conductors.</p><h2>How To Calculate Voltage Drop</h2><p>So, what causes voltage drop is impedance in the flow of current through a length of cable. The voltage drop will also be greater in proportion to the resistance. You can use a voltmeter to check the level of voltage reduction, which you connect between the points where you want to measure the voltage drop. If you connect loads in series, the total of all the voltage drops in AC resistive circuits and DC circuits should add up to the total amount of voltage applied to the whole circuit.</p><div data-elfsight-app-lazy=""><label for="lzb7vuz6">mV/A/m</label><input maxlength="30" type="text" autocomplete="off" value="0" data-dashlane-rid="9921708943f59e14" data-dashlane-classification="other"><label for="lzb7whm5">Design Current (Ib)</label><input maxlength="30" type="text" autocomplete="off" value="0" data-dashlane-rid="7ce7da15ec68f1e8" data-dashlane-classification="other"><label for="lzb7x67f">Cable Length (Metres)</label><input maxlength="30" type="text" autocomplete="off" value="0" data-dashlane-rid="c2cd3a39ce5fb03e" data-dashlane-classification="other">Voltage Drop0 Volts0 VoltsPanel only seen by widget owner<a href="https://dash.elfsight.com/apps/calculator?utm_source=clients&amp;utm_medium=user-panel&amp;utm_campaign=elfsight-icon&amp;utm_content=calculator&amp;utm_term=www.rowse.co.uk" target="_blank" title="Panel only seen by widget owner"></a><a href="https://dash.elfsight.com/widget/2fa9c142-d376-40ed-af06-7cae3c988543?utm_source=clients&utm_medium=user-panel&utm_campaign=edit-widget&utm_content=calculator&utm_term=www.rowse.co.uk" target="_blank">Edit widget</a>Views0%Share🔥Tell your customers about<br>new website functionality!<a href="javascript%3Avoid(0)" target="_blank" title="Share on Facebook"></a><a href="https://twitter.com/share?url=www.rowse.co.uk&amp;via=elfsight&amp;text=Now%20my%20site%20is%20cool%20as%20ever%20with%20a%20widget%20by%20Elfsight%20from%20https://elfsight.com/" target="_blank" title="Share on Twitter"></a><a href="https://plus.google.com/share?url=www.rowse.co.uk" target="_blank" title="Share on Google+"></a></div><p>When using a voltmeter to measure the voltage drop, you should always be sure that the proposed measurement isn't beyond the range of the voltmeter. If you dont know how much voltage is in question, this can make it difficult to keep within the voltmeters range. If you do set out from this position, you should always go from the top and start with the highest range. Trying to measure a higher voltage than it can handle could cause damage to the voltmeter.</p><p>You might occasionally have to measure a voltage drop between a specific point in your electrical circuit and some common reference point or ground. If this is the case, you should connect first to the circuits ground or common point, using the voltmeters black common test probe. The red test probe should only then be connected to the point in the circuit that you need to measure.</p><h2>Voltage Drop Formula</h2><p>When you want to calculate the percentage of voltage drop precisely for any cable length, size and current, you must know the exact resistance of your cable type. To simplify these calculations, you can use this formula to work it out:</p><p>In this formula...</p><ul><li>X represents the voltage drop</li><li>mV/A/m stands for milliVolts per metre per Amp</li><li>Ib represents the design current</li><li>I represents the total length of the circuit cable conductor</li></ul><p>&nbsp;</p><p>Therefore, an electrical conductor loses an amount of voltage for every metre it travels, measured in the number of millivolts (mV) for every amp of electrical power (design current) that flows through it. The whole calculation is then divided by 1,000 to get volts instead of millivolts.</p><p>The design current represents the maximum current that you expect the circuit to use (watts/voltage). If you dont know this amount, you can go with the rating of the protective device, as the design current will never exceed this amount. In order to arrive at a percentage voltage drop for your circuit, you can multiply the amount of design current (amps) by the length of your cable (metres). Take the resulting number and divide it by the value shown in the table to get the percentage.</p><p>The maximum amount of voltage drop permitted in the UK under BS7671 is 3% for lighting circuits (6.9V) and 5% for all other purposes (11.5V).</p><h2>How To Fix Voltage Drop</h2><p>As with any kind of pressure loss over distance, the amount of voltage drop you experience relates directly to the length of cable and circuit you are using. To compensate for this loss, you can try using larger diameter cables, which will offer less impedance to the flow of current. You could also opt for copper conductor cables, as these are less prone to voltage drop. Your costs will inevitably rise as you try to minimise the problem, because copper is more expensive, as are larger-diameter cables. Its therefore of great importance to calculate the voltage drop over various cable options to find the optimum size and type.</p><h2>Counteracting Voltage Drop</h2><p>Voltage drop in general causes the electrical load to work harder, as there is less voltage than there should be pushing the current. Each load device on your circuit can only operate properly when it receives its correctly rated voltage. Without sufficient voltage, an electrical device will present problems such as overheating motors, flickering lights or ineffective heaters. This means that they present a safety hazard and aren't working cost-effectively.</p><p>Any length or size of cable you use has some innate resistance, and the voltage drop is unavoidable when you run a current through it. However, using a larger diameter cable will mean the voltage drop is less than using a small size. To keep within British Standard prescribed limits, and for optimal performance of your electrical equipment, this is often the simplest solution. It will greatly improve the functionality, reliability, and safety of your electrical installations.</p>

If you force anything through a length of pipe or cable, the amount of power at the supply end will inevitably diminish by the time it gets to the exit. Electrical cables are no different. When electric current travels through cables, its flow is always impeded by the cable's inherent DC resistance.

What Causes Voltage Drop?

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