IPC standards ensure quality, reliability, and consistency in PCB design, manufacturing, and assembly. This guide covers key standards like IPC-A-610, IPC-2221, and IPC-J-STD-001, their importance, best practices, compliance challenges, and certification benefits.
A countersink in PCB design is a conical recess that allows flat-head screws to sit flush with the board surface. This article explores countersinks vs. counterbores, when to use them, IPC standards, manufacturing considerations, and best practices to ensure reliable, cost-effective PCB designs.
This article provides an in-depth overview of the various PCB components that make up electronic circuits – from passive elements like resistors and capacitors to active semiconductors and electromechanical devices.
OSAT (Outsourced Semiconductor Assembly and Test) firms package, assemble, and test chips for fabless companies and foundries. As chip complexity rises, they boost efficiency, lower costs, and speed market entry for AI, IoT, and HPC. This article reviews OSAT fundamentals, players, and trends.
Cornell scientists have developed a novel technique to transform symmetrical semiconductor particles into intricately twisted, spiral structures – or “chiral” materials – producing films with extraordinary light-bending properties.
This article explains, how is a microprocessor different from an integrated circuit, exploring their key differences, architectures, technological advancements, and potential applications.
Researchers have developed a drastically smaller and more energy efficient method of creating coveted photon pairs that influence each other from any distance. The technology could transform computing, telecommunications, and sensing.
Researchers at Stanford Engineering have developed an ultrathin material that conducts electricity better than copper and could enable more energy-efficient nanoelectronics.